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Inventec and Renesas to Jointly Develop Proof-of-Concept for Automotive Gateways

　　Inventec (TPE:2356), a global leader in high-powered servers headquartered in Taiwan, and Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today announced that they have agreed to jointly design automotive-grade gateway solutions for the rapidly-growing electric vehicle (EV) market. Targeting Tier-1 automotive suppliers and OEMs, the companies will develop a Proof of Concept (PoC) for connected gateways based on the industry-leading R-Car system-on-chip (SoC) from Renesas.　　Under the terms of the agreement, Renesas will provide Inventec its latest offering of R-Car SoCs, analog, and power products, along with engineering support to assist Inventec in developing a PoC for next-generation in-vehicle connected gateway systems. The two companies will regularly share product development roadmaps, market insights and specifications. The first PoC will integrate cybersecurity and over-the-air (OTA) features for connected gateway applications and is expected to be available by Inventec in Q2 of 2024.　　“We are delighted to have Inventec as a partner to build a faster and more secure gateway solution for EVs,” said Takeshi Fuse, Head of Function Unit and Business Development for the High Performance Computing, Analog and Power Solutions Group at Renesas. “As Tier1s and car manufacturers increasingly invest in automotive electrification, we are uniquely positioned to build a working design that addresses the complex demands of today’s automotive industry.”　　“We have years of experience serving the PC, server and mobile phone markets and meeting the performance and reliability requirements of our customers,” said Sam Yeh, Chairman of Inventec. “The integration of our technology with Renesas’ field-proven R-Car SoC platform will enable us to reach a new base of EV customers in search of advanced intelligent automotive solutions around the world.”　　The development of the PoC for automotive gateways reflects a transformational shift toward new E/E (electrical and electronics) architectures in the automotive industry. Automotive system developers need to integrate complex networks of electronic control units (ECUs) into their vehicles and enable software to receive OTA updates securely. The new PoC will not only drive innovation in vehicle development, but also create new possibilities for emerging vehicle manufacturers worldwide to take part in the rapidly expanding EV market.　　The Renesas R-Car is a high-performance, scalable compute platform that addresses a wide range of automotive applications, such as Automated Driving (AD), ADAS, connected gateways, in-vehicle infotainment systems, cockpits, and dashboards. In the future, the two companies plan to collaborate not only in connected gateways, but also in a wide range of in-vehicle applications such as vehicle computers, and battery management systems.

Key word：

Renesas

Release time：2023-09-11 15:23 reading：3302 Continue reading>>

What is <span style='color:red'>automotive</span> chip What are the types of <span style='color:red'>automotive</span> chips

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What is automotive chip What are the types of automotive chips

　　Chip is a general term for semiconductor component products, also known as integrated circuits (IC).　　Automotive chips are mainly divided into three categories: functional chips (MCU, MicrocontrollerUnit), power semiconductors, and sensors.　　Functional chips mainly refer to processor and controller chips. For a car to run on the road, it cannot do without the electronic and electrical architecture for information transmission and data processing. The vehicle control system mainly includes body electronic system, vehicle motion system, powertrain system, infotainment system, automatic driving system, etc. There are many sub-function items under these systems, and each sub-function item has a control system behind it. There will be a function chip inside the controller.　　Power semiconductors are mainly responsible for power conversion and are mostly used in power supplies and interfaces, such as IGBT power chips for electric vehicles, and field effect transistors MOSFET that can be widely used in analog circuits and digital circuits.　　Sensors are mainly used for various radars, airbags, tire pressure detection, etc.　　What is an autonomous driving chip?The self-driving chip is essentially a functional chip, a high-computing chip produced with the development of smart cars. There is a saying that the self-driving chip is the Mount Everest of chips, representing the highest technical challenge.　　At present, the commercially available autonomous driving chips are basically in the stage of advanced driver assistance systems, which can realize L1-L2 assisted driving, and some claim to realize L3 functions.　　What is the main reason for the shortage of automotive chips?There are three main reasons for the sudden shortage of automotive chips:　　First, the impact of force majeure such as the new crown epidemic and fire. Wafers are the raw materials for making chips. The new crown epidemic has brought a severe impact on wafer production. The world’s first and second wafer foundries TSMC and Samsung have been forced to suspend production due to employees being infected with the epidemic. At the same time, the strike movement in Europe and the fire at the Asahi Kasei plant in Japan once again affected the production capacity of wafer foundries.　　Second, the rapid recovery of the auto industry and insufficient estimates from suppliers. According to the statistics of StrategyAnalytics, the number of functional chips installed in automobiles of all levels is increasing year by year. At present, the average number of functional chips used in automobiles is about 25, and some high-end models have exceeded 100. In the second half of 2020, the auto market represented by China will recover rapidly, exceeding the supply chain’s prediction of chip demand.　　Third, competition for production capacity of consumer electronics products. On the one hand, the demand for consumer electronics products has increased significantly during the pandemic. On the other hand, the profit margin of in-vehicle chips is far lower than that of consumer electronics chips. Some chip suppliers tend to reserve production capacity for consumer electronics products.

Key word：

automotive chips

Release time：2023-09-06 13:46 reading：2443 Continue reading>>

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3PEAK Launches the TPM650xQ Series of High-Performance Automotive Push-Pull Transformer Drivers

　　3PEAK (stock code: 688536), a semiconductor company focusing on the development of high-performance analog chips and embedded processors, unveiled the TPM650xQ series of high-performance automotive push-pull transformer drivers.　　The TPM650xQ series has built-in MOSFETs with a withstanding voltage of 25 V. It can reliably function within a temperature range from –40°C to +125°C. With competitive performance, the TPM650xQ series has been widely used in automotive bus interfaces, industrial instruments, and other terminal areas that require an isolated power supply.　　Wide Input Range: 2.25 V to 5.5 V　　Multiple Fixed Frequency Versions: 160 kHz, 420 kHz, 2.2 MHz　　Provides Frequency Jitter to Simplify EMI Design　　Support for EN:　　TPM6501xQ Series without EN Pins　　TPM6505xQ Series with EN Pins　　External CLK:　　Built-in Frequency Options: 160 kHz and 420 kHz　　External Frequency Range: 100 kHz to 1600 kHz　　Low Rds(on):　　Rds(on) 0.23 Ω@Vcc = 4.5 V　　Wide Operating Temperature Range: –40°C to +125°C　　Various Protection Functions: 1.5-A Cycle-by-cycle Current Limit Protection, OTP Protection, and Undervoltage Protection for the Primary Side　　Soft-start Function for Reducing Voltage Stress at Startup (Optional)　　Packages: SOT23-5 and SOT23-6　　[Typical Application 1] 3.3 V to 5.5 V or 3.3 V to 5 V direct conversion　　Application: 5 V to 5 V/3.3 V/12 V, 3.3 V to 3.3 V/5 V/12 V　　Features: The structure is simple and easy to use, which is suitable for input and output voltages between 3 V and 5 V.　　Efficiency and load regulation curve of typical application 1　　[Typical Application 2] Low temperature rise from 12 V to 12 V/15 V in a dual-channel isolated output　　Application: Single 12-V input to dual-channel isolated 12 V/15 V/20 V output　　Features: VIN can exceed 5.5 V, switching losses are borne by external MOSFETs, and the temperature of the device is reduced.　　[Typical Application 3] Highly integrated 5 V to dual-channel isolated 20-V solution　　Application: 5 V to 20 V (or 23 V, then +15 V and –8 V via the TPR431 voltage divider)　　Features: A push-pull transformer can achieve dual-channel isolated output, and the output is four times the input voltage.

Key word：

3PEAK

Release time：2023-09-06 13:37 reading：3458 Continue reading>>

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ROHM New Matrix-Type LED Drivers for Automotive LCD Backlights Enable Independent Control of up to 192 Zones

　　ROHM has developed LED driver ICs - the BD94130xxx-M series (BD94130MUF-ME2, BD94130EFV-ME2) - for automotive LCD backlights. The devices support large displays increasingly being used in next-generation car infotainment and instrument clusters.　　In recent years, the advancement of ADAS (Advanced Driver Assistance Systems) together with expanding car infotainment functionality have prompted a shift towards higher resolution vehicle displays to improve visibility. As such, LED drivers with a local dimming function capable of turning off only the backlight in dark areas of the LCD improve display screen performance and reduce power consumption. They are now being considered by automotive manufacturers developing next-generation cockpits. But as the number of zones controlled with conventional direct-type LED drivers by a single IC is less than 100, the number of LED drivers and peripheral components will also increase as automotive displays become larger with more zones. This represents a significant design challenge.　　To meet this need, ROHM developed products capable of controlling more zones than conventional ICs -making it possible to reduce the mounting area by reducing the number of LED drivers required. The BD94130xxx-M series of matrix LED drivers combines an 8-line switch controller with 24-channel current driver - allowing control (dimming) of up to 192 zones mini-LED for backlighting with a single IC. On top of that, the mini-LEDs in each zone can be independently adjusted by using a local dimming function - contributing to larger contrast ratio, lower power consumption displays.　　For example, with current mainstream 10-inch class infotainment displays that consist of approx. 600 zones, ROHM’s new products enable operation with just one-fourth of the number of LED drivers compared to existing (48-zone) products - decreasing LED driver mounting area by approx. 84%. And this advantage will only increase as screens become larger and the number of zones rises inside next-generation cockpits.　　New Products: BD94130xxx-MROHM’s BD94130xxx-M series of matrix LED drivers combines a 24-channel current driver with a switch controller that can be divided into 8 lines (Max.). The number of switch controller lines can be selected from among 3 patterns (4, 6, or 8) - via register settings, supporting a variety of specifications based on the number of zones and LED current consumption. In addition, a built-in feedback control function maintains a constant feedback voltage independent of LED temperature characteristics - reducing thermal design man-hours along with loss ratio.　　ApplicationsROHM’s new products are equipped with local dimming functionality to support a variety of high-contrast automotive displays.　　• Electronic mirrors (side/rear view)　　• Instrument clusters• Car infotainment　　• Head-up displays (HUDs)

Key word：

ROHM

Release time：2023-08-28 15:14 reading：2414 Continue reading>>

What is the difference between <span style='color:red'>automotive</span> PCB and communication PCB

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What is the difference between automotive PCB and communication PCB

　　Automotive PCBs and communication PCBs are two common types of circuit boards in the electronics industry. Although they look similar on the surface, there are actually certain differences in design, use, and performance. Automotive PCB boards are mainly used in automotive electronic products, which have the characteristics of anti-vibration and high-temperature resistance, and are suitable for harsh automotive environments; while communication PCB boards are mainly used in communication equipment, pursuing high-speed, high-frequency and other characteristics to meet different communication needs.　　This article will introduce the differences between these two PCBs in detail to help readers better understand their differences.　　Features and applications of automotive PCB boards1.1 Features of automotive PCB boards　　The automotive PCB board has the characteristics of anti-vibration, high-temperature resistance, and corrosion resistance to adapt to the harsh environment in which the car is located; its material and manufacturing process requirements are higher to ensure the stability and reliability of the circuit board.　　1.2 Applications of automotive PCB boards　　Automotive PCB boards are widely used in automotive electronic products, such as car audio, navigation systems, electric vehicle charging piles, etc., to meet the functional requirements of vehicle control, infotainment, and safety monitoring.　　Features and applications of communication PCB boards2.1 Features of communication PCB boards　　The communication board pursues high-speed, high-frequency and other characteristics, and has the characteristics of high-speed signal transmission and strong anti-interference ability to ensure the stability and reliability of communication equipment.　　2.2 Applications of communication PCB boards　　Communication boards are widely used in communication equipment, network equipment and other fields, such as mobile phones, routers, base stations, etc., to meet the needs of information transmission and communication.　　Difference between automotive PCB and communication PCB　　3.1 Material differences　　Automotive PCB boards often use materials with high-temperature resistance and compressive strength, such as FR-4 materials; while communication PCB boards often use high-frequency and high-capacity materials, such as PTFE materials.　　3.2 Design differences　　Automotive PCB boards need to consider the characteristics of anti-vibration and high-temperature resistance, and the design is more stable and strong; while communication PCB boards need to consider high-speed signal transmission and anti-interference capabilities, and the design pays more attention to signal integrity and anti-interference.　　3.3 Differences in application environments　　Automotive PCB boards are used in the automotive environment and need to be able to adapt to the harsh working environment of the car, such as high temperature, high humidity, vibration, etc.; while communication boards are used in communication equipment, they need to meet the requirements of high-speed transmission and stability.　　3.4 Differences in usage　　Automotive PCB boards are mainly used in automotive electronic products to meet functional requirements such as vehicle control and infotainment; communication PCB boards are mainly used in communication equipment to meet data transmission and communication needs.　　There are obvious differences between automotive PCB boards and communication PCB boards in four aspects: material, design, application environment and purpose. The automotive PCB board is mainly adapted to the harsh working environment of the car, and has the characteristics of anti-vibration and high-temperature resistance; the communication PCB board is mainly used for communication equipment and pursues high-speed, high-frequency and other characteristics. Understanding the characteristics and applications of these two boards will help you choose the right board to meet specific needs in practical applications.

Key word：

PCB

Release time：2023-08-24 14:55 reading：2242 Continue reading>>

Trade news

ROHM’s New Automotive-Grade High Voltage Hall ICs

　　ROHM has developed Hall ICs, the BD5310xG-CZ / BD5410xG-CZ series, designed for automotive applications requiring magnetic detection.　　In recent years, the continuing computerization of vehicle systems to meet the demand for increasing electrification and functionality along with greater comfort and safety has required additional ECUs (Electronic Control Units) and sensors to provide control.　　Among these sensors, Hall ICs are becoming one of the most adopted type due to their ability to detect position and motor rotation in a non-contact manner that reduces the wear-and-tear prevalent with mechanical switches while also being compact and can be equipped with protection circuits.　　ROHM has developed Hall ICs for automotive applications that improve reliability by combining Hall IC expertise cultivated over many years for the mobile and consumer sectors with original high withstand voltage processes. As a result, the BD5310xG-CZ / BD5410xG-CZ series features an industry-leading 42V withstand voltage that enables direct connection to a primary (12V battery) power supply. This contributes to improved reliability under battery power, which can fluctuate rapidly depending on the operating conditions. At the same time, a wide operating supply voltage range of 2.7V to 38V enables support for a variety of applications. The unique internal topology also reduces power consumption by approx. 20% over general products to achieve an industry-leading current consumption of 1.9mA. Both series comply with the AEC-Q100 (Grade 1) automotive reliability standard while incorporating multiple protection circuits required for vehicle systems.　　The BD5310xG-CZ series is a unipolar detection type while the BD5410xG-CZ series provides latch-type detection, giving designers the flexibility to select the ideal product based on set needs. A total of 11 models are offered in detection magnetic flux densities - ranging from 2.0mT to 28.0mT. Unipolar detection can be used for detecting position in applications such as door open/close and door locks, whereas latch detection is ideal for rotation detection in various motors used in power windows, sliding doors, and the like.　　Going forward, ROHM will continue to expand its lineup of sensor ICs that contribute to higher reliability and functionality in automotive applications.

Key word：

ROHM

Release time：2023-08-23 10:11 reading：2958 Continue reading>>

Trade news

Microchip Introduces Its First Automotive-Qualified 10BASE-T1S Ethernet Devices

　　To support new automotive functionality while keeping system complexity low, OEMs are moving away from domain-based solutions and toward zonal architectures. Many of these new architectures rely on the widespread rollout of Ethernet in vehicles, and the recently-released 10BASE-T1S Ethernet standard has been a game changer in expanding and unifying this network. This week, Microchip announced the release of its first automotive-qualified 10BASE-T1S PHY transceivers.　　The LAN8670/1/2 10BASE-T1S Ethernet PHYs are functional safety ready and designed for use in ISO 26262 applications. These devices now make it possible to connect low-speed devices that previously required their own communication systems into a standard Ethernet system in automotive applications.　　“Microchip continues to prioritize connectivity solutions for the automotive industry with the expansion of its line of 10BASE-T1S products,” said Matthias Kaestner, vice president of Microchip’s automotive products business unit. “This new technology will connect the sensors and actuators used in the physical world all the way to the cloud, and it will enable a seamless Ethernet architecture everywhere.”　　The ability to connect multiple Ethernet PHYs to a common bus line makes it simpler to implement automotive applications on a single, well-known architecture and saves implementation costs by reducing cabling and switch ports. The LAN8670/1/2 enables the network edges to use Ethernet and Internet Protocol (IP) to easily communicate with the rest of the network infrastructure. These devices include advanced PHY diagnostics to provide the user with troubleshooting capabilities. In addition, sleep/wake functionality allows for low-power modes.　　The 10BASE-T1S device specifications include 10 Mbps, half-duplex mode, flexible topology with multidrop bus line and point-to-point and use a single balanced pair of conductors. These devices also feature enhanced electromagnetic compatibility/electromagnetic interference (EMC/EMI) performance. Time-Sensitive Networking (TSN) support allows for synchronized timing across far-reaching Ethernet networks. Time synchronization is critical for many applications throughout automotive zonal architectures.　　Microchip Extends Support for 10BASE-T1S　　To support the future of 10BASE-T1S systems, Microchip Technology recently announced the launch of a series of new automotive-qualified 10BASE-T1S devices. The company's new portfolio of 10BASE-T1S devices includes the LAN8670, LAN8671, and LAN8672 PHYs.　　With support for 10BASE-T1S, the LAN8670/1/2 devices (datasheet linked) can transmit and receive data at a rate of 10 Mbit/s over a single balanced pair of conductors. This capability enables efficient data transmission, even in environments where space and resources are limited. The devices can also connect multiple PHYs to a common mixing segment. This not only reduces weight and implementation costs by requiring fewer connectors, individual cables, and switch ports but also simplifies the implementation of automotive applications.　　These devices are said to feature enhanced EMC/EMI performance to help meet the stringent standards for automotive environments. Other features include support for time-sensitive networking (TSN) and qualification to AEC-Q1000 Grade 1.　　Microchip hopes this new series will help simplify the design of far-reaching Ethernet networks that are common to zonal architectures.

Key word：

Microchip

Release time：2023-07-27 09:14 reading：2708 Continue reading>>

Basic knowledge of electronic components What are the types of <span style='color:red'>automotive</span> chip?

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Basic knowledge of electronic components What are the types of automotive chip?

　　Electronics has become an integral part of our lives, and its influence extends far beyond traditional electronic devices to a wide range of applications in the automotive industry. Among them, the automotive chip is an important part of electronics in the automotive industry. This AMEYA360 electronic components procurement network will focus on the basic concept of automotive chips and the common types of automotive chips.　　What is an automotive chip?　　Automotive chip is a kind of chip in embedded system, mainly used in automotive control units or other electronic devices. The automotive chip controls various functions in the car, such as engine control, seat adjustment, audio system, etc., through the processor and other circuits. The main function of an automotive chip is to keep the car running efficiently, stably and safely under various extreme conditions.　　Common types of automotive chips　　1. Microcontroller (MCU)　　Microcontrollers are the most common type of automotive chips. They are usually used to control various electrical devices in a car, including engine control, door locking, breathing lights, power windows, etc. Microcontrollers are generally composed of memory, processor, input/output interfaces and other logic circuits embedded in a single chip.　　2. Sensor chip　　Sensor chips are another important part of the automotive chip. They are used to measure various physical parameters in the car, such as temperature, light, sound, etc., and to transmit these parameters to the car control unit. Sensor chips usually consist of sensors and interface circuits.　　3. Analog to Digital Converter (ADC)　　ADC is a chip that converts analog signals to digital signals. They are usually used to measure electrical signals in a car and convert these signals to digital signals so that computer systems can read and process them. ADCs usually consist of an analog front-end circuit, a sampling circuit and a digital circuit.　　4. Signal Processor (DSP)　　A signal processor is a chip dedicated to digital signal processing. In automobiles, DSPs are typically used for audio processing and image processing. They usually consist of a processor core and associated logic circuitry.　　5. Memory (Memory) chip　　A memory chip is a chip used to store data. In cars, memory chips are typically used to store data that is constantly updated as the car is used, such as maintenance records, driver preferences, and music libraries.　　An automotive chip is a group of embedded chips specifically designed to control various electrical devices in a car. Common types of automotive chips include microcontrollers, sensor chips, analog-to-digital converters, signal processors and memories. For automakers, choosing the right automotive chip can greatly improve the performance, efficiency and safety of a vehicle.

Key word：

Electronic Components

Release time：2023-05-22 13:57 reading：3274 Continue reading>>

Trade news

NOVOSENSE:emiconductor Solutions for Automotive & Industrial Applications

　　NOVOSENSE Microelectronics (NOVOSENSE), a highly robust & reliable analog and mixed signal IC company, today announced its scheduled attendance at PCIM Europe 2023, one of the world’s leading international exhibitions and conferences for power electronics and its applications. From May 9 to 11, NOVOSENSE plans to showcase technologies and products for automotive and industrial applications. NOVOSENSE representative will give presentation regarding how isolation technology empowers the electrification process at E-Mobility & Energy Storage in Hall 6, on May 11.　　At the tradeshow, NOVOSENSE will display its products of isolator, interface, driver IC, current sensor, SiC device, etc., which can be applied in applications such as photovoltaic (PV) inverter, industrial automation, battery management system (BMS), motor driver, EV/HEV traction inverter, OBC/DCDC, power supply.　　Prominent accomplishments fulfilled in applications of PV, energy storage, industrial control, automotive electronics　　Since the company’s establishment in 2013, NOVOSENSE has stepped into the fast track of technological innovations, continuously making progress in satisfying the dynamic market demand with high-performance products and solutions.　　PV & energy storage　　With the trend towards high efficiency, low energy consumption and low cost, analog technology and chips are playing an increasingly important role in optimizing and improving the intelligent level of PV power generation technology. NOVOSENSE provides one-stop solution of analog IC in PV systems, including isolated driver IC, sampling, digital isolator, isolated interface, operational amplifier, power supplies, buffers, etc. Particularly, an inverter needs about 25 isolation chips on average, NOVOSENSE isolation chip, which is based on the capacitive isolation technology route, has higher voltage resistance, faster transmission speed, wider temperature range and longer working life, compared with traditional optical and magnetic coupler.　　Industrial control　　By means of applying innovative technologies in industrial challenges and difficulties, NOVOSENSE has been devoted to exploring industrial electronic solutions with higher integration, reliability and cost effectiveness. Solutions like integrated isolated power 3CH digital isolated solution of NOVOSENSE effectively helps developers simplify industrial system design. NOVOSENSE also puts forward total solution for industrial BMS, where NOVOSENSE has developed a series of digital isolators such as NIRSP31 to ensure both compact design and system reliability. Compared with traditional solutions, NIRSP31 has won more customers’ recognition given its advantages of greatly reduced PCB layout area and height as well as lower system cost.　　Automotive electronics　　With mature IC design capabilities, abundant experience in mass production and quality assurance, NOVOSENSE is committed to providing high-performance, reliable products and service for automotive OEMs and Tier-1 suppliers worldwide since 2016. To enable the electrification and intelligence of cars, NOVOSENSE shipped over 100 million pcs automotive chips in the year of 2022.　　Based on 10-year experience in solid IC design & mass production, NOVOSENSE holds the capacity of offering over 1,400 IC products for sale. The accumulative shipment has reached more than 4 billion pcs, widely applied in automotive, industrial control, information & communication as well as consumer electronics etc.　　In pursuit of the mission of "Sense and Drive the Future, Build a Green, Smart and Connected World with Semiconductors”, NOVOSENSE has established partnership with thousands of customers worldwide.

Key word：

NOVOSENSE

Release time：2023-05-09 10:31 reading：3610 Continue reading>>

Trade news

STMicroelectronics ALED7709 Automotive LED Drivers

　　STMicroelectronics ALED7709 Automotive LED Drivers are AEC-Q100 Grade1 qualified and combine a boost/SEPIC controller and four low-side constant-current sinkers. The STMicroelectronics ALED7709 is designed to drive strings of high-brightness LEDs. The switching converter section provides the supply rail for the LED strings, whose value is constantly optimized for maximum efficiency. The boost/SEPIC controller supports the external synchronization and spread spectrum.　　FEATURES　　AEC-Q100 Grade1 qualified　　Operating temperature range -40°C < TJ < 150°C　　4.5V to 42V operating input voltage range　　Up to 60V tolerant for load dump @ 24V battery　　Supports battery cranking events down to 4V supply　　Simultaneous or exclusive control by PWMI and I2C interface　　Switching controller section　　Low shutdown current ISHDN < 15?A　　Fixed frequency peak current-mode controller　　Cycle-by-cycle power switch OCP　　Adjustable (250kHz to 2.2MHz) switching frequency with optional spread spectrum　　Synchronized boost and SEPIC topologies support　　Line switch control for standby power saving and inrush current protection　　Input overvoltage and output short-circuit protection　　LED strings control section　　4 x 40V rated constant current outputs　　Adjustable up to 200mA per channel　　±2% typ. output current accuracy　　Mixed PWM and Analog dimming　　100Hz to 12.8kHz dimming frequency　　Dimming ratio 10000:1 at 100Hz　　LED temperature sensor (NTC) management　　Selectable channels phase-shifting and adjustable Rise/Fall time for reducing EMI　　Open channel, LED short-circuit detection　　Two versions are available ALED7709A and ALED7709B　　APPLICATIONS　　Automotive lighting and backlighting　　Cluster/infotainment display　　Head-Up Display (HUD)　　Instrument lighting system　　Ambient light

Key word：

ST,ALED7709

Release time：2023-04-07 11:39 reading：2076 Continue reading>>

model	brand	Quote
MC33074DR2G	onsemi
CDZVT2R20B	ROHM Semiconductor
RB751G-40T2R	ROHM Semiconductor
BD71847AMWV-E2	ROHM Semiconductor
TL431ACLPR	Texas Instruments

model	brand	To snap up
ESR03EZPJ151	ROHM Semiconductor
TPS63050YFFR	Texas Instruments
IPZ40N04S5L4R8ATMA1	Infineon Technologies
BU33JA2MNVX-CTL	ROHM Semiconductor
BP3621	ROHM Semiconductor
STM32F429IGT6	STMicroelectronics

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