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CXMT’s 471% STAR Debut Makes It China’s Top Listed Firm, Reshaping Global Memory Dynamics

　　China’s leading DRAM maker, CXMT, officially debuted on the Shanghai Stock Exchange’s STAR Market on July 27. According to TechNews, the company’s share price surged as much as 471.6% on its first trading day. After pricing its IPO at RMB 8.66 per share, the stock climbed to an intraday high of RMB 49.50, lifting CXMT’s market capitalization to approximately RMB 3.3 trillion (US$487 billion) and making it China’s most valuable listed company.　　CXMT’s market capitalization also surpassed that of U.S. chipmaker Intel, valued at US$464 billion, and networking equipment maker Cisco, valued at US$450 billion, Nikkei notes.　　The IPO raised at least RMB 57.9 billion (US$8.6 billion), making it not only Asia’s largest IPO so far in 2026 but also the largest listing in the history of the STAR Market, surpassing SMIC’s RMB 53.2 billion offering in 2020. If the company exercises its over-allotment option to sell an additional 15% of shares, total proceeds could rise to as much as RMB 66.6 billion, TechNews adds.　　As noted by TechNews, the global AI boom has fueled a sharp rise in memory prices, driving a dramatic turnaround in the company’s profitability. According to its IPO prospectus, CXMT expects first-half 2026 net profit to reach between RMB 50 billion and RMB 57 billion, compared with a net loss of RMB 2.3 billion a year earlier.　　According to TrendForce, CXMT ranked fourth among DRAM suppliers by revenue in 1Q26 with a 7.6% market share. Samsung, SK hynix, and Micron remained dominant, collectively accounting for 89.7% of the global market.　　Pricing Power and Product Strategy　　CXMT has been capitalizing on the memory price upcycle. Reuters reports that CXMT signed a five-year supply agreement this month with ByteDance, TikTok’s parent company, worth more than US$7 billion.　　The company’s strong financial performance has also been supported by advances in its technology and product strategy. According to TrendForce, CXMT’s gradual transition to its latest G4 process has significantly improved both product quality and production output over the previous generation.　　TrendForce notes that while CXMT has secured some international customers, China remains its primary market. As China seeks to build a self-sufficient AI supply chain, the firm has become a strategically important player. TrendForce also highlights that, amid weak smartphone shipments, CXMT has reduced the share of mobile DRAM in its product mix, with server DRAM expected to become its largest product segment.

Key word：

CXMT

Release time：2026-07-28 10:50 reading：155 Continue reading>>

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AMD Unveils Next-Gen CPU Roadmap: Florence Targets 2028 with Rumored Sub-2nm Node, Ravenna in 2030

　　As NVIDIA expands its AI infrastructure roadmap with Rosa, a data center CPU designed for agentic AI workloads beyond Vera, AMD is stepping up its CPU roadmap as well. At Advancing AI 2026 on July 23, AMD revealed that its next-generation Zen 7-based EPYC server CPUs, codenamed “Florence,” are on track for 2028, followed by “Ravenna” in 2030.　　A key highlight of Florence is its transition to a next-generation process. As noted by Phoronix, CEO Lisa Su confirmed that the EPYC “Florence” will be built on a next-generation node and feature ACE AI compute extensions. Wccftech suggests that the chip could bring AMD’s EPYC lineup into the sub-2nm era, potentially using technologies such as TSMC’s A16 or A14.　　By comparison, NVIDIA’s Feynman GPU and Rosa CPU, also expected around 2028, are reportedly targeting TSMC’s A16 process, according to Commercial Times.　　Ahead of Florence, AMD’s Venice CPU is being manufactured in Taiwan using TSMC’s 2nm process, with plans to later expand production to TSMC’s Arizona fab, Commercial Times reports.　　Beyond the CPU itself, EPYC Florence will serve as the host processor for AMD’s next-generation AI rack-scale platform, codenamed “Ferrara.” The new EPYC family will also become AMD’s first to support next-generation memory standards, including MRDIMM and LPDDR, potentially paving the way for future DDR6 adoption, according to Wccftech.　　Following Florence, AMD’s “Ravenna” CPUs, based on the Zen 8 architecture, are slated for 2030 as the company continues to push for greater share in the server CPU market.　　Instinct GPU Roadmap Moves Forward　　Beyond its CPU roadmap, AMD also outlined its next-generation Instinct GPU plans. The company said the Instinct MI500 series is set to launch in 2027, featuring upgraded compute, memory and interconnect technologies, followed by the MI600 series in 2028.　　Wccftech explains that MI500 series is expected to introduce the CDNA 6 architecture, next-generation HBM4E memory, advanced GPU scale-up capabilities and a flexible design ready for both copper and optical interconnects. The lineup, according to the report, is positioned to take on NVIDIA’s Rubin Ultra GPUs, which are expected to power Kyber rack-scale systems.　　Looking further ahead, AMD is developing its CDNA-Next architecture for the MI600 series, scheduled for 2028 and aimed at competing with NVIDIA’s next-generation Feynman accelerators, Wccftech adds.　　Behind AMD’s next-generation GPU roadmap, memory supply will play a critical role. According to Digital Daily, Samsung currently supplies HBM4 for AMD’s MI455 Instinct GPUs and serves as the dedicated supplier of DDR5 solutions for the 6th-generation EPYC CPUs deployed in the Helios platform.

Key word：

AMD

Release time：2026-07-27 11:19 reading：139 Continue reading>>

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Samsung Reportedly Builds Hybrid Bonding Mass Production Line; Full-Scale Deployment Seen in 2029–2030

　　With next-generation HBM advancing, attention is increasingly turning to the commercialization of hybrid bonding. According to The Elec, citing industry sources, Samsung Electronics is establishing a mass production line equipped with around 50 die-to-wafer (D2W) hybrid bonders at its Pyeongtaek campus to support next-generation HBM and logic semiconductor production. Equipment deliveries and installation are expected to begin toward the end of 2026.　　However, The Elec notes that Samsung internally expects large-scale hybrid bonding production to begin around 2030. Weekly Post similarly reports that Samsung Electronics aims to begin full-scale hybrid bonding mass production in 2029. The era of hybrid bonding-based HBM is expected to begin with the deployments of NVIDIA’s next-generation AI GPU, Feynman. While Rubin Ultra is expected to use HBM4E, Feynman is highly likely to adopt HBM5 or custom HBM.　　BESI Remains the Front-Runner as Samsung Explores Alternatives　　Notably, Samsung Electronics has reportedly selected Dutch semiconductor back-end equipment supplier BESI as its preferred partner for D2W hybrid bonding equipment, The Elec notes. However, the order has yet to be finalized as the companies continue negotiating Samsung’s requested equipment modifications. The report also cites the price of BESI’s hybrid bonder—around KRW 6 billion (approximately US$4.3 million) per unit, roughly twice that of competing products—as a factor contributing to the prolonged negotiations. BESI, which also supplies hybrid bonders to TSMC and Micron, is reportedly reluctant to modify the tool architecture exclusively for Samsung, The Elec adds.　　While BESI remains Samsung’s preferred supplier, the company is also evaluating domestic equipment makers as alternatives. SEMES, Samsung Electronics’ semiconductor equipment subsidiary, has also reportedly been asked to supply D2W hybrid bonders for the planned mass production line. Industry sources cited by The Elec said the equipment is believed to have passed Samsung’s qualification process. Samsung is also said to be considering Hanwha Semitech as a potential hybrid bonder supplier. Hanwha Semitech completed development of its second-generation D2W hybrid bonder, SHB2 Nano, in February and supplied an evaluation system to SK hynix in April, the report notes.　　Hybrid Bonding for cHBM and 3D Packaging　　Hybrid bonding is expected to play a particularly important role in customized HBM (cHBM), The Elec notes. Samsung plans to replace the cHBM base die with a logic die incorporating customer computing IP, enabling it to support external CPUs and GPUs while optimizing data transfer. The company also aims to implement a 3D system-in-package (SiP) structure that stacks HBM DRAM layers directly on the logic die.　　Separately, Samsung Foundry introduced its next-generation hybrid bonding-based 3D vertical stacking solution, 3D Cube-H, last month, according to The Elec. Designed for next-generation AI chips and high-performance computing (HPC) systems, the heterogeneous integration technology is expected to deliver higher performance, improved power efficiency, and greater bandwidth than existing packaging solutions. Samsung Foundry is currently promoting the technology to customers.

Key word：

Samsung

Release time：2026-07-23 10:14 reading：324 Continue reading>>

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High Cost-Effectiveness for RS485 Isolation: NOVOSENSE Launches the SP301H/L Series Three-Channel Digital Isolators

　　NOVOSENSE announced the launch of the SP301H/L series, a family of three-channel digital isolators built on its proprietary third-generation capacitive isolation technology. Designed specifically for RS485 communication isolation applications, the SP301H/L series delivers comprehensive improvements in data rate, power consumption, electromagnetic immunity, and package size.　　Compared with the previous-generation SP301A and NIRS31 series products, the SP301H/L supports communication speeds of up to 8 Mbps, features a low quiescent current design, and offers enhanced electromagnetic immunity performance. Housed in a compact SSOW10 wide-body package with fine-pitch leads, the device achieves higher integration while significantly reducing PCB size, providing customers with a high-performance, highly reliable, and cost-effective isolation solution.　　RS485 communication is widely used in power metering terminals, industrial automation systems, and renewable energy storage applications due to its long transmission distance, strong noise immunity, and flexible multi-node networking capability. In these applications, isolation devices play a critical role in ensuring communication reliability and system safety. Conventional RS485 isolation solutions based on three optocouplers suffer from limitations such as high component count, restricted bandwidth, aging-related performance drift, and large PCB footprint, making them increasingly unable to meet the demands of high-speed communication, long service life, and compact system design. As system performance requirements continue to increase, digital isolation is becoming the preferred approach for next-generation RS485 isolation solutions.　　High Cost-Effectiveness: Replacing Three Optocouplers with a Single Chip for Simplified Design and Lower System Cost　　Traditional isolated RS485 communication solutions typically require three optocouplers together with multiple external resistors and capacitors, resulting in a complex BOM list, higher procurement and inventory management costs, and increased PCB space consumption. By integrating three isolation channels into a single device, the SP301H/L directly replaces discrete optocouplers and their supporting circuitry, significantly simplifying the BOM, reducing component count and routing complexity, and improving overall system integration.　　The SP301H/L adopts a compact SSOW10 wide-body package, reducing PCB size by more than 60% compared to conventional optocoupler-based solutions and freeing up valuable board space for system designers.　　In terms of performance, the SP301H/L supports data rates up to 8 Mbps on the data channel and up to 1 Mbps on the enable control channel, effectively overcoming the bandwidth limitations of traditional optocouplers. This enables high-speed, low-latency communication required by applications such as smart electricity meters and industrial fieldbus networks. To support different system architectures, the SP301H features a default-high enable pin, while the SP301L features a default-low enable pin, providing greater flexibility for MCU enable-logic implementation.　　The device also features a low quiescent current design, making it suitable for battery-powered equipment and field instruments with stringent power consumption requirements. With an operating ambient temperature range of –40°C to +125°C, the SP301H/L fully meets industrial-grade application requirements. Combining high integration, compact packaging, strong performance, and simplified external circuitry, the SP301H/L enables seamless migration from optocoupler-based solutions while addressing the growing demand for miniaturization, lightweight design, and high reliability in smart metering and industrial systems.　　High Reliability: Comprehensive Immunity Enhancement for Stable Communication Operation　　Smart electricity meters are typically deployed in complex electromagnetic environments where communication links must withstand power-grid surges, switching noise, and interference introduced by long-distance cabling. Through optimized isolation architecture and enhanced immunity design, the SP301H/L significantly improves electromagnetic susceptibility (EMS) performance for RS485 communication links, reducing bit-error rates and communication interruptions while ensuring stable and reliable data transmission.　　Compared with the previous-generation SP301A and NIRS31 series, the SP301H/L delivers substantial improvements in electromagnetic robustness:　　·EOS (Electrical Overstress) tolerance is improved by approximately 10%, with latch-up immunity exceeding 10 V. This significantly enhances resistance to power-supply overstress conditions, reducing the risk of damage caused by abnormal power fluctuations and extending overall system lifetime.　　·Excellent power-supply noise immunity enables the device to maintain normal operation and error-free communication even under high-frequency, high-amplitude system noise interference in the MHz range, improving reliability in harsh electromagnetic environments.　　·Common-mode transient immunity (CMTI) reaches a typical value of 200 kV/μs, effectively suppressing common-mode transient disturbances and ensuring accurate and stable signal transmission.　　In addition, the SP301H/L is built on NOVOSENSE’s industry-leading third-generation capacitive isolation technology, delivering outstanding isolation performance. The device supports an isolation withstand voltage of up to 5 kVrms (1 minute) and surge voltage capability exceeding 10 kV, meeting reinforced insulation requirements.　　Comprehensive “Isolation+” Portfolio Setting New Benchmarks for Isolation ICs　　Leveraging its extensive expertise and technological leadership in isolation technologies, NOVOSENSE offers a comprehensive “Isolation+” product portfolio covering digital isolators, isolated sensing solutions, isolated interfaces, isolated power supplies, and isolated gate drivers. Together, these products form a complete ecosystem designed to provide robust safety barriers for high-voltage systems.　　·“+” Represents Enhanced Safety: NOVOSENSE Isolation+ products deliver safety performance beyond basic isolation standards, helping customers establish stronger safety boundaries between high- and low-voltage domains.　　·“+” Represents a Complete Product Ecosystem: Built upon NOVOSENSE’s mature capacitive isolation IP platform, the Isolation+ portfolio encompasses digital isolators, isolated sensing devices, isolated interfaces, isolated power supplies, and isolated drivers, providing customers with a comprehensive one-stop isolation solution.　　·“+” Represents Deep Application Enablement: NOVOSENSE Isolation+ products address the critical requirements of high-voltage electric vehicle platforms, high-power solar, energy storage and EV charging systems, and highly integrated, high-efficiency AI server power supplies, enabling system-level safety, reliability, and efficiency.　　As of 2025, cumulative shipments of NOVOSENSE isolation-related ICs have exceeded 2.7 billion units. As a global leading supplier of isolation ICs, NOVOSENSE remains committed to advancing isolation technology through its comprehensive Isolation+ portfolio, leveraging core isolation IP and a complete product ecosystem to deliver one-stop isolation solutions for customers worldwide.

Key word：

NOVOSENSE

Release time：2026-07-22 13:25 reading：331 Continue reading>>

Trade news

SK Group Chairman Says Abnormal Memory Prices Should Fall; AI Chip Demand Seen Up 60–100% Next Year

　　The recent surge in memory prices has drawn comments from SK Group Chairman Chey Tae-won, who also chairs SK hynix, one of the biggest beneficiaries of the boom. According to ETNews, Chey, who also serves as chairman of the Korea Chamber of Commerce and Industry (KCCI), said current memory prices are abnormally high and warned that if prices remain elevated, PC and mobile device prices will continue to rise, with those higher costs ultimately weighing on consumer demand.　　As noted by Maeil Business Newspaper, Chey said demand for AI semiconductors is expected to increase by 60% to 100% in 2027 from 2026, while the broader memory semiconductor market is also projected to grow by at least 50% to 60% over the same period. However, he noted that few companies are meaningfully expanding supply, meaning the supply-demand gap is likely to widen further. This suggests that while the AI investment boom is driving memory prices higher, it could ultimately place greater pressure on downstream industries.　　He argued that rising prices are not a healthy sign for the market, adding that prices should fall because current levels are abnormal. He also warned that PC and mobile manufacturers cannot continue passing higher memory costs on to consumers. This suggests that while the AI investment boom is driving memory prices higher, it could ultimately place greater pressure on downstream industries.　　Chey also argued that memory companies should not restrict supply to keep prices elevated. As noted by Maeil Business Newspaper, he said limiting production to maintain high prices is not a sustainable strategy, adding that expanding supply to grow the overall market—even at the expense of slightly lower margins—would generate greater long-term benefits. He further warned that persistently high prices could attract new competitors and prompt governments to intervene.　　However, Chey acknowledged that expanding supply will not be easy. According to Maeil Business Newspaper, increasing production of advanced AI memory requires significant investment and time to build manufacturing capacity, while shortages of equipment and skilled personnel remain key constraints. Although the industry is working to maximize output, he said demand is growing much faster, raising concerns that memory prices may continue to rise rather than fall. As ETNews notes, Chey said the top priority is to expand memory production capacity wherever possible, including in Yongin, the Honam region, and the U.S.　　Chey’s comments align with SK hynix CEO Kwak Noh-jung’s assessment of the industry’s supply-demand outlook. According to Reuters, Kwak said the global memory industry is heading for its worst-ever supply shortage in 2027, with memory demand expected to outpace production capacity well into the next decade despite aggressive capacity expansion.　　Chey on AI Infrastructure and Long-Term Growth　　Beyond the memory market, Chey also predicted that even if the current supply shortage is partially eased, AI-related bottlenecks will shift to other parts of the infrastructure stack. According to ETNews, Chey said electrical equipment for energy infrastructure is already in short supply, and as AI adoption accelerates, shortages could eventually extend to power cables and even the raw materials needed to manufacture data center cables.　　Looking further ahead, Chey said the ongoing wave of AI infrastructure investment is expected to eventually lower the cost of generating AI tokens, as noted by ETNews. Once the industry enters a token economy in which AI is converted into productivity for real-world work and services, he believes a self-sustaining AI ecosystem will emerge.

Key word：

SK Group

Release time：2026-07-21 10:29 reading：305 Continue reading>>

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Micron Expands Long-Term Memory Deals with 7 Auto Clients; Qualcomm, Harman Draw Attention

　　Micron is expanding its Strategic Customer Agreements (SCAs) with a fresh batch of automotive partners as it moves to secure more long-term demand visibility. The company, in a press release, announced long-term supply deals with seven automotive customers, with Qualcomm and Samsung subsidiary Harman drawing particular attention, according to Reuters and South Korean media outlet Green Economy News.　　Micron has signed SCAs with key Tier 1 partners, including Qualcomm, Visteon, HARMAN, JOYNEXT, DENSO, Astemo and Hyundai Mobis. The memory chips, as noted by Reuters, are deployed across data centers, consumer electronics and vehicles, powering AI-driven functions ranging from advanced driver assistance systems (ADAS) to digital cockpits.　　Notably, Qualcomm, best known for its smartphone chips, is indeed making inroads into automotive: the sector was the standout performer in its 2Q26 earnings, delivering the strongest growth across all categories at +38% YoY, reaching 10% of total QCT revenue. According to The Elec, its Snapdragon Digital Chassis combines chips and software to support connected vehicles, digital cockpits and autonomous driving, including Snapdragon Cockpit, Snapdragon Auto Connectivity and Snapdragon Ride for ADAS.　　Beyond Qualcomm, Samsung subsidiary Harman has also drawn attention. Green Economy News notes that Harman has operated independently since Samsung’s 2017 acquisition, with CEO Christian Sobottka saying partnerships with key technology providers such as Micron will support the development of increasingly intelligent vehicle platforms.　　The latest automotive SCAs build on Micron’s existing relationships with major automakers, following previous long-term supply agreements with companies such as General Motors and Ford.　　Micron’s SCA Expansion　　Unlike traditional annual long-term agreements (LTAs), SCAs typically lock in both pricing and supply volumes for three to five years. According to Investing.com, Micron has signed 16 SCAs covering roughly 20% of its DRAM output and about one-third of its NAND volumes over the contract period. Meanwhile, CEO Sanjay Mehrotra, cited by CNBC, also noted that these strategic customer agreements are expected to account for roughly half — or potentially more — of Micron’s total revenue once fully implemented.　　The growing adoption of long-term memory agreements is also beginning to reshape pricing dynamics. Citing analysts, Munhwa Ilbo reports that spot prices are expected to remain firm amid tight supply, while contract prices under LTAs may rise more gradually. However, analysts noted that this reflects suppliers’ strategy to sustain high profitability over the long term, rather than weakening pricing power.　　The trend aligns with TrendForce’s latest memory pricing survey, which points out that several U.S.-based CSPs have entered into multi-year long-term agreements (LTAs), which restrict suppliers from raising prices for these clients. Consequently, TrendForce predicts that server DRAM contract prices will rise by 13–18% quarter-over-quarter in 3Q26.　　According to TrendForce, the primary source of server DRAM price increases will shift toward customers without LTAs, as well as incremental supply sold outside LTAs to existing LTA customers.

Key word：

Micron

Release time：2026-07-20 10:53 reading：323 Continue reading>>

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CXMT IPO Could Raise Up to RMB 66.6B; How Founder Zhu Yiming Built China’s DRAM Challenger

　　China’s leading memory maker CXMT is set to list on Shanghai’s STAR Market, drawing widespread market attention. The company has set its IPO price at RMB 8.66 per share and is scheduled to begin its online and offline share subscription on July 16. The company plans to issue 6.688 billion shares, representing approximately 10% of its enlarged share capital after the offering, with an over-allotment option included. According to TechNews, the market expects the IPO to raise up to RMB 66.6 billion, roughly double earlier estimates, potentially making it Asia’s largest IPO of the year.　　Beyond the sheer scale of the IPO, the company’s founder, Zhu Yiming, has also drawn attention. After founding GigaDevice 20 years ago and taking the company public in Hong Kong this January, Zhu has now found success with his second startup.　　From Silicon Valley to GigaDevice　　Born in Yancheng, Jiangsu, Zhu Yiming studied physics at Tsinghua University before pursuing electronic engineering at the State University of New York at Stony Brook. He later worked at iPolicy Networks and Monolithic System Technologies, gaining end-to-end experience in memory chip design and development.　　While working in Silicon Valley, Zhu saw the global memory industry shift from the U.S. to Japan and South Korea, inspiring him to build a homegrown Chinese memory company. As the report highlights, he founded GigaDevice, which developed China’s first high-speed mobile memory chip and became a leading NOR Flash supplier before listing in Shanghai in 2016 and Hong Kong in January 2026.　　Building CXMT　　Also in 2016, Zhu partnered with the Hefei municipal government to invest approximately RMB 18 billion in a 12-inch wafer fab, establishing CXMT. In 2018, Zhu stepped down as GigaDevice’s general manager to lead CXMT as CEO, pledging not to take a salary until the company became profitable, the report notes. Despite CXMT accumulating more than RMB 36.6 billion in losses by the end of 2025, he kept that promise for eight years. In 2019, CXMT announced the volume production of its 8Gb DDR4 chip, China’s first domestically developed DRAM chip to reach mass production.　　A Long-Awaited Turnaround　　As memory demand continued to surge, CXMT turned profitable in the first quarter of 2026. Revenue reached RMB 50.8 billion, up 719% year over year, while net profit rose 1,688% to RMB 24.76 billion. The company expects first-half 2026 revenue to reach RMB 110–120 billion, with net profit projected at RMB 50–57 billion. CXMT has also become the world’s fourth-largest DRAM supplier by market share, trailing only Samsung, SK hynix, and Micron.　　Zhu has reportedly pledged to distribute half of his post-listing stake in CXMT—worth an estimated RMB 20 billion—to employees, saying he wants the team to share in the company’s success. Meanwhile, the IPO is expected to provide CXMT with additional capital for advanced process, capacity expansion, and next-generation DRAM development, further strengthening its global competitiveness.

Key word：

CXMT

Release time：2026-07-17 10:54 reading：400 Continue reading>>

Trade news

ASML Raises 2026 Guidance for Second Time This Year; Taiwan Sales Share Climbs to 30%

　　Ahead of TSMC’s earnings call tomorrow, Dutch lithography giant ASML has reinforced optimism over the AI-driven semiconductor upcycle by raising its 2026 outlook for the second time this year, as highlighted by CNBC.　　The company now expects annual sales of €43 billion ($49 billion) to €45 billion, with gross margins of 54% to 56%, according to its press release. Reuters adds that this would represent a 16% increase at the midpoint compared with ASML’s previous guidance of €36 billion to €40 billion.　　For the quarter ended June 30, ASML reported revenue of €9.33 billion ($10.90 billion), exceeding analysts’ consensus estimate of €8.80 billion, Reuters notes, adding that its net income also came in ahead of expectations at €2.92 billion, versus the €2.62 billion forecast compiled by LSEG.　　Taiwan’s Growing Role in ASML’s Sales Mix　　The strong results were underpinned by robust AI-related demand and accelerating investments in advanced-node capacity. During the earnings call, ASML CEO Christophe Fouquet said customers are rapidly expanding capacity for 5nm, 4nm and 3nm technologies while pushing the 2nm ramp as aggressively as possible, according to an earnings call transcript from Yahoo! Finance.　　As customers speed up capacity expansion and begin planning for the 1.4nm era as well, ASML expects its advanced logic foundry business to deliver around 25% revenue growth this year, Fouquet noted.　　The trend was also reflected in ASML’s second-quarter regional sales mix. Taiwan accounted for 30% of revenue during the quarter, up from 23% in 1Q26, according to the company’s earnings presentation, suggesting continued investment by TSMC as it expands capacity.　　South Korea nevertheless remained ASML’s largest market, contributing 43% of second-quarter sales, although its share edged down from 45% in the previous quarter.　　China’s contribution also fell five percentage points to 14%. Despite the decline, management reiterated that China is still expected to account for around 20% of total net sales, according to the Yahoo Finance earnings call transcript.　　EUV, DUV Expansion Accelerates　　Meanwhile, ASML, per Reuters, also gave a more detailed outlook on its own expansion plan, noting that it is set to increase capacity for both its leading-edge EUV lithography systems and DUV tools by 30% in each of the next two years, as demand remains strong across advanced chips, mature nodes and the China market.　　In 2026, ASML expects to ship around 65 Low-NA EUV systems, putting its EUV business on track for roughly 45% growth, according to the Yahoo! Finance earnings call transcript. The company has also regained momentum in DUV immersion production, with shipments expected to reach around 130 systems this year, roughly matching last year’s level.　　Notably, ASML reached a significant milestone in High-NA EUV adoption, with Intel deploying the next-generation lithography system to produce part of its flagship Panther Lake laptop processors using the 18A process, according to its press release.

Key word：

ASM

Release time：2026-07-16 16:00 reading：348 Continue reading>>

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UMC Announces First Delivery of Mass-Produced Silicon Photonics Wafers from Singapore 12-Inch Fab

　　Taiwan’s foundry UMC and Singapore-based silicon photonics chip designer SILITH announced on July 14 the first delivery of mass-produced silicon photonics wafers from UMC’s 12-inch fab in Singapore. The milestone marks the transition of silicon photonics from development to high-volume production and will support 1.6T solutions for AI and hyperscale data centers. The platform has achieved production-grade performance with high yield and has been qualified by a leading cloud infrastructure customer for volume deployment, according to UMC’s press release.　　According to Nikkei, SILITH will be UMC’s first major customer for its new 12-inch silicon photonics production. The report adds that SILITH’s customers include leading optical transceiver makers such as Innolight and Coherent, both key suppliers to NVIDIA and Google.　　In addition to the successful commercialization of the first silicon photonics product for a customer, UMC is making its own 12-inch silicon photonics platform available for customer product development in 2027, its press release notes.　　Expanding the Silicon Photonics Roadmap　　Building on the successful commercialization of SILITH’s 200G/lane silicon photonics products, UMC and SILITH are extending their silicon photonics roadmap to support next-generation 400G-per-lane optical interconnects.　　Looking further ahead, UMC senior vice president G.C. Hung, as cited by Nikkei, said the company aims to debut an open silicon photonics platform by 2028 to help customers develop a broader range of optical chips and silicon photonics technologies.　　UMC also plans to begin offering advanced packaging services in 2027, enabling photonic chips to be connected to an interposer that shortens electrical paths to processors and improves connectivity speed, according to Nikkei. The press release also notes that UMC is collaborating with ecosystem partners to develop thin-film lithium niobate (TFLN)-based solutions for future ultra-high-bandwidth optical interconnects.　　TrendForce forecasts that the CPO/NPO market will surpass US$39 billion by 2030, with growth accelerating sharply between 2028 and 2029 as scale-up architectures begin incorporating optical interconnect technologies.

Key word：

UMC

Release time：2026-07-15 16:07 reading：313 Continue reading>>

Trade news

Samsung Reportedly Completes Tesla AI5 Tape-out, Paving the Way for 2nm Ramp at Taylor Fab

　　Samsung’s 2nm ramp at its Taylor fab may be moving closer to reality. According to Yonhap News, a Samsung Foundry official recently shared on LinkedIn that Tesla’s AI5 chip has completed tape-out and is expected to enter production afterwards on Samsung’s 2nm process at the Texas facility.　　As highlighted by Yonhap News, the disclosure marks the first time Samsung Foundry’s production timeline for the Tesla AI5 chip has been revealed in concrete terms.　　Notably, Samsung is not expected to be the sole foundry partner for Tesla’s next-generation AI chips. Yonhap News adds that Tesla will split AI5 production between Samsung and TSMC, while Samsung will reportedly take full responsibility for AI6 and TSMC will handle AI6.5.　　Meanwhile, Samsung is already mass-producing Tesla’s existing AI4 chip on its 7nm process at the Pyeongtaek foundry line, with the upgraded AI4 version also expected to be produced at the same campus, according to Yonhap News.　　Taylor Fab Becomes Key to Samsung’s Foundry Recovery　　The positive development, as noted by The Guru, also signals that preparations for Samsung’s Taylor fab are accelerating. Samsung began moving key front-end and back-end semiconductor equipment into the facility in late April and has deployed core engineers from its South Korean headquarters to secure initial yields, the report adds.　　As previously reported by The Elec, Samsung has reaffirmed that the Texas fab will begin ramp production in 2027. Beyond standard 2nm, industry observers cited by the report also expect Samsung to introduce its SF2P+ (second-generation enhanced 2nm process) at the facility, further strengthening its advanced-node capabilities.　　A successful 2nm ramp at Taylor could provide fresh momentum for Samsung Foundry’s long-awaited recovery after years of losses, ET News reports. With its mid- to long-term order backlog nearing KRW 50 trillion, Samsung is also expanding its foundry customer base beyond Tesla, securing partnerships with major tech companies including Meta and Anthropic, the report adds.

Key word：

Samsung

Release time：2026-07-14 15:24 reading：435 Continue reading>>

model	brand	Quote
MC33074DR2G	onsemi
CDZVT2R20B	ROHM Semiconductor
RB751G-40T2R	ROHM Semiconductor
TL431ACLPR	Texas Instruments
BD71847AMWV-E2	ROHM Semiconductor

model	brand	To snap up
IPZ40N04S5L4R8ATMA1	Infineon Technologies
BP3621	ROHM Semiconductor
ESR03EZPJ151	ROHM Semiconductor
STM32F429IGT6	STMicroelectronics
TPS63050YFFR	Texas Instruments
BU33JA2MNVX-CTL	ROHM Semiconductor

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