SK Chair Sees Memory Shortage Through 2030, Eyes Capacity Doubling and Stronger TSMC, Taiwan Ties

　　As next-gen HBM solutions has become a key focus at COMPUTEX amid surging AI demand, SK Group Chairman Chey Tae-won made a brief visit to the SK hynix booth on June 2 and spoke with the media. According to TechNews, Chey expects supply-demand tightness in the memory market to persist through 2030.

　　Notably, he also said SK will make full efforts to expand production under tight supply conditions, targeting a doubling of total wafer capacity over the next five years, the report adds.

　　Marking his first appearance at COMPUTEX, Chey noted that Taiwan has a highly complete AI supply chain and a strong partner ecosystem. As SK Group continues to expand its AI business, he stressed the need to deepen collaboration with more Taiwanese companies. Beyond TSMC, he said meetings with firms such as Foxconn and Asus are also part of this visit to better understand ongoing cooperation and explore ways to further strengthen partnerships, according to the report.

　　SK hynix and TSMC have a long-standing partnership, particularly in logic die integration as custom HBM solutions become an emerging industry trend. As previously reported by The Chosun Daily, SK hynix is expected to adopt a 10nm-class 6th-generation (1c) DRAM process for the core die in its HBM4E, paired with a logic die built on TSMC’s 3nm node. For HBM4 supplied to NVIDIA this year, the company is said to be using a 10nm-class 5th-generation (1b) DRAM core die alongside a logic die based on TSMC’s 12nm process.

　　Jensen Huang’s SK hynix Booth Visit Marks Another COMPUTEX Highlight

　　It is also wort noting that NVIDIA CEO Jensen Huang also visited the SK hynix booth at COMPUTEX 2026 on June 2, meeting SK Group Chairman Chey Tae-won for the second consecutive day, following a dinner meeting the previous evening. According to Chosun Biz, after his keynote the day before—where he directly identified SK hynix as a supplier of next-generation HBM4—Huang toured the exhibition floor and reviewed the company’s latest memory products.

　　During the visit, Huang joined Chey at the SK hynix booth to examine the showcased portfolio, including HBM4E wafers and chipset samples, which entered sampling at the end of last month, the report says. It also marked the first public unveiling of an HBM4E physical mock-up, according to Chosun Biz.