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CXMT IPO Could Raise Up to RMB 66.6B; How Founder Zhu Yiming Built China’s DRAM Challenger

　　China’s leading memory maker CXMT is set to list on Shanghai’s STAR Market, drawing widespread market attention. The company has set its IPO price at RMB 8.66 per share and is scheduled to begin its online and offline share subscription on July 16. The company plans to issue 6.688 billion shares, representing approximately 10% of its enlarged share capital after the offering, with an over-allotment option included. According to TechNews, the market expects the IPO to raise up to RMB 66.6 billion, roughly double earlier estimates, potentially making it Asia’s largest IPO of the year.　　Beyond the sheer scale of the IPO, the company’s founder, Zhu Yiming, has also drawn attention. After founding GigaDevice 20 years ago and taking the company public in Hong Kong this January, Zhu has now found success with his second startup.　　From Silicon Valley to GigaDevice　　Born in Yancheng, Jiangsu, Zhu Yiming studied physics at Tsinghua University before pursuing electronic engineering at the State University of New York at Stony Brook. He later worked at iPolicy Networks and Monolithic System Technologies, gaining end-to-end experience in memory chip design and development.　　While working in Silicon Valley, Zhu saw the global memory industry shift from the U.S. to Japan and South Korea, inspiring him to build a homegrown Chinese memory company. As the report highlights, he founded GigaDevice, which developed China’s first high-speed mobile memory chip and became a leading NOR Flash supplier before listing in Shanghai in 2016 and Hong Kong in January 2026.　　Building CXMT　　Also in 2016, Zhu partnered with the Hefei municipal government to invest approximately RMB 18 billion in a 12-inch wafer fab, establishing CXMT. In 2018, Zhu stepped down as GigaDevice’s general manager to lead CXMT as CEO, pledging not to take a salary until the company became profitable, the report notes. Despite CXMT accumulating more than RMB 36.6 billion in losses by the end of 2025, he kept that promise for eight years. In 2019, CXMT announced the volume production of its 8Gb DDR4 chip, China’s first domestically developed DRAM chip to reach mass production.　　A Long-Awaited Turnaround　　As memory demand continued to surge, CXMT turned profitable in the first quarter of 2026. Revenue reached RMB 50.8 billion, up 719% year over year, while net profit rose 1,688% to RMB 24.76 billion. The company expects first-half 2026 revenue to reach RMB 110–120 billion, with net profit projected at RMB 50–57 billion. CXMT has also become the world’s fourth-largest DRAM supplier by market share, trailing only Samsung, SK hynix, and Micron.　　Zhu has reportedly pledged to distribute half of his post-listing stake in CXMT—worth an estimated RMB 20 billion—to employees, saying he wants the team to share in the company’s success. Meanwhile, the IPO is expected to provide CXMT with additional capital for advanced process, capacity expansion, and next-generation DRAM development, further strengthening its global competitiveness.

Key word：

CXMT

Release time：2026-07-17 10:54 reading：204 Continue reading>>

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ASML Raises 2026 Guidance for Second Time This Year; Taiwan Sales Share Climbs to 30%

　　Ahead of TSMC’s earnings call tomorrow, Dutch lithography giant ASML has reinforced optimism over the AI-driven semiconductor upcycle by raising its 2026 outlook for the second time this year, as highlighted by CNBC.　　The company now expects annual sales of €43 billion ($49 billion) to €45 billion, with gross margins of 54% to 56%, according to its press release. Reuters adds that this would represent a 16% increase at the midpoint compared with ASML’s previous guidance of €36 billion to €40 billion.　　For the quarter ended June 30, ASML reported revenue of €9.33 billion ($10.90 billion), exceeding analysts’ consensus estimate of €8.80 billion, Reuters notes, adding that its net income also came in ahead of expectations at €2.92 billion, versus the €2.62 billion forecast compiled by LSEG.　　Taiwan’s Growing Role in ASML’s Sales Mix　　The strong results were underpinned by robust AI-related demand and accelerating investments in advanced-node capacity. During the earnings call, ASML CEO Christophe Fouquet said customers are rapidly expanding capacity for 5nm, 4nm and 3nm technologies while pushing the 2nm ramp as aggressively as possible, according to an earnings call transcript from Yahoo! Finance.　　As customers speed up capacity expansion and begin planning for the 1.4nm era as well, ASML expects its advanced logic foundry business to deliver around 25% revenue growth this year, Fouquet noted.　　The trend was also reflected in ASML’s second-quarter regional sales mix. Taiwan accounted for 30% of revenue during the quarter, up from 23% in 1Q26, according to the company’s earnings presentation, suggesting continued investment by TSMC as it expands capacity.　　South Korea nevertheless remained ASML’s largest market, contributing 43% of second-quarter sales, although its share edged down from 45% in the previous quarter.　　China’s contribution also fell five percentage points to 14%. Despite the decline, management reiterated that China is still expected to account for around 20% of total net sales, according to the Yahoo Finance earnings call transcript.　　EUV, DUV Expansion Accelerates　　Meanwhile, ASML, per Reuters, also gave a more detailed outlook on its own expansion plan, noting that it is set to increase capacity for both its leading-edge EUV lithography systems and DUV tools by 30% in each of the next two years, as demand remains strong across advanced chips, mature nodes and the China market.　　In 2026, ASML expects to ship around 65 Low-NA EUV systems, putting its EUV business on track for roughly 45% growth, according to the Yahoo! Finance earnings call transcript. The company has also regained momentum in DUV immersion production, with shipments expected to reach around 130 systems this year, roughly matching last year’s level.　　Notably, ASML reached a significant milestone in High-NA EUV adoption, with Intel deploying the next-generation lithography system to produce part of its flagship Panther Lake laptop processors using the 18A process, according to its press release.

Key word：

ASM

Release time：2026-07-16 16:00 reading：197 Continue reading>>

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UMC Announces First Delivery of Mass-Produced Silicon Photonics Wafers from Singapore 12-Inch Fab

　　Taiwan’s foundry UMC and Singapore-based silicon photonics chip designer SILITH announced on July 14 the first delivery of mass-produced silicon photonics wafers from UMC’s 12-inch fab in Singapore. The milestone marks the transition of silicon photonics from development to high-volume production and will support 1.6T solutions for AI and hyperscale data centers. The platform has achieved production-grade performance with high yield and has been qualified by a leading cloud infrastructure customer for volume deployment, according to UMC’s press release.　　According to Nikkei, SILITH will be UMC’s first major customer for its new 12-inch silicon photonics production. The report adds that SILITH’s customers include leading optical transceiver makers such as Innolight and Coherent, both key suppliers to NVIDIA and Google.　　In addition to the successful commercialization of the first silicon photonics product for a customer, UMC is making its own 12-inch silicon photonics platform available for customer product development in 2027, its press release notes.　　Expanding the Silicon Photonics Roadmap　　Building on the successful commercialization of SILITH’s 200G/lane silicon photonics products, UMC and SILITH are extending their silicon photonics roadmap to support next-generation 400G-per-lane optical interconnects.　　Looking further ahead, UMC senior vice president G.C. Hung, as cited by Nikkei, said the company aims to debut an open silicon photonics platform by 2028 to help customers develop a broader range of optical chips and silicon photonics technologies.　　UMC also plans to begin offering advanced packaging services in 2027, enabling photonic chips to be connected to an interposer that shortens electrical paths to processors and improves connectivity speed, according to Nikkei. The press release also notes that UMC is collaborating with ecosystem partners to develop thin-film lithium niobate (TFLN)-based solutions for future ultra-high-bandwidth optical interconnects.　　TrendForce forecasts that the CPO/NPO market will surpass US$39 billion by 2030, with growth accelerating sharply between 2028 and 2029 as scale-up architectures begin incorporating optical interconnect technologies.

Key word：

UMC

Release time：2026-07-15 16:07 reading：219 Continue reading>>

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Samsung Reportedly Completes Tesla AI5 Tape-out, Paving the Way for 2nm Ramp at Taylor Fab

　　Samsung’s 2nm ramp at its Taylor fab may be moving closer to reality. According to Yonhap News, a Samsung Foundry official recently shared on LinkedIn that Tesla’s AI5 chip has completed tape-out and is expected to enter production afterwards on Samsung’s 2nm process at the Texas facility.　　As highlighted by Yonhap News, the disclosure marks the first time Samsung Foundry’s production timeline for the Tesla AI5 chip has been revealed in concrete terms.　　Notably, Samsung is not expected to be the sole foundry partner for Tesla’s next-generation AI chips. Yonhap News adds that Tesla will split AI5 production between Samsung and TSMC, while Samsung will reportedly take full responsibility for AI6 and TSMC will handle AI6.5.　　Meanwhile, Samsung is already mass-producing Tesla’s existing AI4 chip on its 7nm process at the Pyeongtaek foundry line, with the upgraded AI4 version also expected to be produced at the same campus, according to Yonhap News.　　Taylor Fab Becomes Key to Samsung’s Foundry Recovery　　The positive development, as noted by The Guru, also signals that preparations for Samsung’s Taylor fab are accelerating. Samsung began moving key front-end and back-end semiconductor equipment into the facility in late April and has deployed core engineers from its South Korean headquarters to secure initial yields, the report adds.　　As previously reported by The Elec, Samsung has reaffirmed that the Texas fab will begin ramp production in 2027. Beyond standard 2nm, industry observers cited by the report also expect Samsung to introduce its SF2P+ (second-generation enhanced 2nm process) at the facility, further strengthening its advanced-node capabilities.　　A successful 2nm ramp at Taylor could provide fresh momentum for Samsung Foundry’s long-awaited recovery after years of losses, ET News reports. With its mid- to long-term order backlog nearing KRW 50 trillion, Samsung is also expanding its foundry customer base beyond Tesla, securing partnerships with major tech companies including Meta and Anthropic, the report adds.

Key word：

Samsung

Release time：2026-07-14 15:24 reading：269 Continue reading>>

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TSMC’s June Revenue Hits Record NT$442.7 Billion, Q2 Sales Reach Guidance High End: Earnings Call Preview

　　Ahead of TSMC’s July 16 earnings call, the foundry giant today posted record June sales, with revenue rising 6.2% MoM and 67.9% YoY to reach NT$442.7 billion, according to its press release. The strong June performance lifted TSMC’s Q2 revenue to approximately NT$1.27 trillion, falling on the upper end its original guidance range of US$39 billion–$40.2 billion (roughly equivalent to NT$1.24 trillion–NT$1.27 trillion) and marking a new quarterly record.　　TSMC’s cumulative revenue for January through June 2026 reached NT$2,404,484 million, up 35.6% year-on-year from NT$1,773,046 million in the same period of 2025, the company said.　　Upside Ahead for 2026 Revenue and Q2 Gross Margin　　Against the backdrop of stronger-than-expected June sales, analysts cited by Commercial Times expect TSMC to also outperform its 2026 full-year revenue outlook and Q2 gross margin guidance. The company previously guided for full-year U.S. dollar revenue growth of above 30%, but Morgan Stanley now expects the company to raise the outlook toward 40% YoY, while UBS has lifted its forecast to 37%, according to the report.　　For profitability, analysts also see upside to TSMC’s Q2 gross margin guidance of 65.5%–67.5%, with some brokerages cited by Commercial Times forecasting margins approaching 70%, including estimates of 69% and 69.5%.　　Looking further ahead, Liberty Times, citing analysts, expects TSMC’s margin momentum to remain strong through 2027, with gross margin projected to stay above 66% this year and exceed 68% next year.　　Aggressive Capex Push Ahead　　Meanwhile, TSMC is expected to step up its investment pace, with analysts seeing further upside beyond the company’s 2026 capex guidance. While TSMC expects 2026 capital spending to land at the high end of its US$52 billion–$56 billion range, analysts cited by Commercial Times expect faster 2nm and 3nm expansion to push capex higher, with forecasts reaching US$58 billion and even US$60 billion from more bullish estimates.　　The aggressive spending plan is expected to fuel TSMC’s advanced-node expansion. Economic Daily News, citing analysts, expects 3nm capacity to reach 170,000 wafers per month this year and surpass 200,000 by 2028. Combined A14, 2nm/A16, and 3nm capacity could reach 350,000–400,000 wafers per month, the report adds.　　The investment push is also expected to extend into advanced packaging. Commercial Times, citing analysts, forecasts TSMC’s CoWoS capacity to reach 2 million units by 2027, significantly above the previous estimate of 1.35 million. Notably, the Economic Daily News highlights that TSMC’s CoPoS is expected to enter mass production in 2029–2030, with initial capacity of 40,000–50,000 wafers per month.

Key word：

TSMC

Release time：2026-07-14 15:23 reading：306 Continue reading>>

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Samsung Reportedly Developing 4nm GAIA AI PC Chip; Mass Production Targeted as Early as 2027

　　Samsung is reportedly preparing to enter the AI PC chip market. According to Hankyung, industry sources say Samsung Electronics’ System LSI Business under the Device Solutions (DS) Division is developing GAIA, a 4nm AI accelerator for AI PCs. Prototype chips have reportedly already been provided to major customers, including Lenovo and HP, for performance validation, with mass production targeted as early as 2027.　　Samsung plans to pair GAIA with processing-in-memory (PIM), a next-generation DRAM technology that performs computations directly within memory, as the report indicates. Unlike traditional PC processors, GAIA is designed specifically for AI workloads, with an optimized NPU architecture aimed at efficiently handling generative AI tasks.　　The reported move follows Samsung’s earlier attempt to enter the PC chip market 14 years ago with an Exynos application processor that powered Samsung Chromebooks in 2012. However, it failed to break Intel’s dominance and withdrew from the business roughly two years later.　　AI PC Chip Competition Intensifies　　Samsung’s reported move positions it alongside a growing number of companies targeting the AI PC market. The report says the segment remains in its early stages and has yet to produce a dominant player as the AI agent era begins to emerge. Companies including NVIDIA, Qualcomm, Intel, and Huawei are already competing in the space. NVIDIA unveiled its next-generation RTX Spark AI PC chip in May, while Qualcomm first introduced the Snapdragon X Elite in 2023 before expanding its lineup with the entry-level Snapdragon C.　　EBN News says Samsung Electronics aims to differentiate itself by leveraging its leadership in memory alongside the AI chip design expertise gained from developing smartphone APs and mobile NPUs. Industry observers believe that combining AI accelerators with processing-in-memory (PIM) technology could enhance both AI processing performance and power efficiency.　　Industry observers cited by Hankyung say the success of Samsung’s AI PC chip initiative will depend largely on its ability to secure major customers and bring the product to market. If the company achieves mass production and builds a stable supply chain, the business could emerge as a key growth driver, helping the System LSI Business address its long-standing structural losses.　　Despite the growth opportunity, Samsung’s expansion into the AI accelerator market may also present strategic challenges. Hankyung notes that companies including NVIDIA and Qualcomm, which Samsung is expected to compete against in the AI PC market, are also among Samsung Foundry’s key customers.

Key word：

Samsung

Release time：2026-07-13 13:53 reading：280 Continue reading>>

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DRAM Rally Lifts Nanya Tech’s 2Q Gross Margin to Nearly 80%, Closing in on Global Memory Leaders

　　The ongoing phase-out of legacy DRAM capacity by major memory manufacturers has tightened supply and lifted pricing, positioning Taiwan’s Nanya Technology among the biggest beneficiaries. Citing Liberty Times, the company reported a second-quarter gross margin of 79.5%, as average DRAM selling prices rose more than 60% from the previous quarter.　　The strong pricing environment lifted Nanya Tech’s profitability metrics to levels rarely seen among memory suppliers. Its second-quarter gross margin of 79.5% even surpassed foundry titan TSMC’s guidance of 65.5% to 67.5% for the same period, while operating margin climbed to 73.7%, Liberty Times notes.　　By comparison, U.S. memory giant Micron reported record gross and operating margins of 84.9% and 81.2%, respectively, in the third quarter of fiscal 2026.　　According to Commercial Times and Liberty Times, Nanya Technology posted a sharp rebound in the second quarter, as revenue jumped 68.2% sequentially to NT$82.55 billion and net profit surged 92.6% to NT$50.19 billion, yielding EPS of NT$14.66.　　Memory Shortage Expected to Last Several Quarters　　Notably, Nanya Technology is emerging as a player in the AI memory market, with AI infrastructure and server-related products contributing more than 20% of first-half revenue, according to Liberty Times. The company is also expanding its reach across multiple applications with a comprehensive DRAM portfolio, including DDR5, LPDDR5/5X, DDR4, LPDDR4/4X, DDR3 and LPDDR3.　　Looking ahead, Yahoo! Finance, citing Nanya Tech President Pei-Ing Lee, reports that as rising demand for HBM and RDIMM from AI and general-purpose cloud servers keeps tightening supply for smartphones, PCs, automotive and consumer electronics, the memory shortage is expected to persist for several more quarters, with multi-year long-term agreements (LTAs) increasingly becoming the industry norm.　　On the capacity front, Next Apple reports that Nanya Tech plans to ramp up its new fab in phases, with the first stage targeting monthly wafer starts of 30,000 units by 2028 and full capacity reaching 45,000 wafers per month. Meanwhile, development of its third-, fourth- and fifth-generation 10nm-class process technologies (1C/1D/1E), along with EUV-related research, is progressing as planned, the report adds.

Key word：

DRAM

Release time：2026-07-13 13:49 reading：262 Continue reading>>

Trade news

SK Group Chairman Joins ADR Listing Event; Samsung Reportedly Seeks Big Tech Foundry Orders at Sun Valley

　　SK Group Chairman Chey Tae-won is attending SK hynix’s American Depositary Receipt (ADR) listing ceremony on Nasdaq in New York on the morning of July 10 local time. According to ETNews, in addition to meeting with global investors, Chey is expected to hold discussions with major customers on expanding AI memory cooperation. The report also says he may meet with executives from leading tech companies, including NVIDIA and Tesla, during his U.S. visit.　　As the report notes, Chey’s attendance at the event is seen as an effort to showcase SK hynix’s AI memory competitiveness and long-term growth potential to global investors. The report adds that the ADR listing was intended to help the company achieve a valuation in global capital markets that better reflects its role as a key enabler of AI infrastructure expansion.　　The ADR offering is valued at approximately KRW 43 trillion and involves the issuance of up to 17.79 million new shares, representing about 2.5% of the company’s total outstanding shares. The report says the proceeds will be used to finance construction of the first fab at the Yongin semiconductor cluster, the Cheongju P&T7 advanced packaging fab, and the purchase of manufacturing equipment, including extreme ultraviolet (EUV) scanners.　　Samsung Courts Big Tech at Sun Valley　　Samsung executives are also in the U.S., where Samsung Electronics Chairman Jay Y. Lee has attended the Sun Valley Conference alongside Han Jin-man, President and Head of the Foundry Business. According to ZDNet, the move reflects Samsung’s push to secure AI semiconductor orders from major technology companies. Lee is accompanied this year by Han Jin-man, who was appointed head of Samsung’s foundry business late last year. The report says Han is expected to support discussions on securing foundry orders from major tech companies during the conference.　　Against this backdrop, attention has turned to potential foundry customers. According to The Korea Herald, one of the most closely watched meetings is with Apple executives, including CEO Tim Cook, incoming CEO John Turnus, and Senior Vice President of Services Eddy Cue. The report says Samsung Foundry, which secured an order for iPhone image sensor chips last August, is aiming to join Apple’s application processor (AP) supply chain, currently served by TSMC.　　Beyond Apple, The Korea Herald also notes that Amazon CEO Andy Jassy and OpenAI CEO Sam Altman are attending the conference. Both companies are developing in-house AI chips to compete with NVIDIA, already source High Bandwidth Memory (HBM) from Samsung Electronics, and are viewed as potential Samsung Foundry customers.

Key word：

SK Group

Release time：2026-07-10 10:56 reading：296 Continue reading>>

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Intel Patent Reveals XBM Matching HBM4 Footprint Without Interposers; Commercialization Seen After 2030

　　As AI chip demand surges, existing high-bandwidth memory (HBM) is facing supply and cost challenges, prompting the search for alternative memory technologies. According to Tom’s Hardware, an Intel patent application published on July 2, 2026 reveals the company’s proposed cross-batch memory (XBM) architecture, designed to ease the packaging and cost bottlenecks of today’s interposer-based HBM. The report states that the design aims to match HBM4’s footprint while replacing conventional DRAM and its ultra-wide interface with back-end-of-line (BEOL) transistors and serial Universal Chiplet Interconnect Express (UCIe) links.　　As noted by Wccftech, XBM is expected to target commercialization after 2030, in line with ZAM, the memory architecture Intel is co-developing with SoftBank subsidiary SAIMEMORY.　　XBM Architecture and Advantages　　The proposed architecture centers on DRAM blocks connected to a UCIe I/O block operating at 32 GT/s, with the I/O routed through the base die. According to Wccftech, each XBM stack provides a die capacity ranging from 0.5GB to 5GB. Each sub-channel consists of 12 data blocks, with up to 96 data blocks in an 8-high XBM stack and 192 in a 16-high stack. These channels operate at 2GHz. The report also notes that XBM can be implemented in multiple package configurations, including Memory-on-Package (MoP), enabling higher bandwidth and capacity in smaller form-factor designs.　　Notably, the memory die uses 1T1C (one transistor, one capacitor) back-end DRAM, with transistors fabricated in the back-end-of-line (BEOL) metal layers rather than front-end silicon, Wccftech says. According to the report, this significantly improves area efficiency, allowing more space for TSVs (Through-Silicon Via) and enabling higher memory density and bandwidth.　　Competitive and Ecosystem Challenges　　The global HBM market is currently dominated by South Korean suppliers. As Global Economic News points out, conventional HBM incurs high manufacturing costs due to the micro-bump processes used to vertically stack DRAM dies, while silicon interposers add significant routing complexity and cost. Intel’s proposed XBM architecture is designed to address these limitations.　　However, Global Economic News also notes that Intel’s proposal is unlikely to immediately shift the industry’s competitive landscape. SK hynix and Samsung Electronics have spent several years developing cost-saving technologies, including standard chiplets, UCIe, and fan-out packaging, to reduce interposer costs. The report further notes that platform compatibility and software ecosystems remain major barriers to adoption. The global AI accelerator ecosystem, led by NVIDIA, is currently optimized for the existing HBM architecture and wide-bandwidth parallel interfaces, making a transition to alternative memory architectures more challenging.

Key word：

Intel

Release time：2026-07-09 11:24 reading：338 Continue reading>>

Trade news

Samsung’s 2Q Operating Profit Soars 1,810% to Record KRW 89.4T, Reportedly Surpassing NVIDIA and Apple

　　Amid surging DRAM and NAND prices, Samsung’s newly released second-quarter earnings guidance once again exceeded market expectations. According to the the company, cited by Hankyung, preliminary second-quarter operating profit reached KRW 89.4 trillion (US$65.6 billion), up 1,810.3% year over year. According to News 1, this would translate into an operating profit margin of 52.3%.　　Hankyung notes that the result marks Samsung’s highest quarterly operating profit on record, extending its record-breaking earnings streak to three consecutive quarters. ZDNet further highlights that the figure surpasses the quarterly operating profits of U.S. tech giants NVIDIA and Apple.　　Samsung’s record-breaking performance marks the highest quarterly operating profit ever reported by a global IT company, according to ZDNet, surpassing NVIDIA’s previous record of US$53.5 billion (approximately KRW 81.9 trillion) posted in the first quarter of fiscal 2027 (ended April 2026).　　The scale of the earnings surge is further underscored by comparisons with Samsung’s past performance. The company posted operating profit of just KRW 4.7 trillion in the same period last year, while its projected 2Q26 operating profit alone surpassed Samsung’s cumulative operating profit over the entire three-year period from 2023 to 2025, according to Reuters.　　Meanwhile, the company’s preliminary second-quarter revenue came in at roughly KRW 171 trillion, up 129.3% from a year earlier, Hankyung notes.　　Memory Prices Fuel Samsung’s Record Quarter　　The strong results were primarily driven by Samsung’s booming memory semiconductor business within its Device Solutions (DS) division, with industry observers noting that the company has been a major beneficiary of surging memory prices.　　According to ZDNet, average selling prices (ASPs) reportedly climbed more than 50% quarter over quarter for DRAM and over 60% for NAND. A separate ZDNet report also points out that the momentum is expected to continue, as Samsung Electronics is negotiating aggressively with customers to raise its third-quarter DRAM ASP by as much as 20% from the previous quarter.　　This strong performance aligns with TrendForce’s latest memory pricing survey, which indicates that the DRAM market will remain extremely tight in the third quarter of 2026, with contract DRAM prices expected to rise another 13–18%.　　However, Reuters also notes that despite another strong quarter expected from its memory business, losses in Samsung’s foundry and System LSI operations are likely to deepen, as employee bonus expenses continue to be allocated across the broader semiconductor division.

Key word：

Samsung

Release time：2026-07-08 13:16 reading：380 Continue reading>>

model	brand	Quote
BD71847AMWV-E2	ROHM Semiconductor
TL431ACLPR	Texas Instruments
CDZVT2R20B	ROHM Semiconductor
RB751G-40T2R	ROHM Semiconductor
MC33074DR2G	onsemi

model	brand	To snap up
IPZ40N04S5L4R8ATMA1	Infineon Technologies
BP3621	ROHM Semiconductor
ESR03EZPJ151	ROHM Semiconductor
STM32F429IGT6	STMicroelectronics
TPS63050YFFR	Texas Instruments
BU33JA2MNVX-CTL	ROHM Semiconductor

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