SanDisk Goes Beyond HBF: Patent Bonds Processor onto NAND Tile, with HBM Stacks on Shared Interposer
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SanDisk Goes Beyond HBF: Patent Bonds Processor onto NAND Tile, with HBM Stacks on Shared Interposer

　　While SanDisk is speeding up the development of High Bandwidth Flash (HBF), a next-generation architecture that vertically stacks NAND, the company is also advancing additional memory concepts aimed at addressing structural capacity constraints.　　According to a U.S. patent (US 12,430,274 B2) filed and published by SanDisk earlier, the proposed design integrates a multi-core processor directly onto a CBA (CMOS Bonded to Array) memory tile — which itself combines a large NAND flash array with a CMOS logic layer.　　The integrated stack is then mounted on an interposer, with stacks of HBM semiconductor dies affixed around one or more sides of the combined stack, SanDisk notes.　　Rationale Behind the Design　　The design rationale behind SanDisk’s approach, as noted by Wccftech, is partly driven by the inherent limitations of HBM, particularly its relatively constrained capacity, as well as the challenges that HBF has yet to fully address, including latency, power efficiency, and system-level integration complexity.　　To overcome HBM’s capacity ceiling, SanDisk previously introduced its HBF architecture, which adopts a similar concept to HBM by vertically stacking multiple layers of NAND flash and connecting them via through-silicon vias (TSVs) to form a unified memory stack, according to Wccftech.　　While current HBM solutions typically offer 32–64GB per stack, HBF is designed to scale significantly higher, with reported capacity reaching up to 4TB. According to SanDisk, HBF is capable of closely matching HBM’s bandwidth while delivering 8-16x the capacity of HBM at a similar cost.　　However, despite NAND offering higher capacity at a lower cost, Wccftech also points out that it is positioned further from the compute die, resulting in slower data access compared to DRAM-based architectures. In response, SanDisk’s latest patent, as highlighted by the report, proposes a 3D stacking design in which a NAND flash tile, built using a CBA structure, is positioned beneath a compute tile such as an AI accelerator or GPU.　　Under this configuration, HBM DRAM would still be integrated on the same interposer, but would serve a distinct role within the overall memory-compute hierarchy, according to Wccftech. As highlighted by the report, this architecture allows HBM to handle immediate, high-speed memory operations, while the NAND flash layer within the memory tile is used for read/write-intensive workloads and large-scale data storage.
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Release time：2026-06-23 10:58 reading：513 Continue reading>>
Murata Launches Digital Output SMD Pyroelectric Infrared Sensor for Low Power Applications
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Murata Launches Digital Output SMD Pyroelectric Infrared Sensor for Low Power Applications

　　Murata Manufacturing Co., Ltd has launched a digital output SMD pyroelectric infrared sensor, IRS-D200ST00R1, with low power consumption and is already in mass production.　　In recent years, the use of IoT technology in smart homes and smart buildings has increased convenience, safety, and power saving within living spaces and facilities. Because of this, the demand for wireless communication units equipped with human detection functions capable of sensing movement in real time is also increasing to realize more efficient and comfortable environments. One of the key technologies to enable the motion detection function is a pyroelectric infrared sensor. Products which communicate wirelessly require long-term stable operation with reduced battery replacement or charging, thus creating a strong need for pyroelectric infrared sensors that can detect human movement while extending battery life. Additionally, to increase design flexibility inside these products, space-saving measures are essential, driving demand for compact infrared sensors., space-saving measures are essential, driving demand for compact infrared sensors.　　In response, we developed this product using proprietary pyroelectric ceramic technology to achieve low power consumption and a compact size. Even when continuously operating the human detection function, power consumption is kept low, and the sensor includes an interrupt function that activates the microcontroller only when a change is detected, contributing to extended battery life. Furthermore, the compact size enables space-saving, and the adoption of the digital I2C interface simplifies design during development.　　The main features of this product include contributing to overall system power reduction through low power consumption and interrupt functionality, space-saving due to its small and low-profile SMD package, ease of design enabled by built-in amplifier and ADC with digital output (I2C), reduction of false detections and stable operation thanks to high signal-to-noise ratio and EMI noise resistance, Also enabling process cost reduction through reflow compatibility.　　Key specifications are a dual element electrode size of 0.08 × 0.02 inch (2.0 × 0.5 mm), an overall size of 0.24 × 0.24 × 0.10 inch (6.0 × 6.0 × 2.6 mm), typical sensitivity of 19.5 mV, element height of 0.065 inch (1.65 mm), field of view of ±55° horizontal and ±42° vertical, supply voltage from 1.8 to 3.3 V, typical current consumption of 8 µA, and an I2C interface.*
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Release time：2025-09-15 14:09 reading：1073 Continue reading>>
Murata Manufacturing Co., Ltd. expands lineup of isolated DC-DC converters for PoE IEEE802.3af
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Murata Manufacturing Co., Ltd. expands lineup of isolated DC-DC converters for PoE IEEE802.3af

　　Murata Manufacturing Co., Ltd. has expanded its lineup of isolated DC-DC converters for PoE*1 with the launch of an IEEE802.3af-compliant isolated DC-DC converter for PD*2 (hereinafter, ‘the product’). Murata has already started mass production of the product, and samples are available upon request.　　*1PoE: Power over Ethernet. A technology that enables power supply over LAN cables used to build networks.　　*2PD: Powered Device. A device that receives power in a PoE system.　　PoE technology enables power supply over LAN cables used to build networks, improving installation flexibility, and reducing costs. In recent years, network-enabled devices such as security cameras and biometric authentication equipment have increasingly adopted PoE technology. Against this backdrop, demand for compact power modules for PoE-compatible devices is growing. In particular, biometric authentication devices typically require around 10 W of power, making the IEEE802.3af standard, which supports up to 15 W, an ideal match.　　Accordingly, Murata has developed this product compliant with IEEE802.3af. The product’s compact, low-profile design (1.02×0.58×0.27 inches (26×14.8×6.8mm)) enhances layout flexibility on circuit boards. It is mainly suited for camera modules and biometric authentication devices that require space-saving and low-noise characteristics, and contributes to the miniaturization of other communication devices.　　Key features　　Isolated DC-DC converter module compliant with IEEE802.3af Class specifications　　Compact and low-profile (1.02×0.58×0.27 inches (26×14.8×6.8mm)) for high layout flexibility　　Wide operating temperature range (-40°C to +85°C) for versatile applications　　Applications　　IEEE802.3af-compliant devices including wireless access points, biometric authentication devices, security cameras, camera modules, IP phones, and audio speakers　　Specifications
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Release time：2025-09-08 15:11 reading：1019 Continue reading>>
ROHM Group Company SiCrystal and STMicroelectronics Expand Silicon Carbide Wafer Supply Agreement
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ROHM Group Company SiCrystal and STMicroelectronics Expand Silicon Carbide Wafer Supply Agreement

　　Kyoto, Japan and Geneva, Switzerland, April 22, 2024 – ROHM (TSE: 6963) and STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, announced today the expansion of the existing multi-year, long-term 150mm silicon carbide (SiC) substrate wafers supply agreement with SiCrystal, a ROHM group company. The new multi-year agreement governs the supply of larger volumes of SiC substrate wafers manufactured in Nuremberg, Germany, for a minimum expected value of $230 million.　　Geoff West, EVP and Chief Procurement Officer, STMicroelectronics, commented “This expanded agreement with SiCrystal will bring additional volumes of 150mm SiC substrate wafers to support our devices manufacturing capacity ramp-up for automotive and industrial customers worldwide. It helps strengthen our supply chain resilience for future growth, with a balanced mix of in-house and commercial supply across regions”.　　“SiCrystal is a group company of ROHM, a leading company of SiC, and has been manufacturing SiC substrate wafers for many years. We are very pleased to extend this supply agreement with our longstanding customer ST. We will continue to support our partner to expand SiC business by ramping up 150mm SiC substrate wafer quantities continuously and by always providing reliable quality”. said Dr. Robert Eckstein, President and CEO of SiCrystal, a ROHM group company.　　Energy-efficient SiC power semiconductors enable electrification in the automotive and industrial sectors in a more sustainable way. By facilitating more efficient energy generation, distribution and storage, SiC supports the transition to cleaner mobility solutions, lower emissions industrial processes and a greener energy future, as well as more reliable power supplies for resource-intensive infrastructure like data centers dedicated to AI applications.　　About STMicroelectronics　　At ST, we are over 50,000 creators and makers of semiconductor technologies mastering the semiconductor supply chain with state-of-the-art manufacturing facilities. An integrated device manufacturer, we work with more than 200,000 customers and thousands of partners to design and build products, solutions, and ecosystems that address their challenges and opportunities, and the need to support a more sustainable world. Our technologies enable smarter mobility, more efficient power and energy management, and the wide-scale deployment of cloud-connected autonomous things. We are committed to achieving our goal to become carbon neutral on scope 1 and 2 and partially scope 3 by 2027.　　Further information can be found at www.st.com .　　About ROHM　　Founded in 1958, ROHM provides ICs and discrete semiconductor devices characterized by outstanding quality and reliability for a broad range of markets, including automotive, industrial equipment and consumer market via its global development and sales network.　　In the analog power field, ROHM proposes the suitable solution for each application with power devices such as SiC and driver ICs to maximize their performance, and peripheral components such as transistors, diodes, and resistors.　　Further information on ROHM can be found at www.rohm.com .　　About SiCrystal　　SiCrystal, a ROHM group company, is one of the global market leaders for monocrystalline silicon carbide wafers. SiCrystal’s advanced semiconductor substrates provide the basis for the highly efficient use of electrical energy in electric vehicles, fast charging stations, renewable energies and in various fields of industrial applications.　　Further information on SiCrystal can be found at www.sicrystal.de .
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Release time：2024-04-24 11:10 reading：2044 Continue reading>>
CG Power and Industrial Solutions Limited, Renesas and Stars Microelectronics, to Jointly Build Outsourced Semiconductor Assembly and Test Facility in India
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CG Power and Industrial Solutions Limited, Renesas and Stars Microelectronics, to Jointly Build Outsourced Semiconductor Assembly and Test Facility in India

　　CG Power and Industrial Solutions Limited (“CG”), a part of Tube Investments of India Limited and the Murugappa Group; Renesas Electronics Corporation, a premier supplier of advanced semiconductor solutions; and Stars Microelectronics (Thailand) Public Co. Ltd (“Stars Microelectronics”), a Thailand-based Outsourced Semiconductor Assembly and Test (OSAT) provider; had recently signed a Joint Venture Agreement (JVA) to establish a Joint Venture (JV) to build and operate an OSAT facility in India. The Union Cabinet, chaired by Prime Minister Shri Narendra Modi, approved the project of the JV under India’s Semiconductor scheme on February 29, 2024.　　The JV brings together unique capabilities of the partners with a vision to “Make in India for the World.” CG, with around 86 years of manufacturing expertise, is keen to build semiconductor capabilities and ecosystem in India. Renesas, a leading semiconductor company headquartered in Japan, will provide advanced semiconductor technology and expertise. Stars Microelectronics, a Thai based OSAT, will provide both technology for legacy packages and training and enablement.　　The JV will be 92.3% owned by CG, with Renesas and Stars Microelectronics each holding equity capital of approximately 6.8% and 0.9%, respectively. The JV plans to invest INR 7,600 crores over a five-year period, which will be financed through a mix of subsidies, equity, and potential bank borrowings as required.　　The JV will set up a state-of-the-art manufacturing facility in Sanand, Gujarat, with a capacity that will ramp up to 15 million units per day. The JV will manufacture a wide range of products – ranging from legacy packages such as QFN and QFP to advanced packages such as FC BGA, and FC CSP. The JV will cater to industries such as automotive, consumer, industrial, 5G, to name a few.　　Commenting on this new venture, Mr. S. Vellayan, Chairman, CG Power and Industrial Solutions Limited, said, “CG’s entry into the semiconductor manufacturing marks a strategic diversification for us. Our partners, Renesas and Stars Microelectronics, will make our learning curves steeper and help us focus on innovation and excellence.　　This is a very exciting phase for the entire nation, and we are very keen to build out India’s semiconductor capability and ecosystem.”　　Mr. Natarajan Srinivasan, Managing Director, CG Power and Industrial Solutions Limited, added, “It is a matter of great pride for CG to implement this project of National importance.”　　Commenting on the partnership, Mr. Hidetoshi Shibata, CEO of Renesas said, “India is a critical part of Renesas’ business. We value its innovative landscape and robust potential growth and are committed to accelerating our investment in India. By partnering with the Murugappa Group and Stars Microelectronics, we will bolster India’s semiconductor ecosystem and address the growing semiconductor demand for the customers worldwide.”　　Mr. Prompong Chaikul, Chairman of Executive Committee of Stars Microelectronics (Thailand) Public Co., Ltd added, "We are deeply honored to join forces in this thrilling venture. Leveraging our expertise and experience in OSAT, we are committed to providing robust support to ensure the success of this project in India."　　About CG Power and Industrial Solutions Limited　　CG Power and Industrial Solutions Limited is an engineering conglomerate headquartered in Mumbai, India. The Company is a leader in the Electrical Engineering Industry and has two business lines—Industrial Systems and Power Systems. It manufactures Traction Motors, Propulsion systems, Signaling Relays etc., for the Indian Railways, and wide range of Induction Motors, Drives, Transformers, Switchgears, and other allied products for the Industrial and Power sectors. Recently, the Company also made a foray into the business of Consumer Appliances such as Fans, Pumps and Water Heaters.　　The Company has world-class manufacturing plants across 9 locations in India and one in Sweden, and a Pan India network of 4 Regional and 15 Branch offices, with around 3000 employees. The Company’s consolidated revenue for FY23 was Rs 6,973 crores (USD 838 million).　　The Company continues to excel and maintain its leadership position across its businesses, backed by its outstanding expertise, customer-centric approach, and enhanced focus on innovation and sustainability.　　Since November 2020, the Company has become a part of the renowned Murugappa Group.　　About Murugappa Group　　A 123-year-old conglomerate with presence across India and the world, the INR 742 billion Murugappa Group has diverse businesses in agriculture, engineering, financial services and more.　　The Group has 9 listed companies under its umbrella — Carborundum Universal Limited, CG Power & Industrial Solutions Limited, Cholamandalam Financial Holdings Limited, Cholamandalam Investment & Finance Company Limited, Cholamandalam MS General Insurance Company Limited, Coromandel International Limited, EID Parry (India) Limited, Shanthi Gears Limited, Tube Investments of India Limited and Wendt India Limited. Brands such as Ajax, Hercules, BSA, Montra, Montra Electric, Mach City, Gromor, Paramfos, Parry’s are part of the Group’s illustrious stable.　　Abrasives, technical ceramics, electro minerals, electric vehicles, auto components, fans, transformers, signaling equipment for railways, bicycles, fertilizers, sugar, tea and several other products make up the Group’s business interests.　　Guided by the five lights — integrity, passion, quality, respect and responsibility — and a culture of professionalism, the Group has a workforce of over 73,000 employees.　　About Renesas Electronics Corporation　　Renesas Electronics Corporation  empowers a safer, smarter and more sustainable future where technology helps make our lives easier. The leading global provider of microcontrollers, Renesas combines our expertise in embedded processing, analog, power and connectivity to deliver complete semiconductor solutions. These Winning Combinations accelerate time to market for automotive, industrial, infrastructure and IoT applications, enabling billions of connected, intelligent devices that enhance the way people work and live.
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Release time：2024-03-05 13:10 reading：4088 Continue reading>>
STMicroelectronics to Invest EUR 5 Billion in New SiC Wafer Fab
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STMicroelectronics to Invest EUR 5 Billion in New SiC Wafer Fab

　　STMicroelectronics, following its EUR 7.5 billion wafer fab project with GlobalFoundries in Crolles, France. is set to invest EUR 5 billion in building a new SiC super semiconductor wafer fab in Catania, Sicily, Italy. The fab in Italy will specialize in producing SiC chips, a pivotal technology for electric vehicles with substantial growth potential, according to French media L’Usine Nouvelle on November 26th,　　STMicroelectronics competitively plans to transition to 8-inch wafers starting from 2024. The company will integrate Soitec’s SmartSiC technology to enhance efficiency and reduce carbon emissions. Simultaneously, STMicroelectronics aims to increase capacity, achieve internal manufacturing, and collaborate with Chinese firm Sanan Optoelectronics to raise SiC chip-related revenue from the expected USD 1.2 billion in 2023 to USD 5 billion by 2030.　　On June 7th earlier this year, STMicroelectronics and Sanan Optoelectronics announced a joint venture to establish a new 8-inch SiC device fab in Chongqing, China, with an anticipated total investment of USD 3.2 billion.　　To ensure the successful implementation of this extensive investment plan, Sanan Optoelectronics said to utilize its self-developed SiC substrate process to construct and operate a new 8-inch SiC substrate fab independently.　　TrendForce: over 90% SiC market share by major global players　　According to TrendForce, the SiC industry is currently dominated by 6-inch substrates, holding up to 80% market share, while 8-inch substrates only account for 1%. Transitioning to larger 8-inch substrates is a key strategy for further reducing SiC device costs.　　8-inch SiC substrates offer significant cost advantages than 6-inch substrates. The industry’s major players in China, including SEMISiC, Jingsheng Mechanical & Electrical Co., Ltd. (JSG), Summit Crystal, Synlight Semiconductor, KY Semiconductor, and IV-SemiteC, are advancing the development of 8-inch SiC substrates. This shift from the approximately 45% of total production costs associated with substrates is expected to facilitate the broader adoption of SiC devices and create a positive cycle for major companies.　　Not only Chinese companies but also international semiconductor giants like Infineon Technologies and Onsemi are actively vying for a share of the market. Infineon has already prepared the first batch of 8-inch wafer samples in its fab and plans to convert them into electronic samples soon, with mass production applications scheduled before 2030. International device companies like Onsemi and ROHM have also outlined development plans for 8-inch SiC wafers.　　Currently, major companies hold over 90% of the market share, intensifying competition. A slowdown in progress could provide opportunities for followers. According to TrendForce, the market share of the top 5 SiC power semiconductor players in 2022 was dominated by STMicroelectronics (36.5%), Infineon (17.9%), Wolfspeed (16.3%), Onsemi (11.6%), and ROHM (8.1%), leaving the remaining companies with only 9.6%.
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Release time：2023-11-30 10:53 reading：4421 Continue reading>>
What does a power management IC do
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What does a power management IC do

　　What is the meaning of power management?In the domain of electronics, Power Management IC pertains to the astute administration and equitable dispensation of electric energy within a contraption or system. This entails the optimization of energy utilization to protract battery lifespan, mitigate thermal emanation, and ensure steadfast and dependable functionality. Inclusion of this doctrine is indispensable in devices such as smartphones, laptops, Internet of Things (IoT) apparatuses, and even in more expansive complexes akin to data centers.　　What does a power management IC do?　　A Power Management IC or power management integrated circuit, abbreviated as PMIC, constitutes an integrated semiconductor circuit engineered with the express purpose of orchestrating and standardizing electric power within electronic gadgets. Power management ICs are expressly tailored to undertake an extensive gamut of functions encompassing:　　1.Voltage Regulation: power management ICs oversee the regulation of the voltage provisioned to sundry components within a contrivance, thereby warranting that these components receive requisite voltage levels, a sine qua non for unimpeachable operation.　　2.Current Administration: They govern the flux of electric current, thwarting incidents of overburden or underpowering that could result in component jeopardy, whilst concurrently optimizing efficacy.　　3.Battery Replenishment: Power Management ICs orchestrate the process of recharging batteries in portable contraptions, safeguarding a secure and productive recharging process.　　4.Power Sequencing: Their ambit extends to monitoring the initiation and shutdown sequences of diverse constituents to obviate power surge occurrences and to vouchsafe a constancy of operation.　　5.Thermal Oversight: Within the realm of PMICs, you may encounter the inclusion of thermal supervisory and control attributes devised to avert excessive heating of components.　　6.Energy Efficacy: They endeavor to fine-tune energy consumption, thus extending the operational duration of batteries and mitigating energy wastage.　　7.Fault Safeguard: PMICs incorporate mechanisms for discerning and acting upon faults, such as instances of overvoltage, overcurrent, and overheating, thus erecting bulwarks to shield the contraption and its operators.　　What are the types of power management ICs?power management integrated circuits adopt diverse forms tailored for specific applications. Prevalent types encompass:　　1.Voltage Regulator PMICs: These PMICs are primarily dedicated to the oversight of voltage regulation for diverse contraption components, serving as custodians of unfluctuating operation.　　2.Battery Management PMICs: Custom-built for gadgets reliant on rechargeable batteries, these PMICs are stewards of battery replenishment, discharge, and the perpetual surveillance of battery well-being.　　3.LED Driver PMICs: They are tasked with overseeing luminosity and power provisioning to Light Emitting Diodes (LEDs), a task of particular relevance in applications involving screens and lighting systems.　　4.Power Supply PMICs: In intricate systems such as data centers and telecommunications installations, these Power Management ICs furnish power transformation and diffusion.　　What are the applications of PMIC?　　power management integrated circuits traverse a broad array of employment areas encompassing but not tethered to:　　1.Smartphones and Tablets: Within these devices, PMICs are the architects of voltage control for microprocessors, displays, and sensors, in a quest to optimize battery existence and operational efficiency.　　2.Laptops and Personal Computers: They exert control over power allocation and battery replenishment, culminating in an enhanced end-user experience.　　3.IoT Instruments: PMICs facilitate the energy-efficient performance of gadgets such as intelligent thermostats, wearables, and remote sensors.　　4.Automotive Electronics: Automotive applications bank on PMICs to administer power supply to a plethora of automotive constituents, including entertainment systems and safety apparatuses.　　5.Industrial Machinery: Power Management ICs are enablers of reliable power provisioning in the realm of machinery and control systems underpinning industrial operations.　　6.Renewable Energy Schemes: These ICs oversee the conversion and administration of power in domains like photovoltaic inverters and wind turbines.　　What are the components of a PMIC?　　A paradigmatic PMIC embodies several pivotal constituents, inclusive of:　　1.Voltage Regulators: These components underwrite the sustenance of voltage steadiness across sundry junctures of the apparatus.　　2.Current Limiters: Current-limiting units are in place to preclude superfluous electric current flow, thus endowing protection to components.　　3.Control Logic: Control logic machinery is entrusted with the chore of supervising power sequencing, the detection of anomalies, and sundry other functions.　　4.Battery Administration Circuitry: In contrivances that derive energy from batteries, PMICs integrate circuitry dedicated to battery replenishment and monitoring.　　5.Communication Interfaces: Particular Power Management ICs feature communication interfaces like I2C or SPI, thereby affording users the facility for configuration and observation.　　What are the features of a PMIC?　　power management ICs are furnished with an amalgam of characteristics bespoke to their targeted domains. Some quintessential characteristics encompass:　　1.Multitudinous Output Channels: It is commonplace for power management ICs to embrace numerous output channels with variegated voltage and current stipulations, facilitating the power provision to manifold components.　　2.Programmability: An assemblage of PMICs boasts programmability, bestowing upon the user the prerogative to tailor Power Management IC parameters, a fact that engenders versatility.　　3.Efficiency Enhancement: These PMICs integrate mechanisms such as voltage modulation, dynamic voltage-frequency modulation (DVFS), and power-conservation modes in their design to elevate overall efficiency.　　4.Fault Identification and Safeguard: PMICs are proficient in ferreting out faults and instigating measures to avert devastation of the contraption or system.　　5.Thermal Oversight: In select PMICs, temperature gauges and thermal management functionalities are incorporated to avert thermal inundation.　　How do I choose a PMIC?　　Electing an appropriate Power Management IC for your particular application necessitates a meticulous consideration of several elements:　　1.Power Prerequisites: It is imperative to ascertain the voltage and current requisites of the apparatus’s constituent parts.　　2.Efficiency: The efficacy of the PMIC in the domain of power conversion and distribution warrants scrutiny.　　3.Programmability: The exigency for a programmable PMIC is contingent on the requisite for customization and adaptability within the application.　　4.Fault Defenses: Appraising the extent of fault containment mandated by the system is a judicious practice.　　5.Package Dimensions: The physical constraints and design configuration of the contraption must be factored in.
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Release time：2023-10-08 13:39 reading：2405 Continue reading>>
How the touch chip works,How many chips does the touch chip have
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How the touch chip works,How many chips does the touch chip have

　　A touch chip is a microprocessor that can sense human touch and can convert human touch operations into electrical signal input that can be read by a computer. It is widely used in various digital devices such as mobile phones, tablets, and smart watches, and has become an indispensable part of modern electronic products.　　“Touch” specifically refers to single-point or multi-point touch technology; the chip is an IC, which refers to a metal or non-metal sheet whose end surface can be integrated with the friction lining and friction material layer, and a circuit module that integrate a variety of electronic components on a silicon board to achieve a specific function. It is the most important part of electronic equipment, responsible for computing and storage functions. The application scope of integrated circuits covers almost all electronic equipment for military and civilian. A small piece of silicon containing integrated circuits, often is a part of a computer or other device.　　Touch chip, also called touch IC. “Touch” refers to single or multi-touch technology. The touch chip is located between the touch sensor and the PC/or embedded system controller. The chip can be mounted on a controller board inside the system or placed on a flexible printed circuit (FPC) attached to the glass touch sensor. The chip extracts information from the touch sensor and converts it into information that the PC or embedded system controller can understand. Most touch chips now use the capacitive effect, that is, the proximity of the human body will increase the capacitance, thereby changing the original oscillation frequency or changing the charge and discharge time of the RC circuit.　　How the touch chip works　　This is achieved by sensing capacitance changes caused by human touch. When the human body approaches the touch screen surface, it will cause the capacitance between the touch screen and the human body to change, and a new electric field distribution will be formed. The chip will calculate the specific touch position and operation gesture based on this capacitance change. This process requires the use of a series of advanced sensor technologies, signal processing, algorithm optimization and other technologies to achieve high precision and sensitivity.　　Touch chips basically use four multi-touch technologies　　1. “LLP (laser light plane) technology” mainly uses infrared laser equipment to project infrared rays onto the screen. When the screen is blocked, infrared light is reflected, and a camera under the screen captures where the reflection goes. After systematic analysis, a response can be made.　　2. “FTIR (Frustrated Total Internal Reflection) technology” will add LED light to the interlayer of the screen. When the user presses the screen, the light in the interlayer will cause different reflection effects. The sensor will receive the changes in light and capture the point of force application to react.　　3. “ToughtLight technology” uses projection method to project infrared rays onto the screen. When the screen is blocked, infrared light is reflected, and a camera under the screen captures where the reflection goes. After systematic analysis, a response can be made.　　4. “Optical Touch technology”, which has a lens at each end of the top of the screen to receive the user’s gesture changes and the position of the touch point. After calculation, it is converted into coordinates and then reacted.　　How many chips does the touch chip have?1. Capacitive touch chip: Uses the capacitive principle to detect charge changes on the touch screen, with high accuracy, fast response, and supports multi-touch.　　2. Resistive touch chip: It uses the principle of resistance to detect voltage changes on the touch screen. It is cheap, but does not support multi-touch, has low accuracy and short service life.　　3. Acoustic wave touch chip: Uses acoustic wave sensors to detect sound reflections on the touch screen, which can support non-contact touch, but is sensitive to environmental noise and other interference.　　4. Optical touch chip: Using optical sensors to detect optical changes on the touch screen has high accuracy, but is expensive and not suitable for large-scale applications.　　5. Pressure-sensitive touch chip: Uses a pressure-sensitive sensor to detect pressure changes on the screen and supports multi-touch, but the price is higher.
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Release time：2023-09-21 16:42 reading：2851 Continue reading>>
AMEYA360 VIETNAM Electronics Production Equipment and Microelectronics Industry Exhibition NEPCON VIETNAM successfully concluded
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AMEYA360 VIETNAM Electronics Production Equipment and Microelectronics Industry Exhibition NEPCON VIETNAM successfully concluded

　　From September 6th to 8th, 2023, the three-day 2023 VIETNAM Electronic Production Equipment and Microelectronics Industry Exhibition NEPCON VIETNAM was held grandly at Hanoi International Exhibition Center, Vietnam. The exhibition brought together electronic component material and production equipment manufacturers and agents, suppliers and visitors from around the world, making it an important event in the field of Vietnam’s electronics manufacturing industry.　　The exhibition covered a wide range of areas, including raw materials, equipment, systems and services used in printed circuit board , semiconductor packaging, production, design, testing and assembly. It also included microelectronic components such as active/passive components, electromechanical components, and electronic processing services including surface mount technology equipment and services, test and measurement equipment and services, electronic product manufacturing services, electronic components and mobile phone components and other fields. In recent years, Vietnam has become one of the latest advanced electronics product manufacturing centers in ASEAN, attracting numerous excellent electronic companies to establish their presence.　　AMEYA360 as a professional electronic components agent/distributor also participated in this exhibition. During the exhibition, AMEYA360 booth received a continuous flow of visitors seeking information and consultation. It attracted customers from different countries for discussion and exchanges. The team from AMEYA360 , with high spirits, warmly welcomed every visitor to the booth, providing professional and meticulous services to exhibition attendees, allowing customers to gain a deeper understanding of AMEYA360’s remarkable capabilities in the industry.　　Exhibition　　The exhibition was a showcase of our company’s strength on a global scale, as well as an opportunity to drive the development of the electronic component industry. We engaged in-depth exchanges with industry elites from around the world, learning from each other, and striving to provide more efficient and intelligent services for the global electronics manufacturing industry, thus promoting the overall advancement of the industry.　　From the initial preparation to the closing, from the past to the present, AMEYA360 has continuously working hard, staying true to its mission, and committed to pursuing excellent quality to create a great user experience. We value every opportunity to communicate, negotiate, and cooperate with each customer and sincerely appreciate your visits, trust, and support. In the future , AMEYA360 will continue to innovate and accelerate its development, driving the electronic industry’s supply chain to reduce costs and increase efficiency!
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Release time：2023-09-11 15:52 reading：3549 Continue reading>>
Panasonic Wins the Case Brought by Dyson Regarding Nanoe EH-NA0G Hair Dryer
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Panasonic Wins the Case Brought by Dyson Regarding Nanoe EH-NA0G Hair Dryer

　　Panasonic Corporation (Panasonic) announced today (April 27, 2023) that the Tokyo District Court (“the Court”) has rendered judgement (“the Judgement”) to dismiss all claims by Dyson KK (Dyson) relating to the June 9, 2022 case that Dyson brought against Panasonic regarding Panasonic’s EH-NA0G Hair Dryer (“the Case”).　　Dyson filed the Case, seeking an injunction against advertisement of Panasonic’s nanocare EH-NA0G Hair Dryer. Upon filing, Dyson officially stated that it was confident that hair dryer advertisements related to the effects of nanoe technology on hair were misleading to consumers, and submitted test results supporting this claim as evidence to the court.　　In today’s Judgement, the Court points out that the tests were conducted under inappropriate conditions and the results from them cannot be relied upon, and as such it could not conclude that the data proved Dyson’s claim that Panasonic’s advertisements were misleading to consumers. The Court concluded that Panasonic’s advertisements do not violate the Unfair Competition Prevention Act.　　Panasonic will continue to convey accurate information about the value of our nanocare Hair Dryer series to our customers in compliance with all relevant laws, regulations, and guidelines.
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