ROHM launches SiC MOSFETs in TOLL package that achieves <span style='color:red'>bot</span>h miniaturization and high-power capability
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ROHM launches SiC MOSFETs in TOLL package that achieves both miniaturization and high-power capability

　　ROHM has begun mass production of the SCT40xxDLL series of SiC MOSFETs in TOLL (TO-Leadless) packages. Compared to conventional packages (TO-263-7L) with equivalent voltage ratings and on-resistance, these new packages offer approximately 39% improved thermal performance. This enables high-power handling despite their compact size and low profile. It is ideal for industrial equipment such as server power supplies and ESS (Energy Storage Systems) where the power density is increasing, and low-profile components are required to enable miniaturized product design.　　In applications like AI servers and compact PV inverters, the trend toward higher power ratings is occurring simultaneously with the contradictory demand for miniaturization, requiring power MOSFETs to achieve higher power density. Particularly in totem pole PFC circuits for slim power supplies, often called “the pizza box type,” stringent requirements demand thicknesses of 4mm or less for discrete semiconductors.　　ROHM's new product addresses these needs by reducing component footprint by approximately 26% and achieving a low profile of 2.3mm thickness – roughly half that of conventional packaged products. Furthermore, while most standard TOLL package products are limited by a drain-source rated voltage of 650V, ROHM's new products support up to 750V. This allows for lower gate resistance and increased safety margin for surge voltages, contributing to reduced switching losses.　　The lineup consists of six models with on-resistance ranging from 13mΩ to 65mΩ, with mass production started in September 2025 (sample price: $37.0/unit, tax excluded). 　　Product Lineup　　Application Examples　　・Industrial equipment: Power supplies for AI servers and data centers, PV inverters, ESS (energy storage systems)　　・Consumer equipment: General power supplies　　EcoSiC™ Brand　　EcoSiC™ is a brand of devices that utilize silicon carbide (SiC), which is attracting attention in the power device field for performance that surpasses silicon (Si). ROHM independently develops technologies essential for the evolution of SiC, from wafer fabrication and production processes to packaging, and quality control methods. At the same time, we have established an integrated production system throughout the manufacturing process, solidifying our position as a leading SiC supplier.• EcoSiC™ is a trademark or registered trademark of ROHM Co., Ltd.　　Terminology　　Totem Pole PFC Circuit　　A highly efficient power factor correction circuit configuration that reduces diode losses by using MOSFETs as rectifier elements. The adoption of SiC MOSFETs enables high voltage withstand capability, high efficiency, and high-temperature operation for the power supply.
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Release time：2025-12-04 17:10 reading：220 Continue reading>>
Fibocom-Powered Ro<span style='color:red'>bot</span>ic Mower Solution Featured at SPOGA+GAFA 2025, Pioneering the Future of Boundary-Free Smart Lawn Care
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Fibocom-Powered Robotic Mower Solution Featured at SPOGA+GAFA 2025, Pioneering the Future of Boundary-Free Smart Lawn Care

　　Cologne, Germany – June 24, Fibocom, a global leader incommunication modules and AI solutions, had its state-of-the-art intelligentrobotic lawn mower solution prominently showcased at SPOGA+GAFA 2025, theworld’s leading trade fair for the garden and outdoor living industry. Multiplerobotic lawn mowers powered by Fibocom’s technology demonstrated seamlessnavigation across simulated garden environments—autonomously detectingboundaries, planning precise mowing routes, and avoiding obstacles—all withoutrelying on traditional physical perimeter wires. This impressive demonstrationhighlighted the disruptive potential of AI-driven, boundary-free lawn caresolutions.　　The global smartrobotic mower market holds vast potential, with Europe and North Americaaccounting for 72% of the world’s 250 million private gardens. Yet, adoptionremains low—under 6% in North America and 10–30% in Europe—highlightingsubstantial room for growth as demand for intelligent lawn care accelerates.　　Fibocom’ssolution integrates advanced AI vision, multi-sensor fusion, and intelligentnavigation to eliminate the need for traditional boundary wires. This enablesrobotic mowers to autonomously detect perimeters and obstacles, ensuring safe,efficient, and precise operation while significantly improving mowing productivity.It’s worth mentioning that, having accumulated over 350,000 kilometers ofreliable autonomous performance worldwide, this solution has proven itsrobustness in diverse and complex garden environments.　　Fibocom provides two solution variantstailored to diverse customer needs: a standard pure-vision model and a flagshipversion combining binocular VIO (Visual-Inertial Odometry) with RTK (Real-TimeKinematic) for superior stability, precision, and large-area coverage—ideal forprofessional and commercial applications. This comprehensive suite, encompassingstereo cameras, AI processing boards, motor control units, and customizablemobile applications, enables OEM partners to accelerate product developmentcycles and focus resources on product differentiation and go-to-marketstrategies. For end users, it revolutionizes lawn care with smart mapping,autonomous operation, and auto-recharging for a safer, easier experience.　　Strategic partnerships with top global brandsare fast-tracking the launch of Fibocom-powered products in key internationalmarkets over the next six months, underscoring Fibocom’s technologicalleadership and growing influence in the smart lawn care industry. Leveragingcutting-edge innovation and manufacturing excellence, Fibocom empowers partnersto penetrate top-tier European retail channels and scale globally, where everyimpeccably maintained lawn showcases the strength of Chinese smartmanufacturing on the world stage.
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Release time：2025-07-11 11:28 reading：617 Continue reading>>
New High Accuracy Current Sense Amps Compatible with Both Negative and High Voltages
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New High Accuracy Current Sense Amps Compatible with Both Negative and High Voltages

　　ROHM has developed a new lineup of high accuracy current sense amps – the BD1423xFVJ-C and the BD1422xG-C. They are qualified under the AEC-Q100 automotive reliability standard. The BD1423xFVJ-C series, offered in the TSSOP-B8J package, supports input voltages up to +80V, making it ideal for high-voltage environments such as 48V DC-DC converters, redundant power supplies, auxiliary batteries, and electric compressors. The series includes three models with different gain settings: BD14230FVJ-C, BD14231FVJ-C and BD14232FVJ-C.　　For lower voltage use cases, the BD1422xG-C, available in the compact SSOP6 package, supports input voltages up to +40V. This makes them suitable for automotive applications requiring space-saving designs, such as current monitoring and protection (overcurrent) in 5V/12V power supply networks used in body and drivetrain domains. Like its high-voltage counterpart, this series also consists of three different gain options: BD14220G-C, BD14221G-C and BD14222G-C.　　In recent years, alongside conventional 5V/12V power supplies, the automotive market has seen a growing adoption of 48V systems fueled by the rising popularity of electric vehicles. Furthermore, as vehicle functionality becomes more advanced, the need for precise monitoring and control across a wide range of applications continues to increase, placing a greater importance on high-accuracy current sensing.　　A current sense amp indirectly measures the current flowing through a circuit by amplifying the miniscule voltage drop across a shunt resistor. The amplified signal is then sent to an ADC or comparator for system control and monitoring. ROHM’s automotive-grade current sense amps meet market demands by leveraging proven analog expertise. This enables high-accuracy current sensing with compatibility for both negative and high voltage environments, contributing to improved safety and reliability in automotive applications, particularly electric vehicles.　　These new products achieve greater space efficiency by integrating most of current sensing circuitry, typically comprised of an operational amplifier and discrete components, int o a single package. As a result, current detection is possible by simply connecting a shunt resistor. The devices also feature a two-stage amplifier configuration, consisting of a chopper amplifier at the input and an auto-zero amplifier at the output. Internal resistor matching for gain setting ensures stable, accurate current sensing (±1%) while minimizing the effects of temperature variations.　　Furthermore, current detection accuracy is maintained even when an external RC filter circuit added for noise suppression, significantly reducing design complexity and development time. Additional features include -14V negative voltage tolerance that supports back electromotive force, reverse connection, and negative voltage input.　　Going forward, ROHM will continue to deliver optimal solutions that contribute to higher precision and enhanced reliability in automotive equipment.　　Application Examples　　• BD1423xFVJ-C (for 48V systems): Redundant power supplies, auxiliary batteries, DC-DC converters, and electric compressors, and the like　　• BD1422xG-C (for 5V/12V systems): Body DCUs (Domain Control Units) / ECUs (Electronic Control Units), etc.　　Terminology　　AEC-Q100 Automotive Reliability Standard　　AEC stands for Automotive Electronics Council, a reliability standard for automotive electronic components established by major automotive manufacturers and US electronic component makers. Q100 is a standard that specifically applies to integrated circuits (ICs).　　Shunt Resistor　　A resistor connected in series in the current path to detect the current in the circuit by measuring the potential difference across it.　　Chopper Amp　　An amp circuit designed to minimize signal offset and noise, primarily used for accurately amplifying low-frequency and weak DC signals.　　Auto-Zero Amp　　An amp that automatically compensates for offset voltage (unwanted noise and errors) by continuously sampling and correcting it during operation. This ensures high signal accuracy, making it ideal for applications that demand ultra-precise measurement and signal processing.
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Release time：2025-06-13 16:56 reading：650 Continue reading>>
Nidec Instruments Develops Vacuum-resistant Liquid Crystal Substrate Transfer Ro<span style='color:red'>bot</span>s
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Nidec Instruments Develops Vacuum-resistant Liquid Crystal Substrate Transfer Robots

　　Nidec Instruments Corporation (“Nidec Instruments” or the “Company”), a wholly owned subsidiary of Nidec Corporation, today announced the development of liquid crystal substrate transfer robots that can move their joints in a vacuum environment as freely as in the air.　　In a process to manufacture liquid crystal, organic electroluminescent (EL), and other displays, mother glass substrates are constantly required to be made larger, and their processing speed faster, as their production cost must be reduced and screen sizes must be made larger at the same time. In recent years, display manufacturers are required to handle large, 3m x 3m products because the larger glasses robots can transfer, the better transfer efficiency they can achieve.　　As mother glass substrates’ thin-film and vapor deposition processes require an extremely clean vacuum environment, transfer robots used in such processes must be vacuum-resistant as well.　　As the company with the largest global market share for transfer robots used in organic EL substrates’ vapor deposition process, Nidec Instruments utilized its knowhow in these latest products as well. Robots that operate in vacuum have joints with seals to keep air and dust inside their arms and other parts. Though such sealing mechanisms restrain the movements of transfer robots’ joints, the Company’s latest products adopt magnetic seals integrated with reducers to minimize the seals’ use, and thus secure the same level of freedom as in the air. To meet its customers’ needs, Nidec Instruments has added two new modes with different arm shapes, i.e., a boomerang type and a scalar type, to its product lineup, while suppressing cost by using common units for them.　　As a member of the world’s leading comprehensive motor manufacturer, Nidec Instruments stays committed to offering revolutionary solutions that contribute to creating a comfortable society.
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Release time：2023-12-11 17:46 reading：2275 Continue reading>>
Nidec Instruments Launches New Semiconductor Wafer Transfer Ro<span style='color:red'>bot</span>
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Nidec Instruments Launches New Semiconductor Wafer Transfer Robot

　　Nidec Instruments’ Latest Semiconductor Wafer Transfer Robot, SR7163 series.　　Despite a temporary slowdown in 2023, the global semiconductor market is expected to expand from 2024 after demand recovers in a wide variety of product groups such as memory logic and other IC products, and in the O-S-D (optoelectronics, sensor/actuator, and discrete semiconductor) segment. As the demand grows around the world for the construction of semiconductor factories with high production capacity, Nidec Instruments has developed the SR7163 series, a semiconductor wafer transfer robot to respond to its customers’ needs.　　Among semiconductor manufacturing equipment, the SR7163 series is expected to be used in batch-type thermal treatment equipment and other machines in processes that require to transfer multiple substrates to a stage with a different slot pitch. A product that utilizes an arm-link mechanism to move a hand horizontally, the SR7163 series boasts a small minimum turning radius that can accommodate narrow pitches of up to the minimum limit of 6.5mm. In addition, with the use of a highly airtight link-type arm, the SR7163 series meets ISO14644-1’s Class-1 cleanliness requirements, which is the industry’s highest-level cleanliness.　　As a member of the world’s leading comprehensive motor manufacturer, Nidec Instruments stays committed to offering revolutionary solutions that contribute to building a comfortable society.　　For more details on the above product, Please contact AMEYA360 official customer!
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Release time：2023-09-05 13:49 reading：3189 Continue reading>>
OMRON:Enabling safe sterilization of medical equipment with ro<span style='color:red'>bot</span>ics
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OMRON:Enabling safe sterilization of medical equipment with robotics

　　Hospitals play a major role in keeping our societies safe and thriving. Any medical practice is centered around instruments which form the backbone of the hospitals. Medical instruments require special care, and they must always be sterilized before operating on patients. Sterilization is quite a tedious task as it involves moving around instrument trolleys around the hospital which leaves the staff indulged in unproductive and injury prone activities.　　OMRON team in Australia took note of this redundant practice and partnered with Atherton to come up with an innovative solution that will encourage safe sterilization of medical instruments with automation.
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Release time：2023-01-11 14:32 reading：4035 Continue reading>>
IDC Expects Asia/Pacific excluding Japan Spending on Ro<span style='color:red'>bot</span>ics to Reach US$129.4B in 2022
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IDC Expects Asia/Pacific excluding Japan Spending on Robotics to Reach US$129.4B in 2022

　　The latest IDC Worldwide Semiannual Robotics and Drones Spending Guide forecasts Asia Pacific excluding Japan (APEJ) spending on robotics (including drones) and associated services to reach USD 129.4 billion by 2022, essentially three times the spending in 2018, with a five-year CAGR of 25.2% during 2017-2022. APEJ tops with the largest market share for robotics applications followed by the United States and Japan. Both are expected to record for more than 61.6% of the world’s entire robotics market in 2022.　　"To survive the escalating competition, APEJ manufacturing organizations surveyed by IDC in 2018 are putting robotics as their top priority for technology investment," said Dr. Jing Bing Zhang, Research Director for Worldwide Robotics at IDC. “While the uncertainty of the trade war between the United States and China is likely to dampen the market growth in the near term, we expect the growth trend to pick up from 2020 onward.”　　Discrete and process manufacturing are the dominant industries in robotics (including drones) spending, which turns over 58.1% of the overall spend in APEJ in 2019. Largely, welding and assembling use cases in discrete manufacturing, whilst pick and pack, and bottling use cases in process manufacturing are driving the robotics spend in 2019. However, customer deliveries, vegetable seeding and planting are the drone use cases which we expect to grow at fast pace with a five-year CAGR 126.4% and CAGR 112.1% respectively over the forecast period (2017-22).　　“There has been an intensive wave of industrial automation for which robotics and drones provide a major base; hence attracting investments with each passing year. Under Robotics, despite Manufacturing being a dominant industry in this area, investments will continue to increase in resource industry, retail, construction, among others,“ said Swati Chaturvedi, Senior Market Analyst at IDC.　　“On the other hand, drones, which are majorly a consumer-oriented technology, are gaining momentum in its industrial usage by enterprises and governments alike for tasks as mundane as filmmaking and inspection or as complex as agricultural uses, mining operations assistance, and insurance assessment.”　　From a technology perspective, hardware purchases related spending on robotics systems (including drones) in APEJ, which includes industrial, service and consumer robots and after-market hardware, is forecast to grow to $81.0 billion in 2022.　　China accounts largest market share in the Asia Pacific robotics (including drones) market. Its spending on robotics is expected to reach $80.5 billion, representing 62.2% of APEJ region's total spending in 2022.
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Release time：2019-01-25 00:00 reading：4183 Continue reading>>
Ca<span style='color:red'>bot</span> Microelectronics Corporation completes acquisition of KMG Chemicals
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Cabot Microelectronics Corporation completes acquisition of KMG Chemicals

Cabot Microelectronics Corporation (Nasdaq: CCMP), today announced that it has completed its previously announced acquisition of KMG Chemicals, Inc.  As a result of the acquisition, KMG has become a wholly owned subsidiary of Cabot Microelectronics.  Under the terms of the definitive agreement, each share of KMG common stock was converted into the right to receive $55.65 in cash and 0.2000 of a share of Cabot Microelectronics common stock, without interest and with cash paid in lieu of any fractional shares.The acquisition will extend and strengthen Cabot Microelectronics’ position as one of the leading suppliers of consumable materials to the semiconductor industry.  Additionally, the combined company will be a leading global provider of performance products and services for improving pipeline operations and optimizing throughput.  The transaction is expected to be significantly accretive to Cabot Microelectronics’ free cash flow and adjusted earnings per share in year one, excluding any acquisition-related costs.“I am pleased to announce that we have completed the KMG transaction.  We welcome KMG’s employees to our team and look forward to our journey together towards becoming the premier global provider of semiconductor and specialty materials.  We believe that our employees, customers and shareholders will benefit from this transaction as we become a stronger company, focused on providing high-performing and innovative solutions to our customers,” said David Li, President and CEO of Cabot Microelectronics.  “KMG’s industry-leading electronic materials business will expand our CMP product offerings with high-purity solutions used throughout the semiconductor manufacturing process.  We are also excited about the addition of KMG’s performance materials businesses to our portfolio which will allow us to expand our participation into new markets including the attractive, high-growth pipeline performance segment.”In connection with the acquisition, Cabot Microelectronics borrowed $1.065 billion under a new senior secured term loan facility, the proceeds of which were used to finance in part the cash portion of the merger consideration, to repay KMG’s existing indebtedness and to pay fees and expenses related to the acquisition.  Cabot Microelectronics issued approximately 3.2 million shares of common stock to holders of KMG common stock for the stock portion of the merger consideration.
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Release time：2018-11-16 00:00 reading：1267 Continue reading>>
Ca<span style='color:red'>bot</span> Microelectronics to acquire KMG ChemicalsCa<span style='color:red'>bot</span> Microelectronics to acquire KMG Chemicals
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Cabot Microelectronics to acquire KMG ChemicalsCabot Microelectronics to acquire KMG Chemicals

Cabot Microelectronics Corporation (Nasdaq: CCMP), a supplier of chemical mechanical planarization (CMP) polishing slurries and second largest CMP pads supplier to the semiconductor industry, and KMG Chemicals, Inc. (NYSE: KMG), a global provider of specialty chemicals and performance materials, have entered into a definitive agreement under which Cabot Microelectronics will acquire KMG in a cash and stock transaction with a total enterprise value of approximately $1.6 billion. Under the terms of the agreement, KMG shareholders will be entitled to receive, per KMG share, $55.65 in cash and 0.2000 of a share of Cabot Microelectronics common stock, which represents an implied per share value of $79.50 based on the volume weighted average closing price of Cabot Microelectronics common stock over the 20-day trading period ended on August 13, 2018.  The transaction has been unanimously approved by the Boards of Directors of both companies and is expected to close near the end of calendar year 2018.The combined company is expected to have annual revenues of approximately $1 billion and approximately $320 million in EBITDA, including synergies, extending and strengthening Cabot Microelectronics’ position as one of the leading suppliers of consumable materials to the semiconductor industry.  Additionally, the combined company will be a leading global provider of performance products and services for improving pipeline operations and optimizing throughput.“We are excited about the combination of two world-class organizations with dedicated and talented employees that provide innovative, high quality solutions to solve our customers’ most demanding challenges,” said David Li, President and CEO of Cabot Microelectronics. “KMG’s industry-leading electronic materials business is highly complementary to our CMP product portfolio, while its performance materials business broadens our product offerings into the fast-growing industry for pipeline performance products and services.  We welcome KMG’s employees to our team and look forward to our future together as one company.”Chris Fraser, KMG Chairman and CEO, said, “This is an outstanding combination, bringing together two leading companies that will benefit from increased size, scale and geographic reach. For KMG shareholders, this transaction creates significant and immediate value while also providing participation in the future growth of the combined company.  Thanks to the dedication and hard work of KMG employees around the world, KMG has achieved significant progress over the past several years, and I am confident that Cabot Microelectronics will continue to build on this success to further enhance value for our shareholders.”
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Release time：2018-08-16 00:00 reading：3634 Continue reading>>
Big changes at the top and <span style='color:red'>bot</span>tom of Q1 semiconductor equipment market shares
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Big changes at the top and bottom of Q1 semiconductor equipment market shares

Market shares of semiconductor equipment manufacturers shifted significantly in Q1 2018 as Applied Materials, the top supplier dropped, according to the report “Global Semiconductor Equipment: Markets, Market Shares, Market Forecasts,” recently published by The Information Network, a New Tripoli-based market research company.The chart below shows shares for the first quarter (Q1) of calendar year 2017 and 2018. Market shares are for equipment only, excluding service and spare parts, and have been converted for revenues of foreign companies to U.S. dollars on a quarterly exchange rate.Applied Materials lost significant market share YoY, from 18.4% of the $13.1 billion Q1 2017 market to 17.7% of the $17.0 billion Q1 2018 market. This drop follows a 1.8 share-point loss by Applied Materials for CY 2017 compared to 2016. The company competes with Lam Research and TEL in the deposition and etch market, and both gained share at the expense of Applied Materials.At the other end of the spectrum, smaller semiconductor companies making up the “other” category lost 2.4 share points as a whole.Much of the equipment revenue growth was attributed to strong growth in the DRAM and NAND sectors, as equipment was installed in memory manufacturers Intel, Micron Technology, Samsung Electronics, SK Hynix, Toshiba, and Western Digital. The memory sector, which grew grown 61.5% in 2017, is forecast to add another 28.5% in 2018 according to industry consortium WSTS (World Semiconductor Trade Statistics).TEL recorded growth of 120.3% YoY in Korea, much of it on NAND and DRAM sales to Samsung Electronics and SK Hynix, and 69.5% YoY in Japan, much of it on NAND sales to Toshiba at its Fab 6 in Kitakami, Japan. Lam Research gained 42.2% and 70.5% YoY, respectively, in Korea and Japan.Following the strong growth in the semiconductor equipment market, The Information Network projects another 11.5% growth in 2018 for semiconductor equipment.
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Release time：2018-07-11 00:00 reading：1625 Continue reading>>

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