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Ameya360:Ambarella Selects Samsung’s 5nm Technology for Automotive AI Controller

　　Samsung Electronics Co. Ltd’s Foundry business is providing its 5nm process technology to and Ambarella Inc. for its newly announced CV3-AD685 automotive AI central domain controller. This collaboration will help transform the next generation of autonomous driving vehicle safety systems by bringing new levels of AI processing performance, power and reliability.　　The CV3-AD685 is the first production version of Ambarella’s CV3-AD family of automotive AI central domain controllers, with Tier-1 automotive suppliers announcing they will offer solutions using the CV3-AD system-on-chip (SoC) product family. Samsung’s 5nm process technology is optimized for automotive-grade semiconductors, with extremely tight process controls and advanced IP for exceptional reliability and outstanding traceability.　　Ambarella will rely on Samsung’s 5nm process maturity and the technology’s solid track record. This 5nm process is backed by the company’s extensive experience in automotive foundry process, IP, and service package development to enable manufacturers to create cutting-edge innovations in assisted and automated mobility.　　“Ambarella and Samsung Foundry have a rich history of collaboration, and we are excited to bring their world-class 5nm technology to our new CV3-AD685 SoCs,” said Fermi Wang, President and CEO at Ambarella. “Samsung’s proven automotive process technology allows us to bring new levels of AI acceleration, systems integration and power efficiency to ADAS and L2+ through L4 autonomous vehicles.”　　The CV3-AD685 integrates Ambarella’s next-generation CVflow AI engine, which includes neural network processing that is 20 times faster than the previous generation of Ambarella’s CV2 SoCs. It also provides general-vector and neural-vector processing capabilities to deliver the overall performance required for full autonomous driving (AD) stack processing, including computer vision, 4D imaging radar, deep sensor fusion and path planning.　　“Samsung brings 5nm EUV FinFET technology to automotive applications for unprecedented ADAS and vision processor performance,” said Sang-Pil Sim, executive vice president and head of Foundry Corporate Planning at Samsung Electronics. “With Tier-1 automotive suppliers already adopting the technology, we believe other automotive companies will also consider using the Ambarella CV3-AD SoC product family manufactured in Samsung’s 5nm process.”　　The CV3-AD685 will be the first in the CV3-AD product family to use Samsung’s 5nm process, and this SoC integrates advanced image processing, a dense stereo and optical flow engine, ARM Cortex A78AE and R52 CPUs, an automotive GPU for visualizations, and a hardware security module (HSM). It features an “algorithm first” architecture that provides support for the entire autonomous-driving software stack.　　The high-performance, power efficient and scalable CV3-AD family, which is built specifically for ADAS, complements a wide range of solutions for assisted driving, while advancing vehicle automation. The integrated CV3-AD685 SoC enables information from various sensors to be fused for robust L2+ to L4 autonomous driving. Samsung Foundry’s industry-leading process technology and advanced 3D-packaging solutions are powering many of the latest mobile, HPC and automotive solutions.　　Samsung’s 5nm process is also backed by the Samsung Advanced Foundry Ecosystem (SAFE) program. The SAFE program ensures close collaboration between Samsung Foundry, ecosystem partners, and customers to deliver robust SoC designs based on certified key design components including Process Design Kits (PDK), reference flows with Design Methodologies (DM), a variety of Intellectual Properties (IP), and on-demand design support.

Key word：

Ambarella,Samsung,AI

Release time：2023-02-23 16:08 reading：3588 Continue reading>>

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Ameya360:Space-saving Chip Ferrite Beads for Automotive Noise Suppression

　　Murata has broadened its portfolio of chip ferrite beads with the introduction of the BLM15PX_SH1 and BLM15PX_BH1 series. Supplied in a 1005 mm (0402 inch) size, these compact and rugged units are highly optimised for automobile deployment. They present engineers with the industry’s first power supply line noise suppression components in this size format. Current rated versions of 900 mA to 3000 mA are available, with impedance figures at 100 MHz of 33 Ohms to 600 Ohms being covered.　　With mechanical systems inside vehicles being replaced by electronic ones, plus increasing levels of data acquisition being witnessed, suppression of electro-magnetic interference (EMI) noise emanating from power supply lines is recognised as a vital element of modern automobile design. The number of sensors and cameras being incorporated into vehicles is increasing dramatically, in order to support ADAS and eventually autonomous driving, and the integrity of the data captured by these devices needs to be maintained while it is transported to and from the relevant ECUs.　　The inherent robustness of Murata’s AEC-Q200 qualified BLM15PX_SH1 and BLM15PX_BH1 series make these chip ferrite beads highly suitable for use in uncompromising automotive environments. The low DC resistance characteristics of these components (down to 0.022 Ohms Max.) helps to mitigate the power losses experienced and keeps associated heat generation to a minimum. The BLM15PX_SH1 series supports an operational temperature range of ?55°C to +125°C with the BLM15PX_BH1 series supporting an even greater range of ?55°C to +150°C.　　“Engineers need to ensure that high degrees of noise control have been implemented, so that in-vehicle infotainment and driver assistance functions will not be impacted,” states Tomohiro Yao, EMI Division, General Manager of Marketing & Promotion Department, at Murata. “The BLM15PX_SH1 and BLM15PX_BH1 series set new benchmarks when it comes to noise suppression, delivering performance capabilities that would normally only be possible with much larger components.”

Key word：

Chip,Murata

Release time：2023-02-20 15:37 reading：2050 Continue reading>>

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AMEYA360:NOVOSENSE at Automotive World 2023

　　NOVOSENSE Microelectronics, a highly robust & reliable analog and mixed signal IC company, announced that it will showcase technologies and products for automotive electronics solution at Automotive World 2023, one of the world's leading exhibitions for the advanced automotive technologies, on January 25-27 in Tokyo, Japan. During the exhibitor’s seminar, NOVOSENSE engineer will give presentation about semiconductor solutions for automotive applications on Jan 27.　　Comprehensive Automotive Electronic Solutions Enabled by NOVOSENSE　　At this exhibition, NOVOSENSE will present products of isolator, interface, power driver, current sensor, pressure sensor etc., which can be applied in such applications as OBC/ DCDC，PDU, thermal management, battery management system (BMS), inverter/powertrain, automotive lighting, body/vehicle (domain) control and other automotive electronic solutions for electrified vehicle (xEV).　　High-performance, Robust, Reliable Products and Service Provided by NOVOSENSE　　Since 2016, NOVOSENSE has started to develop automotive-qualified products. With mature chip-development capabilities, abundant experience in mass production and quality assurance, NOVOSENSE is committed to providing high-performance, robust, reliable products and service for automotive OEM and Tier1 manufacturers. NOVOSENSE’s automotive-qualified products have been successfully adopted by the global mainstream automotive supply chain and put into mass production.　　Based on ten years’ solid IC design & mass production experience, NOVOSENSE can offer more than 1,400 IC products for sale. The accumulative shipment has reached more than 4 billion pcs, widely used in automotive, industrial control, information & communication as well as consumer electronics etc.　　With the mission of "Sense and Drive the Future, Build a Green, Smart and Connected World with Semiconductors”, NOVOSENSE has built partnership with thousands customers worldwide, including many global automotive OEM and Tier1 manufacturers.

Key word：

AMEYA360,NOVOSENSE

Release time：2023-02-17 13:35 reading：3626 Continue reading>>

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Ameya360:Novosense automotive-qualified Integrated Absolute Pressure Sensor NSPAS1

　　NSPAS1 is a calibrated absolute pressure sensor launched by NOVOSENSE for vehicle intake pressure, NEV vacuum boosting system and motorcycle electronic injection. The product adopts automotive-qualified signal conditioning chip to calibrate and compensate the output of MEMS piezoresistive die, ensuring excellent reliability of the product while integrating the two chips to greatly reduce the package size. At the same time, this product can provide standard output in its operation temperature range without customer calibration, which can accelerate the process of product development and mass production; the product complies with the AEC-Q100 reliability standard.　　Product Features　　Operating temperature range: -40℃~125℃　　High accuracy in full temperature range:　　Better than ±1%F.S. in the range of - 0℃~85℃　　Better than ±1.5%F.S. in the range of -40℃~125℃　　Support -24 v to 28V over voltage and reverse voltage protection　　Fluorinated gel protection, compatible with oil and gas environment　　Faster response time less than 0.8ms　　Support absolute output/ratio-metric output, with output curve customized　　Disconnection detection, output clamping, output alarm function　　Pressure range 10kPa~400kPa, which can be customized　　AEC-Q100 qualified　　Package:SOP-8 (7.3mm x 7.3mm)　　Application　　Automotive: motorcycle three-in-one sensor, vehicle TMAP intake pressure detection, BPS battery pack thermal runaway pressure detection, EGR-TMAP exhaust gas recirculation pressure detection, canister desorption pressure detection, VBS vacuum boosting system sensor, ECU/VCU atmospheric pressure detection, seat air bag pressure detection　　Industrial: pressure transmitter, industrial vacuum degree testing, etc.　　Functional Block Diagram

Key word：

Ameya360,Novosense,NSPAS1

Release time：2023-02-16 15:50 reading：5622 Continue reading>>

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Ameya360:Renesas Automotive IPD Enables 40% Smaller Footprint

　　Renesas Electronics Corp. has launched a new automotive Intelligent Power Device (IPD) that will safely and flexibly control power distribution within vehicles, addressing the requirements of next-generation E/E (electrical/electronic) architectures.　　The new RAJ2810024H12HPD is available in the small TO-252-7 package and reduces the mounting area by about 40% compared to the conventional TO-263 package product. In addition, the advanced current detection function of the new device allows highly accurate detection of abnormal currents such as overcurrent.　　Since the new IPD detects abnormal currents even at low loads, it allows engineers to design highly safe and precise power control systems that can detect even the smallest abnormalities.　　The new IPD was developed to address the growing requirements as E/E architectures continue to evolve. In a conventional distributed E/E architecture, power supply from the battery is distributed to each Electronic Control Unit (ECU) via long, thick wires from a power box consisting of mechanical relays and fuses. IPDs have a longer life and are maintenance-free compared to mechanical relays, so they can be placed anywhere in the vehicle.　　As the automotive industry moves toward centralized or zone-oriented E/E architectures, IPDs are becoming an ideal choice for building efficient and flexible power supply networks since they use shorter, thinner wires. Renesas’ IPD in particular provides a more efficient, safer and smaller solution for power distribution control.

Key word：

Renesas,IPD

Release time：2023-02-15 14:04 reading：1963 Continue reading>>

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Ameya360:Vishay Intertechnology Automotive Grade vPolyTan™ Polymer Tantalum Chip Capacitors Combine Low ESR With High Volumetric Efficiency

　　Vishay Intertechnology, Inc. introduced a new Automotive Grade series of vPolyTan surface-mount polymer tantalum molded chip capacitors. Designed to deliver improved performance in high temperature, high humidity operating conditions. The AEC-Q200 qualified Vishay Polytech T51 series offers lower ESR, lower voltage derating, and a benign failure mode, while maintaining higher volumetric efficiency than traditional tantalum capacitors. In addition, these technological advantages set this technology above multilayer ceramic chip capacitors (MLCC) and aluminum capacitors in a comparable capacitance range.　　Offered in the compact D (EIA 7343-31) and V (EIA 7343-20) case sizes, the devices released today offer a wide capacitance range from 6.8 ?F to 330 ?F over voltage ratings from 2.5 V to 35 V and a capacitance tolerance of ± 20 %. Featuring a highly conductive polymer cathode system, the capacitors provide ultra low ESR from 120 mW down to 40 mΩ at +25 °C.　　Featuring a robust design for harsh environments, T51 series devices offer high temperature operation to +125 °C — with voltage derating above +105 °C — and a high temperature load time to 2000 hours. Combined with ripple current to 2.37 A, the capacitors are ideal for decoupling, smoothing, and filtering in switch mode and point of load (POL) power supplies for automotive ADAS, infotainment, and other in-vehicle electronic systems.

Key word：

Vishay

Release time：2023-02-13 11:31 reading：3345 Continue reading>>

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AMEYA丨ST launches Automotive ultra-low power

　　SiT1881 is an ultra-low power automotive-qualified 32-kHz oscillator (XO), designed for ±50 ppm operation up to 105°C. It is a programmable oscillator with a default frequency of 32.768 kHz with the ability to support 17 other frequencies from 1 Hz to 262.144 kHz. The SiT1881 XO is SiTime’s lowest power XO with a no-load current of only 490 nA. Furthermore, it eliminates any requirement for load capacitors and comes in a small 1.2 X 1.1 mm QFN package. This enables up to 75% smaller footprint compared to 2.0 x 1.2 mm SMD crystal. The SiT1881 can drive up to 100 pf of load, which provides additional system savings by eliminating multiple 32.768 kHz crystals in a design. This device also introduces an innovative new Reduced Swing technology to further minimize overall system power.　　Features：　　Factory programmable down to 1 Hz　　Significantly reduces power compared to fixed 32.768 kHz XTALs　　Ultra-low Power: 490 nA (typ.)　　Extends battery life　　Operates down to 1.14 V　　Supports coin-cell or supercap battery backup　　Reduced Swing technology　　Programmable output swing down to 0.6 V minimizes power　　Small footprint: 1.2 x 1.1 mm　　Saves board space compared to the 2012 SMD XTALs　　Drives multiple loads up to 100 pf　　One SiT1811 can replace multiple quartz XTALs　　No load or VDD filtering capacitors　　Eliminates any external capacitors, further reducing board space　　Eliminates load-dependent startup issues　　±50 ppm frequency stability over -40 °C to +105 °C temp. range　　Better stability compared to quartz XTALs　　Improves wireless connectivity and RTC accuracy　　Applications：　　ADAS ECU　　Infotainment　　Smart mirror　　Industrial applications

Key word：

ST,Ameya360,SiT1881

Release time：2023-02-09 13:51 reading：2010 Continue reading>>

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Ameya360:MathWorks Simulink Now Supports Infineon’s Automotive MCUs

　　MathWorks and Infineon Technologies AG have launched a hardware support package for the MathWorks Simulink products for Infineon’s latest AURIX TC4x family of automotive microcontrollers (MCUs). Automotive engineers designing advanced electric vehicles, sensor fusion, and radar signal processing functions can use the hardware support package, even before silicon is available. With the package, they can validate use cases, rapidly and automatically generate the embedded software, and test algorithms.　　“Our newest AURIX TC4x microcontroller family will give customers unparalleled real-time safety and security performance,” said Marco Cassol, Director of Microcontroller Product Marketing for ADAS, Chassis and EE Architecture applications at Infineon Technologies. “Support for these chips from the widely used MathWorks capabilities for model-based design enables engineers to get an earlier start on pre-silicon software development and automate code generation to accelerate that development. The resulting time-to-market benefits could significantly impact our customers’ success.”　　“This close collaboration with Infineon will enable our mutual customers to accelerate the pace of development of electric vehicle systems,” said Jim Tung, MathWorks Fellow. “Engineers can tackle complex systems while managing risk, with an improved understanding of system-level behavior, continuous verification, and a digital thread to requirements. We are proud to contribute to these activities that help make vehicles cleaner, more efficient, and more reliable.”　　The MathWorks and Infineon partnership delivers capabilities that enable automotive engineers to accelerate the development of electric vehicle and driver-assistance functions. These capabilities simplify the development of increasingly complex automotive systems. Model-based design with MATLAB and Simulink can accelerate embedded-system development and verification by 30 to 40 percent over traditional approaches, making the seamless support of Infineon’s automotive microcontrollers valuable for engineers and researchers.　　This is the latest in a series of collaborations between Infineon and MathWorks. Another recent example is the inclusion of Infineon’s SPICE models for the OptiMOS 5 MOSFET devices in MathWorks’ Simscape physical modeling environment, enabling faster design and effective control of electric motors for powertrain and cooling, pumps, and other automotive control features to increase efficiency and decrease CO2 emissions.

Key word：

Infineon

Release time：2023-02-02 15:03 reading：2141 Continue reading>>

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Ameya360:Renesas ASIL B PMIC Suited to Automotive Camera Applications

　　Renesas Electronics Corp.’s RAA271082 automotive power management IC (PMIC) for next-gen automotive camera applications is a versatile ISO-26262 compliant multi-rail power IC with a primary high voltage synchronous buck regulator, two secondary low voltage synchronous buck regulators, and a low voltage LDO regulator.　　The device offers four overvoltage and undervoltage (OV/UV) monitors, I2C communications, a configurable general-purpose I/O pin, and a dedicated reset output/fault indicator. To meet stringent ASIL B metrics, the RAA271082 includes a second independent reference for OV/UV monitors, built-in self-test at power-up, independent OV/UV monitoring, and continuous CRC error checking on internal registers and I2C communications.　　The highly integrated RAA271082 provides a universal power solution for automotive cameras. It is an ideal companion for Renesas’ Automotive High-Definition Link (AHL) technology that enables car manufacturers to deliver high-definition video using low-cost cables and connectors. The new PMIC simplifies power supply design for automotive camera applications requiring functional safety compliance, modules that include surround view/satellite, rearview, driver monitor, and e-mirror. The RAA271082 supports the power requirements of almost any combination of image sensor, image signal processor (ISP) and encoder technology, while also supporting direct-from-battery as well as power-over coax supply.　　In addition to imaging systems, the RAA271082’s high integration and comprehensive safety features make it an excellent solution for 16- and 32-bit automotive MCUs in a variety of applications.　　“Cameras are now an indispensable feature for all new vehicles,” said Niall Lyne, Vice President of the Automotive Analog Power and Video Business Division at Renesas. “Our new PMIC delivers all the functionality our customers need in a compact form factor suitable for almost all automotive camera modules. It is an excellent companion for our AHL solution, recently named as one of the most innovative applications of computer vision technology.”　　Developed on an ISO-26262 compliant process, the RAA271082 PMIC supports system safety goals reaching ASIL B; features high degree of programmability; and provides 1A output current capability per switching regulator to support the growing power demands of the latest generation of high-resolution automotive image sensors. It also supports general-purpose automotive MCUs with integrated reset generation, watchdog timer and programmable GPIO; as well as integrates multiple components and functions to reduce overall power consumption.

Key word：

Renesas

Release time：2023-02-01 11:19 reading：2075 Continue reading>>

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Ameya360:Infineon and REE Automotive Collaborating to Promote Sustainable Mobility

　　Infineon Technologies AG is collaborating with REE Automotive Ltd to accelerate green and smart mobility. The automotive technology company developed the REE modular Electric Vehicle platform which serves as a foundation for a wide variety of electric vehicle (EV) types, from robotaxis and commercial vans all the way to electric passenger shuttles.　　Infineon and REE last week showcased the REEcorner technology at electronica 2022 in Munich. REEcorner packs critical vehicle components into a compact module positioned between the chassis and the wheel, enabling REE to build fully flat EV platforms. REE’s flagship P7 EV platform is based on four REEcorners with REE’s x-by-wire technology. The ultra-modular P7 EV platform offers greatest interior space for passengers, cargo and batteries as compared to vehicles with an internal combustion engine (ICE) or EVs of similar size. REE’s design and technology affords auto manufacturers, delivery and logistic companies and new technology players vast design freedom allowing them to build vehicles tailored to their exact needs.　　“Infineon is an important forerunner in the mobility transformation. The REEcorner technology demonstrates the breadth and flexibility of our high-quality semiconductor technologies and system expertise,” said Peter Schiefer, President of the Automotive Division of Infineon. “Innovative and modular EV platform designs add new options for both established and emerging industry players to further accelerate electromobility.”　　“REE provides customers with full design freedom to create the broadest range of EVs and autonomous vehicles for current and future applications. Electric vehicles powered by REE are geared to deliver substantial benefits to customers, including significantly reduced Total Cost of Ownership, enhanced maneuverability and safety with x-by-wire steering and drive and operational efficiencies,” said Daniel Barel, REE Co-Founder and CEO.　　To increase safety and cybersecurity – especially with regard to fail-operational drive-by-wire requirements – the REE platform uses as many as 11 AURIX microcontrollers (TC3xx). There are two in each corner module in the platform’s design to actuate all the native driving functions like steering and braking. Two additional microcontrollers are located in the center module, where they function as domain controllers, collecting and controlling data and synchronizing the four corner modules. Another AURIX is responsible for vehicle chassis management in a separate ECU. In addition, the platform also contains numerous other automotive components from Infineon including MOSFETs, power supply ICs (DCDC) and magnetic sensors.　　Infineon is the market leader in automotive semiconductors, pairing the broadest automotive semiconductor product portfolio with system-level competence. The offering ranges from sensors, microcontrollers, high-performance memory for specific applications to power semiconductors based on silicon and silicon-carbide (SiC), as well as components for human-machine interaction and vehicle connectivity.　　Infineon is at the core of the transformation of the automotive industry towards green mobility and partners with established Tier 1s, OEMs and new automotive players.　　Electromobility is showing strong growth driven by emission regulations placed on manufacturers as well as environmental consciousness of consumers. Cars with fully or partially electrified drivetrains will account for more than 50 percent of cars produced in 2027, as per analyst forecasts. Already in 2021, approximately every second of the BEVs (Battery Electric Vehicle) and PHEVs (Plug-in Hybrid Electric Vehicle) produced had integrated Infineon semiconductors in the inverter, the ‘heart’ of an electric drivetrain. Furthermore, Infineon’s AURIX microcontroller fosters the trends of electromobility, advanced driver assists systems (ADAS) and automated driving, automotive electric-electronic (E/E) architectures and affordable artificial intelligence (AI) applications.

Key word：

Infineon

Release time：2023-02-01 11:18 reading：2005 Continue reading>>

model	brand	Quote
MC33074DR2G	onsemi
BD71847AMWV-E2	ROHM Semiconductor
CDZVT2R20B	ROHM Semiconductor
TL431ACLPR	Texas Instruments
RB751G-40T2R	ROHM Semiconductor

model	brand	To snap up
STM32F429IGT6	STMicroelectronics
TPS63050YFFR	Texas Instruments
BP3621	ROHM Semiconductor
IPZ40N04S5L4R8ATMA1	Infineon Technologies
ESR03EZPJ151	ROHM Semiconductor
BU33JA2MNVX-CTL	ROHM Semiconductor

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