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SIMCom Introduces SIM8668 & SIM8666 for Low-Power AI on the Edge

　　AI has clearly become a key focusacross industries at MWC Shanghai 2025. While high-level and advanced-levelAI computing modules are alreadyadopted in applications like video conferencing, AR/VR, edge computing, and industrial PDAs, the growing diversity of edge applications has created strong demand for entry-level AI solutions that prioritize low power consumption, cost-efficiency, and fast deployment.　　To address the trends, and following the recent launches of its SIM9850 (high-level AI computing module) and SIM9630L-W (advanced-level AI module), SIMCom — a global leader in IoT communication solutions — has introduced two new entry-level AI computing modules: SIM8668 and SIM8666, designed to bring intelligent capabilities to lightweight, energy-efficient edge devices.　　Powered by the RK3568 and RK3566 platforms, both SIM8668 and SIM8666 deliver 1 TOPS of NPU performance and come equipped with a wide range of interfaces—including LVDS, MIPI-DSI, HDMI 2.0, CSI, USB, PCIe, UART, SPI, I2C, and more. These interfaces allow easy connection to cameras, displays, audio, and sensors, enabling rich data collection and smooth human-machine interaction. The integrated NPU supports INT8/INT16 hybrid operations and is compatible with popular AI frameworks such as TensorFlow, PyTorch, MXNet, and Caffe, offering flexibility for deploying a variety of deep learning models.　　These capabilities make SIM8668 and SIM8666 ideal for edge AI applications like like face recognition, license plate detection, seatbelt monitoring, people counting, helmet detection, e-bike identification, and safety alerts—all while maintaining low power consumption and cost efficiency for smart, connected devices.　　Specifically, the SIM8668 features a 2.0GHz CPU, ARM Mali-G52 GPU, and an 8M ISP with HDR support. It also supports dual independent displays, suitable for advanced multimedia and multitasking needs. The SIM8666, on the other hand, is designed for cost-sensitive AI applications with a 1.8GHz CPU, the same Mali-G52 GPU, and support for single or mirrored dual display output. It also includes a touchscreen interface (I2C TP), offering enhanced flexibility for HMI (Human Machine Interface) scenarios in both consumer and industrial devices.　　With their compact design and built-in connectivity, SIM8668 and SIM8666 help customers accelerate product development and reduce time-to-market.These modules are well suited for a variety of low-power edge AI applications, including home automation, self-service kiosks, digital signage, audio and video streaming devices, dashcams, and HMI systems.　　By launching the SIM8668 and SIM8666 during MWC Shanghai, SIMCom demonstrates its continued commitment to expanding the accessibility of AI—offering practical, scalable solutions to enable smarter edge devices across a wider range of industries.

Key word：

SIMCom

Release time：2025-07-21 14:49 reading：208 Continue reading>>

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SIMCom Strengthens Japan Market Presence with SIM7672JP Certifications

　　SIMCom, a global leader in IoT communication solutions, announces that its SIM7672JP—powered by the Qualcomm® 216 LTE IoT modem—has successfully obtained key certifications for the Japanese market, including JATE, TELEC, and NTT Docomo Technical Approval (TA). Certification with KDDI is currently ongoing.　　These approvals mark a significant step in SIMCom's strategic expansion into Japan, one of the world’s most advanced and regulated IoT markets.　　Designed to meet Japan's stringent regulatory and operator requirements, the SIM7672JP offers reliable and cost-effective LTE Cat.1 bis connectivity tailored for a wide range of IoT applications. It has already been validated by IIJ (Internet Initiative Japan) and is compatible with the NTT Docomo network, ensuring strong local integration.　　With support for Power Saving Mode (PSM), the SIM7672JP enables long-term, low-power deployments—making it an ideal solution for diverse sectors such as automotive and transport (fleet management, UBI, DVR, public safety), energy and industrial (smart grids, industrial equipment, rugged tablets, infrastructure, pipeline monitoring), consumer and enterprise (payment systems, POS, networking, retail, surveillance), and residential and healthcare (home automation, security, wearables, remote medical devices).　　The SIM7672JP is now in mass production and available for Japanese market. With the latest Japanese certifications, SIMCom is well-positioned to deepen its collaboration with local partners and accelerate the deployment of reliable cellular IoT solutions throughout Japan. SIMCom remains committed to empowering the Japanese IoT ecosystem—with certified, future-proof LTE Cat.1 bis modules that deliver connectivity, efficiency, and compliance.

Key word：

SIMCom

Release time：2025-07-21 14:44 reading：206 Continue reading>>

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Fibocom Unveils the First LTE Cat.1 bis Module L610-IN with IRNSS and NAVIC for India

　　Fibocom (Stock code:300638), a global leading provider of AIoT solutions and wireless communication modules, launched the L610-IN, the first LTE Cat.1 bis module that supports dual-mode, dual-frequency positioning technology with IRNSS (Indian Regional Navigation Satellite System) and NAVIC. With its precise positioning capabilities, high compatibility, and adaptability to various IoT scenarios, the L610-IN provides an efficient and cost-effective connectivity solution for the Indian IoT market. It fully complies with the AIS140 standard, empowering intelligent transformation in key sectors such as fleet management and electronic toll collection (eToll).　　The L610-IN integrates innovative IRNSS and NAVIC dual-mode, dual-frequency positioning functionality, significantly enhancing positioning accuracy and stability in India and neighboring regions. It effectively addresses the challenge of insufficient navigation signal coverage in complex environments. The module strictly adheres to the AIS140 regulations in India, ensuring compliance for applications like vehicle tracking and eToll collection, making it the ideal communication solution for smart transportation and logistics industries.　　The L610-IN features a compact LCC+LGA package with dimensions of 31mm x 28mm and is pin-to-pin compatible with Fibocom's LTE Cat.4 modules NL668/L716. This design enables customers to seamlessly transition between communication technologies while minimizing hardware modification costs. Supporting LTE/GSM networks, the module is ideal for mid-to-low-speed applications such as smart payment, shared economy, industrial IoT, asset tracking, and aftermarket automotive solutions. With additional features like VoLTE HD voice, camera support, LCD display, and multiple sensor interfaces (USB/UART/SPI/I2C/SDIO), the L610-IN delivers flexible and secure end-to-end connectivity for industry clients.　　In addition to the L610-IN for the Indian market, Fibocom has also introduced the L610-EU for Europe and the L610-LA for Latin America, covering major global operator frequency bands. These variants cater to seamless positioning and long-distance communication needs, further expanding the boundaries of smart city and intelligent tracking applications.　　The L610-IN is expected to begin CS in Q2 2025. With its high cost-efficiency and localized service capabilities, the module will accelerate the development of India's IoT ecosystem.　　Ragin Kallanmar Thodikai, Country Sales Manager of India at Fibocom, stated:　　"The launch of the L610-IN bridges the gap in the Indian market for high-precision Cat.1 bis modules while simplifying customer upgrades through technology compatibility, accelerating the global deployment of mid-to-low-speed IoT solutions."

Key word：

Fibocom

Release time：2025-07-17 16:25 reading：268 Continue reading>>

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Fibocom Debuts 5G Module FG390 Powered by MediaTek T930 Platform, Accelerating FWA Innovation with the Convergence of 5G-A and AI

　　Fibocom, a global leading provider of wireless communication modules and AI solutions, announces the launch of its 5G module FG390, developed on the advanced MediaTek T930 platform. Designed specifically for mobile broadband (MBB) terminal products focused on 5G Fixed Wireless Access (FWA), the FG390 series seeks to boost FWA industry growth across diverse applications such as CPEs, ODUs, mobile hotspot devices, enterprise gateways, and industrial gateways.　　FG390 is a highly integrated, high-performance 5G module built on MediaTek’s advanced T930 chipset, featuring cutting-edge 4nm process technology. It incorporates the MediaTek M90 5G modem alongside a quad-core ARM Cortex-A55 CPU, delivering robust functionality and full compliance with 3GPP Release 18 standards. Supporting downlink 6-carrier aggregation (6CC CA) and uplink 5-layer 3Tx transmission within the 5G NR Sub-6GHz spectrum, the FG390 achieves peak standalone (SA) downlink speeds of up to 10 Gbps and uplink speeds reaching 2.8 Gbps, providing an outstanding high-speed 5G experience. Furthermore, with 200MHz bandwidth and 8Rx technology, the module significantly enhances spectrum efficiency about 40% at cell edges, greatly extending signal coverage. Paired with a dedicated NPU chip, the FG390 powers AI-enabled gateway devices to offer advanced, intelligent network interaction capabilities.　　Amid the swift convergence of 5G-A and AI technologies, the FG390 series harnesses cutting-edge specifications, innovative features, and a comprehensive suite of peripherals to drive digital transformation and continuous innovation across both residential and enterprise applications. This breakthrough empowers telecom operators and the broader market to enhance investment efficiency and accelerate returns in the communications terminal sector.　　Leveraged by the MediaTek T930 platform, the FG390 seamlessly integrates robust 5G Release 18 protocol capabilities with exceptional cellular performance and AI-driven intelligence, setting a new benchmark for the next generation of mobile broadband terminals. Enhanced by a dedicated NPU for AI acceleration, this module empowers transformative applications across smart offices, smart homes, and smart cities. Fibocom remains dedicated to deepening the collaboration with MediaTek to drive continuous innovation in 5G technologies, products, and ecosystem development.

Key word：

Fibocom

Release time：2025-07-17 16:21 reading：314 Continue reading>>

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Renesas Debuts Best-in-Class MCUs Optimized for Single-Motor Applications Including Power Tools, Home Appliances and More

　　Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions,introduced the RA2T1 microcontroller (MCU) group based on the Arm® Cortex®-M23 processor optimized for motor control systems in July9. RA2T1 devices are specifically designed for single-motor applications such as fans, power tools, vacuum cleaners, refrigerators, printers, hair dryers and many more.　　Feature Set Optimized for Motor Control　　The new RA2T1 devices include a number of features designed to enhance motor control function, specifically in single-motor systems. One of the notable features is a 3-channel S&H function that simultaneously detects the 3-phase current values of Brushless DC (BLDC) motors. This method provides superior control accuracy as opposed to sequential measurement methods. The RA2T1 MCUs also offer complementary Pulse Width Modulation (PWM) function of the timer, which enables automatic insertion of dead time and generation of an asymmetric PWM. This function is optimized for inverter drive, which facilitates control algorithm implementation.　　The RA2T1 devices offer safety features that are critical in motor control applications. They provide a Port Output Enable function and a high-speed comparator that work together to quickly shut off the PWM output when an overcurrent is detected. The shutdown state can be selected according to the inverter specifications.　　Renesas Leadership in Embedded Processing for Motor Control　　Renesas has shipped motor-control specific MCUs for over 20 years. The company ships over 230 million motor control embedded processors per year to thousands of customers worldwide. In addition to multiple RA MCU groups, Renesas offers motor-control specific devices in its 32-bit RX Family, its 16-bit RL78 MCUs and its 64-bit RZ MPUs.　　“Customers have trusted Renesas motor control solutions for many years across thousands of systems,” said Daryl Khoo, Vice President of Embedded Processing Marketing Division at Renesas. “The RA2T1 MCUs enhance our leadership in this area with market-leading technology, low-power operation, and legendary Renesas quality and safety standards for single-motor systems.”　　Key Features of the RA2T1 Group MCUs　　Core: 64 MHz Arm Cortex-M23　　Memory: 64KB Flash, 8KB SRAM, 2KB Data Flash　　Analog Peripherals: 12-bit ADC with 3-channel Sample and Hold, temperature sensor, internal reference voltage, 2-channel high-speed comparators　　System: High-, mid- and low-speed On-chip Oscillators; clock output; power-on reset; voltage detection; data transfer, event link and interrupt controllers; low-power modes　　Safety: PWM forced shutdown, SRAM parity error check, ADC self-diagnosis, clock frequency accuracy measurement, illegal memory access detection　　Operating Temperature Range: Ta = -40°C to 125°C　　Operating Voltage: 1.6V to 5.5V　　Packages: 48LQFP, 32-LQFP, 48-QFN, 32-QFN, 24-QFN (4mm x 4mm)　　The new RA2T1 Group MCUs are supported by Renesas’ Flexible Software Package (FSP). The FSP enables faster application development by providing all the infrastructure software needed, including multiple RTOS, BSP, peripheral drivers, middleware, connectivity, networking, and security stacks as well as reference software to build complex AI, motor control and cloud solutions. It allows customers to integrate their own legacy code and choice of RTOS with FSP, thus providing full flexibility in application development. Using the FSP will ease migration of motor control designs to other RA Series devices.　　Winning Combinations　　Renesas has combined the new RA2T1 Group MCUs with numerous compatible devices from its portfolio to offer a wide array of Winning Combinations, including Portable Power Tools, Smart BLDC Ceiling Fan, Cordless Vacuum Cleaner, Cordless Leaf Blower. Winning Combinations are technically vetted system architectures from mutually compatible devices that work together seamlessly to bring an optimized, low-risk design for faster time to market. Renesas offers more than 400 Winning Combinations with a wide range of products from the Renesas portfolio to enable customers to speed up the design process and bring their products to market more quickly. They can be found at renesas.com/win.　　Availability　　The RA2T1 Group MCUs are available now, along with the FSP software. The new MCUs are supported in Renesas’ Flexible Motor Control development kit that enables easy evaluation of motor control using permanent magnet synchronous motors (brushless DC motors), and the Renesas Motor Workbench development tool. This development kit offers a common design platform with numerous Renesas motor control MCUs from the RA and RX families, enabling migration of IP across numerous devices. Information on all these offerings is available at renesas.com/RA2T1. Samples and kits can be ordered either on the Renesas website or through distributors.　　Renesas MCU Leadership　　A world leader in MCUs, Renesas ships more than 3.5 billion units per year, with approximately 50% of shipments serving the automotive industry, and the remainder supporting industrial and Internet of Things applications as well as data center and communications infrastructure. Renesas has the broadest portfolio of 8-, 16- and 32-bit devices, delivering unmatched quality and efficiency with exceptional performance. As a trusted supplier, Renesas has decades of experience designing smart, secure MCUs, backed by a dual-source production model, the industry’s most advanced MCU process technology and a vast network of more than 250 ecosystem partners. For more information about Renesas MCUs, visit renesas.com/MCUs.

Key word：

Renesas

Release time：2025-07-14 14:38 reading：320 Continue reading>>

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NOVOSENSE Launches High-Performance 2-Wire Hall Switch MT72xx Series: Compact Design with System-Level Reliability

　　NOVOSENSE Microelectronics ("NOVOSENSE") has launched the MT72xx series, 2-wire current output Hall switches. The switches feature superior EMC performance, multiple sensing polarity options, and highly integrated design, achieving ASIL-A functional safety certification and full compliance with AEC-Q100 Grade 0 standards. Designed for long-wiring scenarios in vehicle body electronics and domain controller systems, the MT72xx series provides optimized solutions for seatbelt buckle detection, window lift motor control, and other automotive applications.　　Addressing Long Wiring Harness Challenges in Automotive　　With rapid advancement of automotive intelligence and electrification, increasingly complex vehicle body functions and highly integrated domain controllers have significantly extended wiring harnesses between sensors and control units. This introduces critical challenges including elevated signal interference risks, increased costs, and compromised system reliability.　　NOVOSENSE's MT72xx series delivers robust signal integrity while effectively reducing wiring complexity and lowering harness costs. Designed for long-wiring scenarios such as door lock detection, anti-pinch window control, power tailgate position sensing, seat adjustment, and seatbelt buckle detection, these devices provide stable current output with superior anti-interference capabilities, maintaining signal reliability even in extended wiring conditions.　　High Integration & Robustness for Automotive-Grade Standards　　Engineered for harsh automotive environments with strong EMI interference, the MT72xx series integrates a 100nF(only TO92S package)capacitor to enhance EMC/ESD performance, simplify peripheral configuration, and optimize BOM space, enabling flexible system architecture design. Compliant with AEC-Q100 Grade 0, the devices ensure long-term stability under extreme high-temperature conditions.　　Featuring multiple sensing polarity options (unipolar, omnipolar, latch) and adjustable sensitivity thresholds, the MT72xx series offers design flexibility to accommodate diverse magnet solutions and vehicle architectures, streamlining development and debugging processes.　　Comprehensive Resources to Accelerate Time-to-Market　　To expedite customer development, NOVOSENSEN provides dedicated MT72xx demo boards and magnetic simulation services. These resources enable rapid device validation, magnet solution matching, and cost-effective debugging, significantly shortening product deployment cycles.

Key word：

NOVOSENSE

Release time：2025-07-14 14:25 reading：323 Continue reading>>

Trade news

Fibocom-Powered Robotic Mower Solution Featured at SPOGA+GAFA 2025, Pioneering the Future of Boundary-Free Smart Lawn Care

　　Cologne, Germany – June 24, Fibocom, a global leader incommunication modules and AI solutions, had its state-of-the-art intelligentrobotic lawn mower solution prominently showcased at SPOGA+GAFA 2025, theworld’s leading trade fair for the garden and outdoor living industry. Multiplerobotic lawn mowers powered by Fibocom’s technology demonstrated seamlessnavigation across simulated garden environments—autonomously detectingboundaries, planning precise mowing routes, and avoiding obstacles—all withoutrelying on traditional physical perimeter wires. This impressive demonstrationhighlighted the disruptive potential of AI-driven, boundary-free lawn caresolutions.　　The global smartrobotic mower market holds vast potential, with Europe and North Americaaccounting for 72% of the world’s 250 million private gardens. Yet, adoptionremains low—under 6% in North America and 10–30% in Europe—highlightingsubstantial room for growth as demand for intelligent lawn care accelerates.　　Fibocom’ssolution integrates advanced AI vision, multi-sensor fusion, and intelligentnavigation to eliminate the need for traditional boundary wires. This enablesrobotic mowers to autonomously detect perimeters and obstacles, ensuring safe,efficient, and precise operation while significantly improving mowing productivity.It’s worth mentioning that, having accumulated over 350,000 kilometers ofreliable autonomous performance worldwide, this solution has proven itsrobustness in diverse and complex garden environments.　　Fibocom provides two solution variantstailored to diverse customer needs: a standard pure-vision model and a flagshipversion combining binocular VIO (Visual-Inertial Odometry) with RTK (Real-TimeKinematic) for superior stability, precision, and large-area coverage—ideal forprofessional and commercial applications. This comprehensive suite, encompassingstereo cameras, AI processing boards, motor control units, and customizablemobile applications, enables OEM partners to accelerate product developmentcycles and focus resources on product differentiation and go-to-marketstrategies. For end users, it revolutionizes lawn care with smart mapping,autonomous operation, and auto-recharging for a safer, easier experience.　　Strategic partnerships with top global brandsare fast-tracking the launch of Fibocom-powered products in key internationalmarkets over the next six months, underscoring Fibocom’s technologicalleadership and growing influence in the smart lawn care industry. Leveragingcutting-edge innovation and manufacturing excellence, Fibocom empowers partnersto penetrate top-tier European retail channels and scale globally, where everyimpeccably maintained lawn showcases the strength of Chinese smartmanufacturing on the world stage.

Key word：

Fibocom

Release time：2025-07-11 11:28 reading：240 Continue reading>>

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GigaDevice GD32C231 Series MCU — Redefining Cost-Performance, Unleashing New Potential

　　GigaDevice, a leading semiconductor company specializing in Flash memory, 32-bit microcontrollers (MCUs), sensors, and analog products, today officially launched the value-packed GD32C231 series of entry-level microcontrollers, further expanding its Arm® Cortex®-M23 core product lineup. As the leader in China's largest Arm® MCU market, GigaDevice positions the GD32C231 series as a "high-performance entry-level" solution designed to offer more competitive options for applications including small home appliances, BMS (Battery Management Systems), small-screen display devices, handheld consumer products, industrial auxiliary controls, and automotive aftermarket systems.　　With over 2 billion cumulative MCU shipments and a mature supply chain, GigaDevice's newly launched GD32C231 series overcomes the performance limitations of traditional entry-level chips through innovative design. The series not only integrates a rich set of peripherals but also adopts an industrial-grade wide-voltage process and offers a comprehensive ecosystem. While maintaining exceptional cost-effectiveness, this affordable MCU supports more complex application scenarios, redefining value standards in the entry-level MCU market and ushering in a new era of "affordable yet high-spec" solutions.　　GD32C231 Series MCUs: The Ultimate Choice for Cost-Effectiveness　　The GD32C231 series MCUs deliver a significant upgrade in computing performance and peripheral features while maintaining excellent price competitiveness, achieving an ultra-high cost-performance balance. Built on Arm's advanced Cortex®-M23 core architecture, the series offers up to 10% higher performance than Cortex®-M0+, with clock speeds reaching 48MHz. It supports efficient processing capabilities such as integer division, greatly enhancing software execution efficiency.　　In terms of memory configuration, the series features 32KB to 64KB of highly reliable embedded Flash and 12KB of low-power SRAM, with full memory areas equipped with ECC error correction. To meet the demands of diverse applications, multiple package options are available, including TSSOP20/LGA20, QFN28, LQFP32/QFN32, and LQFP48/QFN48. Thanks to its highly integrated chip design, the series effectively reduces the number of external components, providing users with a bill-of-materials (BOM) cost-optimized solution.　　The Perfect Balance of Wide Voltage Support, Low Power, and Fast Wake-up Time　　The GD32C231 series delivers exceptional power flexibility and energy efficiency, supporting a wide operating voltage range from 1.8V to 5.5V and a broad temperature range from -40°C to 105°C. This makes it highly adaptable for deployment in harsh and demanding environments. Featuring multiple power management modes, the device consumes as little as 5μA in deep sleep mode and offers ultra-fast 2.6μs wake-up time - achieving an optimal balance between low power consumption and real-time performance. These capabilities make the GD32C231 ideal for battery-powered and portable applications.　　Reliable Operation for Safety-Critical Applications　　Engineered for reliability, the GD32C231 provides robust ESD protection - meeting 8kV contact discharge and 15kV air discharge standards. Full ECC error correction is applied across Flash and SRAM memory, helping to prevent data corruption. An integrated hardware CRC module further enhances data transmission integrity. These features ensure the MCU performs reliably in safety-critical environments such as industrial automation and automotive electronics.　　Highly Integrated Peripherals for Flexible Design　　The GD32C231 series integrates a comprehensive set of peripherals, significantly enhancing system integration and design flexibility:　　A 12-bit ADC with 13 external channels and 2 internal comparators for precise analog signal measurement.　　Up to 4 general-purpose 16-bit timers and 1 advanced 16-bit timer for versatile time-based operations.　　2 high-speed SPI interfaces (including quad QSPI at 24Mbps), 2 I²C interfaces (supporting Fast Mode+ at 1Mbit/s), and 3 UARTs (up to 6Mbps) for robust serial communication.　　An integrated 3-channel DMA controller and 1 I²S interface for efficient peripheral data handling.　　With support for up to 45 GPIOs in a 48-pin package, the GD32C231 offers excellent expandability for complex designs. These rich peripheral resources empower the MCU to meet the demands of a wide range of applications - from consumer electronics to industrial control systems - with ease and reliability.　　Full-Stack Ecosystem Support for Efficient Development　　The GD32C231 series is backed by a comprehensive development ecosystem designed to accelerate product design and time-to-market. Standard software libraries and resources are readily available on GigaDevice's official website.　　To support developers throughout the entire development cycle, GigaDevice provides extensive documentation, including datasheets, user manuals, hardware design guidelines, application notes, and porting references - enabling rapid onboarding for both hardware and software development. A complete SDK firmware package is also offered, featuring rich sample code and development board resources that cover everything from low-level drivers to advanced applications.　　The GD32 MCU family natively supports FreeRTOS, offering developers a lightweight, open-source, and high-efficiency real-time operating system. To streamline development even further, GigaDevice offers the GD32 Embedded Builder IDE - its proprietary development environment that integrates graphical configuration and intelligent code generation, reducing design complexity. The GD32 All-In-One Programmer supports essential Flash operations such as programming, erasing, reading, and option byte configuration. Meanwhile, the GD-Link debugger provides dual-mode SWD/JTAG support with plug-and-play functionality for a seamless debugging experience. GigaDevice also collaborates closely with third-party programming tool providers to offer customers a wide range of programming and debugging options.　　Additionally, the GD32C231 series is fully compatible with major international toolchains including Arm® Keil, IAR Embedded Workbench, and SEGGER Embedded Studio, ensuring flexibility across various development platforms. For typical use cases, GigaDevice provides robust application solutions and reference designs - helping developers shorten design cycles, simplify product validation, and accelerate the path to mass production.

Key word：

GigaDevice

Release time：2025-07-10 14:22 reading：370 Continue reading>>

Trade news

Murata Unveils First High-Frequency XBAR Filter for Next-Gen Networks

　　Murata Manufacturing Co., Ltd. has announced the mass production and commercial shipment of the world’s first*1 high-frequency filter using XBAR technology*2. Developed by combining Murata’s proprietary Surface Acoustic Wave (SAW) filter expertise with XBAR technology from Murata's subsidiary Resonant Inc., it enables the extraction of desired signals while achieving both low insertion loss and high attenuation. These features are critical for the latest wireless technologies, including 5G, Wi-Fi 6E, Wi-Fi 7, and emerging 6G technologies.　　The demand for reliable high-frequency communications continues to grow in response to the widespread deployment of 5G and the future development of 6G. Simultaneously, wireless local-area network (WLAN) standards such as Wi-Fi 6E and Wi-Fi 7 are expanding into higher frequency domains to accommodate ultra-fast data rates. Filters used in these applications must address key challenges, such as preventing out-of-band interference, maximizing system battery performance, and meeting strict space limitations. Traditional approaches using Low Temperature Co-Fired Ceramic (LTCC) or conventional Bulk Acoustic Wave (BAW) filters often fall short in these performance areas.　　Murata’s new XBAR-based filter addresses these limitations by achieving high attenuation performance while maintaining a wide bandwidth and low signal loss. The XBAR structure itself excites bulk acoustic waves using comb-shaped electrodes and a piezoelectric single-crystal thin film, enabling performance beyond the reach of conventional filter structures. It effectively removes high-frequency interference, even in bands above 3 GHz, allowing for clearer signal detection and better performance, contributing to high-speed, high-capacity, and high-quality wireless communication.　　Key performance parameters include a passband of 5150–7125 MHz, a typical insertion loss of 2.2 dB, and a typical return loss of 17 dB. Typical attenuation figures are 11 dB at 4800–5000 MHz, 28 dB at 3300–4800 MHz, 27 dB at 7737–8237 MHz, and 26 dB at 10300–14250 MHz.　　The new filter is targeted at devices with embedded wireless functionality, including smartphones, wearables, notebook PCs, and communication gateways, offering an optimal balance of performance and cost efficiency. Murata will continue to drive innovation in filter technologies to support the evolution of wireless communications, and expects this architecture to scale further, with future product generations capable of operating effectively in ultra-high frequency bands above 10GHz.　　Notes　　*1According to Murata research as of July 7, 2025.　　*2XBAR technology: Murata’s proprietary filter structure that excites bulk acoustic waves using comb-shaped electrodes and piezoelectric single-crystal thin films.

Key word：

Murata

Release time：2025-07-10 14:15 reading：294 Continue reading>>

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Murata Begins World’s First Mass Production of 47µF Multilayer Ceramic Capacitor in 0402-inch Size

　　Murata Manufacturing Co., Ltd. has begun the world’s first mass production of the 0402-inch size (1.0 × 0.5 mm) multilayer ceramic capacitors (MLCC) with a capacitance of 47µF*. The new product line, available in two variants with different temperature characteristics, is designed to advance MLCC miniaturization and enhance customer system performance.　　In recent years, high-performance IT solutions, such as those used in AI servers and data centers, have seen rapid growth. Due to the often high component density demanded by these devices, optimized component placement within limited PCB areas is paramount. As a result, there is increasing demand for capacitors that offer both miniaturization and higher capacitance, along with high reliability under high-temperature conditions caused by heat generated from PCBs and integrated circuits (ICs).　　In response to these requirements, Murata has utilized its proprietary technologies in ceramic dielectric layers and internal electrode miniaturization to facilitate the world’s first mass production of this innovative 47µF product in the compact 0402-inch size. Compared to Murata’s conventional 0603-inch size product with the same capacitance, this new capacitor reduces mounting area by approximately 60%. Additionally, it delivers about 2.1 times the capacitance of Murata’s previous 22µF product in the same 0402-inch size.　　The MLCC is available in two variants – the X5R (EIA) GRM158R60E476ME01 with an operating temperature range of -55 to +85°C, and the X6S (EIA) GRM158C80E476ME01 with an operating temperature range of -55 to +105°C. The ability to operate in environments up to 105°C, makes the X6S variant well-suited for placement near ICs, thereby contributing to improved device performance and integration. Both devices feature a ±20% tolerance and rated voltage of 2.5Vdc.　　Murata is committed to advancing miniaturized capacitors with higher capacitance and improved high-temperature reliability to meet evolving market demands. These innovations not only support the ongoing miniaturization and functional enhancement of electronic devices but also contribute to lower material usage and increased production efficiency per unit, ultimately helping reduce power consumption at Murata’s factories and lessen environmental impact.　　For inquiries regarding this product, please contact us.　　Notes　　*Based on Murata research as of July 9, 2025.

Key word：

Murata

Release time：2025-07-10 14:13 reading：318 Continue reading>>

model	brand	Quote
BD71847AMWV-E2	ROHM Semiconductor
CDZVT2R20B	ROHM Semiconductor
TL431ACLPR	Texas Instruments
RB751G-40T2R	ROHM Semiconductor
MC33074DR2G	onsemi

model	brand	To snap up
BP3621	ROHM Semiconductor
STM32F429IGT6	STMicroelectronics
TPS63050YFFR	Texas Instruments
IPZ40N04S5L4R8ATMA1	Infineon Technologies
ESR03EZPJ151	ROHM Semiconductor
BU33JA2MNVX-CTL	ROHM Semiconductor

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