Shipments of Sensing Camera in Automotive OE Market Will Grow by 63% YoY
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Shipments of Sensing Camera in Automotive OE Market Will Grow by 63% YoY

According to the latest research by TrendForce, the demand for sensing camera in automotive OE (Original Equipment) market will see considerable growth in 2018, driven by the development of smart vehicles in high-end market and the establishment of regulations in the U.S., the EU, Japan and China. The shipments of sensing camera in automotive OE market are expected to reach 121 million units in 2018, a year-on-year growth of 63% compared with 74 million units in 2017.“The soaring demand for sensing cameras is attributed to the development of autonomous driving”, says Yvette Lin, analyst of TrendForce. Driven by advancements in artificial intelligence, communication and sensing technology, many technology companies and traditional car makers have invested in the R&D of autonomous driving. Consumers also show increasing concerns for active safety, which push the demand for advanced driver assistance system (ADAS) and sensors.Currently, car makers adopt different ADAS sensing solutions, including millimeter-wave radar, ultrasonic radar and automotive camera, etc. Particularly, camera-based solutions are gradually accepted by car manufacturers since breakthroughs have been made in image recognition algorithms and capabilities of image processing chips. Camera-based solutions, which can detect the traffic around vehicles through image recognition, are now applied in both cars with ADAS and autonomous-driving vehicles in testing.According to Lin, current mass produced cars with ADAS carry an average of 4 to 8 cameras per car. After the launch of highly-autonomous vehicle in 2020, the number of cameras embedded in each car will increase to 10 to 12. In this trend, major camera manufacturers across the world have been actively deploying in the automotive market, including Chinese companies Sunny Optical and Sunex, Taiwan-based Asia Optical and Calin, and Korean manufactures Sekonix, who have been shipping products to the first-tier car makers.In addition to the development of smart vehicles in high-end market, the establishment of regulations for vehicle safety in the U.S., the EU, Japan and China also drives the rapid expansion of market. Since 2016, forward collision warning (FCW), lane maintenance system (LDW), automatic emergency braking system (AEB), and blind spot detection system (BSD) have been mandatory for vehicles or included in the New Car Evaluation Standard (NCAP) in areas like the United States, the European Union, and Japan. Particularly, China has for the first time included a number of evaluation criteria for active safety in the 2018 version of NCAP. As the largest market of cars in the world, China witnesses increasing demand for sensing camera, which will boost the global market for automotive sensing camera. TrendForce estimates that the shipments of automotive sensing camera will reach nearly 124 million units by 2020.
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Release time：2018-06-13 00:00 reading：1289 Continue reading>>
Automotive IC Market on Pace for Third Consecutive Record Growth Year
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Automotive IC Market on Pace for Third Consecutive Record Growth Year

18.5% forecast increase in 2018 driven by systems monitoring and control, safety, ADAS, convenience, and growth of autonomous driving. Continued rise of memory ASP adds to growth.Consumer demand and government mandates for electronic systems that improve vehicle performance, that add comfort and convenience, and that warn, detect, and take corrective measures to keep drivers safe and alert are being added to new cars each year. This system growth, along with rising prices for memory components within them, are expected to raise the automotive IC market 18.5% this year to a new record high of $32.3 billion, surpassing the previous record of $27.2 billion set last year (Figure 1), according to IC Insights’ soon to be released Update to the IC Market Drivers 2018 report.  If the forecast holds, it would mark the third consecutive year of double-digit growth for the automotive IC market.Figure 1Over the past several years, the global automotive IC market has experienced some extraordinary swings in growth. After increasing 11.5% in 2014, the automotive IC market declined 2.5% in 2015, but then rebounded with solid 10.6% growth in 2016.  It is worth noting that the sales decline experienced in 2015 was primarily the result of falling ASPs across all the key automotive IC product categories—microcontrollers, analog ICs, DRAM, flash, and general- and special-purpose logic ICs, which offset steady unit growth for automotive ICs that year.IC Insights’ recently updated automotive IC market forecast shows the automotive IC market growing to $43.6 billion in 2021, which represents a compound annual growth rate (CAGR) of 12.5% from 2017 to 2021, highest among the six major end-use applications (Figure 2).Figure 2Collectively, automotive ICs are forecast to account for only about 7.5% of the total IC market in 2018, although that share is forecast to increase to 9.3% in 2021.  Analog ICs—both general-purpose analog and application-specific automotive analog—are expected to account for 45% of the 2018 automotive IC market, with MCUs capturing 23% share. There are many suppliers of automotive analog devices but a rash of acquisitions among them in recent years has reduced the number of larger manufacturers.  Some of the acquisitions that have impacted the automotive analog market include NXP, which acquired Freescale in 2015 and is now itself in the process of being acquired by Qualcomm; Analog Devices, which acquired Linear Technology in March 2017; and Renesas, which acquired Intersil.Report Details: IC Market Drivers 2018IC Market Drivers 2018—A Study of Emerging and Major End-Use Applications Fueling Demand for Integrated Circuits examines the largest, existing system opportunities for ICs and evaluates the potential of new applications that are expected to help fuel the market for ICs.IC Market Drivers is divided into two parts.  Part 1 provides a detailed forecast of the IC industry by system type, by region, and by IC product type through 2021.  In Part 2, the IC Market Drivers report examines and evaluates key existing and emerging end-use applications that will support and propel the IC industry through 2021.  Some of these applications include the automotive market, smartphones, Internet of Things, personal/mobile computing (including tablets), medical and health systems, and a review of many applications to watch like virtual reality, robotics, and drones, that may potentially provide significant opportunity for IC suppliers later this decade.  The 2018 IC Market Drivers report is priced at $3,690 for an individual-user license and $6,790 for a multi-user corporate license.
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Release time：2018-06-04 00:00 reading：1211 Continue reading>>
New Shifts In Automotive Design
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New Shifts In Automotive Design

　　Four big shifts in automotive design and usage are beginning to converge—electrification, increasing connectivity, autonomous driving and car sharing—creating a ripple effect across the automotive electronics supply chain.　　Over the past few years the electronic content of cars and other vehicles has surged, with electrical systems replacing traditional mechanical and electro-mechanical subsystems. That has been a key driver for semiconductor growth, and autonomous vehicles are the poster child of this effort. But the emergence of this market also will result in profound technological and sociological changes.　　From the design side, this is already apparent. Automotive electronics fall into the realm of functional safety, which previously was limited to medical devices and military/aerospace applications. Vehicle manufacturers are requiring that everyone in their electronics supply chain be certified as complying with relevant standards, which means that chips developed for parts of a vehicle that are not directly tied to safety now must comply with the most stringent regulations.　　“The ISO 26262 standard sets a high bar for functional verification and elimination of systematic faults, as well as the ability to handle random fault effects in operating devices,” said David Landoll, solutions architect at OneSpin Solutions. “Some EDA vendors are obtaining external certification for compliance to this standard. This makes it easier for their customers, semiconductor suppliers, to meet functional safety compliance requirements and, in turn, for subsystem and vehicle manufacturers to do the same.”　　SoC designers typically target a 10-year lifetime when it comes to reliability metrics that are based on the current usage model and mission profile, said Thomas Wong, business development director in the IP group at Cadence. “If you look at the usage model today, we drive to work, park our cars, and we drive home at 6 p.m. So you drive about 20 miles to work, park your car for 8 hours, and then drive 20 miles to go home. This is your mission profile. Adopting design constraints to reflect a changing mission profile in the automotive industry is nothing new. Consider police patrol cars or taxis. Their usage model is quite different from how the average person uses their car. For police cars and taxis, there will be heavy duty tires, beefed up suspensions, better brakes, larger batteries, different gear ratios, stronger gearboxes, and more robust starters, among other things. The main reason for including more robust mechanical and hydraulic systems on these types of vehicles is to make the vehicle last longer. With the upward trend in electric vehicles and autonomous driving, the systems that have to be more robust are not just the mechanical bits. We now have to ensure that all the semiconductor chips and SoCs that are truly the brains of the vehicles fulfill their mission based on the new usage model and mission profile,” he said.　　Add to that the combination of autonomous driving and car sharing. “With autonomous driving, you may want to send your car home so someone else at home can use it while you are at work,” said Wong. “Then at 5 p.m. you summon your autonomous vehicle to go to the office and pick you up, and you go home. With electrification, your cost per mile drops, so you are likely to see this scenario becoming a reality. Instead of two 20-mile trips, now your car will travel 4 times 20 miles, for a total of 80 miles per day.”　　A second scenario could be a car-sharing arrangement, he said. “This may be a driverless car service, and your car is making money for you while you are at the office. Therefore, your car is being used 10 hours per day. Think about the wear and tear on the vehicle. More importantly, how will that impact semiconductors used in the various systems in your car? How will these two scenarios impact semiconductor design and reliability assessment?”　　With any of these new driving scenarios emerging, more attention must be paid to use cases that were not a concern in the past. That brings in chip foundries, which now must develop process and design rules that are more robust to withstand this new level of use. And that, in turn, translates into more robust transistors, new materials for metallization, better aging models, along with more stringent guidance on design for reliability (DfR) and design for manufacturing (DfM), Wong said. “Designers may need to work more closely with foundries to understand failure mechanisms. Extended reliability models need to be developed to enable EM/IR analysis, and there must be considerations to improve SoC reliability and robustness, such as accommodating larger via coverage and a methodology for implementing redundant vias.”　　Then, requirements stipulated in AEC-Q100 must be revisited to determine if this specification needs to be updated to reflect the intensified usage models resulting from car sharing and autonomous vehicles. “We are already seeing the impact of these trends. Semiconductor foundries have deployed automotive-qualified processes. Design for reliability and design for manufacturing rules have been created. Chip companies have invested in training their engineers to be conversant in functional safety. ISO 26262 and ASIL-readiness are the new must-have buzzwords. Automotive OEMs and fabless companies are learning how to build more robust SoCs that are needed as we approach Level 3, 4 and 5 autonomous vehicles—redundancy, lock step, active safety features, functional safety verification, ASIL-ready IP blocks, more advanced EM/IR tools and more advanced fault injection tools are being deployed to keep pace with the fast-moving trend toward a driverless world.”　　Higher bandwidth required　　Alongside these shifts is a concurrent shift toward more connectivity. While much of the attention initially was focused outside the vehicle with vehicle-to-vehicle and vehicle-to-infrastructure communications, there is an increasing amount of attention being paid to moving huge volumes of data around inside of these vehicles. Automotive cameras, radar and LiDAR will be generating streaming video data, and at this point it’s uncertain where all of this data will be screened and processed. But one thing that is clear is that large amounts of data will have to be moved quickly for autonomous vehicles to avoid accidents.　　“It’s clear to the automotive industry that legacy networking solutions in the car were really challenged from a bandwidth and security perspective moving forward looking into next generation architectures from 2020 to 2025 and beyond,” said Tim Lau, senior director of product marketing for automotive Ethernet at Marvell. “That’s why the entire automotive industry has really started to look at other technologies and most specifically realized that the optimal solution for high bandwidth network connectivity in the car is automotive Ethernet.”　　This, in turn, is causing significant changes inside the automotive industry. It affects what OEMs and tier-one suppliers look for, as well as how they engage with other companies in the supply chain for next-generation ECUs, said Lau.　　Processing requirements changing　　All of that data has a significant impact on the processing requirements for automotive systems, as well. “As more decisions are made by a vehicle rather than a driver — which is becoming a requirement for some ride sharing robo-taxis — then more intelligence, and hence processing performance, is required in the vehicle’s computing platforms,” saidRobert Day, director of automotive solutions and platforms for the Embedded & Automotive Line of Business at Arm “In some cases this leads to more centralized vehicle computers that take large amounts of sensor information and do the detailed perception and decision processing, which leads to the actuation function required to take action.”　　So there is a big jump required in performance, but it still has to within the strict power, space and thermal requirements of a modern vehicle. “Other designs are pushing the perception function closer to the sensor, with the central computing engine making decisions based on information that is fed from the intelligent sensor nodes,” Day said. “In both cases, increased computing performance is required without compromising the power available in a vehicle, which leads to higher performance application CPUs provided in multi-core clusters, with additional acceleration engines such as GPUs, vision processors and machine learning processors all being built into automotive SoCs. All of these compute functions also need higher levels of safety, as the decisions and actions must be held to the same or higher safety levels as driver-initiated functions.”　　And while the ISO 26262 standard is discussed freely, there are additional regulatory or safety concerns that must also be captured in semiconductor design IP.　　“In addition to the ISO 26262 second revision that will be released later this year, and all the other established functional safety standards like IEC 61508, IEC 61511, EN 5012X series, DO-254, etc., a new regulatory framework is emerging. This is called SOTIF (Safety Of The Intended Function), which will be released under the ISO naming PAS 21448. The aim of this document is to cover the validation and the verification of systems with complex sensing and algorithms, whose limitations in performance could cause safety hazards in the absence of a malfunction. While most of the activities defined by this new guideline are at the vehicle and system level, these will have a direct effect on the requirements for SoCs and IP, driving the capturing of performance requirements directly to be allocated on these elements,” Day noted.　　Advanced nodes play a role in automotive　　There are additional impacts on the semiconductor design process from the automotive ecosystem that is barreling down the road to autonomous and connected, electric vehicle sharing.　　“We are starting to see companies planning to do tapeouts on 7nm (the most advanced finFET node today), and they are planning to do automotive chips on that technology,” said Navraj Nandra, senior director of marketing for the DesignWare Analog and MSIP Solutions Group at Synopsys. “That’s very surprising because typically people think about automotive as very stable, using technologies with very long development and qualification cycles. But that whole supply chain has totally been redone because companies like Nvidia, for example, are now providing chipsets into the automotive industry. But they’re not coming from the traditional automotive supply chain, so they’re not encumbered with all that huge overhead that the traditional suppliers have had to follow. For them, they need the latest and greatest in a very short timeframe, which has been typical of the consumer market.”　　So from an IP standpoint, automotive is driving the next generation of technology nodes, Nandra said. “As well, the amount of software and digital implementations in automotive chips has grown phenomenally. What this means is that with the digital part and the software part, you’ve still got to meet all of the functional safety requirements. People used to talk about failure-safe functional safety in the context of semiconductor chips, and now it has to do with your software, which is a very interesting topic. How do you make your software that sits on your SoC that drives some of the IP blocks functionally safe to meet the ISO26262 requirements?”　　Reliability, security requirements　　Advanced automotive applications have additional requirements beyond what many other customers do in terms of their reliability needs, or testability needs, Rob Aitken, Arm Fellow, pointed out. “For reliability, it’s divided into categories liked soft error immunity and how it performs over time, which can include how the circuit ages. Those are requirements that are often less strict than some other areas. For example on an automotive design, if it is going to sit in the car and the expected lifetime is 10 or 20 years, then you need to make sure that the memory will have enough residual performance that, as it ages and the device performance degrades, it is still going to work.”　　Increasingly, there is also the security requirement. That’s both a research topic as well as a practical application for many designs and encrypted memory. “Depending on the application, you don’t want somebody being able to steal the data,” Aitken said. “From an SRAM standpoint, that’s not always important because the chance that somebody is going to break in and steal your SRAM data is low. First of all that’s really hard to do. And second, it’s not obvious for a lot of IOT-ish applications why anyone would want to do that. But for things like DRAM, there have been situations where somebody actually freezes the DRAM chip, they take it off the board and decrypt it at their leisure. In those situations, if the contents of the DRAM are encrypted, you get useless information. But if they are in plain text, you get all kinds of interesting stuff.”　　Not all of this has to be done from scratch, though. Market segments including networking and enterprise servers have the same kinds of reliability requirements as automotive.　　“Based on the quality that is required in those networks, the equipment chips in networking must run for 10 years, so a long life,” noted Frank Ferro, senior director of product management at Rambus. “We’ve already developed our IP for very high extended temperature ranges, and have done extensive testing, so it was an easy step to move into the automotive market. The requirements are very similar, and in some cases the automotive requirements were maybe not even as stringent, depending on the types of certification as some of the networking markets.”　　The opportunities in the automotive segment in general also are driving suppliers to rethink technology in other ways, and how it can be applied here. One such area is data mining and data analysis. Automotive brings some of the most complex system design challenges to multidisciplinary engineering teams, and as such, all of the stops must be pulled out to be a success here.　　“The challenge now is not only automotive, now you not only have to verify that a design works properly, you have to flip it on its head and simulate/emulate improper behavior of the design so that in the cases that it might actually happen, the design can be modified to be able to gracefully exit from an error,” said Mark Olen, a product marketing manager at Mentor, A Siemens Business. “The mathematician in me says this is an N squared problem, and I’ll be really curious to see as we try to tackle this at what sigma level [designs get to.] Everybody realizes it’s really not practical to truly prove 100% quality, but can you do 99.9999%? The economics start playing out there at some number of one in some million. But now what happens when you’re talking about a whole network of flying cars that are self-driven?”　　Further, the only way to solve some of these problems algorithmically on the road to fully autonomous vehicles is with neural networks or non-deterministic algorithms, said  Kurt Shuler, vice president of marketing atArterisIP. “However, that is combined with functional safety, so there must be bounds because this is F=MA, and there is a heck of a lot of M in a car, and at times there is also a lot of A, too. There are real time constraints on this and it includes the traceability problem. Everybody says with software the system will get better, but then the question becomes, ‘Oh, you changed the software, you changed the system. Now you’ve got to have that car go and get certified to get running through that track all by itself.’ Is the industry going to do that? No. There is a lot that we need to do prior to this really being real.”　　This shift in thinking includes determining the best way to have the system perform the actual computing.　　“The advent of the autonomous driving sector portends, in many ways, a return to the past while making a clean break in others,” said Srikanth Rengarajan, vice president of products and business development at Austemper Design Systems. “Correct computing, for instance, has always been the assumed imperative with no variance or tolerance for deviation. DSP and similar tasks were largely ancillary tasks. In the car, the bulk of the processing for, say an ADAS chipset, is heuristic in nature. The dominant neural algorithms are based on stochastics and tolerance and deviation is assumed. For a chip designer, this shifts the focus from absolute correctness to approximate computing. Total accuracy is sought via system-level cross-checks, multi-channel computing and modular redundancy providing greater leeway to the chip designer. Since no system is completely fail-proof, designers shifted left to fail-safe, again by resorting to probabilistic interpretations of correct operation,”　　Nowhere is this more apparent than in the functional safety segment, where incorrect operation is tolerated so long as it is probabilistically limited or can be detected within a failure tolerance interval. This approach is being ingrained into the industry via the ISO26262 and related standards, Rengarajan said.　　Supply chain disruptions　　Given the number of moving pieces in the connected, electric, autonomous car-sharing model, in addition to solving the technical challenges, there may be business ramifications as well.　　“The pace of innovation for autonomous systems is increasing dramatically, which is very much changing the delivery time for new silicon for the automotive industry,” said Arm’s Day. “This change could be seen as disruptive to the supply chain, and could possibly lead to new players in the market. The growth in the amount of software in a vehicle as autonomous functions are introduced also means that Arm needs to understand and support that new ecosystem, ensuring that these huge software stacks are optimized for the Arm architecture and looking at new functions that Arm can produce to increase the performance and efficiency of the system.”　　While some believe the industry has the horizon in its line of sight, Magdy Abadir, vice president of marketing at Helic, pointed out that the full brunt of any of this has not been seen yet. “Automotive has always been an area where people are worried about reliability and safety,” he said. “Historically, it’s been more about higher quality standards, higher reliability standards, more risk-averse and conservative in adopting new technology. This is because of the fear of some disaster happening, which could end up costing someone’s life or the liability is too high and the warranties are too expensive.”　　As the technologies continue to be developed and refined, stringent standards, requirements and specifications will be put in place such that by the time connected, electric ride-sharing cars are ready, semiconductor and systems designers will have worked many of the kinks. But at least for the foreseeable future, big shifts will bring other shifts, and the result will be both significant and widespread.
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Release time：2018-04-09 00:00 reading：1195 Continue reading>>
Alibaba IoT Platform Partners with NXP for Automotive
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Alibaba IoT Platform Partners with NXP for Automotive

　　AliOS, the operating system for IoT solutions developed by China’s Alibaba Group, has entered into a partnership with NXP to install the AliOS system and NXP’s automotive infotainment solution in "millions of vehicles" in China by 2020.　　The collaboration will help build a smart cockpit enhanced by multi-screen display, artificial-intelligence-driven interaction and secure over-the-air (OTA) updates, according to the companies.　　Alibaba is said to be aiming to connect 10 billion devices by 2023on its IoT network, and it appears to be creating the ecosystem to develop this, with partnerships announced in recent months with STMicroelectronics, MediaTek and others.　　The partnership with NXP, which combines AliOS and NXP i.MX applications processors, will also explore the optimization of software and hardware design for next-generation auto e-cockpits, future car broadcasting systems and beyond.　　"Over the past three years, AliOS has been a pioneer in driving the digital transformation of cars and helping auto brands to enhance the overall user experience,” said Simon Hu, senior vice president of Alibaba Group and president of AliOS.  He added that they will strive to make cars more intelligent to better connect with the digitized road infrastructure in cities, by creating a robust platform to spur innovation and reduce the costs associated with the mass production of smart vehicles.　　“We look forward to redefining the future of the automobile sector in collaboration with our ecosystem partners such as NXP,” Hu said.　　“Alibaba and NXP share the new vision that in-vehicle experiences and consumer services will be an essential differentiator for carmakers moving forward,” said Kurt Sievers, executive vice president and general manager of NXP automotive. “Alibaba has great momentum in the development, innovation and application of automotive operating systems. We believe the partnership will bring rich opportunities to the auto industry.”　　Validation of STMicroelectronics IoT sensors　　Earlier this month, STMicroelectronics announced the validation of its LSM6DSL 6-axis inertial sensor and LPS22HB pressure sensor for Alibaba's IoT ecosystem, enabling users to create complete IoT nodes and gateway solutions.  Alibaba recently announced the release of AliOS Things v1.2, which includes a sensor-based component called uData. The ST sensors that have passed the AliOS validation have been integrated in uData and the two companies are cooperating on the development of IoT systems that aim to improve end-user experiences.　　The LSM6DSL is a system-in-package featuring a 3D digital accelerometer and a 3D digital gyroscope that operates at 0.65 mA in high-performance mode and enables always-on low-power features for an optimal motion experience for the consumer; it also features high robustness to mechanical shock. It supports main OS requirements, offering real, virtual and batch sensors with 4Kbyte for dynamic data batching.　　The LPS22HB is an ultra-compact piezo-resistive absolute pressure sensor that functions as a digital output barometer. Dust-free and water-resistant by design, the sensor enables high accuracy and low-power operation. It is available in full-mold package with silicon cap and six 20?m holes guaranteeing sensor moisture resistance, relative accuracy of pressure measurement 0.1 mbar, and very low power consumption (e.g. 12?A in Low-Noise mode).　　“The validation by Alibaba of ST’s LSM6DSL and LPS22HBsensors is an important achievement. Creating and connecting nodes quickly and securely is facilitated by the holistic platform of AliOS, which cuts time to market for users and allows them to create IoT systems in China quickly for applications in smartphones, smart watches, smart locks, smart parking and beyond. On top of this, Alibaba is collaborating closely with ST to integrate more products in the platform, offering compelling IoT solutions for customers,” said Collins Wu, marketing director, for ST's analog and MEMS Group in Greater China and South Asia.　　MediaTek IoT initiative in smart homes　　At CES earlier this year, Alibaba A.I. Labs announced a strategic collaboration with MediaTek in IoT initiatives including smart home protocols, customized IoT chips and AI smart hardware. The two parties also announced the first Smartmesh connectivity solution in China that supports the latest many-to-many Bluetooth mesh technology, in an effort to speed up the adoption of this technology in smart home settings.　　The partnership comes on the heels of the successful collaboration on Tmall Genie, the lab’s first voice-controlled smart assistant, for which MediaTek provided chip technology support. Alibaba A.I. Labs launched the smart home assistant in July last year, with an aim to provide brand new interaction experiences for Chinese consumers. More than 1 million Tmall Genie devices were sold in China during Alibaba’s Global Shopping Festival on November 11 last year.
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Release time：2018-03-30 00:00 reading：1298 Continue reading>>
Next generation <span style='color:red'>automotive</span> controller microcontroller from Renesas
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Next generation automotive controller microcontroller from Renesas

　　Renesas Electronics has announced the sample shipment of the industry's first on-chip flash memory microcontroller (MCU) that uses a 28nm process technology.　　The RH850/E2x Series MCU incorporates up to six 400MHz CPU cores, making it the first on-chip flash memory automotive MCU to achieve the industry's highest processing performance of 9600 MIPS. The series also features a built-in flash memory of up to 16MB as well as enhanced security functions and functional safety.　　Renesas is describing the 28nm-generation automotive control MCU as a breakthrough product featuring next-generation technology that's intended to support complex automotive control. OEMs and Tier 1 manufacturers in the automotive space have started to adopt the new 28nm MCU,　　According to the company as the automotive industry looks to develop environmentally-friendly vehicles, next-generation fuel-efficient engines will require much higher processing performance in order to allow the implementation of new fuel combustion systems. High processing performance and high integration densities will be required to achieve miniaturisation and higher efficiency in the motors and inverters used in electric vehicles (EV) and plug-in hybrid electric vehicles (PHEV).　　Looking to address these requirements, and when compared to the earlier 40nm MCUs, the RH850/E2x Series of MCUs are able to achieve approximately three times the performance at the same power level. The RH850/E2x also includes enhanced sensor interfaces which are necessary for precise automotive control functions.　　The RH850/E2x Series is also equipped with up to 16MB of flash ROM and it is possible to only update certain arbitrary areas during program operation. The RH850/E2x Series comes with improved serial interfaces, including up to ten channels of CAN FD and one Ethernet channel. Security functions that support Evita Medium enable the MCUs to support safe and rapid OTA updating of the software.　　Targeting ASIL-D, the highest level of the ISO 26262 functional safety standard for automotive E/E systems, the RH850/E2x Series has adopted the dual core lock step CPU structure that is able to guarantee that the calculations performed by two CPU cores are identical. The RH850/E2x also provides up to four sets of CPU pairs, and features a variety of hardware functional safety improvements.　　In applications where a system malfunction could lead to life-endangering accidents, these features immediately detect faults should a malfunction occur and allow system safety to be maintained.　　Renesas will provide safety analysis tools that can flexibly support a wide range of use cases to implement safe systems.　　To assure scalability in the RH850/E2x Series, in addition to the 28nm flash memory MCU, Renesas has also launched a 40nm process MCU.
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Release time：2018-03-28 00:00 reading：2215 Continue reading>>
Automotive and IoT Will Drive IC Growth Through 2021
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Automotive and IoT Will Drive IC Growth Through 2021

　　IC Insights’ IC Market Drivers 2018 report also projects good increases in IC sales for medical electronics,wearable systems,cellphones,servers,and gov/mil applications.　　Integrated circuit sales for automotive systems and the Internet of Things are forecast to grow 70%faster than total IC revenues between 2016 and 2021,according to IC Insights’new 2018 Integrated Circuit Market Drivers Report.ICs used in automobiles and other vehicles are forecast to generate worldwide sales of$42.9 billion in 2021 compared to$22.9 billion in 2016,while integrated circuit revenues for Internet of Things(IoT)functionality in a wide range of systems,sensors,and objects are expected to reach$34.2 billion in four years compared to$18.4 billion last year,says the new 358-page report.　　Between 2016 and 2021,automotive and IoT IC sales are projected to rise by compound annual growth rates(CAGRs) of 13.4%and 13.2%,respectively,compared to 7.9%for the entire IC market,which is projected to reach$434.5 billion in four years versus$297.7 billion last year.As shown in Figure 1,strong five-year IC sales growth rates are also expected in medical electronics(a CAGR of 9.7%to$7.8 billion in 2021)and wearable systems(a CAGR of 9.0%to$4.9 billion).　　Cellphone IC sales—the biggest end-use market application for integrated circuits,accounting for about 25%of the IC market’s total revenues—are expected to grow by a CAGR of 7.8%in the 2016-2021 period,reaching$105.6 billion in the final year of the new report’s forecast.Meanwhile,weak and negative IC sales growth rates are expected to continue in video game consoles(a CAGR of-1.9%to$9.7 billion in 2021)and tablet computers(a CAGR of-2.3%to 10.7 billion),according to the 2018 IC Market Drivers report.　　Sharply higher average selling prices(ASPs)for DRAMs and NAND flash are playing a significant role in driving up dollar-sales volumes for ICs in cellphones and PCs(both desktop and notebook computers)in 2017.Cellphone IC sales are on pace to surge 24%this year to an estimated$89.7 billion,while PC integrated circuit dollar volume is expected to climb 17.6%to$69.0 billion.For both the cellphone and PC market segments,2017 will be the strongest increase in IC sales since the 2010 recovery year from the 2009 downturn.The 2018 IC Market Drivers report’s forecast shows cellphone integrated circuit sales rising 8%to$97.3 billion next year and PC IC revenues growing 5%to$72.6 billion in 2018.　　The new report estimates that automotive IC sales will rise 22%in 2017 to about$28.0 billion after increasing 11%in 2016.Automotive IC sales are forecast to increase 16%in 2018 to$32.4 billion.Meanwhile,IoT-related integrated circuit sales are on pace to grow 14%in 2017 to an estimated$14.5 billion after increasing about 18%in 2016.In 2018,integrated circuit sales for Internet of Things end-use applications are expected to rise 16%to about$16.8 billion,according to the 2018 edition of the IC Market Drivers report.
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Release time：2017-12-08 00:00 reading：1119 Continue reading>>
Automotive Seen as Strongest Semiconductor Driver Through 2021
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Automotive Seen as Strongest Semiconductor Driver Through 2021

　　The PC market, for many years the single biggest driving force for semiconductor sales, is headed toward its sixth consecutive year of decline. Meanwhile, the semiconductor industry is on pace for its best year ever.　　As the PC has waned as the killer application for semiconductors, a host of new applications has risen in prominence. Among them is the automotive semiconductor market — a strong market for the semiconductor industry for years — which is becoming arguably the most important market for semiconductors as the amount of semiconductor content per vehicle rises.　　In fact, market research firm IC Insights forecasts that the automotive semiconductor market will be the the strongest end market for chips through 2021. According to the firm, automotive electronic system sales are forecast to rise by a compound annual growth rate (CAGR) of 5.4 percent from 2016 through 2021.　　Behind the forecasted CAGR, IC Insights said, is rising demand for electronic systems in cars, with increasing attention focused on self-driving (autonomous) vehicles, vehicle-to-vehicle (V2V) and vehicle-to-infrastructure (V2I) communications, as well as on-board safety, convenience and environmental features — not to mention growing interest in electric vehicles.　　As a result, automotive IC sales are expected to increase by 22 percent in 2017 and another 16 percent next year, IC Insights said.　　The automotive segment is expected to account for an estimated 9.1 percent of the $1.49 trillion total worldwide electronic systems market in 2017,up from 8.9 percent in 2015 and 9 percent in 2016, IC Insights said. Automotive’s share of global electronic system production has increased only incrementally through the years, and is forecast to show only marginal gains as a percent of total electronic systems market through 2021, when automotive electronics are forecast to account for 9.8 percent of global electronic systems sales, according to the firm.　　IC Insights said pricing pressures on both ICs and electronic systems will keep the automotive  end-use application from accounting for much more than its current share of total electronic systems through 2021, despite the rise in electronic systems being added to cars, the firm said.　　According to IC Insights most recent report on semiconductor industry drivers, industrial electronic systems are forecast to enjoy the second-fastest CAGR through 2021, 4.6 percent. This growth includes increases in robotics, wearable health devices and systems promoting the Internet of Things help drive growth in this segment, the firm said.　　Other forecasted compound annual growth rates listed in the report include 4.2 percent for communication systems and 2.8 percent for consumer electronic systems. The personal computing segment is expected to have the weakest CAGR of all major semiconductor drivers through 2021, IC Insights said.
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Release time：2017-11-14 00:00 reading：1242 Continue reading>>
Siemens Doubles Down on Automotive Simulation
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Siemens Doubles Down on Automotive Simulation

　　Siemens announced plans to buy for an undisclosed sum Tass International (Helmond, The Netherlands), an established simulation software company in the global automotive industry for 25 years.　　For skeptics wondering what motivated Siemens to acquire EDA vendor Mentor Graphics (in a deal that closed earlier this year), Siemens’ acquisition of Tass International closes the circle, making clear that “automotive” was a key thread connecting Siemens, Siemens PLM Software and Mentor.　　The Siemens-Tass deal adds automated driving solutions to Siemens’ portfolio, providing a shot in the arm for Siemens PLM Software, which now owns Mentor.　　Siemens said Tass' “simulation software and engineering and test services” will strengthen the automotive wing of Siemens’ PLM Software. The plan is to combine Tass’ software with Mentor’s EDA solutions “to frontload the verification and validation of ADAS and autonomous driving systems,” according to Siemens.　　Phil Magney, founder and principal advisor for Vision Systems Intelligence (VSI), told us, “This is pretty important acquisition for Siemens because simulation is such as important element of automated vehicle solutions.” He believes that the Tass portfolio “helps companies at various phases in the development of automated vehicle functions.”　　Siemens is convinced that connected and autonomous vehicles will set a high bar for the automotive industry in meeting requirements for virtual and physical validation and verification. “The increased complexity of the involved mechatronic systems, the interaction with the environment, and the increased liability risks due to a shift of responsibility from driver to system require an integrated product development approach,” a Siemens PLM Software spokeswoman told us. For that, Tass' offerings are critical.　　Physics-based simulator　　So, what’s Tass' claim-to-fame in automotive?　　The Dutch company, on its website, cites its “unique development methodology, offering a set of advanced simulation software tools, tailor-made engineering solutions and state-of-the-art testing and certification facilities and services.”　　The Siemens PLM Software spokeswoman added, “Tass also broadens our current engineering and testing services offerings into homologations [the process of certifying a vehicle to indicate that it meets regulatory standards and specifications], cooperative mobility, crash testing, tyre testing, vehicle hardware-in-the-loop and integrated vehicle safety.”　　VSI’s Magney sees the value of Tass offerings in “a real physics-based simulator.”　　“From early-level algorithm development to functional validation of software components, Tass provides a simulator where the developers can design their own scenarios and model various sensor configurations at an early stage,” Magney noted.　　VSI, which tracks the building blocks of automated vehicles by putting together its own autonomous cars, uses Tass simulation software. Magney said, “Earlier this year, VSI was able to develop and test its own algorithms in a virtual world before we ported them to our vehicle.”　　He noted, “Since Tass offers a true physics engine (vs. a gaming engine), we were able to fine tune the behavior of our control algorithms long before we deployed them on a test vehicle!”　　Indeed, simulation is becoming a hotly sought-after field with vital importance for automated vehicle development. “For example, simulation allows you to test for infinite scenarios and/or combinations of parameters,” said Magney, calling it “something you cannot do in the real world.”　　He added, “Simulation also plays a role in developing AI based algorithms because you can use environment simulation to train the algorithms rather than collecting and annotating your own data sets. And since simulated data contains ground truth and actual physics models, the data is well suited for algorithm training.”　　Roadmap　　Asked about the integration roadmap, the Siemens PLM Software spokeswoman explained Tass' simulation software will combine with her company's “Simcenter” portfolio and the Mentor Graphics portfolio, “for a fully integrated solution for design exploration and frontloaded verification and validation of ADAS and Autonomous Driving systems.”　　“Simcenter” is a software developed by Siemens PLM Software. It “combines system simulation, 3D Computer Aided Engineering and test to help you predict performance across all critical attributes earlier and throughout the entire product lifecycle,” according to the company. “By combining physics-based simulations with insights gained from data analytics, Simcenter helps you optimize design and deliver innovations faster and with greater confidence.”　　Siemens will acquire 100 percent of the share capital of Tass and integrate the business into its PLM Software business unit. Tass, with about 200 employees, has annual revenue of around 27 million euros ($32.3 million).　　The deal is expected to close in early September.
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Release time：2017-09-01 00:00 reading：2542 Continue reading>>
Automotive, Industrial Continue to Drive TI's Sales Gains
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Automotive, Industrial Continue to Drive TI's Sales Gains

　　Texas Instruments Inc. reported a second consecutive quarter of double digit year-over-year sales gains as continued strength in the automotive and industrial chip sectors continue to propel its business.　　TI (Dallas) reported sales of $3.69 billion and a profit of $1.06 billion for the quarter, increases of 13 percent and 29 percent, respectively compared to the second quarter of 2016. The company said it expects sales for the third quarter to grow to between $3.74 billion to $4.06 billion, beating consensus analysts' forecasts.　　"Demand for our products continues to be strong in the automotive market and continues to strengthen in the industrial market," said Dave Pahl, vice president and head of investor relations at TI, in a conference call with analysts following the second quarter report.　　TI said its revenue from its analog segment increased by 18 percent year-over-year, largely due to growth in power and signal chain devices. The company reported that its embedded processor revenue, included connected microcontrollers and processors, grew by 15 percent year-over-year.　　Sales of other products, including DLP products, calculators and custom ASICs, fell by $60 million compared with the second quarter of 2016, TI said.　　"We continue to focus our strategy on the industrial and automotive markets, which are the end markets where we have been allocating our capital and driving initiatives," Pahl said. This, Pahl said, is driven by TI's "belief that industrial and automotive will be the fastest growing semiconductor markets due to their increasing semiconductor content and that they will provide diversity and longevity of products."
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Release time：2017-07-27 00:00 reading：1104 Continue reading>>
Infineon Rides Automotive Wave into Top-10 Semi Supplier Ranking
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Infineon Rides Automotive Wave into Top-10 Semi Supplier Ranking

　　Memory market surge propels SK Hynix and Micron up two spots in the top-10 ranking.　　IC Insights will release its May Update to the 2017 McClean Report later this month.  This Update includes a discussion of the 1Q17 semiconductor industry market results, an update of the capital spending forecast by company, a review of the IC market by electronic system type, and a look at the top-25 1Q17 semiconductor suppliers (the top-10 1Q17 semiconductor suppliers are covered in this research bulletin).　　The top-10 worldwide semiconductor (IC and O S D—optoelectronic, sensor, and discrete) sales ranking for 1Q17 is shown in Figure 1.  It includes four suppliers headquartered in the U.S., two in Europe, two in South Korea, and one each in Singapore and Japan.  In total, the top-10 semiconductor suppliers represented 56% of the 1Q17 worldwide semiconductor market of $99.6 billion (2Q17 is forecast to be the first ever quarterly semiconductor market to exceed $100 billion).　　Figure 1　　Intel held a slim 4% lead over Samsung for the number one position in 1Q17.  However, as reported in an earlier IC Insights’ Research Bulletin, Samsung is on pace to displace Intel as the world’s largest semiconductor supplier in 2Q17. Memory giants SK Hynix and Micron made the biggest moves in the 1Q17 ranking as compared to the full-year 2016 ranking.  Spurred by the recent surge in the DRAM and NAND flash markets, each company moved up two spots in the top-10 ranking with SK Hynix now occupying the third position and Micron moving up to fourth.　　There was one new entrant into the top-10 ranking in 1Q17—Germany-headquartered Infineon.  The company’s 1Q17/1Q16 sales increase was 6%.  Infineon replaced fabless supplier MediaTek, whose 1Q17/1Q16 sales were up by 7% to $1.8 billion but the company suffered a sequential 1Q17/4Q16 sales decline of 17%.  Half of the top-10 companies had sales of at least $4.0 billion in 1Q17.  As shown, it took $1.9 billion in quarterly sales just to make it into the 1Q17 top-10 semiconductor supplier list.　　As would be expected, given the possible acquisitions and mergers that could/will occur this year (e.g., Qualcomm/NXP), as well as any new ones that may develop, the top-10 semiconductor ranking is likely to undergo some significant changes over the next few years as the semiconductor industry continues along its path to maturity.　　Report Details: The 2017 McClean Report
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Release time：2017-05-15 00:00 reading：1261 Continue reading>>

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