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SK hynix Reportedly Pulls Forward HBM4E Sample Timeline, Eyeing June–July Shipments to Key Customers

　　Samsung announced the start of HBM4E sampling in late May and later unveiled an HBM5 mock-up for the first time at COMPUTEX 2026. Against this backdrop, rival SK hynix is also stepping up its next-generation HBM push, with South Korean media outlet Newsis reporting that the memory giant has secured positive results in HBM4E development and is nearing sample shipments to key customers.　　Notably, certain analysts cited by the report expect SK hynix to begin HBM4E sample shipments as early as this month, or by July at the latest. The company had previously guided that sampling would start in the second half of the year, suggesting the timeline is now being pulled forward, the report adds.　　As Newsis notes, next-generation HBM is highly customized for customers, and earlier sample shipments enable faster performance validation and optimization—ultimately translating into a strategic edge in securing final mass production orders.　　Beyond sampling timelines, broader supply and pricing dynamics are also shifting, which may give early movers key advantages. According to TrendForce, as the market enters 2Q26, negotiations between buyers and suppliers have shifted toward HBM4 supply agreements for 2027, which is expected to become the market’s mainstream project generation. The shift underscores how both Samsung and SK hynix are accelerating HBM4 and HBM4E development amid tightening market cycles.　　SK hynix HBM4E Specs Under Spotlight　　As highlighted by Newsis, SK hynix’s HBM4E is likely to be used in NVIDIA’s next-generation AI accelerator, Rubin Ultra, set for release next year. In line with this platform upgrade, TrendForce notes that NVIDIA’s Rubin Ultra is expected to further increase HBM capacity per GPU to 384GB.　　Against this backdrop of rising system-level requirements, HBM4E specifications are also being pushed higher across the stack. According to Newsis, SK hynix’s HBM4E core die is expected to adopt a 1c DRAM process node, compared with the 1b node used in HBM4. In addition, The Chosun Daily previously reported that the company is likely to use TSMC’s 3nm process for its HBM4E logic die, aiming to challenge Samsung’s 4nm design.　　On the competitive front, Samsung Electronics completed the world’s first shipment of HBM4E samples in late May, supplying them to NVIDIA, according to Yonhap News.　　Samsung’s HBM4E combines a 1c DRAM core die with a 4nm foundry-based base die, delivering speeds of up to 14Gbps per pin and peaking at 16Gbps, equivalent to a maximum bandwidth of 4TB/s, the report notes.

Key word：

SK hynix

Release time：2026-06-16 10:43 reading：199 Continue reading>>

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Tesla Elon Musk Discusses TeraFab at ASML Conference; Project Expected to Spur EUV Tool Orders

　　Elon Musk is expanding his ambitions beyond EVs, AI, and space technology with TeraFab, a large-scale semiconductor manufacturing project in Texas. According to CNBC, during an ASML conference on Thursday, Tesla CEO Elon Musk outlined his TeraFab vision. As the only provider of a crucial EUV machine, ASML is widely expected to become a key supplier for the Texas-based fabrication plant.　　Joining remotely at ASML’s annual technology conference, Musk took part in a fireside chat with CEO Christophe Fouquet. While the event was limited to employees, ASML confirmed Musk’s participation, the report states.　　ASML also signaled support for the initiative. As noted by Reuters, the company said that Musk and his team are becoming part of the broader semiconductor ecosystem and that many companies, including ASML, will collaborate on the project.　　For the project, SpaceX and its partner Tesla will invest an initial US$55 billion, with total investment potentially rising to US$119 billion if fully built out, as noted by Reuters.　　TeraFab Fuels Equipment Demand Across the Supply Chain　　In May, ASML CEO Christophe Fouquet said he had spoken directly with Elon Musk about the TeraFab semiconductor project, according to Tom’s Hardware, citing Reuters. While Fouquet did not disclose details of the discussions, he said projects such as TeraFab and Starlink are expected to place growing pressure on equipment suppliers’ capacity in the coming years.　　Maeil Business Newspaper also notes that expectations for a surge in equipment demand have risen after Musk discussed the TeraFab project at the ASML Technology Conference. The report adds that ASML’s core equipment is expected to be essential to the project.　　South Korean equipment makers are also seeking to capitalize on the opportunity. According to Seoul Economic Daily, Hanmi Semiconductor announced on June 12 that it will invest KRW 50 billion in SpaceX. The report says Hanmi aims to strengthen ties with SpaceX and position itself to supply key equipment for TeraFab.　　Interest in the project has been building for months. According to Bloomberg, Musk’s team had reportedly contacted major chip equipment suppliers, including Applied Materials, Tokyo Electron, and Lam Research, regarding the planned facility. Sources said staff working for the Tesla-SpaceX venture had requested pricing and delivery information for a range of semiconductor manufacturing tools.

Key word：

Elon Musk

Release time：2026-06-15 10:48 reading：209 Continue reading>>

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Lenovo Reportedly Set for July Price Hikes Across Product Portfolio as Memory Costs Pressure PC Market

　　With memory prices remaining elevated, consumer electronics could be heading for another round of price increases. Chinese media outlet Lanjinger.com, citing sources familiar with the matter, reports that Lenovo plans to raise prices across its product lineup from July, broadly in line with the previous round of increases, after the 618 shopping festival ends.　　Notably, Lanjinger.com highlights this would not be Lenovo’s first price hike this year, pointing to March when the PC maker issued nationwide price adjustment notices and raised retail prices for some models by over RMB 1,000. The report adds it has already urged distributors to lock in inventory and secure current pricing ahead of the upcoming increase, with a formal notice expected to be issued by the end of June.　　The pricing pressure is spreading across the PC industry. Dell, as highlighted by the report, has already raised prices on certain products as well, with server prices increasing 20%–40%. Prices for desktops, notebooks, and workstations are also expected to see further significant hikes by July, the report suggests.　　A separate report from Sina also suggests the sharp rise in costs has put pressure on the entire PC industry, prompting several major vendors to begin raising prices as early as six months ago. Dell, according to Sina, increased prices across its commercial PC portfolio in late 2025, with hikes ranging from 10% to 30%.　　Memory Price Surge Drives PC Cost Pressure　　Surging memory prices have become a key driver behind rising costs for PC brands. Lanjinger.com, citing TrendForce data, reports that cumulative spot price increases for DRAM and NAND flash have exceeded 300%. By May 2026, the average price of PC-grade DDR4 8Gb memory had climbed to US$20, the highest level since TrendForce began tracking the market, according to the report.　　Against this backdrop, Taipei Times, citing TrendForce’s latest forecast, reports that global notebook shipments are now expected to decline 13% YoY in 2026, as soaring memory prices and tight CPU supply weigh on demand in the second half—marking a sharper downturn than the 9.4% drop projected in January.

Key word：

Lenovo

Release time：2026-06-11 10:33 reading：359 Continue reading>>

Trade news

Samsung, NVIDIA Deepen Ties as Talks Reportedly Expand to HBM5 Next Year and Next-Gen Groq Chips

　　Following Jensen Huang’s high-profile meetings with SK hynix during his South Korea visit, Samsung Electronics Vice Chairman Jun Young-hyun met with the NVIDIA CEO on June 8 to discuss potential cooperation in HBM and foundry services. According to The Chosun Daily, Jun said the discussions focused on collaboration in HBM and foundry. He added that the near-term priority is to ensure stable supplies of HBM4 and SOCAMM this year, while the two companies also discussed longer-term collaboration beginning next year, including HBM4E, foundry services, and HBM5.　　Samsung, NVIDIA Expand Foundry Cooperation　　On the foundry front, Samsung Electronics is in discussions with NVIDIA on next-generation chip production using its advanced process technologies, including the Drive AGX Thor autonomous driving chip and the Groq language processing unit (LPU), according to Seoul Economic Daily.　　Jun said Samsung is manufacturing NVIDIA’s autonomous driving and Groq chips using 4nm and 8nm nodes, according to ZDNet. He added that the partnership also extends to next-generation Groq chips.　　As highlighted by Seoul Economic Daily, Samsung currently manufactures the third-generation Groq LPU (LP30) on its 4nm process. Jun’s remarks suggest the company is also in position to produce the next-generation LP40, despite industry expectations that TSMC could secure the order through its advanced packaging strengths.　　Samsung Details Memory Portfolio for NVIDIA　　On the memory front, Samsung Electronics is supplying HBM4 (6th-generation) memory with data transfer speeds exceeding 11.7 Gbps per pin for NVIDIA’s Vera Rubin platform, according to Yonhap News. The company is also providing LPDDR5X-based SOCAMM2 modules for the Vera CPU, as well as its PCIe Gen6-based PM1763 storage solution.　　Yonhap News adds that Samsung’s HBM4E combines DRAM core dies with a proprietary 4nm foundry base die, enabling operating speeds of 14 Gbps per pin and achieving up to 16 Gbps in testing.　　Meanwhile, Vice Chairman Jeon stopped short of confirming whether Samsung Electronics and NVIDIA would sign a long-term memory supply agreement, saying Samsung would do its utmost as a key partner to support NVIDIA’s success, according to Newspim.　　NVIDIA CEO Jensen Huang also discussed the company’s partnership with Samsung during a Q&A session following the NVIDIA Korea AI Ecosystem Reception. According to Dealsite, Huang said NVIDIA and Samsung have long collaborated in the Application-Specific Integrated Circuit (ASIC) sector and are jointly developing new ASIC products. He added that the two companies also share a long history of cooperation in memory technologies.

Key word：

Samsung

Release time：2026-06-10 10:37 reading：414 Continue reading>>

Trade news

Largan Expands CPO Push, Plans September Fiber Array Pilot Line, Eyes 2027 Revenue Contribution

　　Taiwan’s Largan Precision, a key optical lens supplier in Apple’s supply chain, is expanding into CPO. According to Liberty Times, Chairman Adam Lin said after the company’s shareholders’ meeting today that Largan plans to establish an automated pilot production line for its fiber array (FA) products in September and may invite a potential major customer to visit the facility.　　Lin said the company has developed a proprietary technology that enables conventional V-grooves and optical fibers to be assembled into high-precision FA products. He noted that tolerance stack-up between V-grooves and optical fibers has been a key challenge for the industry, often forcing competitors to rely on the highest-precision V-grooves and optical fibers to achieve the required accuracy. Largan, however, can use less-than-perfect components to produce FA products with precision below 0.3 microns, outperforming the industry’s typical range of 0.5 to 0.8 microns, the report highlights.　　Largan made its first appearance at Computex this year, showcasing CPO-related solutions and expanding into optical components such as FAUs (fiber array units) and MLAs (microlens arrays). The move is widely viewed as an important signal that the company is seeking new high-margin growth drivers beyond its core smartphone lens business, as noted by China Times.　　The company’s investment in fiber arrays aligns with growing demand for CPO technologies. TrendForce forecasts that co-packaged optics (CPOs) will steadily increase their share of optical communication modules in AI data centers, with penetration potentially reaching 35% by 2030.　　Largan Sees Multi-Row FAs as Next Growth Driver　　FAUs (fiber array units) combine FAs with components such as microlens arrays (MLAs) and prism microlens arrays (PMLAs). According to Liberty Times, Lin expects single-row products to remain the industry’s primary source of demand through 2028. Over the next three to four years, however, rising computing requirements are expected to drive a gradual shift toward two-row, four-row, and eventually eight-row configurations, the report notes. Lin said this transition would play to Largan’s strengths, citing the company’s multilayer stacking and high-precision technologies as key differentiators.　　Largan Eyes 2027 FA Revenue as Qualification Process Advances　　Looking ahead, Lin said FA products could begin contributing to revenue in 2027 if Largan successfully completes customer qualification, the Liberty Times report notes. However, because the products have yet to enter mass production, the company is not currently able to estimate yields or gross margins. Meanwhile, preparations for low-volume production are expected to take about six months to one year. Lin said the production line will be highly automated to improve process precision and manufacturing capacity while reducing reliance on labor-intensive production.

Key word：

Largan

Release time：2026-06-10 10:29 reading：414 Continue reading>>

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Apple May Debut M5 Ultra-Powered Mac Studio at WWDC, Boosting Demand for TSMC N3P and SoIC-mH

　　Apple’s annual Worldwide Developers Conference (WWDC) is set to kick off on June 9. According to Commercial Times, beyond updates to Apple Intelligence, Siri, and macOS 27, market attention is focused on whether a next-generation Mac Studio powered by Apple’s M5 Ultra chip will also make an appearance.　　The M5 Ultra is expected to retain Apple’s UltraFusion dual-die architecture, combining two M5 Max dies and delivering interconnect bandwidth of more than 1,000GB/s. Specifications are rumored to include a 36-core CPU, an 84-core GPU, and up to 512GB of unified memory, the report adds.　　Notably, as the report highlights, TSMC’s N3P is expected to serve as the key manufacturing foundation for the M5 Ultra, potentially adding to demand for already tight 3nm capacity.　　TSMC’s SoIC-mH Emerges as Potential M5 Ultra Enabler　　TSMC’s advanced packaging is also expected to play a key role in boosting the performance of the M5 Ultra. According to institutional investors cited by Commercial Times, SoIC-mH could emerge as a core technology platform if Apple adopts a higher-density heterogeneous integration approach alongside its UltraFusion high-speed interconnect architecture.　　As TechNews notes, SoIC-mH uses a molded horizontal packaging architecture and integrates multiple chips directly at the wafer level through no-bump hybrid bonding technology. The approach can increase packaging density, improve signal transmission efficiency, and enhance thermal performance.　　In addition, TechPowerUp notes that TSMC’s SoIC-mH allows Apple to separate the CPU and NPU from the GPU. This enables Apple to scale CPU clusters and GPU dies independently, adding more cores as needed. The approach also gives Apple greater flexibility to expand its product lineup without pushing die sizes close to the 830 mm² reticle limit. According to the report, this can improve yields and reduce defects associated with larger silicon dies.　　Despite these potential advantages, the launch timing of the next-generation Mac Studio remains uncertain. According to Macworld, citing Bloomberg, supply-chain constraints are affecting production of Apple’s next-generation professional Macs and could delay the debut of the M5 Ultra-powered system until October 2026.　　Touchscreen MacBooks Could Create New Opportunities for TSMC　　Meanwhile, macOS 27 is another key focus of this year’s WWDC. Commercial Times notes that Apple is expected to strengthen touch support features, laying the groundwork for future touchscreen MacBooks through the early adoption of on-cell touch panel integration.　　Institutional investors cited by the report say that the shift toward OLED displays and touch-enabled MacBooks is expected to drive demand for upgraded display driver ICs, TDDI chips, and touch controllers, while also benefiting TSMC’s specialty process. The report adds that TSMC has completed reliability certification for its 16nm high-voltage process platform and is set to enter the yield-validation stage in 2026, potentially helping customers develop more competitive OLED display driver ICs.

Key word：

Apple

Release time：2026-06-09 13:50 reading：397 Continue reading>>

Trade news

SK hynix Reportedly to Double DRAM Capacity to 1M Monthly Wafers by 2030, Speeds Yongin Expansion

　　TrendForce　　SK hynix is reportedly preparing a major DRAM capacity expansion. According to The Elec, the company has shared plans with key suppliers to nearly double its DRAM wafer production capacity by 2030–2031 from current levels. The plan aligns with comments made by SK Group Chairman Chey Tae-won at Computex 2026, where he said the company would “double overall wafer production capacity within five years at full speed.”　　The report says SK hynix aims to raise monthly DRAM wafer capacity from about 550,000 wafers today to roughly 1 million wafers by 2030. The current figure includes around 200,000 wafers per month from its Wuxi fab in China.　　Much of the expansion will be centered on the Yongin Semiconductor Cluster. According to the report, SK hynix plans to divide its first Yongin fab into six cleanrooms and has moved up the first equipment installation schedule from May 2027 to February 2027. The fab is expected to add 360,000 wafers per month of DRAM capacity by the first half of 2030.　　SK hynix is also expanding its M15X fab in Cheongju. The report says the facility is scheduled to begin operations in the second half of 2026 with an initial capacity of 40,000 wafers per month, rising to about 80,000 wafers per month in 2027.　　Combined with the additional output from Yongin, SK hynix’s total DRAM wafer input capacity could approach 1 million wafers per month between 2030 and 2031, according to the report.　　Notably, all newly added capacity is currently designated for DRAM production, the report notes. For NAND flash, SK hynix is expected to focus on technology upgrades, such as increasing layer counts, rather than significant capacity expansion.　　Equipment Suppliers See Near-Term Gains, but Remain Cautious　　The expansion of the Yongin Semiconductor Cluster is drawing a growing number of semiconductor equipment and materials suppliers. According to iNews24, equipment and materials suppliers continue to move into the Yongin Semiconductor Cluster. South Korean materials, parts, and equipment firms, along with ASML, Lam Research, and Tokyo Electron Korea, have either relocated or are in the process of moving in.　　However, The Elec notes that suppliers remain cautious about execution given the scale and pace of the expansion plan. Supplier sources cited by the report said the increased investment is expected to provide a meaningful near-term boost for equipment and materials vendors, though achieving the full expansion target will ultimately depend on whether market demand remains strong enough to support it.　　Samsung Also Accelerating DRAM Expansion　　As for Samsung, according to Digital Daily, Samsung Electronics is accelerating DRAM capacity expansion at its P4 fab in Pyeongtaek by bringing forward its investment schedule. The report says Samsung’s DRAM investment next year could increase by roughly 10,000 wafers per month above previous estimates. Some industry observers also expect Samsung to begin issuing purchase orders for the P5 line from the second quarter of next year, potentially supporting investment equivalent to 150,000 wafers per month in 2027.

Key word：

SK hynix

Release time：2026-06-08 10:46 reading：460 Continue reading>>

Trade news

TSMC Rejects High-NA EUV Investment Concerns, Confirms Purchase for R&D Use

　　As Intel advances its High-NA EUV roadmap for its A14 node, market attention has turned to TSMC’s comparatively cautious approach to the cutting-edge lithography tool, which is estimated to cost around US$400 million per system.　　However, at its June 4 shareholder meeting, TSMC Chairman C.C. Wei rejected speculation that the company had opted not to invest in High-NA EUV. According to TechNews, he stressed that TSMC has already purchased the equipment and is actively conducting R&D.　　Wei explained that the main reason the High-NA EUV system has not yet been introduced into mass production is purely cost-related. The company will continue working to improve efficiency and reduce costs, and will move the technology into production once conditions are ready, TechNews reports.　　Interestingly, Wei also added with a touch of humor that TSMC is not only investing in the technology but has already purchased the tools, noting that “it would even be a bit embarrassing to say how many.” As previously reported by Tom’s Hardware, citing Kevin Zhang, senior vice president of business development and global sales and deputy COO at TSMC, TSMC’s upcoming A13 and A12 processes, both targeted for 2029, are not expected to require High-NA EUV lithography tools.　　This contrasts with Intel’s strategy for its 14A node and subsequent generations, which are set to adopt High-NA EUV starting in 2027–2028, according to Tom’s Hardware. Reuters, citing ASML CEO Christophe Fouquet, also reported in May that the semiconductor equipment giant expects to see the first memory and logic products manufactured on High-NA EUV systems within the next few months.　　TSMC Reaffirms Strong Capex Outlook　　Against this backdrop, TSMC reaffirmed its capital expenditure plans to support sustained growth. According to TechNews, when investors asked Chairman C.C. Wei how long the company’s current investment cycle would last and when a potential “plateau period” might emerge, he said TSMC remains highly confident in its multi-year outlook, supported by forecasts from both customers and “customers’ customers,” with the company’s growth trajectory expected to continue upward.　　He noted that, as previously guided at the earnings call, capital expenditure for 2026 is projected to range between US$52 billion and US$56 billion, with an internal bias toward the upper end of US$56 billion, as noted by the report.　　Liberty Times adds that at TSMC’s annual shareholder meeting, C.C. Wei said in his opening remarks that the company achieved record-high revenue and profit last year, delivering strong operational results. He noted that TSMC’s share price has risen by more than 1.5 times over the past year, while cash dividend payouts have increased by over 30%.

Key word：

TSMC

Release time：2026-06-05 10:44 reading：489 Continue reading>>

Trade news

Intel Says 18A May Reach Strong Margins by 2027; Notebook Chips on the Node Mark Fastest Ramp in 5 Years

　　Intel is betting heavily on 18A to support the company’s turnaround plan. According to The Register, Chief Financial Officer David Zinsner said that early last year Intel faced the challenge of trying to improve both performance and yield at the same time. The company later shifted its focus to stabilizing performance first, and with that objective largely achieved, it is now concentrating on improving yield month by month.　　Zinsner said Intel’s goal is to achieve yield levels that support strong margins, adding that the company is currently ahead of schedule to reach that target by the end of 2027, as the report highlights. He added that after Lip-Bu Tan joined the company, Intel began sharing more manufacturing data with its vendors. The increased collaboration helped improve yields and made a dramatic difference.　　Looking beyond 18A, Zinsner also expressed confidence in Intel’s 14A. According to the report, he said the company has adopted a more aggressive approach than it did with 18A, adding that yield and performance metrics are currently ahead of where 18A was at the same stage of development.　　Intel 3 and 18A Supply Set to Rise Amid Strong CPU Demand　　In addition to providing an update on Intel’s manufacturing roadmap, Zinsner highlighted growing supply from Intel 3 and 18A, according to Seeking Alpha. As cited by the report, he said Intel expects a meaningful increase in supply from both Intel 3 and 18A over the coming quarters to meet rising demand. He added that 18A-based notebook processors are ramping quickly and represent the company’s fastest-ramping product launch in at least the past five years.　　The company is also seeing rising CPU demand. According to The Register, Zinsner said it remains difficult to predict the full extent of future growth, but he expects the market to be substantial. He said the key challenge at present is supply, adding that Intel sees sufficient demand in the market and should be able to grow data center revenue meaningfully if it executes successfully on planned supply ramps.

Key word：

Intel

Release time：2026-06-05 10:40 reading：440 Continue reading>>

Trade news

Memory Spot Price Update: DDR4 and DDR5 Extend Gains, Though Higher Quotes Temper Procurement Demand

　　According to TrendForce’s latest memory spot price trend report, in terms of DRAM, DDR4 and DDR5 spot prices continued to rise, with both segments posting notable gains. However, buyers remained cautious amid higher supplier quotes. In the NAND flash segment, spot quotations would continue to slump in the short term with major buy orders nowhere to be seen. Details are as follows:　　DRAM Spot Price:　　Building on last week’s momentum, spot prices on the whole have maintained an upward trajectory, with prices of both DDR4 and DDR5 chips registering notable gains. Despite the overall price increases, suppliers’ higher quotes have made buyers hesitant to chase further increases, thereby limiting actual procurement demand. The average spot price of mainstream chips (i.e., DDR4 1Gx8 3200MT/s) has increased by 3.57% from US$33.6 last week to US$34.8 this week.　　NAND Flash Spot Price:　　Continuing from clients’ profound wait-and-see sentiment last week, the spot market still lacks momentum this week, where the sizable differences towards price consensus between market participants are unable to actuate procurement. There have only been sporadic transactions thus far, with major buy orders nowhere to be seen, which also indicates how spot quotations would continue to slump in the short term. Spot prices of 512Gb TLC wafers climbed by 0.22% this week, arriving at US$20.683.

Key word：

Memory

Release time：2026-06-04 10:43 reading：498 Continue reading>>

model	brand	Quote
RB751G-40T2R	ROHM Semiconductor
CDZVT2R20B	ROHM Semiconductor
TL431ACLPR	Texas Instruments
BD71847AMWV-E2	ROHM Semiconductor
MC33074DR2G	onsemi

model	brand	To snap up
STM32F429IGT6	STMicroelectronics
TPS63050YFFR	Texas Instruments
ESR03EZPJ151	ROHM Semiconductor
IPZ40N04S5L4R8ATMA1	Infineon Technologies
BU33JA2MNVX-CTL	ROHM Semiconductor
BP3621	ROHM Semiconductor

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