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Renesas Introduces USB PD EPR Solution Featuring Type-C Port Controller and Buck-Boost Battery Charger

　　Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today introduced the RAA489118 buck-boost battery charger and the RAA489400 USB Type-C® port controller. The two new ICs combine to provide a premier Extended Power Range (EPR) USB Power Delivery (PD) solution.　　Renesas is a worldwide leader in USB-PD solutions, offering a comprehensive range of products including turnkey solutions for various applications. Renesas helps customers shorten their time-to-market with an extensive development environment and pre-certified USB-IF reference designs, Renesas USB-PD solutions offer superior quality and safety, along with high efficiency and power density.　　The RAA489118 functions as either a battery charger supporting two to seven battery cells in series or as a voltage regulator supporting 30V input and 30V output. It employs Renesas’ patented R3™ (Robust Ripple Regulator) technology, which combines the best features of fixed-frequency and hysteretic Pulse-Width Modulation (PWM) technologies. R3 modulation technology delivers acoustic noise-free operation, fast dynamic response, and best-in-class light-load efficiency for longer battery life.　　The RAA489118 includes an SMBus (System Management Bus) interface that is widely employed in power tools, home appliances and light industrial products. The SMBus interface, combined with the buck-boost and bidirectional features, allows the RAA489118 to work seamlessly with the RAA489400 and other components in USB-C PD implementations. Its input and output voltage levels also match mainstream solar power voltage levels, making it an ideal fit for solar portable power station applications.　　The RAA489400 port controller supports USB-PD VBUS power up to 48V/5A. It features an integrated PHY, both Sink and Source Power Path Gate Drivers with external NFETs, short-circuit protection, VBUS discharge, a VCONN MUX and dead battery support.　　“Renesas has been a worldwide leader in battery charging for many years based on advanced technology, adaptability, and exceptional value,” said Chris Allexandre, Senior Vice President and General Manager of Power at Renesas. “The RAA489118 and RAA489400 bring those strengths along with Renesas’ strong legacy of safety and reliability to new applications such as power tools and light industrial products. We expect to see strong demand from customers across multiple markets.”　　Key Features of the Renesas USB EPR PD Solution　　Battery charger supporting two to seven battery cells in series　　Buck-boost voltage regulator supporting 30V input and 30V output　　Renesas R3™ technology ensures minimal power loss and improved efficiency　　Advanced control scheme delivers fast transient response and system performance　　Robust thermal management and protection features for safety and reliability　　Adaptable configurations support a wide range of applications　　Built-in protection against overcharging, overheating, and voltage anomalies　　Bidirectional power flow　　USB-IF certified reference design reduces compliance testing time and effort　　Comprehensive design support and tools　　Winning Combinations　　Along with other USB-PD controllers, battery management ICs, and Type-C port management products, Renesas offers a turnkey USB-PD Charger Winning Combination that minimizes the effort required for customers to integrate USB-PD and battery management system features into their products. Winning Combinations are technically vetted system architectures from mutually compatible devices that work together seamlessly to bring an optimized, low-risk design for faster time to market. Renesas offers more than 400 Winning Combinations with a wide range of products from the Renesas portfolio to enable customers to speed up the design process and bring their products to market more quickly. They can be found at renesas.com/win.　　Device Availability　　The RAA489118 comes in a 4×4 mm 32-lead TQFN package, and the RAA489400 is packaged in a 32-Ld 3x5 mm FCQFN. Both products are available today from Renesas. Comprehensive design support and tools, including VIDWriter configuration tools and battery charger GUI software to configure designs, are also available.　　Renesas Power Management Leadership　　A world leader in power management ICs, Renesas ships more than 1.5 billion units per year, with increased shipments serving the computing industry, and the remainder supporting industrial and Internet of Things applications as well as data center and communications infrastructure. Renesas has the broadest portfolio of power management devices, delivering unmatched quality and efficiency with exceptional battery life. As a trusted supplier, Renesas has decades of experience designing power management ICs, backed by a dual-source production model, the industry’s most advanced process technology, and a vast network of more than 250 ecosystem partners.　　About Renesas Electronics Corporation　　Renesas Electronics Corporation (TSE: 6723) empowers a safer, smarter and more sustainable future where technology helps make our lives easier. A leading global provider of microcontrollers, Renesas combines our expertise in embedded processing, analog, power and connectivity to deliver complete semiconductor solutions. These Winning Combinations accelerate time to market for automotive, industrial, infrastructure and IoT applications, enabling billions of connected, intelligent devices that enhance the way people work and live.　　(Remarks). USB Type-C® and USB-C® are registered trademarks of USB Implementers Forum. All names of products or services mentioned in this press release are trademarks or registered trademarks of their respective owners.

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Renesas

Release time：2024-12-10 14:06 reading：1129 Continue reading>>

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ROHM’s New SiC Schottky Barrier Diodes for High Voltage xEV Systems: Featuring a Unique Package Design for Improved Insulation Resistance

　　ROHM has developed surface mount SiC Schottky barrier diodes (SBDs) that improve insulation resistance by increasing the creepage distance between terminals. The initial lineup includes eight models - SCS2xxxNHR - for automotive applications such as onboard chargers (OBCs), with plans to deploy eight models - SCS2xxxN - for industrial equipment such as FA devices and PV inverters in December 2024.　　The rapidly expanding xEV market is driving the demand for power semiconductors, among them SiC SBDs, that provide low heat generation along with high-speed switching and high-voltage capabilities in applications such as onboard chargers. Additionally, manufacturers increasingly rely on compact surface mount devices (SMDs) compatible with automated assembly equipment to boost manufacturing efficiency. Compact SMDs tend to typically feature smaller creepage distances, fact that makes high-voltage tracking prevention a critical design challenge.　　As leading SiC supplier, ROHM has been working to develop high-performance SiC SBDs that offer breakdown voltages suitable for high-voltage applications with ease of mounting. Adopting an optimized package shape, it achieves a minimum creepage distance of 5.1mm, improving insulation performance when contrasted with standard products.　　The new products utilize an original design that removes the center pin previously located at the bottom of the package, extending the creepage distance to a minimum of 5.1mm, approx. 1.3 times greater than standard products. This minimizes the possibility of tracking (creepage discharge) between terminals, eliminating the need for insulation treatment through resin potting when surface mounting the device on circuit boards in high voltage applications. Additionally, the devices can be mounted on the same land pattern as standard and conventional TO-263 package products, allowing an easy replacement on existing circuit boards.　　Two voltage ratings are offered, 650V and 1200V, supporting 400V systems commonly used in xEVs as well as higher voltage systems expected to gain wider adoption in the future. The automotive-grade SCS2xxxNHR are AEC-Q101 qualified, ensuring they meet the high reliability standards this application sector demands.　　Going forward, ROHM will continue to develop high-voltage SBDs using SiC, contributing to low energy consumption and high efficiency requirements in automotive and industrial equipment by providing optimal power devices that meet market needs.　　Application Examples◇ Automotive applications: Onboard chargers (OBCs), DC-DC converters, etc.　　◇ Industrial Equipment: AC servo motors for industrial robots, PV inverters, power conditioners, uninterruptible power supplies (UPS), and more　　Online Sales InformationAvailability: The SCS2xxxxNHR for automotive applications are available now.　　The SCS2xxxN for industrial equipment are scheduled in December 2024.　　Pricing: $10.50/unit (samples, excluding tax)　　Online Distributors: DigiKey™, Mouser™ and Farnell™　　The products will be offered at other online distributors as they become available.　　EcoSiC™ BrandEcoSiC™ is a brand of devices that leverage silicon carbide, which is attracting attention in the power device field for performance that surpasses silicon. ROHM independently develops technologies essential for the advancement of SiC, from wafer fabrication and production processes to packaging, and quality control methods. At the same time, we have established an integrated production system throughout the manufacturing process, solidifying our position as a leading SiC supplier.　　TerminologyCreepage Distance　　The shortest distance between two conductive elements (terminals) along the surface of the device package. In semiconductor design, insulation measures with such creepage and clearance distances must be taken to prevent electric shocks, leakage currents, and short-circuits in semiconductor products.　　Tracking (Creepage Discharge)　　A phenomenon where discharge occurs along the surface of the package (insulator) when high voltage is applied to the conductive terminals. This can create an unintended conductive path between patterns, potentially leading to dielectric breakdown of the device. Package miniaturization increases the risk of tracking by reducing creepage distance.　　Resin Potting　　The process of encapsulating the device body and the electrode connections between the device and circuit with resin, such as epoxy, to provide electrical insulation. This provides durability and weather resistance by protecting against water, dust, and other environmental conditions.　　AEC-Q101 Automotive Reliability Standard　　AEC stands for Automotive Electronics Council, a reliability standard for automotive electronic components established by major automotive manufacturers and US electronic component makers. Q101 is a standard that specifically applies to discrete semiconductor products (i.e. transistors, diodes).

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ROHM

Release time：2024-11-20 14:00 reading：504 Continue reading>>

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Murata SCH1633-D01 Sets a New Standard for Automotive 6DoF Sensor

　　Murata is expanding its range of innovative Six Degrees-of-Freedom devices with the introduction of the SCH1633-D01. The micro-electromechanical system (MEMS) based sensor moves the benchmark for performance, system integration, and total cost optimization. It is designed for various automotive applications, including autonomous driving (AD), advanced driver-assistance systems (ADAS), inertial navigation, vehicle stability control, and camera or headlight alignment.　　Market Demands　　With the increasing push for vehicle autonomy and safety, there is an unquestionable demand for extremely accurate sensors with comprehensive built-in safety features and a high level of integration. Likewise, complying with technical regulations like the UNECE’s headlight leveling regulation requires accurate and cost-optimized solutions – something the SCH1633-D01 has demonstrated it can achieve.　　The SCH1633-D01 is a single-package solution optimized for zonal architecture where all required subsystems, like GNSS integration, chassis control, and vehicle attitude sensing (camera and headlight alignment) can utilize its measurements. It is targeted for deployment in the central vehicle inertia measuring unit (IMU) providing a high-quality signal for all subsystems within the vehicle even in the toughest environments. This integration helps to reduce system complexity and provides a much-needed opportunity for cost optimization.　　SCH1633-D01 Features　　SCH1633-D01 is packaged in a unique 24-pin SOIC housing and uses the SafeSPI 2.0 interface with an up to 20-bit data frame for an extremely smooth and high-resolution output. The component supports various system-level time synchronization features, ensuring that the SCH1633-D01’s output can be easily harnessed across the entire vehicle. Furthermore, the extensive self-diagnostics features utilize over 200 monitoring signals to ensure the output is always trustworthy.　　The SCH1633-D01 is designed to provide a high-quality output, even in harsh temperature conditions. It features AEC-Q100 grade 1 qualification to guarantee reliable use throughout the whole component lifetime and is ISO26262 compliant with ASIL-B+ rating (up to ASIL-D via system integration) for exceptional built-in safety.　　For further information on the product’s extensive functionality, please visit its detail page here.　　Murata’s Recent 6DoF MEMS Success　　Murata’s previous generation 6DoF MEMS solution has proven to be highly successful as over 90% of autonomous miles in California alone are driven with the sensor on board. The improvements in this next-generation 6DoF devices are based on customer feedback, and they have already gained global recognition.　　The industrial counterpart SCH16T-K01, launched in January this year, has won the first prize in the Industrial & Manufacturing category of the Sensors Converge fair’s “Best of Sensors Award” competition and the SCH1633-D01 preliminary sample feedback has been remarkably positive.　　A partner of Murata, Hexagon, has been using the SCH1633-D01 in their products. Gordon Heidinger, Segment Manager, Automotive and Safety-Critical Systems at Hexagon’s Autonomy & Positioning division, remarked, “　　The SCH1633-D01 is displaying exceptional performance for a single MEMS sensor. We're pleased to promote this sensor integrated with our positioning solution”.　　Murata has also successfully demonstrated that the UNECE headlight leveling regulation can be fulfilled with the SCH1633-D01 sensor in combination with a commercially available alignment algorithm. This is a significant leap towards cost-effective regulation compliance.　　“Automotive 6DoF applications are rapidly developing, with fierce competition among manufacturers to capture a share of the market. This product offers high performance, demanded by the latest systems, while also providing a much-needed cost-saving opportunity,” said Ville Nurmiainen, General Manager of Product management at Murata Electronics Oy. He continued, “The SCH1633-D01 will give both a technological and cost down advantage to OEMs choosing to utilize the product to its full potential and will help them to further drive automotive applications forward and create safer roads for us all.”　　Preliminary samples are available now. Mass production of this exciting new solution is planned for early 2025.

Key word：

Murata

Release time：2024-11-12 11:22 reading：1085 Continue reading>>

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GigaDevice GD32F30x Software Test Library (STL) Achieves TÜV Rheinland IEC 61508 Functional Safety Certification

　　GigaDevice, a leading semiconductor company specializing in Flash Memory, 32-bit Microcontrollers (MCUs), Sensors, and Power Management technologies announced that its GD32F30x Software Test Library (STL) has received IEC 61508 SC3 (SIL 2/SIL 3) functional safety certification from TÜV Rheinland. This certification follows the earlier certification of the GD32H7 Software Test Library (STL), demonstrating that GigaDevice has established a comprehensive presence in the field of functional safety. The company now offers software test libraries for both high-performance Arm® Cortex®-M7 core MCUs and mainstream Arm® Cortex®-M4 core MCUs, providing users with a broader range of product options for industrial applications. These achievements highlight GigaDevice’s commitment to product safety and reliability, as well as its expertise and advancements in the field of functional safety.　　The GD32F30x STL software test library is designed to ensure the safe operation of the GD32F30x series MCUs. It monitors the status of core units such as the internal CPU/DPU, FPU, and MPU, and conducts regular checks on memory like SRAM and Flash to quickly identify random hardware faults. Upon detecting a fault, the GD32F30x Software Test Library (STL) immediately triggers a preset safety response mechanism, placing the MCU in a safe state, thereby mitigating potential risks and providing users with time to address and rectify system failures. Additionally, it offers comprehensive documentation, including FMEDA and safety manuals, to ensure that the product meets specific safety requirements throughout the design, development, and production processes.　　Vincent Li, GigaDevice CTO and General Manager of MCU BU, stated: "As industrial automation and intelligence continue to evolve, the importance of functional safety becomes increasingly evident. The consecutive IEC 61508 SC3 (SIL 2/SIL 3) functional safety certifications for the GD32H7 STL and GD32F30x STL demonstrate that GigaDevice has established a mature management system in the functional safety field. This is crucial for enhancing the overall competitiveness of our GD32 MCU products and enabling users to develop products that meet functional safety standards in a shorter timeframe. Meanwhile, the certification process for the GD32 MCU software test library based on the Arm® Cortex® M33 core is also progressing concurrently. We will continue to align with international standards and drive technological advancements and product upgrades.”　　Bin Zhao, General Manager Cybersecurity & Functional Safety Greater China of TÜV Rheinland stated: Congratulations to GigaDevice for once again obtaining TÜV Rheinland's STL functional safety certification! GigaDevice's steadfast commitment to functional safety reflects its dedication to stringent safety standards, which we highly commend. In the future, we will continue to uphold professional technical requirements, adhere to rigorous certification processes, and deepen our collaboration to support GigaDevice in achieving further breakthroughs in the field of functional safety.”　　About GigaDevice　　GigaDevice Semiconductor Inc. (SSE Stock Code 603986) is a global leading fabless supplier. The company was founded in April 2005 and headquartered in Beijing, China, with branch offices in many countries and regions worldwide, providing local support at customers' fingertips. Committed to building a complete ecosystem with four major product lines – Flash memory, MCU, sensor and analog – as the core driving force, GigaDevice can provide a wide range of solutions and services in the fields of industrial, automotive, computing, consumer electronics, IoT, mobile, networking and communications. GigaDevice has received the ISO26262:2018 automotive functional safety ASIL D certification, IEC 61508 functional safety production certification, as well as ISO9001, ISO14001, ISO45001, and Duns certifications. In a constant quest to expand our technology offering to customers, GigaDevice has also formed strategic alliances with leading foundries, assembly, and test plants to streamline supply chain management.

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GigaDevice

Release time：2024-11-07 14:00 reading：975 Continue reading>>

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Murata’s Type 1SC-NTN module achieves Skylo U.S. certification for cellular and non-terrestrial network connectivity

　　Murata announced today that its Type 1SC-NTN has received Skylo U.S. certification for its dual-mode cellular and non-terrestrial network (NTN) capabilities, making it the first ultra-compact resin mold module to achieve this recognition from an NTN service provider. The product seamlessly integrates the latest Rel-17 NTN standard, enabling satellite data communication capabilities without necessitating any hardware design changes. When paired with Skylo's NTN service, it extends the reach of satellite connectivity, ensures uninterrupted communication, and delivers a new class of solution for the demanding satellite IoT market.　　Murata’s Type 1SC is the world’s smallest form factor LTE Cat M/NB-IoT module with both global regulatory and NTN certification. It supports GPS/GNSS, OpenMCU, and Integrated SIM to support the applications that are defining today’s market, such as dual-mode cellular IoT. In addition to its unmatched size, low power, and cost-efficiency, its high level of integration accelerates time to market while lowering development and deployment costs for customers. Target uses include wearable, tracking, and medical monitoring devices, as well as M2M communication, smart meters, and other size-limited IoT edge products.

Key word：

Murata

Release time：2024-10-15 13:19 reading：556 Continue reading>>

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ROHM’s New PWM Controller ICs with SOP Package for Power Supply in a Wide Variety of Industrial Applications

　　ROHM has developed external FET-type controller ICs utilizing PWM current control mode optimized for AC-DC power supply in various industrial applications. Mass production has begun for four variants designed to drive a wide range of power semiconductors: the BD28C55FJ-LB for low-voltage MOSFETs, BD28C54FJ-LB for medium- to high-voltage MOSFETs, BD28C57LFJ-LB for IGBTs, and BD28C57HFJ-LB for SiC MOSFETs.　　Although the global semiconductor shortage is beginning to ease, the supply of semiconductor components for power supplies in industrial applications continues to lag behind demand. This is particularly true for PWM controller ICs, where the limited number of manufacturers has resulted in chronic shortages, leading to numerous requests for product development.　　In response, ROHM has developed PWM controller ICs that address the ongoing supply issue by meeting the industrial market’s stringent package and performance requirements. Depending upon the input AC voltage range of the application, a wide variety of semiconductors are used for power supply circuit. Each of these semiconductors demand different undervoltage lock out levels to prevent thermal runaway in case of supply/gate voltage drop. To solve this issue, ROHM has developed 4 variants with different undervoltage lock out levels.　　The new products feature an input voltage range of 6.9V to 28.0V, circuit current up to 2.0mA, maximum startup current of 75µA, and a maximum duty cycle of 50%, offered in the standard SOP-J8 package (equivalent to the JEDEC SOIC8). The products are pin to pin compatible to standard products commonly used in power supply circuits, thus reducing re-design and modification efforts. All variants are equipped with a self-recovery-type undervoltage lockout function (UVLO) with voltage hysteresis. This significantly improves application reliability by reducing the threshold voltage error to ±5%, compared to the typical ±10% of standard products.　　At the same time, these ICs are designated for long-term supply, thus ensuring continuous operation of long-life industrial equipment. Going forward, the lineup will be further expanded to include products suitable to drive high-voltage MOSFETs and GaN devices. More variants to support a maximum duty cycle of 100% are also being planned.　　Application ExamplesIndustrial equipment: AC-DC power supplies, motor drive inverters, and other AC-powered devices　　Product Information　　Applicable Part Nos: BD28C54FJ-LB, BD28C55FJ-LB, BD28C57HFJ-LB, BD28C57LFJ-LB　　TerminologyPWM Control Type　　Short for Pulse Width Modulation, a method for controlling power using semiconductors. The output power is controlled by varying the ratio of ON and OFF times within a fixed cycle.　　Duty Cycle　　The proportion of ON and OFF times as percentage of the switching period is known as ON- and OFF-duty cycle, respectively. It is common to refer to the ON-time ratio as the duty cycle. Duty Cycle (%) = Pulse Width (t) / Period (T).　　Self-Recovery Undervoltage Lockout Function (UVLO) with Voltage Hysteresis　　This function safety stops IC operation before the circuit inside the IC becomes abnormal when the input voltage drops below a threshold. For self-recovery types, the IC can become unstable by repeatedly stopping and starting near the threshold voltage, so a protection circuit with hysteresis is used to create a voltage difference between the stop and restart points.

Key word：

ROHM

Release time：2024-10-08 14:42 reading：721 Continue reading>>

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How to Discharge a Capacitor : A Step-by-Step Guide

　　Capacitors are essential components in electronic circuits, storing electrical energy for later use. However, when working with capacitors, it’s crucial to handle them properly to ensure safety and prevent damage. One important aspect of working with capacitors is “How to Discharge a Capacitor”. In this guide, we’ll walk you through the steps to safely discharge a capacitor, why it’s necessary, and the precautions you should take.　　What is capacitors?Before diving into the discharge process, it’s helpful to understand what capacitors are and how they function. A capacitor is an electrical component that stores and releases energy in the form of an electric charge. It consists of two conductive plates separated by an insulating material called a dielectric. When a capacitor is charged, it holds a voltage difference between its plates, which can persist even after power is disconnected.　　Why Discharge a Capacitor?1. Safety: Capacitors can retain a significant amount of charge even after the power is turned off. Discharging a capacitor is crucial to avoid electric shocks or damage to electronic components.　　2. Maintenance and Repair: When servicing electronic devices, discharging capacitors ensures that there are no residual charges that could interfere with repairs or adjustments.　　3. Circuit Design: In some cases, you might need to discharge a capacitor to reset or test electronic circuits.　　How to discharge a capacitor?1. Safety First: Power Off the Device　　– Unplug the Device: Ensure the device or circuit is completely disconnected from the power source. This is the most critical step in preventing electrical shocks.　　– Wait for a Safe Period: Even after disconnecting power, give the capacitor some time to self-discharge. However, don’t rely solely on this; always use proper discharge methods.　　2. Use Proper Discharge Tools　　– Discharge Tool: For high-voltage capacitors, it’s advisable to use a dedicated capacitor discharge tool, which often includes a resistor to safely dissipate the charge.　　– Insulated Tools: For lower-voltage capacitors, you can use insulated screwdrivers or pliers.　　3. Discharge Process　　– Connect the Discharge Tool: If using a discharge tool with a resistor, connect it across the capacitor’s terminals. If using a screwdriver, carefully touch the insulated handle to both terminals, ensuring you don’t touch the metal parts directly.　　– Hold for a Few Seconds: Allow the tool to stay in contact with the terminals for several seconds to ensure the capacitor is fully discharged.　　4. Verify the Capacitor is Discharged　　– Use a Multimeter: To confirm that the capacitor is completely discharged, use a multimeter to check the voltage across the terminals. A reading close to 0 volts indicates that the capacitor is safe to handle.　　5. Dispose of or Store Safely　　– Handling: Once discharged, handle the capacitor with care. If it’s to be reused, store it in a safe location where it won’t accidentally get recharged or come into contact with conductive materials.　　– Disposal: If you need to dispose of the capacitor, follow local electronic waste disposal regulations to ensure environmentally responsible handling.　　Precautions　　– Never Short the Terminals Directly: Directly shorting the capacitor terminals with a metal object can cause sparks, heat, and potential damage.　　– Use Insulated Equipment: Always use tools with proper insulation to avoid accidental electric shocks.　　– Handle with Care: Even discharged capacitors can have residual charges. Handle them carefully to avoid any accidental charge buildup.　　ConclusionDischarging a capacitor is a straightforward but essential task when working with electronic devices. By following these steps and taking the necessary precautions, you can ensure both your safety and the proper functioning of your electronic components. Always prioritize safety and use the appropriate tools to handle capacitors effectively. With these practices, you’ll be better equipped to handle capacitors in various electronic applications.

Key word：

capacitors

Release time：2024-09-25 15:20 reading：688 Continue reading>>

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ROHM's 4th Generation SiC MOSFET Bare Chips Adopted in Three EV Models of ZEEKR from Geely

　　ROHM has announced the adoption of power modules equipped with 4th generation SiC MOSFET bare chips for the traction inverters in three models of ZEEKR EV brand from Zhejiang Geely Holding Group (Geely), a top 10 global automaker. Since 2023, these power modules have been mass produced and shipped from HAIMOSIC (SHANGHAI) Co., Ltd. - a joint venture between ROHM and Zhenghai Group Co., Ltd. to Viridi E-Mobility Technology (Ningbo) Co., Ltd, a Tier 1 manufacturer under Geely.　　Geely and ROHM have been collaborating since 2018, beginning with technical exchanges, then later forming a strategic partnership focused on SiC power devices in 2021. This led to the integration of ROHM’s SiC MOSFETs into the traction inverters of three models: the ZEEKR X, 009, and 001. In each of these EVs, ROHM’s power solutions centered on SiC MOSFETs play a key role in extending the cruising range and enhancing overall performance.　　ROHM is committed to advancing SiC technology, with plans to launch 5th generation SiC MOSFETs in 2025 while accelerating market introduction of 6th and 7th generation devices. What’s more, by offering SiC in various forms, including bare chips, discrete components, and modules, ROHM is able to promote the widespread adoption of SiC technology, contributing to the creation of a sustainable society.　　ZEEKR Models Equipped with ROHM’s EcoSiC™The ZEEKR X, which features a maximum output exceeding 300kW and cruising range of more than 400km despite being a compact SUV, is attracting attention even outside of China due to its exceptional cost performance. The 009 minivan features an intelligent cockpit and large 140kWh battery, achieving an outstanding maximum cruising range of 822km. And for those looking for superior performance, the flagship model, 001, offers a maximum output of over 400kW from dual motors with a range of over 580km along with a four-wheel independent control system.　　About ZEEKRZEEKR was launched in 2021 as the dedicated EV brand of Geely, a leading Chinese automaker that also owns well-established premium brands such as Volvo Cars and Lotus Cars. The name ZEEKR combines ZE, representing ZERO, the starting point of infinite possibilities, E for innovation in the electric era, and KR, the chemical symbol for krypton, a rare gas that emits light when energized. ZEEKR’s philosophy centers on harmonizing humanity, technology, and nature, aiming to redefine the perception of electric vehicles through innovative designs and technologies. The brand has garnered praise in markets outside of China, including in the US and Europe, for its impressive driving performance and range, with plans to expand sales to Western and Northern Europe.　　Please visit ZEEKR's website for more information: https://zeekrglobal.com/　　Market Background and ROHM’s EcoSiC™In recent years, there has been a push to develop more compact, efficient, lightweight electric systems to expand the adoption of next-generation electric vehicles (xEVs) and achieve environmental goals such as carbon neutrality. For electric vehicles in particular, improving the efficiency of the traction inverter, a key element of the drive system, is crucial for extending the cruising range and reducing the size of the onboard battery, heightening expectations for SiC power devices.　　As the world’s first supplier to begin mass production of SiC MOSFETs in 2010, ROHM continues to lead the industry in SiC device technology development. These devices are now marketed under the EcoSiC™ brand, encompassing a comprehensive lineup that includes bare chips, discrete components, and modules. For more information, please visit the SiC page on ROHM’s website: https://www.rohm.com/products/sic-power-devices 　　EcoSiC™ BrandEcoSiC™ is a brand of devices that utilize silicon carbide (SiC), which is attracting attention in the power device field for performance that surpasses silicon (Si). ROHM independently develops technologies essential for the evolution of SiC, from wafer fabrication and production processes to packaging, and quality control methods. At the same time, we have established an integrated production system throughout the manufacturing process, solidifying our position as a leading SiC supplier.　　EcoSiC™ is a trademark or registered trademark of ROHM Co., Ltd.　　Supporting InformationROHM is committed to providing application-level support, including the use of in-house motor testing equipment Additionally, by clicking on the URL below, users can access various supporting contents on ROHM’s website that facilitate the evaluation and introduction of 4th generation SiC MOSFETs, such as SPICE and other design models, simulation circuits for common applications (ROHM Solution Simulator), and evaluation board information.　　https://www.rohm.com/products/sic-power-devices/sic-mosfet#supportInfo

Key word：

ROHM

Release time：2024-09-03 10:42 reading：704 Continue reading>>

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simcom：MWC Shanghai 2024: A New Avenue for 5G Popularization

　　Under the theme "Future First," as we all know, 5G-Advanced is the next step in the evolution of cellular technologies, enabling advanced use cases for various verticals such as government and security, transportation, oil and gas, airlines and logistics, and healthcare to realize the full potential of 5G.　　As a hallmark technology of 5G evolution, RedCap has garnered extensive attention from the industry since its inception during MWC Shanghai. 5G RedCap offers advantages such as lowering the complexity, cost, size, and power consumption of 5G products. This not only fills the middle ground of 5G capabilities but also opens a new avenue for 5G to empower various industries.　　At MWC Shanghai, SIMCom aims at 5G ultra-high-speed scenarios and has the 5G module series SIM8270 and SIM8390, providing a maximum speed of over 10Gbps. These modules are suitable for applications that have strict requirements on speed and latency, such as broadband access, video monitoring and industrial control.　　Also, SIMCom has launched the SIM8230 and SIM8230-M2 series RedCap modules based on the Qualcomm platform. The SIM8230 module supports multi-frequency bands for 5G R17 SA, comes with a variety of functional interfaces for external device expansion, and boasts advantages such as lightweight, energy efficiency, compactness, and cost-effectiveness. It can be widely utilized in various domains including 5G CPE, wearable devices, industrial routers, high-definition streaming devices, AR/VR, drones, and remote-controlled robots.　　SIMCom has already fully deployed and accelerated the commercial scale of 5G RedCap. As market recognition of RedCap technology continues to increase, the popularization of 5G will further accelerate. SIMCom is committed to developing more diverse and reliable products based on advanced technology, promoting the large-scale commercialization of technologies like 5G RedCap, and contributing to the digital transformation and development of various industries with 5G technology.

Key word：

simcom

Release time：2024-08-27 15:56 reading：923 Continue reading>>

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Renesas Launches Ultra-Compact Sensor Module for Smart Air Quality Monitoring at Homes, Schools and Public Buildings

　　Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today introduced an advanced all-in-one sensor module designed for indoor air quality monitoring. The RRH62000, the first multi-sensor air quality module from Renesas, integrates multiple sensor parameters in a compact design and accurately detects different particle sizes, volatile organic compounds, and gasses harmful to human health. With a Renesas microcontroller (MCU) on board, the module offers an intelligent sensor management solution for a growing market of air monitoring applications, including air purifiers, smoke detectors, HVAC systems, weather stations, and smart home systems. Its robust firmware also enables customer products to comply with various air quality standards around the world.　　The RRH62000 features one of the smallest footprints in its class of sensor modules, measuring only 46.6 x 34.8 x 12 mm. It packs Renesas’ RA Family MCU and seven sensor signals: the laser-based PM1/ 2.5/ 10 sensor, ZMOD4410 gas sensor, and the HS4003 humidity and temperature sensor. Together, these sensors can detect particulate matter, total volatile organic compounds (TVOC), estimated CO2, temperature, and humidity all in one system. All key components have been pre-integrated and fully calibrated at the factory, allowing developers to start their sensor system designs right out of the box.　　"Our RRH62000 module represents the next step in sensor fusion technology, which combines data from multiple sensors and turns it into comprehensive and actionable insights for environmental monitoring," said Uwe Guenther, Sr. Director, Modules and Solutions Product Line at Renesas. "We are dedicated to providing integrated sensing solutions that simplify development for customers and will continue to drive innovation in sustainable products that reduce environmental impact and enhance safety and comfort in our lives."　　Public interest in air quality and its effects on health has increased significantly since the COVID-19 pandemic. People are now more aware of how air pollutants can affect respiratory health and overall well-being. Less known is that pollutants are typically six to ten times more concentrated indoors than outdoors. These include dust, paint fumes, smoke from cooking, pollen, and particulates from HVAC filters, which can enter the respiratory system and cause lung damage, cancer, and other health problems.　　In order to meet these new challenges, Renesas’ new sensor module is equipped to monitor a broad range of air quality conditions. Using laser-based technology, which offers higher precision compared to conventional LED methods, it can monitor concentrations of PM1, PM2.5, and PM10 particulates -- particles with diameters of 0.3- to 10µm -- as well as absolute or relative TVOC measurements in different power mode settings, providing the highest level of accuracy for these pollutants. The RRH62000 delivers seven sensor outputs simultaneously, and its onboard MCU allows the system to detect surrounding air quality data in real time.　　The RRH62000 combo module comes with building standard firmware plus artificial intelligence (AI) algorithms, which lets engineers configure the sensors to conform to the requirements of various green air quality standards in public buildings, such as The Well Building Standard (WELL), Home Ventilating Institute (HVI) and RESET. With these features, for example, a school in China can use the same hardware as one in the U.S. or another location and simply update the AI-enabled firmware for its needs.　　Intelligent sensor devices, such as the Renesas RRH62000 and recently announced RRH46410 gas sensor module, can support demand-controlled ventilation, allowing HVAC systems to adjust airflow based on carbon dioxide levels and occupancy information to maintain optimal air quality and energy efficiency. Similarly, these modules use AI algorithms to predict when HVAC filters must be replaced or detect an anomaly before system failure occurs, significantly saving cost and time for system maintenance.　　Key Features of the RRH62000 All-in-One Sensor Module　　Up to 7 simultaneous sensor outputs　　Laser-based technology for accurate detection of PM1, PM2.5, PM10　　Metal oxide-based gas sensor　　Precise temperature and humidity sensor　　Absolute measurement of TVOC　　Estimated CO2 for low-cost CO2 room indication　　Ultra-compact size: 46.6 x 34.8 x 12mm to fit in many applications　　On-board MCU for smart sensor management　　Robust & Siloxane resistant　　Support I²C and UART communication　　Winning Combinations　　Renesas has combined the RRH62000 with numerous compatible devices from its portfolio to offer a wide array of Winning Combinations. This includes the In-home Air Quality Monitoring System and Air Quality Monitor (PM2.5) with Secure Cloud Connection, which combine the RRH62000 with the RA6M3 and RL78/G14 MCUs, and various power devices to enable cost-efficient, compact, modular solutions for modern appliances. These Winning Combinations are technically vetted system architectures designed from mutually compatible devices that work together seamlessly to bring an optimized, low-risk design for faster time to market. Renesas offers more than 400 Winning Combinations with a wide range of products from the Renesas portfolio to enable customers to speed up the design process and bring their products to market more quickly. They can be found at renesas.com/win.　　Availability　　The RRH62000 is available today along with the RRH62000-EVK evaluation kit. The RRH46410 and the RRH46410-EVK are also available. Please contact your local sales teams for more details. A blog about the new air quality sensor module is also available on the Renesas website.

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Renesas

Release time：2024-08-26 14:10 reading：1238 Continue reading>>

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