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NOVOSENSE launched the latest <span style='color:red'>automotive</span>-qualified chips - I²C GPIO extension, half-bridge driver, three-state buffer

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NOVOSENSE launched the latest automotive-qualified chips - I²C GPIO extension, half-bridge driver, three-state buffer

　　Leading analog and mixed signal IC company NOVOSENSE Microelectronics (short as NOVOSENSE) has recently launched a variety of automotive-qualified IC products including IC GPIO expansion chip, 40V multi-channel half-bridge driver and three-state buffer for automotive, industrial and other applications.　　NOVOSENSE automotive-qualified I?C IO expander NCA9539-Q1 provides up to 16 bits of GPIO expansion for I2C bus, which is widely used in automotive infotainment system, automotive assistant driving system, body, xEV powertrain and other modules. Operating at temperatures as high as 125 ℃, it provides enhanced anti-interference capability in the harsh environment, while meeting customer requirements on both cost and performance.　　40V automotive-qualified multi-channel half-bridge driver NSD830x-Q1 is capable to realize the full-bridge and half-bridge driver modes through SPI interface, supporting various loads like DC brushed motor, bipolar stepper motor, relay and LED, etc. In automotive systems, the solution can be widely used in HVAC flap control, electric side view mirror and domain/zonal controller.　　NOVOSENSE NCA824X series is an 8-channel three-state buffer, which can improve the driving ability of bus-oriented transceivers, clock drivers, and ensure the accuracy of signal timing. This device is usually used for motor driver, EV/HEV Traction Inverter, Solar Inverter, LED display and other applications. The product series is available in two versions: dual power supply and single power supply. Single power supply is with two-way transmission or one-way data transmission functions. Dual power supply is the upgraded version, which better meets customers' requirements for system upgrade and revision, and help customers realize bi-directional voltage conversion flexibly, with the function of Level shift.

Key word：

novosense

Release time：2023-01-28 14:39 reading：3041 Continue reading>>

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Ameya：TAIYO YUDEN Launches Automotive 150°C Multilayer Metal Power Inducto

　　TAIYO YUDEN CO. LTD. has announced today the addition of seven items intwo sizes to the AEC-Q200 (reliability qualification test standard for automotive passive components) qualified multilayer metal power inductor MCOIL? LCCN series, including the LCCNF1608KKTR24MAD (1.6x0.8x1.0 mm, height is the maximum value).　　This power inductor product is designed for use as a choke coil in power supply circuits for automotive body and information systems. The product has a wider operating temperature range of -55 to +150°C than our existing product, the LCCNF1608KKTR24MA (-40 to +125°C). The LCCNF1608KKTR24MAD simultaneously features industry-leading DC superposition characteristics (saturation current at 3.2 A) and　low DC resistance (35 mΩ) (both are the maximum values), while maintaining the compact size of the metal　power inductor MCOIL? LSCN series. The product contributes to the high-density mounting of power supply circuits for ADAS units and instrument clusters, which are increasingly being upgraded with greater functionality and performance.　　Production of the product commenced at our subsidiary company, WAKAYAMA TAIYO YUDEN　　CO., LTD. (Inami-cho, Hidaka-gun, Wakayama prefecture, Japan) from June 2022, with a sample price of 50　yen per unit.　　Technology Background　　Vehicles produced recently are equipped with an ever-greater number of electronic control units, typified by　ADAS units. As a result, more power supply circuits are required, thereby boosting the demand for power　inductors used in them. In addition, it is expected that the instrument cluster and other infotainment devices　will increasingly be consolidated into an integrated cockpit. While ICs have increasingly higher throughput to　support such greater functionality and performance, smaller and thinner on-board electronics components are　also required to allow for high-density arrangement of devices in an integrated module.　　In response to this requirement, TAIYO YUDEN has launched the AEC-Q200 qualified, highly　reliable LCCN series based on the metal power inductor MCOIL? LSCN series, which has a multilayer structure with advantages in realizing smaller, thinner products and further improving its material and　multilayer technologies.　　TAIYO YUDEN focuses on the development of products that meet market needs, and will continue to　expand its power inductor product lineup.　　Application　　Choke coils in power supply circuits for automotive body systems as well as information systems, typified by　instrument clusters and other infotainment devices

Key word：

TAIYO

Release time：2023-01-19 13:14 reading：1911 Continue reading>>

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STMicroelectronics Automotive-grade Devices Feature Enhanced Power Densities

　　STMicroelectronics has introduced five power-semiconductor bridges in popular configurations, housed in its advanced ACEPACK SMIT package that eases assembly and enhances power density over conventional TO-style packages.　　Engineers can choose from two STPOWER 650V MOSFET half bridges, a 600V ultrafast diode bridge, a 1.2kV half-controlled full-wave rectifier, and a 1.2kV thyristor-controlled bridge leg. All devices meet automotive-industry requirements and are suitable for electric vehicle on-board chargers (OBC) and DC/DC converters, as well as industrial power conversion.　　ST’s ACEPACK SMIT surface mounted package delivers the easy handling of an insulated package with the thermal efficiency of an exposed drain. It allows direct-bonded copper (DBC) die attachment for efficient top-side cooling. The 4.6cm2 exposed metal topside of the ACEPACK SMIT permits easy attachment of a planar heatsink. This creates a space-saving low profile that maximizes thermal dissipation for greater reliability at high power. The module and heatsink can be placed using automated inline equipment, which saves manual processes and boosts productivity.　　While minimizing the stack height and enhancing power density, the topside cooling design and 32.7-by-22.5mm package footprint allow 6.6mm lead-to-lead creepage distance. The tab-to-lead insulation is 4.5kVrms. The package also has low parasitic inductance and capacitance.　　The SH68N65DM6AG and SH32N65DM6AG 650V-MDmesh DM6 MOSFET half bridges now available in ACEPACK SMIT are AQG-324 qualified. Their Rds(on) (max) of 41m? in the SH68N65DM6AG and 97m? in the SH32N65DM6AG ensures high electrical efficiency and low thermal dissipation. They can be used in DC/DC converters for both OBC and high voltage to low voltage section. Their multi-role flexibility helps streamline inventory and simplify procurement.　　The STTH60RQ06-M2Y 600V, 60A full-wave bridge rectifier comprises ultrafast diodes with soft recovery characteristic and is PPAP capable for use in automotive applications.　　The STTD6050H-12M2Y 1.2kV, 60A half-controlled single-phase AC/DC bridge rectifier is AEC-Q101 qualified and has high noise immunity with dV/dt of 1kV/μs.　　The STTN6050H-12M1Y is a 1.2kV, 60A half bridge that comprises two internally connected thyristors (silicon-controlled rectifiers – SCRs). AEC-Q101 qualified, it can be used in automotive OBCs and charging stations and industrial applications such as AC/DC conversion in motor drives and power supplies, single- and tri-phase controlled rectifier bridges, totem-pole power-factor correction, and solid-state relay.

Key word：

STMicroelectronics,ST

Release time：2023-01-12 10:43 reading：3780 Continue reading>>

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STMicroelectronics Enhances Op Amp Performance for Industrial, Automotive Applications

　　STMicroelectronics has launched three 6MHz rail-to-rail op amps with strong all-round parameters for industrial and automotive applications.　　STMicroelectronics is simplifying designers’ search for high-performing operational amplifiers (op amps) by introducing three new 6MHz rail-to-rail devices with strong all-round parameters including a wide operating-voltage range and low noise.　　The TSB511, TSB512, and TSB514 are single, dual, and quad op amps, respectively. They can operate from a single supply in the range from 2.7V to 36V, and with dual supplies from ±1.35V to ±18V. This wide voltage range and flexibility let engineers benefit from applying a familiar op-amp type across various applications and different power domains. The rail-to-rail input and output help ensure suitable dynamic range when operating close to the minimum supply voltage.　　Input noise density of 12nV/√Hz allows use in circuits where signal integrity is a priority, particularly with weak or wideband signals. In addition, the fast slew rate of 3V/?s saves trading signal amplitude and frequency range in filter and amplifier circuits. The maximum offset voltage of 1.5mV ensures good accuracy and precision for control and measurement applications.　　The TSB511, TSB512, and TSB514 are ideal for use in filters, power-supply controls, motor controls, actuator drivers, and resistive transducers such as strain gauges and pressure, temperature, and position sensors. They are also chosen for high-side and low-side current sensing, Hall effect sensors, and various applications in test and measurement equipment, industrial process controllers, and signal conditioning circuits.　　The wide -40°C to 125°C operating temperature range ensures robust performance in industrial and automotive environments. Automotive-qualified variants are available.　　Part of ST’s 10-year longevity program, the TSB511, TSB512, and TSB514 are in production now, in Mini SO8, SO8, SOT23-5, TSSOP14, and SO14 package options with standardized pin assignments that ease plug-and-play insertion in customers’ circuits.

Key word：

STMicroelectronics

Release time：2022-12-28 13:44 reading：3771 Continue reading>>

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NXP Driving Carbon Reduction, Energy Savings in Automotive Industry

　　The global automotive industry’s move toward electrification and intelligence is driving up demand further for chips, making the automotive market a battleground for semiconductor makers in recent years.　　The global automotive industry’s move toward electrification and intelligence is driving up demand further for chips, making the automotive market a battleground for semiconductor makers in recent years. NXP Semiconductors, which has been focusing on enabling energy savings and carbon reduction, aims to leverage its technology innovations to help drive the automotive industry toward a sustainable world.　　Traditional fuel vehicles emit about 2.2kg of carbon dioxide per liter of gasoline, which can be regarded as one of the major causes that have accelerated global warming. Because of this, many countries have set a schedule to ban the sale of fuel vehicles to slow down climate change. This has accelerated the entry of electric vehicles (EVs) into people’s lives. Market analyst TrendForce estimates that global shipments of new energy vehicles would reach 14.5 million units this year, and around 25 million units in 2025.　　“One industry where we are seeing significant growth and opportunities is the automotive industry, which is undergoing a huge shift from internal combustion engines [ICE] to electrification,” says Elton Tsang, Senior Director, Global Sales for NXP Semiconductors in Taiwan. He points out that California, United States, has recently announced a ban on ICE vehicles, which will come into force in 2035. Meanwhile, the latest EY Mobility Consumer Index reports that China leads the world in the progress towards an EV future.　　NXP’s EV power management technology enabling automotive industry transformation　　The electrification of vehicles worldwide is very dependent on battery efficiency and battery management. The more precise the management, the higher the battery efficiency. Which is why the battery management system (BMS) plays a pivotal role in the process of vehicle electrification.　　Tsang explains that the composition of the BMS includes ICs and sensors that control such key characteristics as voltage, temperature, and current. Apart from maximizing the battery’s power output, the BMS also balances its functions and help ensure its safe operation.　　Two of the three major EV makers have used NXP’s BMS since 2021, while 16 of the top 20 car makers have already adopted the company’s battery system solutions. Such fruitful results have allowed NXP to be voted not only as this year’s “Featured Industry 4.0 MPU/MCU Supplier” but its dedicated high-performance MPU-S32R45 for 4D imaging radar has also received the Best Sensor Product of the Year award—both in the Taiwan and Asia categories—at EE Awards Asia 2022. Organized by AspenCore, the publisher of EE Times and EDN in Taiwan and Asia, EE Awards Asia, now on its second year, celebrates the innovation, creativity, and contributions of Asia’s engineering community that have made a difference in the way we work, live, and communicate over the past year.　　Tsang says that automakers are currently facing many severe challenges, including laying the foundation for subsequent automotive innovations and integrating connectivity, safety, and electrification functions into future software-defined vehicles. OEMs must integrate at least hundreds of processors in vehicles and tap the valuable data generated by distributed electronic control units to cope with the rapid growth of vehicle software.　　To achieve this goal, Tsang says automakers need to evolve to a platform-based architecture to ensure consistency across brands and different models, while making full use of software reuse to save high software development costs.　　“This emerging OEM platform model requires automakers to achieve rapid integration of new functions, to secure over-the-air remote updates through scalable processor solutions, and to make significant progress in architecture in the final step,” explains Tsang.　　Driving AI development with machine learning platforms and solutions　　On top of automotive products, NXP has also won the Featured Influential Enterprise in Asia. Not only has NXP’s IW612 tri-band radio device, the first such invention in the industry, which supports Wi-Fi 6, Bluetooth 5.2, and 802.15.4 protocols, won the Best RF and Wireless IC of the Year Award in the Taiwan and Asia categories, but NXP’s eIQ machine learning (ML) platform and development environment has also won the Best AI Solution of the Year in Taiwan, clearly indicating that NXP is also deeply trusted by customers in the fields of secure connection technology and artificial intelligence (AI).　　“AI-related applications require support in machine learning and run-time inference. This is the strength that NXP’s eIQ machine learning software development environment can provide!” Tsang says, highlighting the special features of the eIQ ML platform and development environment. He says as AI continues to stride forward, developers can use eIQ’s easy-to-use tools to train ML models for applications on the cores of neural processing unit (NPU) or central processing unit (CPU), and then deploy them on the microcontroller (MCU).　　Taking NXP’s latest MCX with a new 32-bit Arm Cortex-M33 core built in a customized NPU as an example, Tsang says using the easy-to-use tools provided by eIQ to train ML models targeting NPU or CPU cores, the MCX series will offer secure boot constructed by NXP’s “security-by-design” methodology, with an immutable root-of-trust on chips and hardware-accelerated encryption, while specific series also provide built-in EdgeLock security subsystem to ensure hardware security.　　On the heels of AI development is increasingly popular edge computing. As many new applications are constantly being added, the original MCU must process more and more data, and the terminals that need to be connected are becoming more and more complex. Tsang says improvements in the performance of MCUs is a must for the market, so NXP has recently launched the MCX series of products.　　“Through the MCX series of products, AI can be introduced into low-power embedded devices and edge devices. When using NPU to perform machine learning operations, the speed can be increased by 30 times. If AI is imported from the cloud to the consumer and industrial IoT devices, it can effectively improve operational efficiency and meet more complex application requirements,” says Tsang.　　Creating a sustainable world by through continuous technology innovations　　Whether it is the development of technologies related to vehicle electrification, EVs, or AI, NXP’s ultimate goal is to fulfill its ESG mission. Winning several awards this time, the company becomes more confident in helping achieve a better, safer, and more sustainable world through innovation. Automakers and industry players will continue to play as the two major growth drivers for NXP, while the R&D of innovative technologies in related fields will still be the direction of NXP’s efforts.　　Tsang says NXP expects to achieve a better, safer, more secure, and sustainable world through innovation. “We believe that this has aroused a strong resonance among all the industrial customers whom we are serving, and these customers are trying to deploy more reliable, more powerful, more energy-efficient emerging technologies that will outperform previous generations,” he notes.　　In particular, all kinds of smart devices that are changing human life will have the opportunity to make a major contribution to environmental sustainability once they can branch out. Tsang says while these technologies save energy at the edge and increase performance, they can also bring the benefit of lower power consumption to more users. Considering that millions of devices are sold all over the world every quarter, even a small reduction in power consumption would reduce the need for the addition of power plants.　　“If everyone becomes energy efficient, the whole world will change,” Tsang concludes.

Key word：

NXP

Release time：2022-12-28 13:38 reading：1947 Continue reading>>

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NXP:Raising the Bar in Security and Performance for Automotive Bluetooth® Low Energy

　　NXP：Bluetooth Low Energy (BLE) , with its cost-effective, low-power infrastructure and its ubiquitous availability in smartphones, has become an important tool for car makers. Over the past several years, what started as a way to give drivers a better way to make voice calls, send texts and stream music, has penetrated deeper into the vehicle architecture, serving to replace legacy technologies, increase efficiency and add convenience.　　For example, BLE can be used as an alternative to traditional LIN and CAN networks, replacing heavy cables with wireless connectivity. In hybrid and all-electric vehicles, BLE can be used to send temperature and voltage data from battery packs to the main vehicle computer, as part of battery management systems. In the infotainment system, BLE can increase efficiency, by using duty cycling to put other, more power-intensive communication formats—such as cellular or Wi-Fi—in sleep mode when not in use. BLE also gives tire pressure monitoring systems (TPMS) the ability to send notifications to your smartphone when the tires need air and can let you check tire pressure using an app instead of fiddling with a mechanical gauge.　　BLE for Smart Car Access　　Of the many ways that BLE can benefit automotive, few promise to improve the end-user experience more than BLE’s integration into smart access systems, where a BLE-enabled key fob or smartphone enables handsfree control of the car’s door locks and ignition along with digital-key car sharing capability.　　Handsfree access has been around for a while, but newer formats, based on a combination of BLE and ultra-wideband (UWB) , are much more secure and far less vulnerable to the relay attacks that have plagued earlier versions of remote access.　　These newly defined digital keys go beyond traditional key fobs, extending the usual features of locking and unlocking the car, opening the windows or starting the engine, to provide full control over the access rights to the car. Vehicle owners can share access among family and friends, no matter the physical distance, and can grant certain rights, ranging from access only to the car’s trunk to full driving capability. Using wireless protocols such as BLE and UWB for localization, digital key standards let you access your car without having to fish your phone out of your pocket or bag, and without having to open an app. Presence alone is all that’s needed to unlock or lock doors and start the engine.　　The Car Connectivity Consortium (CCC), for example, is a cross-industry organization, focused on smartphone-to-car connectivity solutions, that has defined a standard that enables mobile devices to securely store, authenticate and share digital keys for vehicles. The CCC’s Digital Key release 3.0 specification, released in 2021, adds BLE and UWB functional requirements for secure car access (NXP is a CCC board member and helped define the Digital Key 3.0 specification).　　Beyond the CCC, other standard bodies, such the Asia-Pacific Connected Vehicles Industry Association (ICCE) and the Smart Car Association Open Alliance (ICCOA), have proposed digital-key standards that use a combination of BLE and UWB.　　Taking Automotive BLE to The Next Level　　As a leading supplier of BLE solutions, NXP has played a key role in helping to add BLE to vehicles. In particular, our broad portfolio of BLE-enabled MCUs is designed specifically for automotive use. Most recently, we’ve introduced the KW45, a third-generation device that delivers an unmatched combination of security, flexibility, upgradability and performance.　　Building on the success of the KW3x, the KW45 offers a three-core architecture that includes a 96-MHz CM33 application core a dedicated CM3 64-MHz radio core, and an isolated EdgeLock Secure Enclave.　　Use this block diagram to see the interaction between the three cores in the KW45.　　App core: 1 MB of Flash and 128 kB of RAM to support advanced automotive applications, including communication over CAN, using an integrated FlexCAN module, as well as support for AutoSAR applications.　　Radio subsystem: Upgradeable Bluetooth 5.3 compliant, channel sounding-capable radio core with 256 kB of Flash memory and up to 88 kB of RAM.　　EdgeLock Secure Enclave: Isolated core with advanced security features such as secure lifecycle management, key-store operations and hardware-accelerated cryptographic functionality.　　By dividing responsibilities between application, radio and security cores, the KW45 ensures that connected automotive applications have the resources, upgradability and integration to evolve with changing standards and design requirements.　　Discover NXP's advanced Bluetooth solutions for Automotive, IoT and Industrial.　　The KW45’s advanced hardware is supported by a suite of software-enablement tools that target important automotive applications, including car sharing, sensors, wireless on-board diagnostics functions and, of course, CCC Digital Key 3.0 for secure car access. The KW45 is also the first to offer MCAL Drivers and a complex device driver for BLE enabling AutoSAR-compliant solutions.　　KW45 for Digital Key　　The KW45 is designed to meet the advanced security requirements of Digital Key 3.0. The KW45’s EdgeLock Secure Enclave enables secure trust provisioning and secure firmware updates, security lifecycle management and other security tasks associated with secure access. For Digital Key 3.0, the KW45 enables BLE with end-to-end security, so communications between the phone’s Secure Element and the car’s Secure Element are always protected.　　As part of a Digital Key 3.0 solution, along with NXP’s Secure Elements and NFC product families, the KW45 works seamlessly with NXP’s Trimension SR106, the industry’s first single-chip solution to combine UWB ranging and radar. Together, the KW45 and SR106 create a single-supplier solution that simplifies the design of Digital Key features. At the same time, the SR106 can do double duty, supporting in-cabin radar, as part of occupant-safety systems now being mandated in Europe, the US and elsewhere.　　KW45 for AUTOSTAR-Certified ECUs　　To streamline the development of automotive software and enable quick AUTOSAR certification for electronic control units (ECUs), the KW45 includes an NXP MCAL drivers, which maps all the on-chip MCU peripheral modules and external devices to memory, and makes the upper software layer independent of the MCU. KW45's MCAL driver package includes a complex device driver (CDD) for BLE. The KW45 can also be combined with NXP’s SBC offerings, for a streamlined, single-supplier solution for a broad range of ECU applications.　　KW45 for Future-Proof Development　　Using a Flash-based software core for radio operation adds a remarkable amount of flexibility and longevity to the design. The KW45 can evolve as BLE evolves, so vehicles can interface with smartphones today, tomorrow and for years to come—without expensive, time-consuming hardware upgrades or redesigns.　　Near-field communication (NFC) provides the backup entry for access when a smartphone runs out of power. Altogether, these smart technologies function collectively to give users a seamless experience.

Key word：

NXP

Release time：2022-12-27 17:14 reading：1516 Continue reading>>

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Outlook Remains Bright for Automotive Electronic Systems Growth

Despite some high-profile setbacks with autonomous vehicles, auto electronic systems growth projects well; remains a hotbed for semiconductor growth.Sales of automotive electronic systems are forecast to increase 7.0% in 2018 and 6.3% in 2019, the highest growth rate in both years among the six major end-use applications for semiconductors. Figure 1 shows that sales of automotive-related electronic systems are forecast to increase to $152 billion in 2018 from $142 billion in 2017, and are forecast to rise to $162 billion in 2019. Furthermore, automotive electronic systems are expected to enjoy a compound annual growth rate (CAGR) of 6.4% from 2017 through 2021, again topping all other major system categories, based on recent findings by IC Insights.Figure 1Overall, the automotive segment is expected to account for 9.4% of the $1.62 trillion total worldwide electronic systems market in 2018 (Figure 2), a slight increase from 9.1% in 2017. Automotive has increased only incrementally over the years, and is forecast to show only marginal gains as a percent of the total electronic systems market through 2021, when it is forecast to account for 9.9% of global electronic systems sales. Though accounting for a rather small percentage of total electronic system marketshare in 2018, (larger only than the government/military category), automotive is expected to be the fastest-growing segment through 2021.Figure 2Technology features that are focused on self-driving (autonomous) vehicles, ADAS, vehicle-to-vehicle (V2V) communications, on-board safety, convenience, and environmental features, as well as ongoing interest in electric vehicles, continues to lift the market for automotive electronics systems, despite some highly publicized accidents involving self-driving vehicles this year that were at least partly blamed on technology miscues.New advancements are more widely available onboard mid range and entry-level cars and as aftermarket products, which has further raised automotive system growth in recent years. In the semiconductor world, this is particularly good news for makers of analog ICs, MCUs, and sensors since a great number of all of these devices are required in most of these automotive systems. It is worth noting that the Automotive—Special Purpose Logic category is forecast to increase 29% this year—second only to the DRAM market, and the Automotive—Application-Specific Analog market is forecast to jump 14% this year—as backup cameras, blind-spot (lane departure) detectors, and other “intelligent” systems are mandated or otherwise being added to more vehicles. Meanwhile, memory (specifically, DRAM and flash memory) is increasingly playing a more critical role in the development of new automotive system solutions used in vehicles.

Key word：

Automotive Electronic

Release time：2018-11-21 00:00 reading：1261 Continue reading>>

Micron collaborates with premium German automaker to advance <span style='color:red'>automotive</span> memory technologies

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Micron collaborates with premium German automaker to advance automotive memory technologies

Micron Technology, Inc., (Nasdaq: MU) today announced at Electronica 2018 that it will collaborate with the BMW Group to further advance the development of automotive memory solutions used in vehicles. Memory and storage are key components in accelerating the intelligence and user experience of next-generation systems in vehicles, including in-cabin infotainment as well as advanced driver-assistance systems (ADAS) technology, which together play an important role in making self-driving autonomous cars a reality.Micron and the BMW Group will intensify their existing efforts toward testing and development of automotive memory solutions at Micron’s state-of-the-art lab in Munich, Germany. Using the Test Automation Framework of the BMW Group as a car emulator platform, the two companies will work together to define and validate memory and storage solutions for next-generation platforms. The collaborative effort will leverage Micron’s memory and storage technology expertise, along with its broad portfolio of DRAM, NAND, and NOR technologies, including LPDRAM, e.MMC, UFS and SSD storage solutions.As a proven memory partner for automotive manufacturers, Micron recognizes the importance of validating and testing new automotive memory technologies for robustness and reliability before releasing them into the market. Micron’s customer lab expertise in developing innovative automotive memory technologies will enable the BMW Group to raise the quality of the driving experience in automobiles of the future.“The incorporation of new features and capabilities in advanced in-vehicle infotainment (IVI) and ADAS, such as voice recognition, hand gesturing and image recognition, are driving an explosive growth in both volatile and nonvolatile memory embedded in vehicles, accelerating intelligence at the edge,” said Giorgio Scuro, vice president of Micron’s automotive division. “Micron has a long-standing record working with automotive industry partners, and this joint initiative with the BMW Group is a testament to our expertise in bringing innovative automotive memory technologies to market.”As a leading memory partner with more than 25 years of experience, Micron provides advanced automotive memory solutions that meet stringent quality, reliability and compliance requirements. Micron’s broad portfolio of volatile and nonvolatile memory products are optimized for automotive and supported by a formal product longevity program.

Key word：

Micron

Release time：2018-11-15 00:00 reading：1377 Continue reading>>

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Automotive semiconductors to reach $73B by 2023, says Semico Research

Automotive electronics are a bright light for the semiconductor industry, as smartphone growth slows, and personal computing growth continues to decline. The expectation is that automotive electronics will become the next big technology market driver. The automotive semiconductor market will exceed the overall industry growth as semiconductor content expands with added features and functionality. The desire to put self-driving vehicles on the road is creating increased interest in innovative automotive solutions as well as increased semiconductor demand. A new research report from Semico Research, Automotive Semiconductors: Accelerating in the Fast Lane, states that the automotive segment of the semiconductor industry will grow to $73 billion by 2023.“There are a number of challenges in the automotive industry that are unique for the system developers to navigate. Autonomous driving is a critical one,” says Jim Feldhan, President of Semico Research. “Many people feel AI is the key to the success of autonomous driving. Autonomous driving includes the ability to have optical character recognition, i.e. reading signs, distinguishing a sign from a person, and determining if the brakes should be turned on. Security surveillance, computer vision, virtual reality and image processing, real-time diagnosis and corrective solutions and strategic map planning are critical to autonomous driving. Increasing levels of processing are required as these systems become more sophisticated.”Key findings in the report include:The TAM market for automotive IP processor royalties will grow to $2.34 billion by 2023.A fully autonomous vehicle (L5) is expected to require 74GB DRAM and 1TB NAND memory.Powertrain requires the highest compute function and carries the highest ASP.Revenue generated from processors in Autonomous Driving Systems will reach $422 million in 2018.In its recent report, Automotive Semiconductors: Accelerating in the Fast Lane (MP118-18), Semico Research provides a comprehensive review of the current market and future opportunities for the semiconductor industry in the automotive segment. Topics covered in the report include Automotive Trends, Opportunities and Challenges, Manufacturing Technology for Auto ICs, Automotive Forecast, and Semiconductor IP in Automotive. The report is 56 pages long and includes 28 tables and 34 figures.

Key word：

Automotive semiconductors

Release time：2018-08-16 00:00 reading：1178 Continue reading>>

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Automotive mmWave Radar Market Expects Rapid Growth with a CAGR of 15% from 2018 to 2023

According to the latest research by TrendForce, the market of automotive mmWave radar expects rapid growth with the shipment estimated at 65 million units in 2018; the CAGR is expected to be 15% from 2018 to 2023. The growth momentum comes from China’s adoption of C-NCAP, a car safety assessment program, and NHTSA’s new regulation that makes automatic emergency braking system as a standard feature for new cars.“With its wavelengths between centimeter wave and light wave, mmWave radar has been widely used in military fields because of its properties of both optical waveguide and electromagnetic waveguide”, says Yvette Lin, an analyst of TrendForce. With the development of automotive electronics, mmWave sensors have become a key for ADAS and autonomous driving, but its development in the past years has been stalled since mmWave radar needs exclusive frequency band. The situation has changed after the World Radiocommunication Conference 2015 allocated 76~81GHz for automotive radar, providing a clear direction for the development of automotive mmWave radar.Compared with other sensors, automotive mmWave radars are less influenced by weather, as well as shapes and colors of objects, with a detection range of 250 meters. Therefore, it has been widely used in active safety systems like blind spot detection (BSD), automatic emergency braking (AEB) and front anti-collision warning (FCW). At present, mass-produced cars with FCW and AEB are normally equipped with a long-range mmWave radar with two short-range ones, while cars with BSD require two short-range ones.Current suppliers of long-range mmWave radar are mainly Tier 1 international manufacturers, while most Taiwan-based and Chinese manufacturers remain in the process of R&D or verification. As for short-range ones, Taiwan-based companies like Alpha Networks, Wistron NeWeb, Cubtek and Universal Microelectronics, have launched related products. Chinese companies, including Nanoradar, Sensortech Intelligent Technology and Intibeam, have also entered the stage of productization.Lin notes that, China has included FDW and AEB in C-NCAP for the first time in 2018, while the U.S. will make AEB system as a standard feature for new cars since 2022, which will jointly drive the global shipments of mmWave radar to 65 million units this year. Driven by the demand for active safety from auto markets in China and the U.S., Trendforce estimates the annual shipments of automotive mmWave radars at 132 million in 2023, a CAGR of 15% for the period 2018~2023.

Key word：

Automotive Market

Release time：2018-07-23 00:00 reading：1137 Continue reading>>

model	brand	Quote
TL431ACLPR	Texas Instruments
RB751G-40T2R	ROHM Semiconductor
BD71847AMWV-E2	ROHM Semiconductor
MC33074DR2G	onsemi
CDZVT2R20B	ROHM Semiconductor

model	brand	To snap up
TPS63050YFFR	Texas Instruments
BU33JA2MNVX-CTL	ROHM Semiconductor
BP3621	ROHM Semiconductor
ESR03EZPJ151	ROHM Semiconductor
IPZ40N04S5L4R8ATMA1	Infineon Technologies
STM32F429IGT6	STMicroelectronics

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