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Samsung Reportedly Develops Mobile HBM Packaging With Copper Pillars, Bandwidth Up 15%–30%

　　Samsung Electronics is reportedly developing a next-generation HBM packaging technology aimed at bringing high-performance on-device AI to mobile devices. According to ETNews, sources say the company is working on a “Multi Stacked FOWLP” technology that combines ultra-high-aspect-ratio copper pillars with FOWLP (Fan-Out Wafer Level Packaging) by advancing its existing VCS (Vertical Cu-post Stack) technology.　　The report notes that traditional mobile memory (LPDDR) packaging still relies on copper wire bonding. However, the technology is limited to roughly 128 to 256 I/O terminals, while also suffering from higher signal loss and lower thermal and power efficiency. To address these constraints, Samsung previously introduced its VCS (Vertical Cu-post Stack) technology, which arranges DRAM dies in a staircase-style stacked structure connected by copper pillars. The newly reported technology is viewed as a further evolution of this approach through the adoption of ultra-high-aspect-ratio copper pillars.　　More specifically, Samsung has increased the aspect ratio of copper pillars used in VCS packaging from 3–5:1 to 15–20:1, significantly boosting bandwidth, the report notes. However, copper pillars thinner than 10 micrometers become more vulnerable to bending and breakage. To address this issue, Samsung reportedly combined the design with an FOWLP process, which molds the chip and extends wiring outward to help support the copper pillars.　　The approach could enable more I/O terminals within the same area, potentially boosting bandwidth by 15% to 30% while increasing memory stack capacity by more than 1.5 times, the report adds.　　Commercialization Timeline Remains Unclear　　Meanwhile, the technology is still under development, making the timeline for mass production and commercialization unclear. However, the report says industry observers believe it could be adopted as early as a later version of the Exynos 2800 or the Exynos 2900.　　Notably, some industry observers said mobile HBM development and commercialization could progress more slowly than initially expected, as demand for HBM in servers, data centers, and AI accelerators is expected to remain strong for the foreseeable future. The report adds that booming demand for server and data center HBM may make it difficult for Samsung to fully concentrate its resources on mobile HBM development.　　SK hynix Advances Mobile AI Packaging　　SK hynix is also accelerating development of semiconductor packaging technologies for smartphones and Extended Reality (XR) devices. According to a Hankyung report published earlier this year, sources say the company is developing “High Bandwidth Storage (HBS),” a packaging solution that vertically stacks low-power (LPDDR) DRAM and NAND flash memory beside the Application Processor (AP), which handles core computing tasks in IT devices.　　Hankyung notes that HBS adopts a packaging technology called “Vertical Fan-Out” (VFO). Unlike conventional wire bonding, which connects stacked memory and substrates with thin copper wires, VFO uses pillar-shaped interconnects to enable denser wiring and faster data transfer speeds, helping APs process rapidly growing AI-driven workloads.

Key word：

Samsung

Release time：2026-05-15 10:49 reading：148 Continue reading>>

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Visit NOVOSENSE at PCIM Europe 2026！

　　We warmly invite you to visit NOVOSENSE at PCIM Europe 2026. Discover how NOVOSENSE empowers innovation across automotive electronics, renewable energy & power supply, and industrial control with a comprehensive portfolio of isolators, interfaces, drivers, sensors, signal chain, and power management ICs.　　Date: June 9–11, 2026　　Venue: Nuremberg Exhibition Centre, Germany　　Booth: Hall 4A, Booth 119　　✦ What to Expect ✦　　Functional safety ICs for safety-critical automotive systems　　One-stop body control & automotive lighting solutions　　SerDes and ultrasonic radar IC solutions for smarter mobility　　Technical presentations on high-voltage electric mobility and AI data center power systems　　✦ Highlights Preview ✦　　Functional Safety ICs for Safety-Critical Automotive Systems　　Isolated gate driver NSI6911F — certified by TÜV Rheinland to meet ISO 26262 ASIL D requirements, featuring up to 19A peak drive capability, ±150kV/μs CMTI, an integrated 12-bit isolated ADC, and advanced diagnostic functions for high-voltage applications such as traction inverters, OBCs, and DC-DC converters.　　ASIL B ultrasonic radar ASSP NSUC1800 and LED driver NSL21924FS , reflecting NOVOSENSE's expanding functional safety portfolio across sensors, signal chain, power management, and driver ICs.　　One-Stop Automotive Body Control & Lighting Solutions　　For BCM and ZCU applications, NOVOSENSE offers motor driver products for brushed DC motors, stepper motors, BLDC motors, relays, valves, and solenoids, supporting efficient, precise, and safe motor control.　　For automotive lighting, NOVOSENSE will showcase full-scenario LED driver solutions for ambient lighting, reading lights, headlighting, rear lighting, ISD/ISC lighting, grille lighting, and more, helping create safer, smarter, and more distinctive vehicle lighting experiences.　　Enabling Smarter Mobility with SerDes and Ultrasonic Radar IC Solutions　　SerDes chipset — NLS9116 single-channel serializer and NLS9246 four-channel deserializer, designed for cameras, displays, and domain controllers in ADAS and intelligent cockpit systems.　　AK2 ultrasonic radar ASSP — comprising the NSUC1800 sensor-side chip and NSUC1802 host-side interface conversion chip, providing a turnkey solution for applications such as UPA and APA.　　✦ Keynote Speeches ✦　　Join NOVOSENSE experts at PCIM Europe 2026 for in-depth technical presentations on how advanced semiconductor technologies are addressing the evolving demands of high-voltage electric mobility and AI data center power systems.　　E-Mobility & Energy Storage Stage　　Hall 6, Booth 220　　Topic: Evolution and Challenges of Gate Driver Technology for New Generation of xEV Powertrain System　　Time: June 9, 2026 | 15:25–15:45 (GMT+1)　　Speaker: Timmy Wu　　Topic: Enabling EV High-Voltage Safety with Advanced Isolated Sensing　　Time: June 11, 2026 | 12:05–12:25 (GMT+1)　　Speaker: Lillian Liu　　AI & Data Centers Stage　　Hall 5, Booth 320　　Topic: Power Density Scaling in AI Data Centers: From System Constraints to Semiconductor Device Challenges　　Time: June 9, 2026 | 14:35–14:55 (GMT+1)　　Speaker: Wenzhe Xu

Key word：

NOVOSENSE

Release time：2026-05-14 11:40 reading：183 Continue reading>>

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SMIC Founder Says China May Gain Edge in Niche Chips as 80% of Demand Lies Outside Advanced Nodes

　　As China pushes to strengthen its chip industry, Richard Chang, founder of SMIC, China’s largest foundry, suggests that success in semiconductors is not solely about winning the 2nm or 3nm race, with niche markets potentially emerging as a key competitive advantage for China. According to STAR Market Daily, Chang said that niche markets have become a key breakthrough point for China’s semiconductor industry, adding that advancing in specialized market segments could help strengthen the country’s overall chip capabilities.　　SMIC remains limited to the 7nm node due to its reliance on older DUV lithography equipment. However, Richard Chang’s emphasis on niche markets suggests that the company’s mature-node technologies could still find meaningful opportunities across a range of applications, as noted by Wccftech.　　SMIC Founder Highlights Opportunity Beyond Advanced Nodes　　As noted by STAR Market Daily, Richard Chang argued that semiconductor success should not be defined solely by achieving 3nm or 2nm nodes, describing such thinking as a misconception and highlighting niche markets as a key opportunity for China’s chip industry.　　Chang further noted that advanced nodes account for less than 20% of the global semiconductor market by product volume, while more than 80% of demand comes from mature-node and specialty-process segments. According to Chang, many niche markets still dominated by overseas players could represent key breakthrough opportunities for Chinese semiconductor companies.　　The trend may already be emerging across parts of the supply chain. According to TrendForce, with Taiwanese foundries shifting capacity and raising prices, customers in HV processes and CIS applications are increasingly turning to Chinese foundries for more stable pricing and capacity availability. This order migration has been evident since the second half of 2025, driving strong demand for 90 nm-and-above 12-inch wafers among Chinese players.　　Beyond Large Models: Richard Chang Highlights Edge AI Potential　　In addition, Richard Chang argued that edge AI and scenario-driven applications remain underappreciated opportunities within the broader AI landscape. As STAR Market Daily notes, Chang said sectors such as industrial control, automotive electronics, and wearable devices could create strong demand for application-specific semiconductor solutions, offering startups room to pursue differentiated strategies outside direct competition with global AI giants.

Key word：

SMIC

Release time：2026-05-12 10:24 reading：218 Continue reading>>

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ARM CEO Says Agentic AI May Drive CPU Core Counts to 512 as GPU-CPU Ratios Become Less Relevant

　　The rise of agentic AI is fueling fresh debate over the future GPU-to-CPU balance in AI systems, with Arm CEO Rene Haas now weighing in on the discussion. According to a transcript published by Investing.com, Haas said that while CPUs may not outnumber GPUs on a chip basis, they could from a core-count perspective.　　Haas noted that overall CPU demand is likely to increase significantly as agentic AI scales, with data centers potentially requiring more than four times today’s CPU capacity. He said this could create a data center CPU market opportunity exceeding US$100 billion by 2030.　　At the same time, Haas emphasized that the industry is seeing not only an explosion in overall CPU demand, but also rapid growth in the number of cores per CPU. According to Haas, many agentic AI workloads involve independent jobs, flows, or batches running on dedicated CPU cores, increasing the need for higher-core-count processors.　　Haas used Blackwell, Rubin, and other large AI accelerators as examples, noting that these chips are already approaching reticle limits, meaning their size is constrained by the maximum area a lithography mask can print. In contrast, he said CPU core counts could still double or even quadruple over the coming years.　　Haas noted that the Arm AGI CPU already features 136 cores, significantly higher than many competing offerings. Looking ahead, he said the industry is likely to move toward 256-core and even 512-core CPU designs. He added that such high-core-count architectures play to Arm’s strengths, as efficiency per core becomes increasingly critical at larger scales.　　Mydrivers notes that AMD and Intel are moving in a similar direction. AMD’s 2nm Zen 6-based EPYC processors are already expected to reach up to 256 cores with SMT multithreading support, while Intel’s all-E-core Xeon processors have reached 288 cores, with the next generation expected to scale to as many as 512 cores.　　Regarding the Arm AGI CPU launched at the company’s Arm Everywhere event last quarter, Haas said customer response has been “very strong.” He added that customer demand across fiscal 2027 and fiscal 2028 has already exceeded US$2 billion, more than double the level projected at launch.

Key word：

ARM

Release time：2026-05-11 13:48 reading：227 Continue reading>>

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Apple Reportedly Keeps 2nm 5G Modem Orders with TSMC Amid Intel Cooperation Signals

　　While recent market chatter has focused on a potential shift by Apple between longtime foundry partner TSMC and Intel, the Economic Daily News, citing industry sources, reports that the Cupertino-based company remains heavily dependent on the Taiwanese foundry giant, as it plans to place its entire in-house 5G modem orders with TSMC, leveraging its 2nm process technology.　　The report suggests that Apple’s self-developed 5G modem chips are expected to power future iPhone, iPad, and Apple Watch devices, replacing modems from Qualcomm. The volume used across its product lineup is projected to reach hundreds of millions of units, the report adds.　　Notably, Apple’s iPhone 17 lineup is expected to be the last to ship with Qualcomm Incorporated’s 5G modems, as the company moves toward a full transition to its in-house C2 baseband chip across all iPhone 18 models, according to Wccftech.　　The C2 development builds on Apple’s earlier in-house modem effort. Apple’s C1, first introduced in early 2025 with the iPhone 16e, marked its most complex chip system to date, integrating a 4nm baseband modem and a 7nm transceiver, according to earlier reporting from Reuters. The Economic Daily News further reports that Apple Inc.’s in-house C2 5G modem is expected to add full mmWave support—addressing the Sub-6 GHz limitation of its predecessor—while also incorporating satellite connectivity.　　Supply chain sources cited in the Economic Daily News report say TSMC has already secured foundry orders for Apple’s modem chips. Its back-end testing partner is also reportedly preparing for higher demand, with around 600 test systems being procured, as capacity is set to ramp from 2027.　　Apple’s Chip Tug-of-War: TSMC vs Intel　　Though claims of an Apple order shift to Intel remain unconfirmed, and any such move would not signal a departure from TSMC, cooperation between Apple and Intel appears to be warming. According to The Wall Street Journal, the two companies have reportedly reached a preliminary agreement for Intel to manufacture some of the chips powering Apple devices.　　The two sides have been engaged in intensive talks for more than a year, with a formal deal said to have been hammered out in recent months, the report adds.　　In parallel, Commercial Times reported earlier that Apple is evaluating Intel’s 18A-P process for its M-series chips. Looking further ahead, The New 7 reports that the first Intel-manufactured low-end M-series chips could emerge as early as mid-2027 under contract production, likely targeting entry-level Macs or iPads.　　As highlighted by The Wall Street Journal, Apple’s reported outreach to Intel may reflect growing supply chain pressures, as the Cupertino firm—long TSMC’s top customer—faces tightening access to advanced manufacturing capacity amid surging demand from NVIDIA and other AI chip designers.　　Intel previously played a central role in powering Apple’s Mac lineup, before Apple transitioned in 2020 to its own Arm-based custom chips, the report points out.

Key word：

Apple

Release time：2026-05-11 11:12 reading：246 Continue reading>>

Trade news

TSMC, Sony to Form JV for Image Sensors, Including New Production Lines for AI and Automotive Use

　　As TSMC has decided to upgrade its 2nd Kumamoto fab to 3nm, the foundry giant is also exploring to secure more opportunities for its mature nodes in Japan. According to its press release on May 8, Sony and TSMC announced the signing of a non-binding memorandum of understanding (MOU) to establish a strategic partnership focused on the development and manufacturing of next-generation image sensors.　　Notably, under the proposed framework, the two companies plan to form a joint venture (JV), with Sony serving as the majority and controlling shareholder. The JV is expected to build development and production lines at Sony’s newly constructed fab in Koshi City, Kumamoto Prefecture.　　TSMC said that beyond manufacturing expansion, the partnership is also aimed at exploring emerging opportunities in physical AI applications, including automotive and robotics.　　Through this collaboration, Sony will contribute its deep expertise in image sensor design, while TSMC will bring its advanced process technology and large-scale manufacturing capabilities. Both sides aim to combine their respective strengths to further enhance the performance and competitiveness of future image sensor technologies.　　The move aligns with an April Reuters report, which noted that Japan’s Ministry of Economy, Trade and Industry (METI) has confirmed that the Japanese government will provide subsidies of up to ¥60 billion (approximately US$380 million) to Sony Semiconductor Solutions Corporation for the construction of an image sensor facility in Kumamoto Prefecture, western Japan.　　Sony is a long-time customer of TSMC. As previously reported by Commercial Times, TSMC’s first Kumamoto fab—entering mass production in late 2024—supplies logic chips to Sony and DENSO, using 22/28nm and 12/16nm process technologies.　　Separately, Sony has recently begun restructuring efforts, including a spin-off of its television business. Its CIS (image sensor) unit is also facing rising competitive pressure, as Samsung Electronics continues to expand its share in supplying image sensors for Apple, prompting Sony to seek new growth momentum in the segment, Commercial Times added.

Key word：

TSMC

Release time：2026-05-09 10:16 reading：276 Continue reading>>

Trade news

TSMC Hints at Potential Further U.S. Expansion; Industry Sources Reportedly See Up to US$250B Investment

　　As TSMC continues expanding its U.S. footprint, comments from Cliff Hou, TSMC Senior Vice President and Deputy Co-COO, have caught industry attention. According to Commercial Times, Hou said at the 2026 SelectUSA Investment Summit that the company “is prepared for growth from any new business opportunities,” remarks the market has interpreted as signaling potential further expansion of TSMC’s U.S. investments. TSMC’s total U.S. investment currently stands at US$165 billion.　　Commercial Times notes that supply chain developments show chip equipment suppliers have also begun establishing U.S. subsidiaries to support TSMC. Industry sources added that TSMC’s total U.S. investment could reach as much as US$250 billion, with the company expected to replicate the Hsinchu Science Park cluster model in Phoenix.　　Meanwhile, Economic Daily News reported that TSMC’s first Arizona fab entered mass production in 4Q24, while its second fab has already been completed and is expected to begin 3nm mass production in the second half of 2027. TSMC previously said construction of its third Arizona fab is already underway, while permits are being sought for a fourth fab and its first advanced packaging facility in the state. The report also noted that TSMC has acquired a second large parcel of land near its existing Arizona site to support future expansion plans.　　Although TSMC’s U.S. fabs are more costly, capacity remains in strong demand, with previous reports indicating that customers had already reserved capacity at all four Arizona fabs, as noted by Economic Daily News. Institutional investors said that, for process technologies below 2nm, TSMC’s related capacity ratio between Taiwan and the U.S. is expected to reach roughly 7:3 by 2030.　　TSMC Reshapes Board Amid Global Expansion　　In addition, TSMC has also recently adjusted its board structure. According to Commercial Times, the company plans to revise its corporate charter by increasing the number of board seats from the current seven to ten directors to nine to twelve, with the proposal set to be discussed at the shareholders’ meeting on June 4.　　The move reflects TSMC’s response to the rapidly changing global business environment and is intended to provide greater flexibility in recruiting directors from diverse professional backgrounds, the report said. It also noted that, as TSMC rapidly expands overseas and continues increasing its U.S. investments, the board will need more members with expertise in international supply chains, geopolitics, and U.S. policy.

Key word：

TSMC

Release time：2026-05-07 13:22 reading：272 Continue reading>>

Trade news

Apple Reportedly Eyes Samsung, Intel U.S. Foundry for Core Chips Amid TSMC Constraints, Supply Diversification

　　Apple is reportedly weighing the possibility of having some of its core device chips manufactured by Samsung and Intel. According to Bloomberg, citing sources, the company has held preliminary discussions on using the two as alternative production partners for its main processors—potentially providing a second sourcing option alongside its longstanding supplier, TSMC.　　Sources say the company has held early-stage discussions with Intel about leveraging its foundry services, while Apple executives have also visited a Samsung facility under construction in Texas that is expected to produce advanced chips.　　That said, the report notes that neither effort has led to any orders so far. Engagements with both suppliers remain at a preliminary stage, as Apple continues to have reservations about adopting non-TSMC manufacturing technologies.　　One of the key drivers behind Apple’s potential shift is supply constraints at TSMC, according to Bloomberg. As the report notes, Apple executives addressed the issue during the company’s quarterly earnings call last week, indicating that limited chip availability for iPhone and Mac devices is currently weighing on growth.　　In early 2026, Tim Cook identified access to advanced-node manufacturing as the main bottleneck for Apple’s iPhone output, according to CNBC. He noted that production is constrained by limited capacity for the company’s A-series and M-series system-on-chip (SoC) chips, which are fabricated on TSMC’s 3nm process.　　In addition, it also aims to maintain at least two suppliers for key components, allowing Apple to strengthen its negotiating leverage on pricing while reducing the risk of supply disruptions, Bloomberg adds.　　Apple’s Reported Supplier Talks May Open Door for Intel Comeback, Samsung Gains　　Apple’s talks with both companies reportedly began before the most recent supply constraints emerged. As Bloomberg notes, collaborating with Intel could offer an added advantage, potentially strengthening Apple’s ties with the Donald Trump administration. As for Samsung, the report indicates that it has already been working on supplying more peripheral components for Apple’s devices, including power management parts.　　In an August 2025 press release, Apple also announced a partnership with Samsung to co-develop a new chip manufacturing technology at Samsung’s Austin fab. Citing industry sources, Business Korea adds that the chip Samsung is expected to produce will likely be used as an image sensor in future iPhones and other Apple products.　　Separately, industry momentum appears to be building around Intel’s foundry push. According to Commercial Times, major tech firms including Google and Apple are weighing a shift to Intel’s foundry. The report adds that Apple’s M-series chips are evaluating Intel’s 18A-P node.　　Apple’s potential shift could provide a boost to both Samsung and Intel. As the report notes, securing external customers for its foundry business is central to Intel’s turnaround strategy under CEO Lip-Bu Tan. Winning Apple as a client would mark a major milestone for Tan and could help draw in additional business. Samsung, meanwhile, would also stand to gain significantly from an endorsement by Apple.

Key word：

Apple

Release time：2026-05-06 14:44 reading：294 Continue reading>>

Trade news

ROHM Launches an Ultra-Compact Wireless Power Chipset for Wearables

　　ROHM has developed a wireless power supply IC chipset consisting of the receiver - ML7670 - and transmitter - ML7671 - compatible with Near Field Communication (NFC) technology for compact wearables such as smart rings and smart bands as well as peripheral devices like smart pens.　　The smart ring market has seen rapid growth in recent years, primarily in healthcare and fitness applications. However, for extremely small ring-shaped devices worn on the finger, wired charging is impractical, while conventional Qi wireless charging standard is difficult to implement due to constraints such as coil size. This has driven increased demand for a proximity-based power transfer method capable of reliably charging ultra-compact devices.　　In response, NFC-based charging, which operates at the high-frequency 13.56MHz band that enables antenna miniaturization, is attracting increased attention, with adoption accelerating in next-generation wearables. Following the successful commercialization of the 1W ML7660/ML7661, ROHM has developed the ML7670/ML7671 chipset optimized for even smaller devices.　　This new chipset builds on the proven receiver - ML7660 - and transmitter - ML7661. The maximum power transfer is specified at 250mW, while peripheral components such as the switching MOSFETs required to supply power to the charging IC are built in. The result is a solution optimized for both mounting area and power transfer efficiency in the power class demanded by compact wearable devices, especially smart rings.　　The ML7670 power receiver IC achieves a maximum power transfer efficiency of 45% in the 250mW low output range – all in an industry-leading form factor of just 2.28 × 2.56 × 0.48mm. A key feature of the new chipset is superior performance that surpasses the efficiency of comparable products in the same class by optimizing elements such as coil matching, rectifier circuitry, and reduced losses in switching devices.　　What's more, all firmware required for wireless power delivery is embedded directly within the IC, eliminating the need for a host MCU. This significantly reduces board space along with development workload in device design.　　Compliance with NFC Forum (WLC 2.0) enables power transfer while maintaining compatibility with existing devices, positioning the chipset as a core element in the expanding NFC wireless power ecosystem.　　The new chipset is already in mass production. Furthermore, it has been adopted in SOXAI RING 2, the latest model launched on December 10th, 2025, by SOXAI, Inc. (“SOXAI” is pronounced “SOK-sai”.), the Japanese developer and distributor of the original sleep monitoring ring SOXAI RING. Evaluation boards and reference designs are also offered to facilitate integration. For more information, please contact a sales representative or submit an inquiry via the contact page on ROHM’s website.　　Going forward, ROHM will continue to promote device development that leverages miniaturization and low-power consumption technologies essential for wearable devices, contributing to improved user convenience and the continued growth of the wearable market.　　Specifications　　Case Study: SOXAI RING 2 Adoption Example SOXAI RING is the only smart ring for sleep management developed in Japan capable of accurately capturing and analyzing sleep data. It incorporates cutting-edge technologies such as an optical vital sensor, temperature sensor, accelerometer, Bluetooth® Low Energy communication, and NFC wireless charging functionality.　　The latest model, SOXAI RING 2, is equipped with Deep Sensing™, a proprietary photoplethysmography (PPG) sensor that significantly improves measurement accuracy, enabling the visualization of physical health changes with far greater depth and precision.　　Bluetooth® is a registered trademark of Bluetooth SIG, Inc. in the US.　　Deep Sensing™ is a trademark or registered trademark of SOXAI, Inc.

Key word：

ROHM

Release time：2026-04-29 10:03 reading：334 Continue reading>>

Trade news

MicroLED Gains Focus as Seoul Semiconductor Plans $180M AR Investment, Aledia Reports Breakthrough

　　Amid mounting margin pressure and slowing growth in the LED industry, players are moving beyond traditional segments in search of new momentum, with MicroLED emerging as a key focus. According to MicroLED-info, Seoul Semiconductor plans to invest KRW 250 billion (around $180 million) over the next five years, primarily in the R&D and production of microLED microdisplay modules for AR applications.　　The report suggests that the company has embarked on a government-approved restructuring plan as its core LED package business faces mounting pressure from falling prices and weakening profitability. Under the initiative, the new displays will be built on Seoul Semiconductor’s proprietary WICOP (Wafer Integrated Chip on PCB) technology, the report adds.　　As noted by Maeil Ilbo, founded in 1992, Seoul Semiconductor supplies LED packages across lighting, automotive, and IT, and holds about a 4.8% global share in the optoelectronics market. Despite its proprietary wire-free WICOP technology, the company has come under pressure from persistent price declines and softer demand, weighing on margins, the report explains.　　French MicroLED Startup Achieves Key Milestone　　On the other hand, French startup Aledia, according to MicroLED-info, has successfully demonstrated a fully functional monolithic RGB epitaxial wafer, marking a key milestone for the technology. The achievement validates the company’s end-to-end monolithic RGB process, enabling red, green, and blue emission from a single epi wafer fabricated in a single run, the report notes.　　According to the company, its proprietary nanowire-based architecture can grow nanowires in a single processing step, with diameters ranging from 100 nm to 400 nm depending on the target wavelength, enabling full RGB capability within one unified structure.　　On device performance, the company demonstrated a 2.5 μm sub-pixel pitch—equivalent to a 5.0 μm × 5.0 μm pixel size—and outlined a roadmap to further shrink this to 2.0 μm for both monochrome and monolithic RGB displays, MicroLED-info suggests.　　In parallel, Aledia has validated its 9V microLED devices on 200 mm silicon wafers, including 15×30 μm blue emitters on the same platform. The company also confirmed the commercial availability of its 3D-Nano microLED technology built on 200 mm silicon in February, the report adds.

Key word：

Optical Semiconductors

Release time：2026-04-27 10:39 reading：362 Continue reading>>

model	brand	Quote
TL431ACLPR	Texas Instruments
RB751G-40T2R	ROHM Semiconductor
BD71847AMWV-E2	ROHM Semiconductor
CDZVT2R20B	ROHM Semiconductor
MC33074DR2G	onsemi

model	brand	To snap up
BU33JA2MNVX-CTL	ROHM Semiconductor
TPS63050YFFR	Texas Instruments
STM32F429IGT6	STMicroelectronics
BP3621	ROHM Semiconductor
IPZ40N04S5L4R8ATMA1	Infineon Technologies
ESR03EZPJ151	ROHM Semiconductor

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