AMEYA<span style='color:red'>360</span>:Renesas Unveils Quick-Connect Studio
  Renesas Electronics Corporation, a premier supplier of advanced semiconductor solutions, today introduced a groundbreaking new online, cloud-based IoT system design platform that enables users to graphically build hardware and software to quickly validate prototypes and accelerate product development.  Today’s development cycle is cumbersome – engineers research and define the project, collect device information and requirements, layout hardware, develop software, test, and iterate until the product is ready to release to market. This process is typically done sequentially, and each step takes a significant amount of time. Often the software development phase consumes the most engineering power and ultimately becomes the biggest bottleneck.  With Renesas’ first-of-its-kind Quick-Connect Studio, engineers can now perform hardware and software development simultaneously. This is a radical shift in the industry, enabling designers to build software immediately with the ability to quickly reconfigure and test product ideas. This yields dramatic time savings and reduces risk as engineers can validate designs before committing to hardware layout.  Quick-Connect Studio empowers engineers to graphically drag and drop device and subsystem blocks on the Cloud to build their solution. After placing each block, users can generate, compile, and build software automatically, a major shift towards the no-code paradigm of development. This makes building production-level software as easy as piecing building blocks together. With Quick-Connect Studio, users can rapidly build a full solution in the cloud and deploy to hardware in under 10 minutes. There is very little upfront learning or investment needed. The cloud compute power provides fast compilation, and the modern GUI reduces the learning curve and promotes project reuse.  Renesas’ Quick-Connect Studio is built on Quick-Connect IoT, a platform of standardized hardware featuring industry-established interfaces such as PMOD?, Arduino, and MIKROE. With standard connectors, engineers can mix and match MCUs, MPUs, sensors, and connectivity boards seamlessly. In the future, users will be able to extend and expand beyond Renesas to different partners such as major cloud providers, service integrators, and leaders in the open-source community.  Engineers will benefit from graphically building in the cloud, connecting to real hardware, and easily programming and testing a complete solution. Quick-Connect Studio automatically generates system projects that can be downloaded and imported into Renesas’ e2 studio either as a pre-built binary or full-source code project, enabling users to leverage the full Renesas tool chain.  “Renesas is heavily investing in advancing the digital user experience,” said Chris Allexandre, Senior Vice President, CSMO and Head of the Global Sales and Marketing Unit at Renesas. “Quick-Connect Studio exemplifies how Renesas is accelerating the development cycle for engineers, enabling the fast validation and testing of new ideas, and allowing designers to innovate quickly using Renesas as their preferred platform.”
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Release time:2023-03-23 13:30 reading:2451 Continue reading>>
AMEYA<span style='color:red'>360</span>:KYOCERA AVX MIL SPEC Leaded MLCCs
AMEYA<span style='color:red'>360</span>:ROHM Semiconductor 4th Generation N-Channel SiC Power MOSFETs
  ROHM Semiconductor 4th Generation N-Channel Silicon-Carbide (SiC) Power MOSFETs provide low on-resistances with improvements in the short-circuit withstand time. The 4th Generation SiC MOSFETs are easy to parallel and simple to drive. The MOSFETs feature fast switching speeds/reverse recovery, low switching losses, and a +175°C maximum operating temperature. The ROHM 4th Generation N-Channel SSiC Power MOSFETs support a 15V gate-source voltage that contributes to device power savings.  FEATURES  Low on-resistance with improving short-circuit ruggedness  Minimizes switching loss by drastically reducing parasitic capacitance  Supports 15V Gate-Source voltage, improving application design freedom  Fast switching speed  Fast reverse recovery  Easy to parallel  Simple to drive  Silicon Carbide (SiC) technology  N-Channel transistor polarity  Single-channel  Through-hole mounting  Enhancement mode  +175°C maximum operating temperature  AEC-Q101-qualified options available  Lead-free, RoHS and REACH compliant  APPLICATIONS  Automobile  Switch mode power supplies  Solar inverters  DC/DC converters  Induction heating  Motor drives  SPECIFICATIONS  3 to 7 pins  -4V to +21V gate-source voltage range, 4.8V threshold  63nC to 170nC gate-charge range  26A to 105A continuous drain current range  13mΩ to 62mΩ on-drain source resistance  750V or 1.2kV Drain-source breakdown voltage  11ns to 57ns rise time  9.6ns to 21ns fall time  Typical delay time  4.4ns to 20ns turn-on range  22ns to 83ns turn-off range  93W to 312W power dissipation range  Available packages  TO-247-4L  TO-247N-3  TO-263-7L
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Release time:2023-03-17 11:59 reading:1655 Continue reading>>
AMEYA<span style='color:red'>360</span>:For the Most Demanding Precision Requirements ZEISS MMZ M
AMEYA<span style='color:red'>360</span>:ZEISS launches the ZEISS MMZ T
AMEYA<span style='color:red'>360</span>:Networking a Smart City: Using Fit-for-Purpose Tech
  Multiple market forecasts project smart cities will grow at a compounded annual growth rate of as much as 25% between now and 2030, making cities a very attractive market for internet of things (IoT) solution providers. However, cities present various unique challenges for vendors seeking to enter this market.  Cities are highly complex deployments for any technology, and IoT networking is no exception. Let’s examine the challenges to understand why selecting a networking technology designed to meet a city’s needs is vital.  Diagram of a smart city, where LoRaWAN is essential for networking.  First, there are very real physical challenges to deploying networks in cities. Cities are largely built with steel and concrete, which creates connectivity issues as wireless signals often struggle to penetrate these materials. Further, many IoT sensors reside in basements or underground, which also presents a challenge for achieving reliable connections. So, it is important to select a networking technology with a track record of success in urban environments, like LoRaWAN (LoRa stands for Long Range).  LoRaWAN is proven to transmit signals through cement, metal and underground. The recent addition of battery-operated relays provides an easy-to-deploy, low-power and standards-based approach to extend LoRaWAN coverage beyond its current physical limits at a fraction of the cost of adding additional gateways.  Second, the vast majority of IoT applications transmit tiny amounts of data, making low-bandwidth networking desirable because it meets the connectivity and scaling requirements at a fraction of the cost of high-bandwidth technologies. With LoRaWAN, a single gateway supports thousands of sensors and costs only hundreds of dollars, making it highly cost effective to expand the system as new applications are added to the network. This scalability is a critical benefit for cities that want to be sure their networking choice will continue to be optimal even with future urban development and growth.  Third, it is crucial to consider the power consumption of the devices. Maintenance and ongoing operation are key drivers of cost that must be considered when making a networking decision. Using end devices with low-power consumption extends battery life to more than 10 years, saving time, money and our environment.  It is important to note that there will be millions of devices operating in hard-to-reach places, or buried underground, so longer battery life also saves significant time and labor costs. This allows LoRaWAN to deliver considerable cost savings over a device’s lifetime, which increases environmental and energy sustainability in turn.  Fourth, having flexible business models future proofs a networking solution because a city’s needs will evolve over time. LoRaWAN addresses this by offering the most network flexibility of any LPWAN, allowing it to meet the needs of all departments, which each have their own unique requirements. A city can build a private network, subscribe to a public or satellite one, join a community network, or utilize a hybrid. Finally, a city also has the ability to roam across these various types of deployment options.  Fifth, because cities are governmental entities, there are many rules, regulations and requirements to consider. Open standards are the only viable choice when investing in long-term solutions because they enable longevity and are backed by dynamic ecosystems that foster competition and give cities a choice in terms of vendors and pricing. Proprietary solutions are problematic because they lock cities into a single vendor, which restricts the quantity and types of available products and may include price lock-ins.  These are serious drawbacks that risk not meeting all a city’s long-term needs. Further, cities should insist on using end devices that are certified by a regulatory body. Certification is the only way to have confidence that devices will be reliable and compliant with the standards, thus reducing potential support costs and ensuring interoperability. LoRaWAN meets these requirements, having been officially approved as a standard by the International Telecommunications Union (ITU). Additionally, the technology is backed by the LoRa Alliance Certification Program.  Because cities that want to become smart must anticipate future needs and consider current challenges, open standards like LoRaWAN are ideal because they bring reliability, flexibility and ecosystems that offer a wide variety of choices. These features allow cities to find strong partners who are willing to innovate and collaborate to solve the city’s challenges. Combine the use of open standards with a requirement to deploy certified end devices, and cities’ IoT connectivity selections will offer a return on investment for years to come.
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Release time:2023-03-15 11:18 reading:1624 Continue reading>>
AMEYA<span style='color:red'>360</span>:Renesas Electronics RA4E2 microcontroller
  The Renesas Electronics RA4E2 microcontroller features a 100MHz Arm? Cortex?-M33 core, 128KB code flash memory, and 40KB SRAM for extremely high performance. Renesas Electronics RA4E2 features a variety of peripherals, such as universal PWM timer, 12-bit ADC, 12-bit Dacs, USB FS devices, SCI, SPI, I3C, SSI, and HDMI-CEC. The device is ideal for low memory, small package, low pin number applications, ensuring high speed performance. With the support of flexible software package (FSP), the RA4E2 group can easily design applications.  Characteristic  Entering the RA series, parameters are optimized to reduce device and system costs  It also achieves the lowest active power consumption, breaks space constraints and achieves 100MHz performance  Open Arm ecosystem, easy to use flexible software packages for easy development and migration  100MHz Arm Cortex-M33  128kB flash memory and 40kB SRAM  4kB data flash memory, as stored in EEPROM  Expandable 32 pin to 64 pin package  Universal PWM timer  12-bit ADC and ADC  SCI (UART, Simple SPI, Simple I2C), SPI, I3C  USB FS device  CAN FD, SSI  HDMI-CEC  Application  Smart home (fan control, water dispenser)  Consumer electronics (games, DSC cameras, printers, home entertainment)  PC (fingerprint reader, headset)  Building Automation (Voice Control)  Medical (hospital bed, massage chair)  Industry (Sensor, optical module, Sensor Center, tracking)  Metering (communication module)
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Release time:2023-03-15 11:12 reading:2760 Continue reading>>
AMEYA<span style='color:red'>360</span>:Skyworks Solutions Inc. OLC449 Optocoupler
  Skyworks Solutions Inc OLC449 Optocoupler is a radiation-tolerant phototransistor non-hermetic surface-mount optocoupler. The optocoupler consists of an LED and N-P-N silicon phototransistor that is electrically isolated but optically coupled inside a non-hermetic six-pin Leadless Chip Carrier (LCC) package. This optocoupler offers electrical parameters similar to JEDEC registered 4N49 optocoupler, with a higher CTR and better CTR degradation characteristics due to radiation exposure.      The hermetic surface mount variant is available as OLS449 in both high-reliability screened and non-screened catalog versions. This optocoupler is designed for a low LED operating current while providing excellent radiation tolerance margins. The OLC449 optocoupler features a radiation-tolerant version of the 4N49U. This optocoupler operates at 50mA continuous collector current and 40mA average input current.  FEATURES  Radiation tolerant version of the 4N49U  High Current Transfer Ratio (CTR)  Same processing and construction as the OLC249, but with a higher CTR  SPECIFICATIONS  1000VDC electrical isolation  300mW power dissipation (output detector)  70mW power dissipation (input diode)  40mA average input current  2V reverse voltage  240°C lead temperature range for 10 sec  50mA continuous collector current  1mA LED current  –55°C to 125°C operating temperature range  –65°C to 125°C ambient temperature range  APPLICATIONS  Satellite constellation  Avionics  Radar  Surveillance systems  Space  Communications
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Release time:2023-03-15 11:10 reading:2158 Continue reading>>
AMEYA<span style='color:red'>360</span>:Panasonic TLE Conductive Polymer Tantalum Solid Capacitors
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Release time:2023-03-14 13:41 reading:2350 Continue reading>>
AMEYA<span style='color:red'>360</span>:NOVOSENSE participated in the fourth Global New Energy
  The Fourth Global New Energy and Intelligent Vehicle Supply Chain Innovation Conference, co-sponsored by China EV 100 and Nanjing Jiangning Economic and Technological Development Zone, was held in Nanjing. With the theme of "Reshaping the core automotive supply chain", the conference focused on "establishing a safe and reliable automotive chip industry chain", and launched in-depth communication and discussion on solving the problems of automotive chip industry chain. Wang Shengyang, founder, chairman and CEO of NOVOSENSE Microelectronics, was invited to attend the forum and deliver a keynote speech.  Wang Shengyang from NOVOSENSE attended the conference and delivered a speech  In the context of global automotive supply chain remodeling, the original international division of labor and supply chain system of the automotive industry are affected, and the shortage of core components such as chips is still prominent, which brings severe challenges to the security and stability of the global automotive industry chain and supply chain. In addition, the rapid development of new energy vehicles driven by "carbon peaking and carbon neutrality" target not only pushes forward the new reform of the automobile supply chain system, but also provides rare historical opportunities for China's automobile parts industry. With the demand of "supply guarantee" and "stable supply", enterprises in the upstream and downstream of China's automobile industry chain deeply realize the importance of independent and controllable supply chain.  This conference focuses on the problem of automotive chip and intelligent supply chain reconstruction to find and discuss China's countermeasures and answers in respect of the international industrial chain system remodeling, domestic supply chain transformation and upgrading. The conference was attended by Miao Wei, deputy director of the Committee of Economy of the CPPCC National Committee, Dong Yang, vice chairman of China EV 100, Zhang Yongwei, vice chairman and secretary general of China EV 100, and representatives from domestic and foreign well-known car factories, parts suppliers, institutions and consulting companies, including China Automotive Technology & Research Center, BYD, NIO, Changan, Chery, JAC, JIDU, Mercedes-Benz, Jaguar Land Rover, Bosch, Valeo, Desay SV, SVOLT, CAIC, SUNGROW, Baidu Apollo, Zhuzhou CRRC Times, UESTC, VDA QMC, McKinsey and Accenture.  As a representative of domestic chip manufacturers, Wang Shengyang of NOVOSENSE shared the company's core concepts and practical experience in supporting the development of the automobile industry at the meeting: Take quality as the priority, application as the principle, supply chain as the cornerstone, and service as the key to win. "NOVOSENSE needs to strengthen itself to better serve the Tier 1 customers and the automotive industry.” Said Wang.  NOVOSENSE focuses on the development of analog and mixed signal chain chips. After nearly ten years of development, the company has a rich technical reserve in three product lines covering signal sensing, system interconnection and driver respectively, which can provide more than 1,100 chip models. At present, the chip products of NOVOSENSE are widely used in OBC/DCDC, main motor driver, vehicle domain control, intelligent cabin, vehicle thermal management, vehicle lighting, fuel vehicle powertrain and other system applications in mainstream auto factories, including isolated gate driver, non-isolated high-side and low-side driver, isolated voltage and current sampling, vehicle motor driver, vehicle lighting driver, vehicle power supply, vehicle communication interface, vehicle power path protection, current sensor, magnetic angle sensor and pressure sensor. The research, development and production of the company's automobile-qualified chips are strictly in accordance with the automobile-qualified reliability standards. Each chip needs to undergo a three-temperature test to meet the AEC-Q100 and other reliability standards, so as to ensure the high quality and reliability of products.  In recent years, the global semiconductor market growth has slowed. Although the demand for traditional electronic products is shrinking, structural opportunities are emerging, with significant growth in application areas such as new energy and automotive electronics. More than 800 million chips were delivered by NOVOSENSE in the first half of 2022. In the second half of 2022, Suzhou NAXIWEI Semiconductor Co., Ltd., the wholly-owned subsidiary of NOVOSENSE will be put into production successively to undertake part of the packaging and testing business of NOVOSENSE, which will further enhance the company's ability to serve the automotive industry.  At the Supply Chain Leaders Exhibition, NOVOSENSE exhibited its automotive electronic solutions for new energy vehicles such as DCDC/ OBC/PDU/ thermal management, battery management system, inverter/powertrain, automotive lighting, body/vehicle (domain) controller, etc.  NOVOSENSE Automotive electronic solutions on display at the Supply Chain Leading Enterprises Exhibition
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Release time:2023-03-14 13:39 reading:3672 Continue reading>>

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