Renesas Strengthens Power Leadership with New GaN FETs for High-Density Power Conversion in AI Data Centers, Industrial and Charging Systems
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Renesas Strengthens Power Leadership with New GaN FETs for High-Density Power Conversion in AI Data Centers, Industrial and Charging Systems

　　Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, introduced three new high-voltage 650V GaN FETs for AI data centers and server power supply systems including the new 800V HVDC architecture, E-mobility charging, UPS battery backup devices, battery energy storage and solar inverters. Designed for multi-kilowatt-class applications, these 4th-generation plus (Gen IV Plus) devices combine high-efficiency GaN technology with a silicon-compatible gate drive input, significantly reducing switching power loss while retaining the operating simplicity of silicon FETs. Offered in TOLT, TO-247 and TOLL package options, the devices give engineers the flexibility to customize their thermal management and board design for specific power architectures.　　The new TP65H030G4PRS, TP65H030G4PWS and TP65H030G4PQS devices leverage the robust SuperGaN® platform, a field-proven depletion mode (d-mode) normally-off architecture pioneered by Transphorm, which was acquired by Renesas in June 2024. Based on low-loss d-mode technology, the devices offer superior efficiency over silicon, silicon carbide (SiC), and other GaN offerings. Moreover, they minimize power loss with lower gate charge, output capacitance, crossover loss, and dynamic resistance impact, with a higher 4V threshold voltage, which is not achievable with today’s enhancement mode (e-mode) GaN devices.　　Built on a die that is 14 percent smaller than the previous Gen IV platform, the new Gen IV Plus products achieve a lower RDS(on) of 30 milliohms (mΩ), reducing on-resistance by 14 percent and delivering a 20 percent improvement in on-resistance output-capacitance-product figure of merit (FOM). The smaller die size reduces system costs and lowers output capacitance, which results in higher efficiency and power density. These advantages make the Gen IV Plus devices ideal for cost-conscious, thermally demanding applications where high performance, efficiency and small footprint are critical. They are fully compatible with existing designs for easy upgrades, while preserving existing engineering investments.　　Available in compact TOLT, TO-247 and TOLL packages, they provide one of the broadest packaging options to accommodate thermal performance and layout optimization for power systems ranging from 1kW to 10kW, and even higher with paralleling. The new surface-mount packages include bottom side (TOLL) and top-side (TOLT) thermal conduction paths for cooler case temperatures, allowing easier device paralleling when higher conduction currents are needed. Further, the commonly used TO-247 package provides customers with higher thermal capability to achieve higher power.　　“The rollout of Gen IV Plus GaN devices marks the first major new product milestone since Renesas’ acquisition of Transphorm last year,” said Primit Parikh, Vice President of the GaN Business Division at Renesas. “Future versions will combine the field-proven SuperGaN technology with our drivers and controllers to deliver complete power solutions. Whether used as standalone FETs or integrated into complete system solution designs with Renesas controllers or drivers, these devices will provide a clear path to designing products with higher power density, reduced footprint and better efficiency at a lower total system cost.”　　Unique d-mode Normally-off Design for Reliability and Easy Integration　　Like previous d-mode GaN products, the new Renesas devices use an integrated low-voltage silicon MOSFET – a unique configuration that achieves seamless normally-off operation while fully capturing the low loss, high efficiency switching benefits of the high- voltage GaN. As they use silicon FETs for the input stage, the SuperGaN FETs are easy to drive with standard off-the-shelf gate drivers rather than specialized drivers that are normally required for e-mode GaN. This compatibility simplifies design and lowers the barrier to GaN adaptation for system developers.　　GaN-based switching devices are quickly growing as key technologies for next-generation power semiconductors, fueled by demand from electric vehicles (EVs), inverters, AI data center servers, renewable energy, and industrial power conversion. Compared to SiC and silicon-based semiconductor switching devices, they provide superior efficiency, higher switching frequency and smaller footprints.　　Renesas is uniquely positioned in the GaN market with its comprehensive solutions, offering both high- and low-power GaN FETs, unlike many providers whose success in the field has been primarily limited to lower power devices. This diverse portfolio enables Renesas to serve a broader range of applications and customer needs. To date, Renesas has shipped over 20 million GaN devices for high- and low-power applications, representing more than 300 billion hours of field usage.
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Release time：2025-07-04 15:04 reading：205 Continue reading>>
Renesas Sets New MCU Performance Bar with 1-GHz RA8P1 Devices with AI Acceleration
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Renesas Sets New MCU Performance Bar with 1-GHz RA8P1 Devices with AI Acceleration

Unprecedented 7300+ CoreMarks1 with Dual Arm CPU coresTSMC 22ULL Process Delivers High Performance and Low Power ConsumptionEmbedded MRAM with Faster Write Speeds and Higher Endurance and RetentionDedicated Peripherals Optimized for Vision and Voice AI plus Real-Time AnalyticsNew AI Software Framework Eases Development and Enables Easy Migration with MPUsLeading-Edge Security Features Ensure Data Privacy　　Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, introduced the RA8P1 microcontroller (MCU) Group targeted at Artificial Intelligence (AI) and Machine Learning (ML) applications, as well as real-time analytics. The new MCUs establish a new performance level for MCUs by combining 1GHz Arm® Cortex®-M85 and 250MHz Cortex-M33 CPU cores with the Arm Ethos™-U55 Neural Processing Unit (NPU). This combination delivers the highest CPU performance of over 7300 CoreMarks and AI performance of 256 GOPS at 500 MHz.　　Designed for Edge/Endpoint AI　　The RA8P1 is optimized for edge and endpoint AI applications, using the Ethos-U55 NPU to offload the CPU for compute intensive operations in Convolutional and Recurrent Neural Networks (CNNs and RNNs) to deliver up to 256 MACs per cycle that yield 256 GOPS performance at 500 MHz. The new NPU supports most commonly used networks, including DS-CNN, ResNet, Mobilenet TinyYolo and more. Depending on the neural network used, the Ethos-U55 provides up to 35x more inferences per second than the Cortex-M85 processor on its own.　　Advanced Technology　　The RA8P1 MCUs are manufactured on the 22ULL (22nm ultra-low leakage) process from TSMC, enabling ultra-high performance with very low power consumption. This process also enables the use of embedded Magnetoresistive RAM (MRAM) in the new MCUs. MRAM offers faster write speeds along with higher endurance and retention compared with Flash.　　“There is explosive growth in demand for high-performance edge AIoT applications. We are thrilled to introduce what we believe are the best MCUs to address this trend,” said Daryl Khoo, Vice President of Embedded Processing Marketing Division at Renesas. “The RA8P1 devices showcase our technology and market expertise and highlight the strong partnerships we have built across the industry. Customers are eager to employ these new MCUs in multiple AI applications.”　　“The pace of innovation in the age of AI is faster than ever, and new edge use cases demand ever-improving performance and machine learning on-device,” said Paul Williamson, Senior Vice President and General Manager, IoT Line of Business at Arm. “By building on the advanced AI capabilities of the Arm compute platform, Renesas’ RA8P1 MCUs meet the demands of next generation voice and vision applications, helping to scale intelligent, context-aware AI experiences.”　　“It is gratifying to see Renesas harness the performance and reliability of TSMC 22ULL embedded MRAM technology to deliver outstanding results for its RA8P1 devices,” said Chien-Hsin Lee, Senior Director of Specialty Technology Business Development at TSMC. “As TSMC continues to advance our embedded non-volatile memory (eNVM) technologies, we look forward to strengthening our long-standing collaboration with Renesas to drive innovation in future groundbreaking devices.”　　Robust, Optimized Peripheral Set for AI　　Renesas has integrated dedicated peripherals, ample memory and advanced security to address Voice and Vision AI and Real-time Analytics applications. For vision AI, a 16-bit camera interface (CEU) is included that supports sensors up to 5 megapixels, enabling camera and demanding Vision AI applications. A separate MIPI CSI-2 interface offers a low pin-count interface with two lanes, each up to 720Mbps. In addition, multiple audio interfaces including I2S and PDM support microphone inputs for voice AI applications.　　The RA8P1 offers both on-chip and external memory options for efficient, low latency neural network processing. The MCU includes 2MB SRAM for storing intermediate activations or graphics framebuffers. 1MB of on-chip MRAM is also available for application code and storage of model weights or graphics assets. High-speed external memory interfaces are available for larger models. SIP options with 4 or 8 MB of external flash in a single package are also available for more demanding AI applications.　　New RUHMI Framework　　Along with the RA8P1 MCUs, Renesas has introduced RUHMI (Renesas Unified Heterogenous Model Integration), a comprehensive framework for MCUs and MPUs. RUHMI offers efficient AI deployment of the latest neural network models in a framework agnostic manner. It enables model optimization, quantization, graph compilation and conversion, and generates efficient source code. RUHMI provides native support for machine-learning AI frameworks such as TensorFlow Lite, Pytorch & ONNX. It also provides the necessary tools, APIs, code-generator, and runtime needed to deploy a pre-trained neural network, including ready-to-use application examples and models optimized for RA8P1. RUHMI is integrated with Renesas’s own e2Studio IDE to allow seamless AI development. This integration will facilitate a common development platform for MCUs and MPUs.　　Advanced Security Features　　The RA8P1 MCUs provide leading-edge security for critical applications. The new Renesas Security IP (RSIP-E50D) includes numerous cryptographic accelerators, including CHACHA20, Ed25519, NIST ECC curves up to 521 bits, enhanced RSA up to 4K, SHA2 and SHA3. In concert with Arm TrustZone®, this provides a comprehensive and fully integrated secure element-like functionality. The new MCUs also provides strong hardware Root-of-Trust and Secure Boot with First Stage Bootloader (FSBL) in immutable storage. XSPI interfaces with decryption-on-the-fly (DOTF) allow encrypted code images to be stored in external flash and decrypted on the fly as it is securely transferred to the MCU for execution.　　Ready to Use Solutions　　Renesas provides a wide range of easy-to-use tools and solutions for the RA8P1 MCUs, including the Flexible Software Package (FSP), evaluation kits and development tools. FreeRTOS and Azure RTOS are supported, as is Zephyr. Several Renesas software example projects and application notes are available to enable faster time to market. In addition, numerous partner solutions are available to support development with the RA8P1 MCUs, including a driver monitoring solution from Nota.AI and a traffic/pedestrian monitoring solution from Irida Labs. Other solutions can be found at the Renesas RA Partner Ecosystem Solutions Page.　　Key Features of the RA8P1 MCUs　　Processors: 1GHz Arm Cortex-M85, 500MHz Ethos-U55, 250 MHz Arm Cortex-M33 (Optional)　　Memory: 1MB/512KB On-chip MRAM, 4MB/8MB External Flash SIP Options, 2MB SRAM fully ECC protected, 32KB I/D caches per core　　Graphics Peripherals: Graphics LCD controller supporting resolutions up to WXGA (1280x800), parallel RGB and MIPI-DSI display interfaces, powerful 2D Drawing engine, parallel 16bit CEU and MIPI CSI-2 camera interfaces, 32bit external memory bus (SDRAM and CSC) interface　　Other Peripherals: Gigabit Ethernet and TSN Switch, XSPI (Octal SPI) with XIP and DOTF, SPI, I2C/I3C, SDHI, USBFS/HS, CAN-FD, PDM and SSI audio interfaces, 16bit ADC with S/H circuits, DAC, comparators, temperature sensor, timers　　Security: Advanced RSIP-E50D cryptographic engine, TrustZone, Immutable storage, secure boot, tamper resistance, DPA/SPA attack protection, secure debug, secure factory programming, Device Lifecycle management　　Packages: 224BGA, 289BGA
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Release time：2025-07-04 14:56 reading：205 Continue reading>>
Murata Launches World’s First 10µF/50Vdc MLCC in 0805-inch Size for Automotive Applications
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Murata Launches World’s First 10µF/50Vdc MLCC in 0805-inch Size for Automotive Applications

　　Murata Manufacturing Co., Ltd. has announced the new GCM21BE71H106KE02 multilayer ceramic capacitor (MLCC) has entered mass production. The device is the world's first 0805-inch size (2.0 x 1.25 mm) MLCC to offer a capacitance of 10µF with a 50Vdc rating and is specifically engineered for automotive applications*. This cutting-edge product marks a significant advancement in MLCC design, delivering a smaller 0805-inch package while maintaining capacitance, voltage rating, and MLCC reliability.　　Advancements in advanced driver-assistance systems (ADAS) and autonomous driving (AD) technologies necessitate deploying an increased number of integrated circuits (ICs) within vehicle systems. This surge in ICs simultaneously leads to a greater demand for supporting high-capacitance passive components while imposing tighter spatial constraints – as a greater number of capacitors must be accommodated on increasingly crowded automotive printed circuit boards (PCBs).　　Designed for 12V automotive power lines, the GCM21BE71H106KE02 capacitor leverages Murata’s proprietary ceramic material and thinning technologies to help engineers to save PCB space and reduce the overall capacitor count, resulting in smaller, more efficient, and reliable automotive systems. As the first automotive-specific MLCC to achieve a 10µF capacitance with a 50Vdc rating in the compact 0805-inch size the GCM21BE71H106KE02 represents a significant advancement in capacitance efficiency. It offers roughly 2.1 times the capacitance of Murata’s previous 4.7µF/50Vdc product, despite sharing the same physical size. Furthermore, compared to the previous 10µF/50Vdc MLCC in the larger 1206-inch size (3.2 x 1.6 mm), the new MLCC occupies approximately 53% less space, providing substantial space savings for automotive applications.　　Murata will continue to pursue further miniaturization and increased capacitance of MLCCs, while expanding its product lineup to meet the evolving needs of the automotive market. These efforts will support the industry as they look to develop higher-performance and more multifunctional vehicles. In addition, by downsizing electronic components, Murata aims to reduce material usage and improve production efficiency per unit, helping to lower electricity consumption at its manufacturing sites and reduce overall environmental impact.
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Release time：2025-07-04 13:59 reading：250 Continue reading>>
ROHM Introduces a New MOSFET for AI Servers with Industry-Leading* SOA Performance and Low ON-Resistance
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ROHM Introduces a New MOSFET for AI Servers with Industry-Leading* SOA Performance and Low ON-Resistance

　　ROHM has released of a 100V power MOSFET - RY7P250BM - optimized for hot-swap circuits in 48V power systems used in AI servers and industrial power supplies requiring battery protection to the market.　　As AI technology rapidly advances, data centers are facing unprecedented processing demands and server power consumption continues to increase annually. In particular, the growing use of generative AI and high-performance GPUs has created a need to simultaneously improve power efficiency while supporting higher currents. To address these challenges, the industry is shifting from 12V systems to more efficient 48V power architectures. Furthermore, in hot-swap circuits used to safely replace modules while servers remain powered on, MOSFETs are required that offer both wide SOA (Safe Operating Area) and low ON-resistance to protect against inrush current and overloads.　　The RY7P250BM delivers these critical characteristics in a compact 8080-size package, helping to reduce power loss and cooling requirements in data centers while improving overall server reliability and energy efficiency. As the demand for 8080-size MOSFETs grows, this new product provides a drop-in replacement for existing designs. Notably, the RY7P250BM achieves wide SOA (VDS=48V, Pw=1ms/10ms) ideal for hot-swap operation. Power loss and heat generation are also minimized with an industry-leading low ON-resistance of 1.86mΩ (VGS=10V, ID=50A, Tj=25°C), approximately 18% lower than the typical 2.28mΩ of existing wide SOA 100V MOSFETs in the same size.　　Wide SOA tolerance is essential in hot-swap circuits, especially those in AI servers that experience large inrush currents. The RY7P250BM meets this demand, achieving 16A at 10ms and 50A at 1ms, enabling support for high-load conditions conventional MOSFETs struggle to handle.　　ROHM’s new product has also been certified as a recommended component by leading global cloud platform provider, where it is expected to gain widespread adoption in next-generation AI servers. Especially in server applications where reliability and energy efficiency are mission-critical, the combination of wide SOA and low RDS(on) has been highly evaluated for cloud infrastructure.　　Going forward, ROHM will continue to expand its lineup of 48V-compatible power solutions for servers and industrial equipment, contributing to the development of sustainable ICT infrastructure and greater energy savings through high-efficiency, high-reliability products.　　Application Examples　　• 48V AI server systems and power supply hot-swap circuits in data centers　　• 48V industrial equipment power systems (i.e. forklifts, power tools, robots, fan motors)　　• Battery-powered industrial equipment such as AGVs (Automated Guided Vehicles)　　• UPS and emergency power systems (battery backup units)　　Online Sales InformationSales Launch Date: May 2025　　Pricing: $5.50/unit (samples, excluding tax)　　Online Distributors: DigiKey™, Mouser™ and Farnell™　　The products will be offered at other online distributors as they become available.　　Applicable Part No: RY7P250BM　　EcoMOS™ BrandEcoMOS™ is ROHM's brand of silicon MOSFETs designed for energy-efficient applications in the power device sector.　　Widely utilized in applications such as home appliances, industrial equipment, and automotive systems, EcoMOS™ provides a diverse lineup that enables product selection based on key parameters such as noise performance and switching characteristics to meet specific requirements.　　TerminologyHot-Swap Circuit　　A circuit that enables components to be inserted or removed while the system remains powered on.　　It typically consists of MOSFETs, protection elements, and connectors, and is responsible for suppressing inrush current and protecting against overcurrent conditions, ensuring stable operation of the system and connected components.　　Power MOSFET　　A MOSFET designed for power conversion and switching applications. N-channel MOSFETs are the dominant type, turning on when a positive voltage is applied to the gate relative to the source. They offer lower ON-resistance and higher efficiency than P-channel variants. Due to their low conduction loss and high-speed switching performance, power MOSFETs are commonly used in power supplies, motor drives, and inverter circuits.　　SOA (Safe Operating Area)　　The defined range of voltage and current in which a device can operate reliably without risk of failure. Operating outside this boundary may result in thermal runaway or permanent damage. SOA is especially critical in applications exposed to inrush currents or overcurrent conditions.　　Low ON-resistance (RDS(on))　　The resistance value between the Drain and Source of a MOSFET during operation. A smaller RDS(on) reduces power loss during operation.　　Inrush Current　　A sudden surge of current that momentarily exceeds the rated value when an electronic device is powered on. Proper control of this current reduces stress on power circuit components, helping to prevent device damage and stabilize the system.
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Release time：2025-07-03 14:52 reading：158 Continue reading>>
Redefining Smart Living: Fibocom FG390 with MediaTek T930 Brings AI to the Heart of Homes and SMBs
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Redefining Smart Living: Fibocom FG390 with MediaTek T930 Brings AI to the Heart of Homes and SMBs

　　As AI technology rapidly advances and smart devices proliferate, households and small to medium-sized businesses (SMBs) are seeking intelligent, secure, and efficient “digital housekeepers”. These AI-powered ecosystems must enable seamless device coordination, centralized data management, and real-time decision-making across scenarios like smart security, remote work, and digital infrastructure management.　　To address the growing demand, Fibocom, in collaboration with MediaTek, introduces the FG390, a next-generation 5G module powered by the MediaTek T930 platform. Combining superior cellular connectivity, integrated AI capabilities, and deep insight into smart home and enterprise networking, FG390is set to become a key enabler in building AI-driven home ecosystems and intelligent control hubs. The module helps bridge data silos and optimize operational efficiency amid ongoing digital transformation.　　Exceptional Cellular Performance for Enhanced 5GExperience　　FG390 is powered by MediaTek’s advanced T930 platform, built on a 4nm process and integrating the MediaTek M90 5G modem with a quad-core ArmCortex-A55 CPU. Delivering exceptional cellular performance, it supports6-carrier downlink aggregation (6CC CA) and 5-layer 3Tx uplink over Sub-6GHz 5GNR, reaching peak speeds of 10 Gbps downlink and 2.8 Gbps uplink for ultra-fast, low-latency connectivity. Ideal for bandwidth-intensive applications such as multi-stream 8K video or immersive AR/VR experiences, FG390 also features 8Rx reception with 200MHz bandwidth to enhance spectral efficiency and ensure stable coverage, even at cell edges.　　Next-Gen Smart Home Hub with Advanced Personalization　　As 5G and AI technologies converge, the CPE (Customer Premises Equipment) is emerging as the central hub of the smart home. Powered by FG390, this hub gains advanced sensing capabilities, broad compatibility with smart devices—including support for the Matter protocol—and deeply integrated AI algorithms. Together, these features enable real-time adaptation to environmental changes and user behavior, delivering a more personalized, seamless, and comfortable smart living experience.　　AI Services Spark New Commercial Potential　　What truly differentiates the FG390 is its deep AI integration alongside exceptional connectivity. Equipped with a dedicated NPU, it functions as an intelligent in-home AI agent, delivering context-aware services to end users. Designed to support edge-cloud collaborative AI models, such as those from Open AI and DeepSeek, the FG390 empowers AI-enabled FWA (Fixed Wireless Access) solutions for both consumer and enterprise markets. Its intuitive AI SDK enables flexible service expansion for FWA users, while mobile operators can leverage it to unlock new AI-driven value-added services and monetization channels. Additionally, the module supports NAS integration for centralized data management and optimized AI resource allocation, enhancing productivity and setting the stage for next-generation smart applications.　　“We have a long history of working together with Fibocom to reach significant FWA milestones, and our collaboration on the next-generation T930 5G FWA platform will help to drive growth of the FWA ecosystem,” said Evan Su, General Manager of Wireless Communications at MediaTek. “With this partnership in mind, we are pushing forward by creating a higher focus on new products that are rich in features and innovative design, while delivering cutting-edge solutions and exceptional service to customers around the world.”　　“Designed to meet the evolving needs of the FWA market over the next 3–5 years, we’re pleased to collaborate with MediaTek to launch the FG390 5G FWA module,” Added Simon Tao, VP of MBB Product Management Dept, Head of MBB BU at Fibocom. “Powered by the full capabilities of the MediaTek T930 platform and 5G Release 18, FG390addresses the connectivity needs of large-scale smart home and SMB deployments with high gain, low latency, and multi-OS compatibility. Fibocom remains dedicated to advancing 5G eMBB modules with superior cellular and AI performance. Leveraging powerful NPUs, we’ll work closely with our partners to further enable AI-driven applications across smart homes, offices, and cities, fully embracing the AI era. Together with MediaTek, we’ll continue to innovate across products, technologies, and applications to shape a smarter future.”
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Release time：2025-06-30 15:02 reading：255 Continue reading>>
GD32C231 Series MCU — Redefining Cost-Performance, Unleashing New Potential
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GD32C231 Series MCU — Redefining Cost-Performance, Unleashing New Potential

　　GigaDevice, a leading semiconductor company specializing in Flash memory, 32-bit microcontrollers (MCUs), sensors, and analog products, today officially launched the value-packed GD32C231 series of entry-level microcontrollers, further expanding its Arm® Cortex®-M23 core product lineup. As the leader in China's largest Arm® MCU market, GigaDevice positions the GD32C231 series as a "high-performance entry-level" solution designed to offer more competitive options for applications including small home appliances, BMS (Battery Management Systems), small-screen display devices, handheld consumer products, industrial auxiliary controls, and automotive aftermarket systems.　　With over 2 billion cumulative MCU shipments and a mature supply chain, GigaDevice's newly launched GD32C231 series overcomes the performance limitations of traditional entry-level chips through innovative design. The series not only integrates a rich set of peripherals but also adopts an industrial-grade wide-voltage process and offers a comprehensive ecosystem. While maintaining exceptional cost-effectiveness, this affordable MCU supports more complex application scenarios, redefining value standards in the entry-level MCU market and ushering in a new era of "affordable yet high-spec" solutions.　　GD32C231 Series MCUs: The Ultimate Choice for Cost-Effectiveness　　The GD32C231 series MCUs deliver a significant upgrade in computing performance and peripheral features while maintaining excellent price competitiveness, achieving an ultra-high cost-performance balance. Built on Arm's advanced Cortex®-M23 core architecture, the series offers up to 10% higher performance than Cortex®-M0+, with clock speeds reaching 48MHz. It supports efficient processing capabilities such as integer division, greatly enhancing software execution efficiency.　　In terms of memory configuration, the series features 32KB to 64KB of highly reliable embedded Flash and 12KB of low-power SRAM, with full memory areas equipped with ECC error correction. To meet the demands of diverse applications, multiple package options are available, including TSSOP20/LGA20, QFN28, LQFP32/QFN32, and LQFP48/QFN48. Thanks to its highly integrated chip design, the series effectively reduces the number of external components, providing users with a bill-of-materials (BOM) cost-optimized solution.GD32C231 Product Portfolio　　The Perfect Balance of Wide Voltage Support, Low Power, and Fast Wake-up Time　　The GD32C231 series delivers exceptional power flexibility and energy efficiency, supporting a wide operating voltage range from 1.8V to 5.5V and a broad temperature range from -40°C to 105°C. This makes it highly adaptable for deployment in harsh and demanding environments. Featuring multiple power management modes, the device consumes as little as 5μA in deep sleep mode and offers ultra-fast 2.6μs wake-up time - achieving an optimal balance between low power consumption and real-time performance. These capabilities make the GD32C231 ideal for battery-powered and portable applications.　　Reliable Operation for Safety-Critical Applications　　Engineered for reliability, the GD32C231 provides robust ESD protection - meeting 8kV contact discharge and 15kV air discharge standards. Full ECC error correction is applied across Flash and SRAM memory, helping to prevent data corruption. An integrated hardware CRC module further enhances data transmission integrity. These features ensure the MCU performs reliably in safety-critical environments such as industrial automation and automotive electronics.　　Highly Integrated Peripherals for Flexible Design　　The GD32C231 series integrates a comprehensive set of peripherals, significantly enhancing system integration and design flexibility:　　A 12-bit ADC with 13 external channels and 2 internal comparators for precise analog signal measurement.　　Up to 4 general-purpose 16-bit timers and 1 advanced 16-bit timer for versatile time-based operations.　　2 high-speed SPI interfaces (including quad QSPI at 24Mbps), 2 I²C interfaces (supporting Fast Mode+ at 1Mbit/s), and 3 UARTs (up to 6Mbps) for robust serial communication.　　An integrated 3-channel DMA controller and 1 I²S interface for efficient peripheral data handling.　　With support for up to 45 GPIOs in a 48-pin package, the GD32C231 offers excellent expandability for complex designs. These rich peripheral resources empower the MCU to meet the demands of a wide range of applications - from consumer electronics to industrial control systems - with ease and reliability.GD32C231 block diagram　　Full-Stack Ecosystem Support for Efficient Development　　The GD32C231 series is backed by a comprehensive development ecosystem designed to accelerate product design and time-to-market. Standard software libraries and resources are readily available on GigaDevice's official website.　　To support developers throughout the entire development cycle, GigaDevice provides extensive documentation, including datasheets, user manuals, hardware design guidelines, application notes, and porting references - enabling rapid onboarding for both hardware and software development. A complete SDK firmware package is also offered, featuring rich sample code and development board resources that cover everything from low-level drivers to advanced applications.　　The GD32 MCU family natively supports FreeRTOS, offering developers a lightweight, open-source, and high-efficiency real-time operating system. To streamline development even further, GigaDevice offers the GD32 Embedded Builder IDE - its proprietary development environment that integrates graphical configuration and intelligent code generation, reducing design complexity. The GD32 All-In-One Programmer supports essential Flash operations such as programming, erasing, reading, and option byte configuration. Meanwhile, the GD-Link debugger provides dual-mode SWD/JTAG support with plug-and-play functionality for a seamless debugging experience. GigaDevice also collaborates closely with third-party programming tool providers to offer customers a wide range of programming and debugging options.　　Additionally, the GD32C231 series is fully compatible with major international toolchains including Arm® Keil, IAR Embedded Workbench, and SEGGER Embedded Studio, ensuring flexibility across various development platforms. For typical use cases, GigaDevice provides robust application solutions and reference designs - helping developers shorten design cycles, simplify product validation, and accelerate the path to mass production.　　About GigaDevice　　GigaDevice Semiconductor Inc. is a global leading fabless supplier. Founded in April 2005, the company has continuously expanded its international footprint and established its global headquarters in Singapore in 2025. Today, GigaDevice operates branch offices across numerous countries and regions, providing localized support at customers' fingertips. Committed to building a complete ecosystem with major product lines – Flash memory, MCU, sensor and analog – as the core driving force, GigaDevice can provide a wide range of solutions and services in the fields of industrial, automotive, computing, consumer electronics, IoT, mobile, networking and communications. GigaDevice has received the ISO26262:2018 automotive functional safety ASIL D certification, IEC 61508 functional safety product certification, as well as ISO9001, ISO14001, ISO45001, and Duns certifications. In a constant quest to expand our technology offering to customers, GigaDevice has also formed strategic alliances with leading foundries, assembly, and test plants to streamline supply chain management. For more details, please visit: www.GigaDevice.com　　*GigaDevice, GD32, and their logos are trademarks, or registered trademarks of GigaDevice Semiconductor Inc. Other names and brands are the property of their respective owners.
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Release time：2025-06-30 14:52 reading：270 Continue reading>>
GigaDevice Anchors Global Headquarters in Singapore to Power Synergy and Impact
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GigaDevice Anchors Global Headquarters in Singapore to Power Synergy and Impact

　　GigaDevice, a leading semiconductor company specializing in Flash memory, 32-bit microcontrollers (MCUs), sensors, and analog products, today officially opened its global headquarters in Singapore. This strategic move marks a major milestone in GigaDevice's international growth journey, underscoring its commitment to closer customer engagement, building a resilient and agile supply chain, and strengthening its ecosystem and brand presence across key global markets.　　Founded in 2005, GigaDevice has rapidly built a competitive product portfolio and innovative solutions. Its SPI NOR Flash commands the No. 2 global position with a 20.4% market share, and it ranks No. 7 worldwide in the 32-bit general-purpose MCU segment. Serving diverse sectors including industrial, automotive, consumer, and IoT, GigaDevice is recognized for delivering semiconductor solutions with reliability and innovation at its core.　　As global demand for smart, connected technologies accelerates—particularly in industrial automation, automotive electronics, and intelligent edge devices—GigaDevice is sharpening its focus on innovation, supply chain agility, and ecosystem collaboration. The company is positioning itself to meet the evolving needs of international customers and capture opportunities across fast-growing markets.　　"We chose Singapore not just for its strategic location, but for its clarity, consistency, and global ambition," said Jennifer Zhao, GigaDevice Global Business CEO. "This is more than a regional office—it's a collaborative innovation hub where expertise across disciplines and borders comes together to build smarter systems, accelerate execution, and power what's next."　　Singapore's robust infrastructure, pro-innovation environment, and exceptional talent pool have established it as a global premier technology and business hub. Its strong connectivity, transparent regulatory framework, and dedication to digital transformation provide the ideal foundation for companies like GigaDevice to scale globally while maintaining agility and future readiness.　　Functioning alongside GigaDevice's group headquarters in China, the Singapore global headquarters will serve as a central platform to drive global coordination, foster localized product innovation, and deepen collaboration with customers and supply chain partners. From this base, the company aims to expand its presence in international markets and build a more connected, agile, and responsive global ecosystem.
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Release time：2025-06-30 14:57 reading：257 Continue reading>>
Tumfei Valve Technology：Fine small electric actuator
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Tumfei Valve Technology：Fine small electric actuator

　　Quick Detail:　　Tumfei Valve Technology 's fine electric actuator is a motor and gearbox or transmission device combined together, through the output shaft to generate conversion torque, to achieve the control, regulation and automatic operation of mechanical equipment.　　Description:　　Main feature　　Compact structure: The fine small electric actuator adopts the top type structure, which reduces the connection bolts of the valve body itself, enhances the reliability of the valve, and has a compact structure and takes up little space.　　Rich in functions: According to demand, fine small electric actuators can be divided into switching type, regulating type and intelligent type three. Switch type valves and other similar products for controlling rotation from zero to 270 degrees; The intelligent type can adjust the opening position of the valve arbitrarily according to customer needs to control the flow size, and has a field control button, which can realize local and remote switching operation.　　Strong corrosion resistance: the shell is usually made of hard aluminum alloy, after anodizing treatment and settlement powder coating, strong corrosion resistance and high protection level.　　High-precision control: Through the cooperation of motors, gearboxes, sensors and control systems, fine electric actuators can achieve high-precision control and automatic operation of mechanical equipment.　　Performance characteristics　　Motor part: The core component of the electric actuator is the motor, usually using an AC motor or a DC motor. The motor completes selective rotation by reversing and adjusting the power supply voltage, thus driving the movement of the output shaft.　　Gearbox part: In order to increase the torque of the output shaft and reduce the speed of the output shaft, the electric actuator usually uses a gearbox or transmission device. The gearbox is generally composed of gears, which can change the speed of the input shaft and the torque of the output shaft, and can improve stability and durability.　　Sensor part: Small electric actuators usually need to communicate with external devices, so sensors need to be installed to monitor the position and status of the output shaft. The sensor can detect the stroke and Angle of the output shaft, and send the position and status information to the control system, so as to realize the accurate control of the output shaft.　　Control system part: In order to achieve the control and adjustment of the electric actuator, it is necessary to use a control system. The control system can calculate according to the feedback information of the sensor, so as to output the control signal and drive the motor to realize the accurate motion control of the output shaft.
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Release time：2025-06-23 15:13 reading：235 Continue reading>>
ROHM's SiC MOSFET Adopted for Mass Production in Toyota's New BEV
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ROHM's SiC MOSFET Adopted for Mass Production in Toyota's New BEV "bZ5" for the Chinese Market

　　~Integration in traction inverters extends the cruising range and improves performance~　　The power module equipped with ROHM Co., Ltd.'s 4th generation SiC MOSFET bare chip has been adopted in the traction inverter of Toyota Motor Corporation's (hereinafter "Toyota") new crossover BEV "bZ5" for the Chinese market.　　The "bZ5" is a crossover-type BEV jointly developed by Toyota, BYD TOYOTA EV TECHNOLOGY Co., Ltd. (hereinafter "BTET"), FAW Toyota Motor Co., Ltd. (hereinafter "FAW Toyota"), etc., and was launched by FAW Toyota in June 2025.　　The power module adopted this time has started mass production shipments from HAIMOSIC (SHANGHAI) Co., Ltd., a joint venture between ROHM and Zhenghai Group. ROHM's power solutions centered on SiC MOSFETs contribute to the extended range and enhanced performance of the new BEV.　　ROHM aims to complete the construction of the production line for the next-generation 5th generation SiC MOSFET by 2025, and is also accelerating the market introduction plans for the 6th and 7th generations, focusing on the development of SiC power devices. ROHM will continue to work on improving device performance and production efficiency, and strengthen the system to provide SiC in various forms such as bare chips, discrete components, and modules, promoting the spread of SiC and contributing to the creation of a sustainable mobility society.　　About the "bZ5"　　The "bZ5" is a crossover BEV jointly developed by Toyota, BTET, FAW Toyota, etc., with the concept of "Reboot." It features active and iconic styling and is designed to provide a personal space for young users known as Generation Z. The driving range is 550 km for the lower grade and 630 km (CLTC mode) for the higher grade. Reservations began on April 22, 2025, the day before the opening of the 2025 Shanghai Motor Show, attracting significant attention.　　About HAIMOSIC (SHANGHAI) Co., Ltd.　　HAIMOSIC (SHANGHAI) CO.,LTD. is a Joint venture initiated by Zhenghai Group Co., Ltd. (China) and ROHM Co., Ltd. (Japan). HAIMOSIC is mainly engaged in the R&D, design, manufacturing and sales of the silicon carbide power module, with an estimated annual capacity of 360,000 pieces/year. The total investment of the project is 450 million RMB and the registered capital is 250 million RMB. For more details, please visit HAIMOSIC's website: http://www.haimosic.com/
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Release time：2025-06-23 14:11 reading：287 Continue reading>>
Tumfei Valve Technology：The principle of common valves and their use
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Tumfei Valve Technology：The principle of common valves and their use

　　Tumfei Valve Technology has summarized the principle of common valves and their use. Let's learn about them together.　　First, the role of the valve　　1, opening and closing action - cut off or communicate the flow of fluid in the tube;　　2, regulating effect - regulating tube flow, flow rate;　　3, throttling effect - make the fluid through the valve to produce a large pressure drop;　　4. Other functions -a. Automatic opening and closing b. Maintain a certain pressure c, prevent steam drainage.　　Second, the type of valve　　1, according to the use of: cut-off valves, regulating valves, diverting valves, check valves, safety valves;　　2, according to the force points: he action with the valve, automatic action valve.　　Three, the main parameters of the valve　　PN nominal pressure (the maximum pressure that allows fluid to pass through);　　DN nominal diameter;　　TN Temperature range (permissible fluid temperature range).　　Forth， Check the valve before use　　Check items include:　　1, the internal and external surfaces of the valve body have sand holes, cracks and other defects;　　2. Whether the valve seat is firmly engaged with the valve body, whether the spool is consistent with the valve seat, and whether the sealing surface is defective;　　3, whether the valve stem and the spool connection is flexible and reliable, whether the valve stem is bent, whether the thread is damaged or corroded;　　4, packing, gasket is aging damage;　　5, the valve open is flexible, etc.　　Fifth，Problems often occur in the use of valves　　1, flange and thread leakage at the connection of the pipeline;　　2, packing culvert leakage, waist pad leakage and valve stem can not move;　　3, between the valve core and the seat is not tightly closed to form internal leakage.　　Sixth, the characteristics of commonly used valves and their use precautions　　(1) Plug Valve (Cock)　　Features: TN less than 150 degrees PN less than 1.6Mpa its simple structure, quick opening and closing, easy operation, low fluid resistance and other advantages　　Precautions for use:　　1, the outer end of the valve stem is square, the straight line marked by the diagonal is vertical and the direction of the valve body is closed, and the direction of the valve body is consistent with the open state;　　2, the normal switch valve with cock special wrench, to avoid sliding with the valve stem caused by safety accidents; Try not to use an adjustable wrench to cause slippage;　　3, open the valve according to the previous check item check, slowly open the valve after the check, try not to stand in the direction of the sealing surface when opening, encounter acid and alkali fluid must wear acid mask;　　4, if the pipeline has a sight mirror see the fluid in the sight mirror can be checked and left.　　(2) Ball valve:　　Ball valve and plug valve are the same type of valve, but the opening and closing part is a ball with a hole, and the center line of the ball valve stem rotates to achieve the purpose of opening and closing.　　Insulated ball valve with jacket　　Stainless steel ball valve　　Stainless steel ball valve quick opening ball valve　　Features: Valve structure is simple, reliable, used for two-way flow medium pipeline, fluid resistance is small, good sealing; Disadvantages; The medium is easy to leak from the stem.　　Precautions for use:　　Same as a plug valve;　　With a handle valve, the handle perpendicular to the medium flow direction for the closed state, consistent with the direction for the open state; If the ball valve with jacket insulation should pay attention to the following matters:　　The jacket insulation steam should be opened to melt the crystallizing medium in the valve before opening and closing the valve, do not forcibly open and close the valve before the medium is completely melted;　　When the valve cannot be opened, the method of lengthening the lever cannot be used to forcibly open the valve, because this will cause the valve stem to be resisted and the spool to fall off, causing damage to the valve or causing damage to the wrench, resulting in unsafe factors.　　(3) Butterfly valve　　The butterfly valve uses a rotating disc with a flexible shaft to control the opening and cosing of the pipeline, and the Angle size reflects the opening degree of the valve.　　According to the different transmission methods, the butterfly valve is split, pneumatic and electric three, commonly used for manual, rotating handle through the gear drive valve stem to open and close the valve.　　Features: Butterfly valve has the advantages of simple structure, rapid opening and closing, small fluid resistance, easy maintenance, etc., but it can not be used for high temperature and high pressure occasions, PN less than 1.6Mpa, t less than 120 degrees of large diameter water, steam, air, oil and other pipelines.　　Precautions for use:　　1, the spool can only be rotated 90 degrees, generally the valve body will indicate the direction of the CLOSE and OPEN arrows, the hand wheel clockwise rotation is closed, and the reverse is open;　　2, if sometimes there is a certain resistance to opening and closing, you can use a special P wrench to open the valve. But it can not be forced to open and close, otherwise the male will stir the thin rod gear:　　3. It is forbidden to remove the handwheel and report the hand vibration valve sample with activity; (Same goes for lower waist)　　4. Gradually open and close when opening and closing, observe whether there is any abnormal situation, and prevent leakage.　　(4) Stop valve　　The globe valve is the most widely used cut-off valve in chemical production. Compared with the above three cut-off valves, it is not the use of the rotation of its closing parts to open and close the valve, but the use of the valve stem to drive the circular valve disc (valve head) connected with it, and change the distance between the valve disc and the seat to control the valve opening and closing.　　Streamline type stop valve American standard stop valve　　Features: The upper part of the globe valve has a handwheel, valve stem, the middle has a thread and packing culvert sealing section, the small valve stem on the thread in the valve body, its compact structure, but the valve stem and the medium contact part, especially the thread part is easy to corroded, from the height of the valve stem exposed to the valve cover can be judged　　The globe valve structure is more complex, but the operation is simple, not very laborious, easy to adjust the flow rate and truncate the channel, slow closing without water hammer phenomenon, so it is more widely used.　　When installing the globe valve, pay attention to the direction of the fluid, the pipeline fluid should flow through the valve seat from the bottom up, and the so-called "low into high", the purpose is to reduce the fluid resistance, so that the valve stem and packing culvert are not in contact with the medium under the opening and closing state, to ensure that the valve stem and packing culvert are not damaged and leaked.　　The globe valve is mainly used for the pipeline of water, steam, compressed air and various materials, which can adjust the flow rate more accurately and strictly cut off the channel, but can not be used for materials with large viscosity and easy crystallization.　　Precautions for use:　　1, before opening to check the valve for defects, especially the filler culvert leakage:　　2, in the valve stem can not be directly rotated by hand, the special F wrench can be used to open and close, when it is still unable to open and close, please do not extend the wrench lever to force open and close, resulting in damage to the valve or cause safety accidents:　　3, when used for medium pressure steam pipeline valve, the condensate in the pipe should be drained first when opened. Then slowly open the valve with 0.2 to 0.3Mpa steam to preheat the pipeline, to avoid the sudden opening of pressure caused by damage to the sealing surface, called the normal inspection after the pressure to adjust the required state　　(5) Gate valve　　Gate valve, also known as gate valve or gate valve, it is through the lift of the gate to control the valve opening and closing, the gate is straight to the direction of the fluid, change the relative position between the gate and the seat can change the size of the channel.　　Open stem gate valve Dark stem gate valve　　According to the different movement of the valve stem when the gate valve is opened and closed, the gate valve has two kinds of distinct rod type and dark rod type.　　Open rod gate valve stem thread strike outside the valve body, open the valve stem out of the handwheel, its advantage is that according to the length of the valve stem to determine the size of the valve open, the valve stem and the medium contact length is small, the thread part is basically not affected by the medium corrosion, the disadvantage is that the height of the overhang space.　　The valve stem thread inside the valve stem and the internal thread on the gate plate want to match, open the valve stem only rotation without up and down, the gate rises along the valve stem thread. The advantage of dark rod gate valve is that the overhang space is small, the disadvantage is that the opening of the valve can not be judged according to the condition of the valve stem, and the valve stem thread is easily corroded by long-term contact with the medium.　　Gate valve has the advantages of small fluid resistance, constant medium flow direction, slow opening without water hammer phenomenon, easy to adjust the flow rate, etc. The disadvantages are complex structure, large size, long opening and closing time, and difficult maintenance of sealing surface. Due to the large bore feed pipe　　1, when the valve stem is opened and closed in place, it can not be forced to force, otherwise it will break the internal thread or latch screw, so that the valve is damaged;　　2, open and close the valve when the hand can not be directly started, F wrench can be used to open and close;　　3. When opening and closing the valve, pay attention to the sealing surface of the valve, especially the packing gland to prevent leakage.　　(6) Throttle valve　　Throttle valve, also known as needle valve, its shape is similar to the globe valve, its valve core shape is different, back to the base or parabola, often used in the instrument, often bundle connection.　　Precautions for use:　　1, because of the threaded connection, first check whether the threaded connection is loose when opening and closing;　　2, open and close the valve slowly, because the flow area is small, the flow rate is large, may cause corrosion of the sealing surface, should pay attention to observe, pay attention to the change of pressure.　　(7) Check valve　　Check valve is a valve that automatically opens and closes by using the pressure difference between the medium before and after the valve to control the one-way flow of the medium, also known as check valve or check valve.　　Check valves are divided into two types according to different structures: lifting type (jumping type) and swinging type (shaking pole type).　　Lift type swing type　　Precautions for use:　　Pay attention to the direction of the valve, the arrow is consistent with the flow direction of the medium, such as the medium easy crystallization may cause the valve disc can not be pressed down to play the role of command and check.　　(8) Safety valve　　The safety valve is a kind of valve that automatically opens and closes according to the medium pressure. When the medium pressure exceeds a certain value, it can automatically open the valve to discharge pressure relief, so that the equipment pipeline is free from the danger of damage, and can automatically close after the pressure returns to normal.　　According to the way of balancing the internal pressure, the safety valve is divided into two categories: lever weight type and spring type.　　Precautions for use:　　1, the safety valve must be used within the validity period;　　2, the safety valve control valve installed on the pipeline and equipment is usually the globe valve must be opened to ensure that the safety valve can work effectively;　　3. Periodically lift the valve disc slightly and use the medium to blow the impurities in the valve.　　4, if the safety valve can not work within the setting pressure, it must be re-validated or replaced　　(9) Steam trap　　Steam trap is a kind of valve that can automatically and intermittently remove condensate and prevent steam from leaking out in steam pipeline, heater and other equipment systems. Commonly used are bell-shaped float type, thermal power type and pulse type.　　Precautions for use:　　1, use the pipeline bypass valve to remove condensate before use, when there is steam to close the bypass, start the trap path, otherwise the valve will be closed water can not play the role of drainage;　　2. Be careful not to be scalded by steam when opening and closing the valve.　　(10) All kinds of sampling valves　　As the name suggests, the sampling valve is a valve used to obtain media samples so that chemical analysis can be performed, generally installed in equipment or pipelines are roughly divided into the following categories:　　Double opening valves, flanged clip valves, and sampling valves with insulated jacket:　　Use note method:　　1, the double opening valve is generally composed of two ball valves, to sample safety and achieve the purpose of sampling through linkage in the negative pressure device; When sampling, close the second valve near the equipment and pipeline and open the first valve. Let the medium flow into the space between the two valves; Then close the first valve, open the second valve, and place the sampling vessel into the sampling port to contain the medium;　　2. The flange clip valve is generally sealed through the top cone of the valve stem and the cone hole of the seat, and the valve stem is separated from the cone hole by turning the hand wheel during sampling, so that the medium can flow from the cone hole to the external sampling vessel;　　3, with jacket insulation sampling valve should pay attention to the following matters:　　I should open the jacket insulation steam to melt the crystallizable medium in the valve before opening and closing the valve, do not forcibly open and close the valve before the medium is completely melted;　　When the valve cannot be opened, the method of lengthening the lever cannot be used to forcibly open the valve, because this will cause the valve stem to suffer greater resistance and the valve core to fall off, or cause the valve stem and the cone hole sealing surface to be damaged. from　　And cause damage to the valve or cause damage to the wrench, resulting in unsafe factors.　　(11) Fluorine plastic lined rubber valve　　Fluorine plastic lined rubber valve is mainly used in acid and alkali and other corrosive media, its structure principle is similar to the unlined fluorine plastic valve, but its stem, valve core, valve seat are used fluorine plastic substrate, its use method is similar.　　Classification of valves　　There are many kinds of valves. With the continuous improvement of the process flow and performance of various complete sets of equipment, the types of valves are still increasing, and there are a variety of classification methods.　　According to the automatic and drive classification, can be divided into:　　1) Automatic valves rely on the ability of the medium (liquid, air, steam, etc.) to operate by itself. Such as safety valves, check valves, pressure reducing valves, steam traps, solenoid valves, air traps, emergency cut-off valves, etc.　　2) Drive valves Valves that are operated manually, electrically, hydraulically or pneumatic. Such as gate valve, globe valve, throttle valve, butterfly valve, ball valve, plug valve and so on.　　According to the use and function classification, can be divided into:　　1) The cut-off valve is mainly used to cut off or connect the medium flow in the pipeline. Such as globe valve, gate valve, ball valve, plug valve, butterfly valve, diaphragm valve and so on.　　2) Check valves are used to prevent the backflow of the medium. Such as a variety of different structures of the check valve.　　3) Regulating valves are mainly used to regulate the pressure and flow of the pipeline medium. Such as regulating valve, throttle valve, pressure reducing valve and so on.　　4) The diverter valve is used to change the direction of the flow of the medium in the pipeline, and plays the role of distributing, diverting or mixing the medium.　　Such as various structures of distribution valves, three-way or four-way plug valves, three-way or four-way ball valves, various types of traps and so on.　　5) Safety valves are used for overpressure safety protection, discharge of excess media, and prevent pressure from exceeding the specified value. Such as various types of safety valves.　　6) Multi-purpose valves are used to replace two, three or even more types of valves. Such as stop check valve, check ball valve, stop check safety valve, etc.　　7) Other special valves such as blowdown valve, blowdown valve, coke valve, pigging valve, etc.
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Release time：2025-06-17 14:09 reading：320 Continue reading>>

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