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ROHM Develops Automotive Primary LDOs: Leveraging Original QuiCur™ Technology to Achieve Industry-Leading* Load Response Characteristics

　　ROHM has developed 45V rated 500mA output primary LDO regulators: BD9xxM5-C (BD933M5EFJ-C / BD950M5EFJ-C / BD900M5EFJ-C / BD933M5WEFJ-C / BD950M5WEFJ-C / BD900M5WEFJ-C). These devices are suitable for supplying power to automotive electronic components such as ECUs that operate from vehicle batteries.　　In recent years, the number of onboard power supply system and functions continues to grow as electrification in the automotive industry progresses. This increases the demand for primary LDOs that can directly step down the battery voltage to MCUs and other components used in ECUs. However, the energy supplied by the vehicle’s lead-acid battery is often subject to sudden voltage fluctuations, which primary LDOs are required to provide with excellent line-transient response in these conditions.　　At the same time, ECUs and other downstream devices often experience load current variations during operation, that also demand excellent load-transient response characteristics. A high frequency response is essential for fast output voltage recovery, but it has been difficult to provide sufficient phase margin at the same time to ensure stable operation. In response, ROHM developed a novel solution that addresses these challenges.　　The BD9xxM5-C incorporates original QuiCur™ high-speed load response technology that delivers excellent response characteristics to load current fluctuations. For example, the LDO can maintain output to within 100mV of set voltage even as the load changes between 0 and 500mA in 1μs (Rise time/Fall time). Furthermore, low 9.5µA (typ.) current consumption contributes to lower power consumption in automotive applications. These new products will be available in four packages, ranging from the compact HTSOP-J8 to the high heat dissipation TO252 (TO252-3/TO252-5) and HRP5 types. This allows users to select the most suitable package for each use case.　　Going forward, ROHM will continue to improve reliability while reducing power consumption in automotive applications by developing products utilizing its strengths in analog and other technologies.　　Product LineupThe new BD9xxM5-C meets the basic requirements for automotive products, including 150°C operation and qualification under the AEC-Q100 automotive reliability standard. A wide range of packages will be available to select from depending on the application environment, all featuring excellent response performance and low current consumption using proprietary QuiCur™ technology.　　The lineup will be expanded to comprise a total of 18 models, (including the TO252-3, TO252-5, and HRP5 packages) by FY2024.　　Application ExamplesSuitable for a wide range of automotive applications such as ECUs that operate on vehicle primary power supply systems.　　• Powertrain: Fuel Injection (FI), Tire Pressure Monitoring System (TPMS)　　• Body systems: Body Control Modules　　• Infotainment: Instrument Clusters, Head-Up Displays (HUDs)　　QuiCur™ High-Speed Load Response TechnologyQuiCur™ is the name of ROHM’s proprietary ‘Quick Current’ high-speed load response circuit capable of maximizing load response characteristics (response performance) without causing instability in the feedback circuits of power supply ICs.　　Stable operation of the power supply IC is also possible with minimal output capacitance. And in the case of switching regulators, which are a type of power supply IC, it is possible to linearly adjust the capacitance and output voltage fluctuation to easily achieve stable operation even when the capacitance is changed due to specification changes, significantly reducing the number of person-hours required for power circuit design - both in terms of decreasing component count and ensuring stable operation.　　Click on the URL below for more information on QuiCur™ Technology.　　https://www.rohm.com/news-detail?news-title=rohm-establishes-quicur-that-maximizes-the-response-performance-of-power-supply-ics&defaultGroupId=false　　• QuiCur™ is a trademark or registered trademark of ROHM Co., Ltd.　　Support ToolsROHM Real Models are high accuracy SPICE models that utilize original model-based technology to faithfully reproduce the electrical and temperature characteristics of the actual IC, resulting in a perfect match between the IC and simulation values. This ensures reliable verification, contributing to more efficient application development - for example by preventing rework after prototyping.　　ROHM Real Models are now available on ROHM’s website (see link below).　　https://www.rohm.com/products/power-management/linear-regulators/single-output-ldo-regulators?page=1&PS_ProductSeries=BD9xxM5%20series&PS_SpiceLink=1.0#parametricSearch　　Online Sales InformationSales Launch Date: February 2024　　Pricing: $1.5/unit (samples, excluding tax)　　Online Distributors: DigiKey, Mouser and Farnell　　The products will be sold at other online distributors as well.　　Applicable Part Nos: BD950M5EFJ-C, BD933M5WEFJ-C, BD950M5WEFJ-C, BD900M5WEFJ-C　　TerminologyPrimary　　In a power supply circuit, the side in charge of 1st stage conversion from a power source such as a battery is called the primary and the side responsible for 2nd stage conversion referred to as the secondary.　　LDO Regulator (Low Drop Out/Low Saturation Regulator)　　A type of power supply IC that converts between two different DC voltage levels. Falls under the category of linear regulator (where the input/output voltages operate linearly) characterized by a small input-output voltage difference. Compared to DC-DC converter ICs (switching regulators), LDOs feature a simpler circuit configuration and lower noise.　　Load Current　　From the point of view of the power supply ICs, all electronic circuits in the subsequent stages, including MCUs and sensors, can be considered “loads”. When these loads operate, a (load) current flows, causing the output voltage of the power supply IC to undershoot (drop) or overshoot. Load transient response characteristics refer to the response time until the changed voltage due to load current is restored and the power supply stabilizes.

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ROHM

Release time：2024-03-27 11:07 reading：521 Continue reading>>

3PEAK Partners with I<span style='color:red'>AR</span> to Build a New Embedded Development Ecosystem！

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3PEAK Partners with IAR to Build a New Embedded Development Ecosystem！

　　On January 18, 2024, 3PEAK and IAR jointly announced that IAR's flagship product, IAR Embedded Workbench for Arm, fully supports 3PEAK's mainstream TPS32 mixed-signal microcontrollers, giving developers a more complete and efficient development solution.　　Based in China, 3PEAK provides analog chips alongside embedded processors and solutions and has sales and technical support networks across the USA, Europe, Japan, South Korea, and Taiwan (China). After years of deep exploration in the signal chain and power management domains, 3PEAK ventured into the embedded processor sector and achieved notable success.　　Following two years of dedicated research and development, and through careful process selection and strict quality control efforts, 3PEAK successfully launched its first mixed-signal MCU platform. The TPS32 Series is the flagship brand of 3PEAK's independently developed mixed-signal microcontrollers. Through our deep understanding of vertical applications and continuous exploration of customer needs, 3PEAK introduced the TPS325M0 Series and TPS325M5 Series to serve a broad range of industrial applications, which have rapidly earned widespread adoption and praise from leading industry customers.　　The IAR Embedded Workbench remains the optimal solution for many embedded software developers worldwide. This powerful toolkit provides comprehensive and efficient support for millions of developers. It enables developers to fully utilize code optimization features and offers a range of powerful debugging functions, including code and data breakpoints, runtime stack analysis, and call stack visualization. Additionally, the IAR Embedded Workbench features C-STAT, a static code analysis tool, and C-RUN, a dynamic code analysis tool, to help developers identify potential issues early and improve code quality. Notably, IAR also offers a TÜV SÜD-certified functional safety version that meets functional safety certification standards like ISO 26262. This version is an important tool for developers of functional safety products.　　Ms. Chen Lihua, Senior Director of the 3PEAK MCU BU, said,　　"While we are focused on providing high-quality devices, 3PEAK is also committed to creating an easy-to-use, high-quality, comprehensive, and open hardware and software development ecosystem for users. We are honored to be able to establish a partnership with renowned toolchain provider IAR. Our relationship has just started, but we expect to make steady progress. IAR's comprehensive support for 3PEAK devices and 3PEAK's full TPS32 SDK software package based on the IAR Embedded Workbench for Arm are just the first results of our work together. We believe that soon we will expand our collaboration with IAR into more areas to build a new embedded development ecosystem and create genuine value and convenience for our customers.　　Kiyo Uemura, Vice President of IAR Asia-Pacific Region, expressed,　　We are delighted to partner with 3PEAK, and we look to the future with confidence and anticipation. We have long recognized China's key position in the global market, with its vast potential and endless opportunities. As both a listed and domestically influential semiconductor company, 3PEAK possesses powerful technical capabilities and persistently pursues innovation. Our collaboration with 3PEAK highlights our mutual trust. Both companies will leverage their technical strengths in their respective fields to build a vibrant embedded ecosystem, as well as provide developers with world-class development tools and original manufacturer technical support.

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3PEAK

Release time：2024-03-22 14:51 reading：1962 Continue reading>>

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Chip-on-Board (COB) vs. Package-on-Package (PoP)- Comparison and Applications

　　The ever-evolving landscape of electronic devices demands innovation in packaging technologies. Among the array of approaches available, two prominent methods stand out: Chip-on-Board (COB) and Package-on-Package (PoP). These techniques play pivotal roles in the assembly, functionality, and miniaturization of electronic components, each with distinct advantages and applications.　　Chip-on-Board (COB)　　COB is a packaging technique that involves mounting bare semiconductor chips directly onto a substrate or a Printed Circuit Board (PCB). This method eliminates the use of individual packaging for each chip, opting instead for direct bonding or soldering onto the board’s surface. By doing so, COB reduces space requirements and enhances heat dissipation efficiency.　　One of COB’s key strengths lies in its compactness. By eschewing traditional packaging, this approach significantly reduces the overall size of electronic devices, making it ideal for applications where space is a constraint. Moreover, the direct connection between the chip and the substrate minimizes signal interference, enhances electrical performance, and reduces circuit inductance and resistance.　　COB technology finds widespread use across various industries. In automotive applications, COB is often utilized in LED lighting modules, offering higher brightness levels and superior thermal management due to the close arrangement of LED chips. Additionally, COB’s cost-effectiveness makes it appealing for applications where simplicity in circuitry is essential.　　Package-on-Package (PoP)　　In contrast to COB, Package-on-Package (PoP) involves vertically stacking multiple packaged chips within a single device. This configuration enables the integration of different functionalities or components, such as memory and processors, into a compact assembly. The stacking of chips facilitates enhanced performance without increasing the device’s footprint.　　PoP’s primary advantage lies in its versatility. By vertically stacking chips, PoP allows for better integration of various components, leading to improved performance and reduced signal distortion due to shorter interconnection paths. This technology excels in accommodating diverse functionalities within limited space, making it a preferred choice for applications where performance and miniaturization are critical factors.　　Mobile devices, particularly smartphones and tablets, heavily leverage PoP technology. These devices require high-performance capabilities within a confined space. PoP facilitates the integration of memory chips and processors, enabling seamless multitasking and high-speed data transfer without compromising on performance.　　Chip-on-Board (COB) vs. Package-on-Package (PoP)- Comparison and ApplicationsWhen weighing the advantages of COB and PoP, the choice between the two largely depends on specific design requirements and application needs. COB’s strengths in compactness, cost-effectiveness, and thermal management make it suitable for applications where space optimization and simplicity in circuitry are crucial.　　Conversely, PoP’s versatility in accommodating multiple functionalities within a confined space makes it ideal for devices requiring high performance without sacrificing miniaturization. Industries such as mobile technology heavily rely on PoP to enhance the capabilities of their devices while maintaining a compact form factor.　　ConclusionBoth Chip-on-Board (COB) and Package-on-Package (PoP) are indispensable packaging technologies in the realm of modern electronics. Understanding their differences enables manufacturers and designers to make informed decisions based on specific requirements, contributing to the development of innovative and efficient electronic devices catering to diverse consumer needs.　　By harnessing the capabilities of COB and PoP, the electronics industry continues to evolve, providing consumers with increasingly powerful yet compact devices across various applications, from consumer electronics to automotive and beyond.

Key word：

Chip

Release time：2024-03-21 16:32 reading：736 Continue reading>>

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GigaDevice Partners with SEGGER to Provide emWin GUI Software

　　GigaDevice and SEGGER announce their collaboration to provide customers with SEGGER emWin embedded system graphics library, free of charge. GigaDevice customers can now use emWin , as well as AppWizard, across all GD32 Cortex®-M series MCUs.　　With GD32, the largest Arm®-based MCU product family in China, GigaDevice was first to launch MCUs containing Cortex®-M3, -M4, -M23, -M33, and -M7 cores. With this, GigaDevice achieves comprehensive coverage of mainstream microcontroller applications, from low energy to ultra-high performance, covering consumer to automotive grade whilst adopting the latest architectures, keeping costs low, and offering rapid real-time response. The GD32 family has 46 product series and more than 600 devices, maintaining excellent compatibility throughout.　　SEGGER emWin is a cutting-edge, high-performance graphical user interface solution, optimized for minimum memory consumption, both in RAM and ROM, as well as for high speed and versatility. It provides high-quality graphic functions and can be adapted to any size display, physical or virtual. It is compatible with single-task and multitask environments, with a proprietary operating system or with any commercial RTOS such as SEGGER embOS and embOS-Ultra.　　SEGGER award-winning AppWizard enables the creation of highly efficient and high-quality graphical user interfaces on any embedded system without requiring in-depth knowledge of the emWin graphics library or even the C language for coding.　　Providing extensive ecosystem support is a crucial aspect of GigaDevice's MCUs. Utilizing the emWin tool further enhances graphical user interface solutions offered by GD32 Cortex®-M series MCU. SEGGER emWin can help developers achieve professional embedded GUI in a short time, and also has excellent performance on resource-limited platforms. In the end, the corresponding C language program code is generated, which can greatly reduce the development difficulty and the time to market. Drawing on decades of expertise in embedded technology and a comprehensive suite of tools for embedded systems, SEGGER continues to enhance the user experience for GD32 customers by offering greater convenience and efficiency. Furthermore, SEGGER will strengthen the collaboration with GigaDevice to jointly assist customers in accelerating their product launches.　　Visit GD32 website or SEGGER Website (Partner page for GigaDevice) for a free commercial GDemWin GUI library that enables professional embedded GUI development based on the GD32 Cortex®-M series MCU hardware platform.　　About GigaDevice　　GigaDevice Semiconductor Inc. (SSE Stock Code 603986) is a global leading fabless supplier. The company was founded in April 2005 and headquartered in Beijing, China, with branch offices in many countries and regions worldwide, providing local support at customers' fingertips. Committed to building a complete ecosystem with four major product lines – Flash memory, MCU, sensor and analog – as the core driving force, GigaDevice can provide a wide range of solutions and services in the fields of industrial, automotive, computing, consumer electronics, IoT, mobile, networking and communications. GigaDevice has received the ISO26262:2018 automotive functional safety ASIL D certification, as well as ISO9001, ISO14001, ISO45001, and Duns certifications. In a constant quest to expand our technology offering to customers, GigaDevice has also formed strategic alliances with leading foundries, assembly, and test plants to streamline supply chain management.

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GigaDevice

Release time：2024-03-15 15:10 reading：1980 Continue reading>>

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Nidec Machine Tool Develops World-first Polish (Grinding) Method to Process Internal Gears for Mass-production

　　Nidec Machine Tool Corporation (“Nidec Machine Tool” or the “Company”), a group company of Nidec Corporation, today announced that it has developed the world’s first high-accuracy polishing (grinding) method to machine internal gears for mass production that are used for automobiles’ drive units and transmissions and for robots’ joints. While there are already high-accuracy polish-machining methods for external gears for mass-production, no such methods have been available for internal gears. After conducting research focused on this point, the Company has achieved positive results to secure the level of accuracy and production that conventional grinding, honing, or skiving methods could not.　　Though the planetary gear mechanism boasts such merits as high efficiency, high load capacity, and compactness, gears used in the mechanism are required to be high-quality, as even a slight distortion in the gears as the mechanism’s components affects the durability and transmission efficiency, and may cause noise and vibration. As a growing number of products become electrified and automated, and as the needs for highprecision gears increase accordingly, the Company has realized this new machining method fast, and release it to contribute to improving gears’ durability, transmission efficiency, and NVH (noise, vibration, and harshness) performance.　　This latest R&D project identified and derived machining conditions based on Nidec Machine Tool’s processing machines and technologies. This project is part of the joint research with Germany’s RWTH Aachen University. For more details on the project, please see the attached paper.　　Processing machine: The Company used ZI20A, the grinding machine that it used its unique technology and launched in 2009 for internal gears for mass production. This machine can process internal gears with high precision to the degree of productivity required for their mass production.　　Selection of grinding stones for polishing: The Company selected grinding stones, which are consumables, based on its preliminary assessment of their availability, economic efficiency, and suitability for autonomous driving.　　Specifying machining conditions: By targeting Ra0.1µm and Rz1.0µm or less (a general surface roughness index for polish machining), the Company derived high-efficiency machining conditions that would maintain the post-polish gear accuracy of ISO levels 3 - 5, while preventing grinding burn.　　With its world-leading gear-machining technology, Nidec Machine Tool provides machines, tools, and machining solutions to stay committed to contributing to solving social issues.

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Nidec

Release time：2024-03-13 11:43 reading：1398 Continue reading>>

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Murata’s Latest Partnership Aids IoT Development, Enabling M.2 Wireless Module Integration for STM32 Nucleo Boards

　　Murata, a leading electronics manufacturer, in collaboration with Infineon are pleased to announce a new IoT development solution. This comprehensive innovation allows Murata’s Infineon-based Wi-Fi® and Bluetooth® modules to seamlessly integrate with a wide range of STM32 Nucleo-144 boards, helping to reduce the time-to-market for many wireless-enabled applications.　　The joint project is built on the collaboration with Infineon and Murata. / By combining each company’s extensive expertise, the collaboration has engineered a complete hardware and software solution that addresses a number of IoT development requirements. At its core, the platform solution allows STM32 microcontroller to connect Murata M.2 wireless modules featuring Infineon chipsets. Providing the hardware connection is Murata’s new Nucleo-144 to M.2 adapted board, while software integration is enabled through Infineon AIROC™ STM32 Expansion Pack. Whether you are evaluating low-power implementations, such as wearables and battery-powered devices, or high-performance deployments, such as industrial equipment and smart homes, this exciting solution creates a more efficient evaluation process.　　Murata Nucleo-144 to M.2 Adapter board　　Providing physical M.2 support for STMicroelectronics STM32 Nucleo board for microcontrollers, including the popular STM32U5 and STM32H5 series, is the Murata Nucleo-144 to M.2 adapter board. This innovative PCB-based adapter effortlessly mounts to the STM32 and features a convenient top-mounted M.2 socket. The M.2 dock grants effortless physical integration and swapping of Embedded Artists Murata M.2 modules which use Infineon chipsets. This allows the STM32 to accept a wide range of Wi-FiWi-Fi® and Bluetooth® combination units, including Wi-Fi 4, Wi-Fi 5 and industrial grade modules.　　AIROC™ STM32 Expansion Pack　　Produced by Infineon, a leading global semiconductor manufacturer, Infineon AIROC™ STM32 Expansion Pack provides the framework required to facilitate the Murata hardware. Using the Common Microcontroller Software Interface Standard (CMSIS), the AIROC™ STM32 Expansion Pack enables the integration of Infineon based Wi-Fi® and Bluetooth® module with STM32 STM32Cube ecosystem, including STM32CubeMX tool. Within the semiconductor industry, CMSIS establishes a consistent approach for software components, hardware parameters and code, helping to increase development productivity. Documentation, libraries and example projects are also available on Infineon’s dedicated Expansion Pack GitHub page,helping to support the quick deployment of your hardware environment.　　Innovation Through Collaboration　　Through the Infineon AIROC™ STM32 Expansion Pack, engineers can leverage an effective design environment to evaluate a range of Murata M.2 wireless modules (featuring Infineon chipsets) with STM32 Nucleo boards. With full support from dependable hardware, extensive documentation and example libraries, this comprehensive solution is the perfect tool for accelerating IoT development across an extensive variety of applications.　　Comment from Infineon　　Neil Chen, Director, Wi-Fi Product Line Marketing, IoT Compute and Wireless Business Unit at Infineon said “To reduce the barrier to entry for first-time IoT developers, semiconductor and module companies must come together to offer simple, easy-to-use and ease-to-productize solutions to market. Our collaboration with Murata does just that by leveraging our industry-leading AIROC™ Wi-Fi and Bluetooth portfolio to simplify the development of next-generation IoT products for a variety of applications.”　　Comment from Murata　　Masatomo Hashimoto, Director, Connectivity Module Division, Communication and Sensor Business Division, Murata Manufacturing Co. Ltd., said “We are excited to collaborate with Infineon, a global leader in semiconductors in the IoT and power systems to deliver this innovation. Customers face many barriers when bringing connectivity products to market, but this partnership provides a solution for a variety of development challenges and reduces time-to-market for a wide range of applications.”

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Murata

Release time：2024-03-08 14:47 reading：859 Continue reading>>

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Nidec Receives “Clarivate Top 100 Global Innovator 2024” Award

　　Nidec Corporation (TSE: 6594; OTC US: NJDCY) (“Nidec” or the “Company”) announced today that it has been selected by the UK’s Clarivate Plc, a global information service provider, as a top 100 global innovator for the second consecutive year.　　Since 2012, Clarivate Plc annually gives the “Clarivate Top 100 Global Innovator” award to organizations selected as the top 100 revolutionary companies and institutions leading the world, based on the company’s own patent database to analyze various entities’ intellectual properties (IP) in the four evaluation areas of “success rate,” “geographical investment,” “influence,” and “scarcity.” This year, 38 Japanese companies have received this award.　　By building and managing a portfolio appropriate for its product life cycles’ individual stages, and by utilizing its rights, Nidec secures and enhances its internationally competitive IP portfolio to increase its IPs’ values. In particular, to realize a sustainable society, the Company develops products that help solve SDGs-related and other common social issues by riding the five big waves, i.e., “decarbonization,” “manpower saving,” “power saving,” “thermal solution,” and “digital data explosion.” At the same time, Nidec applies for patents and obtains rights to protect such products and secure competitive advantage, to transform its IP portfolio to fit the market’s needs. We believe that it is based on our active engagement in these activities that the Company was positively evaluated by Clarivate Plc via an objective assessment.　　Nidec stays committed to promoting business activities to realize a sustainable society, building an IP portfolio to secure competitive advantage, and appealing its technological and patent-based capabilities that contribute to society.

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Nidec

Release time：2024-03-07 15:45 reading：2578 Continue reading>>

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CG Power and Industrial Solutions Limited, Renesas and Stars Microelectronics, to Jointly Build Outsourced Semiconductor Assembly and Test Facility in India

　　CG Power and Industrial Solutions Limited (“CG”), a part of Tube Investments of India Limited and the Murugappa Group; Renesas Electronics Corporation, a premier supplier of advanced semiconductor solutions; and Stars Microelectronics (Thailand) Public Co. Ltd (“Stars Microelectronics”), a Thailand-based Outsourced Semiconductor Assembly and Test (OSAT) provider; had recently signed a Joint Venture Agreement (JVA) to establish a Joint Venture (JV) to build and operate an OSAT facility in India. The Union Cabinet, chaired by Prime Minister Shri Narendra Modi, approved the project of the JV under India’s Semiconductor scheme on February 29, 2024.　　The JV brings together unique capabilities of the partners with a vision to “Make in India for the World.” CG, with around 86 years of manufacturing expertise, is keen to build semiconductor capabilities and ecosystem in India. Renesas, a leading semiconductor company headquartered in Japan, will provide advanced semiconductor technology and expertise. Stars Microelectronics, a Thai based OSAT, will provide both technology for legacy packages and training and enablement.　　The JV will be 92.3% owned by CG, with Renesas and Stars Microelectronics each holding equity capital of approximately 6.8% and 0.9%, respectively. The JV plans to invest INR 7,600 crores over a five-year period, which will be financed through a mix of subsidies, equity, and potential bank borrowings as required.　　The JV will set up a state-of-the-art manufacturing facility in Sanand, Gujarat, with a capacity that will ramp up to 15 million units per day. The JV will manufacture a wide range of products – ranging from legacy packages such as QFN and QFP to advanced packages such as FC BGA, and FC CSP. The JV will cater to industries such as automotive, consumer, industrial, 5G, to name a few.　　Commenting on this new venture, Mr. S. Vellayan, Chairman, CG Power and Industrial Solutions Limited, said, “CG’s entry into the semiconductor manufacturing marks a strategic diversification for us. Our partners, Renesas and Stars Microelectronics, will make our learning curves steeper and help us focus on innovation and excellence.　　This is a very exciting phase for the entire nation, and we are very keen to build out India’s semiconductor capability and ecosystem.”　　Mr. Natarajan Srinivasan, Managing Director, CG Power and Industrial Solutions Limited, added, “It is a matter of great pride for CG to implement this project of National importance.”　　Commenting on the partnership, Mr. Hidetoshi Shibata, CEO of Renesas said, “India is a critical part of Renesas’ business. We value its innovative landscape and robust potential growth and are committed to accelerating our investment in India. By partnering with the Murugappa Group and Stars Microelectronics, we will bolster India’s semiconductor ecosystem and address the growing semiconductor demand for the customers worldwide.”　　Mr. Prompong Chaikul, Chairman of Executive Committee of Stars Microelectronics (Thailand) Public Co., Ltd added, "We are deeply honored to join forces in this thrilling venture. Leveraging our expertise and experience in OSAT, we are committed to providing robust support to ensure the success of this project in India."　　About CG Power and Industrial Solutions Limited　　CG Power and Industrial Solutions Limited is an engineering conglomerate headquartered in Mumbai, India. The Company is a leader in the Electrical Engineering Industry and has two business lines—Industrial Systems and Power Systems. It manufactures Traction Motors, Propulsion systems, Signaling Relays etc., for the Indian Railways, and wide range of Induction Motors, Drives, Transformers, Switchgears, and other allied products for the Industrial and Power sectors. Recently, the Company also made a foray into the business of Consumer Appliances such as Fans, Pumps and Water Heaters.　　The Company has world-class manufacturing plants across 9 locations in India and one in Sweden, and a Pan India network of 4 Regional and 15 Branch offices, with around 3000 employees. The Company’s consolidated revenue for FY23 was Rs 6,973 crores (USD 838 million).　　The Company continues to excel and maintain its leadership position across its businesses, backed by its outstanding expertise, customer-centric approach, and enhanced focus on innovation and sustainability.　　Since November 2020, the Company has become a part of the renowned Murugappa Group.　　About Murugappa Group　　A 123-year-old conglomerate with presence across India and the world, the INR 742 billion Murugappa Group has diverse businesses in agriculture, engineering, financial services and more.　　The Group has 9 listed companies under its umbrella — Carborundum Universal Limited, CG Power & Industrial Solutions Limited, Cholamandalam Financial Holdings Limited, Cholamandalam Investment & Finance Company Limited, Cholamandalam MS General Insurance Company Limited, Coromandel International Limited, EID Parry (India) Limited, Shanthi Gears Limited, Tube Investments of India Limited and Wendt India Limited. Brands such as Ajax, Hercules, BSA, Montra, Montra Electric, Mach City, Gromor, Paramfos, Parry’s are part of the Group’s illustrious stable.　　Abrasives, technical ceramics, electro minerals, electric vehicles, auto components, fans, transformers, signaling equipment for railways, bicycles, fertilizers, sugar, tea and several other products make up the Group’s business interests.　　Guided by the five lights — integrity, passion, quality, respect and responsibility — and a culture of professionalism, the Group has a workforce of over 73,000 employees.　　About Renesas Electronics Corporation　　Renesas Electronics Corporation empowers a safer, smarter and more sustainable future where technology helps make our lives easier. The leading global provider of microcontrollers, Renesas combines our expertise in embedded processing, analog, power and connectivity to deliver complete semiconductor solutions. These Winning Combinations accelerate time to market for automotive, industrial, infrastructure and IoT applications, enabling billions of connected, intelligent devices that enhance the way people work and live.

Key word：

Renesas

Release time：2024-03-05 13:10 reading：2705 Continue reading>>

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NOVOSENSE Launches NSI22C1x Series Isolated Comparators to Help Create More Reliable Industrial Motor Drive Systems

　　NOVOSENSE announced the launch of its NSI22C1x series isolated comparators based on capacitive isolation technology, which include NSI22C11 isolated single-ended comparators for overvoltage and overtemperature protection and NSI22C12 isolated window comparator for overcurrent protection. The NSI22C1x series can be used for overvoltage, overtemperature and overcurrent protection of industrial motor drives, solar inverters, uninterruptible power supplies and on-board chargers. While improving system reliability, it supports higher power density system designs and simplifies peripheral circuits to reduce the size of system protection circuits by 60% compared to the traditional discrete scheme.　　Industrial motor drive systems, for example, are developing towards higher efficiency, higher power density and higher reliability. At the same time, with the application of wide bandgap semiconductors represented by SiC and GaN in power devices, higher requirements are placed on system reliability, especially the response time of overcurrent and short-circuit protection. The NSI22C1x series isolated comparators launched by NOVOSENSE can meet the growing demand for high reliability, high efficiency and compact design in industrial motor systems.　　Ultra-low propagation delay and ultra-high CMTI support higher power density designs　　The application environment of industrial motor drive systems is complex and harsh. Unexpected conditions such as bridge arm shoot-through, phase-to-phase short-circuit and ground short-circuit may occur, resulting in excessive current flowing into the motor drive system and causing damage to the driver. Traditional overcurrent detection design uses a discrete scheme of general-purpose comparators and optocouplers, with a response time of 3~5µs. As power devices shift from silicon-based IGBTs to third-generation semiconductors SiC and GaN, their short-circuit withstand time has been shortened to less than 1µs, which can no longer be met by the traditional scheme.　　VIN(CH1), VOUT(CH2), VREF=320mV (protection threshold), NSI22C12 propagation delay measured 144ns　　Meanwhile, general-purpose op amps/comparators have limited common-mode voltage tolerance and are limited in applications such as DC+ overcurrent and phase current overcurrent detection. If only DC- overcurrent is monitored, the fault condition of the motor shell being shorted to ground cannot be covered. NOVOSENSE's NSI22C12 isolated comparators provide a single-chip isolated overcurrent protection scheme that can cover a more comprehensive range of fault scenarios, support a maximum propagation delay of 250ns and bi-directional overcurrent protection, and provide CMTI (Common-Mode Transient Immunity) of up to 150kV/μs, which greatly improves system reliability and supports the adoption of higher power density designs for customers' motor drive systems.　　VIN=0V, VOUT(CH1), CMTI(CH3)=150kV/μs, VOHmin =2.40V>0.7*VDD2(VDD2=3.3V)　　When the primary and secondary sides of NSI22C12 withstand a CMTI of up to 150kV/μs, the output still maintains a high level and overcurrent protection will not be mistakenly triggered.　　Simplified system designs reduce the size of system protection circuits by 60%　　In industrial motor drive systems, the bill of materials for the overcurrent protection scheme based on general-purpose comparators and optocouplers is up to 27 pieces, and the system failure rate of peripheral circuits consisting of numerous discrete devices is relatively higher. NSI22C12 integrates a high-voltage LDO with a primary-side supply range of 3.1~27V, which can help customers reduce extra step-down regulators; NSI22C12 also integrates a 100μA ±1.5% high-precision current source, which can help customers achieve ±20mV~±320mV bidirectional threshold adjustment with only a single resistor on board.　　With the support of a highly integrated design, the overcurrent protection scheme using NSI22C12 isolated comparators can reduce the bill of materials to 11 pieces and reduce the size of system protection circuits by 60%, greatly reducing the use of discrete devices, simplifying the system design, and further improving system reliability. At the same time, in some systems with fast protection requirements, using NSI22C12 isolated comparators can reduce the use of high-speed optocouplers and provide customers with more cost-effective design options.　　Typical application block diagram of NSI22C12 for bus/phase current protection in motor drive systems　　Packaging and selection　　NSI22C11 isolated single-ended comparator and NSI22C12 isolated window comparator NSI22C12 are available in both SOP8 package (for basic isolation) and SOW8 package (for reinforced isolation). In addition, the NSI22C1x series supports a wide operating temperature range of -40°C to 125°C. Currently, the industrial version of the NSI22C1x series has been put into mass production, and the AEC-Q100 automotive version is expected to be launched in the second half of 2024.

Key word：

NOVOSENSE

Release time：2024-02-28 13:58 reading：3044 Continue reading>>

Trade news

ROHM's EcoGaN™ has been adopted in the 45W Output USB-C Charger C4 Duo from Innergie, a brand of Delta

　　ROHM has announced the adoption of its 650V GaN device (EcoGaN™) in the C4 Duo, a 45W output USB-C charger from Innergie, a brand of Delta. Delta is a global provider of IoT-based Smart Green Solutions headquartered in Taiwan. ROHM’s EcoGaN™ device contributes to greater application performance, reliability, and miniaturization by providing higher efficiency in power supply systems.　　Efforts to save energy are accelerating toward achieving a sustainable society by reducing power loss, especially in equipment that handle high power. Furthermore, GaN devices that enable high-speed switching are being considered for power supplies, since high frequency operation not only saves energy but also allows the use of smaller circuits.　　Offering GaN-based devices under the brand name EcoGaN™, ROHM is advancing product development and providing solutions by focusing on mastering the use of GaN, which has high potential but is difficult to handle. For discrete products, mass production of 150V withstand GaN HEMTs began in 2022 and 650V withstand GaN HEMTs in 2023 featuring industry-leading device performance (RDS(ON) × Ciss / RDS(ON) × Coss). What’s more, integrating an ESD protection element into the GNP1150TCA-Z improves ESD breakdown tolerance by approximately 75% over standard GaN HEMTs, and has been evaluated to improve application reliability that ultimately led its adoption.　　Yuhei Yamaguchi, General Manager,　　Power Stage Product Development Dept., LSI Business Div., ROHM Co., Ltd.　　We are pleased to have ROHM's EcoGaN™ incorporated into USB-C chargers from Delta, a global leader in power and thermal management solutions. ROHM contributes to Delta’s prowess in high-energy power supplies by leveraging analog technology that maximizes power semiconductor performance and achieves superior topologies. Both companies share a similar management vision to realize a decarbonized and digital society, forming a strong partnership that resulted in the adoption of ROHM devices and ICs in Delta’s power circuit design. Furthermore, we look forward to our continued collaboration to promote greater miniaturization and efficiency in chargers and other products that can contribute to enriching people’s lives.　　Jason Chen, General Manager,　　Innergie, a brand of Delta　　The development of GaN power devices is a major focus in the global electronics industry, and therefore, we have deepened our collaboration with ROHM over the past several years. Moreover, in 2022, we initiated a strategic partnership to jointly develop next-generation power semiconductors for power supply systems. This partnership has delivered ROHM’s advanced 650V GaN (GNP1150TCA-Z) devices, which are now supporting Innergie’s new products. The C4 Duo is the first model from Innergie’s One for All Series adapters to use ROHM’s GaN devices, and we expect more models to adopt this state-of-the-art technology. We believe that, by strengthening our collaboration with ROHM, we will be able to provide customers adapters featuring higher power efficiency and capability, but with much smaller product size.　　Related Pages　　・Delta Electronics Website　　https://www.deltaww.com/en-US/index　　・Innergie Website　　https://myinnergie.com/us/product/c4-duo-45w-dual-usbc-power-adapter-fold/　　・ROHM's GaN Power Device Website　　https://www.rohm.com/products/gan-power-devices　　ROHM EcoGaN™　　Refers to ROHM’s new lineup of GaN devices that contribute to energy conservation and miniaturization by maximizing GaN characteristics to achieve lower application power consumption, smaller peripheral components, and simpler designs requiring fewer parts.

Key word：

ROHM

Release time：2024-02-27 13:51 reading：778 Continue reading>>

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