TAIYO YUDEN Solutions for Automotive UWB Design Challenges

　　RF Devices for Automotive UWB

　　Supporting the Evolution of Digital Keys

　　The adoption of UWB digital keys, which combine high-precision positioning with robust security, is accelerating rapidly. However, automotive UWB development faces three key technical challenges: compact footprint for high-density mounting, RF interference mitigation, and high reliability in harsh automotive environments.

　　TAIYO YUDEN provides RF devices featuring an ultra-compact form factor among the smallest in the industry and steep out-of-band noise attenuation. Enabled by our proprietary multilayer technology and rigorous automotive quality control, these solutions help resolve design challenges in next-generation mobility development.

　　Ultra-Compact Form Factor Among the Smallest in the Industry: 1608 Size (1.6 × 0.8 mm)

　　・Achieves an industry-leading compact footprint using proprietary multilayer ceramic technology, contributing to high-density mounting in automotive modules and enhancing antenna layout flexibility.

　　RF Interference Suppression via Steep Attenuation Characteristics

　　・Delivers both low insertion loss in the UWB band and steep out-of-band noise attenuation, ensuring stable operation in environments where multiple wireless systems coexist.

　　High Automotive Reliability Qualified to AEC-Q200

　　・Supports automotive system design and qualification through high manufacturing quality backed by fully integrated domestic production and PPAP compliance.

　　Explore our full product lineup and detailed specifications on the Product Introduction Page.

　　Technical details are available in our white paper.

　　▶Download White Paper

　　【Featured Automotive Solutions】

　　Explore our automotive components supporting the evolution of autonomous driving and ADAS.

　　Soft Termination MLCCs

　　Addresses reliability concerns such as board flexure cracking to ensure stable operation in harsh automotive environments.

　　Industry-leading High-Capacitance MLCCs for ADAS

　　3225 size / 220 µF among the highest capacitance products in the industry, contributing to advanced electronic system integration.

　　Conductive Polymer Hybrid Aluminum Electrolytic Capacitors (HTX-J/HVX-J Series)

　　Combines solid polymer and liquid electrolyte technologies to achieve high-voltage capability, high capacitance, and low ESR stability.