Murata Expands Matter-Compliant <span style='color:red'>IoT</span> Connectivity Portfolio
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Murata Expands Matter-Compliant IoT Connectivity Portfolio

　　Murata today introduced the Type 2FR connectivity module. The solution is driven by NXP® Semiconductor's RW612 Wireless MCU with integrated Tri-radio and measures just 12mm x 11mm. Its class-leading integration, efficiency, and tri-radio capabilities represent a breakthrough in IoT connectivity. Target applications include smart home devices, smart appliances, enterprise and industrial automation, and smart city and smart energy solutions.　　The Type 2FR supports various communication protocols, including dual-band WiFi 6, Bluetooth® Low Energy (LE) 5.3, 802.15.4, and ethernet. This versatility ensures seamless connectivity and operational efficiency. Additionally, Type 2FR is primed for Matter, enabling compatibility with Matter over WiFi, Matter over Thread, and Matter over Ethernet, simplifying device interoperability and management.　　With its built-in 260 MHz Arm® Cortex®-M33 core, 1.2 MB of RAM, 16 MB of flash memory, and fortified by NXP EdgeLock® security technology, the Type 2FR establishes a secure environment for a broad spectrum of IoT applications. The module offers the flexibility to operate in co-processor mode. The RW612 is supported by the NXP MCUXpresso ecosystem of software and tools to accelerate development and reduce time-to-market. The solution also boasts full regulatory certification and provides numerous external antenna options, ensuring compliance and reliability.　　Mehul Udani, Vice President, Corporate Technology and Innovation, Murata Americas stated, "Murata's commitment to innovation and collaboration is evidenced in this miniaturized, high-performance, highly integrated module. By leveraging our proprietary technology and NXP's latest Tri-radio Wireless MCU, we have delivered a robust solution that is approximately 50 percent smaller compared to discrete implementation. Further, the WiFi and ethernet capability allows the IoT device to function as a border router to enable other new applications."　　Larry Olivas, Vice President and General Manager for Wireless Connectivity Solutions, NXP Semiconductors added, "Murata possesses a strong mass market portfolio of wireless module solutions based on NXP’s ICs. This latest offering demonstrates an advanced solution that enables a complete system in a module, thus reducing design time and risk for IoT developers.”　　This announcement represents an expansion of Murata’s new class of IoT offerings announced in March. The Type 2EL is a small and high-performance module based on NXP’s IW612 combo chipset and supports IEEE 802.11a/b/g/n/ac/ax + Bluetooth 5.3 BR/EDR/LE + 802.15.4. The Type 2DL is based on NXP’s IW611 combo chipset and supports IEEE 802.11a/b/g/n/ac/ax + Bluetooth 5.3 BR/EDR/LE.　　Murata will showcase the Matter-enabled tri-radio module solution portfolio at CES 2024 January 9-12 in Las Vegas (West Hall, Booth 6300). Samples will be available at the same time. More information can be requested from the Murata team here.
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Release time：2024-01-12 15:47 reading：1725 Continue reading>>
Murata and IIJ to launch a new <span style='color:red'>IoT</span> data service, “Crossborder Co-DataBiz Platform”
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Murata and IIJ to launch a new IoT data service, “Crossborder Co-DataBiz Platform”

　　Murata and IIJ have today announced the launch of the Crossborder Co-DataBiz IoT data service platform, a collaborative service founded on the sensing and network technologies, data analytics, business model knowledge and know-how developed by the two organizations through the highly successful Traffic Counter data service.　　Commercially available from today, the platform enables one-stop provision of everything required to setup and operate a cross-border data collection and analysis business. Customers of the service gain access to all systems and functions required to collect, analyze, and act upon acquired data, including the sensor devices, the networks necessary for data collection, the cloud infrastructure for data utilization, and monitoring and operating systems at both the edge and the cloud.　　Murata’s expertise in advanced IoT devices is complimented by IIJ’s cloud services, certified for privacy protection to APEC CBPR*1 and European BCR*2 approval. Security measures for data storage and utilization are ensured by Safous, IIJ's network service providing integrated, zero-trust level 4 security.　　This robust and secure platform complies with all relevant local laws and regulations within Southeast Asia, including aspects relating to cross-border use of acquired data. Customers can also leverage Murata’s know-how and relationships with local service providers and governments to customize the collection, accumulation, analysis, and visualization of their operational data.　　The Co-Databiz platform is ideally suited to applications such as:　　Maintenance of roads and equipment in public transportation　　Traceability management of automobile and other mobile data　　Sensing of local workers in ports and industrial areas and improving the working environment　　Soil, water, and production management in smart agriculture　　Two early examples of customer solutions built upon the Co-Databiz platform include:　　The Tripod Works TRac Cloud solution enables centralized management of alcohol checker measurements in the cloud via a smartphone app. The solution also enables ID verification by transmitting photographs along with the result. This service is being developed in response to commercial driving regulations, currently in Japan and soon to become legal requirements in Thailand. IIJ and Murata’s expertise will guarantee the security of this confidential information in accordance with local laws.　　Nippon Koei and UrbanX Technologies are developing an AI solution which automatically detect road surface damage based on images obtained from smartphones and other cameras installed in vehicles and displays maps and detailed road surface damage information on a management screen on the Web. The solution enables local governments to save labor costs, improve the efficiency of road inspections and repairs and implement preventative maintenance programs.　　*1CBPR (Cross Border Privacy Rules): The CBPR certification system applies to the cross-border protection of personal data by corporations or organizations, indicating their compliance with the APEC (Asia-Pacific Economic Cooperation) privacy principles in the transfer of personal data.　　*2BCRs (The Binding Corporate Rules): BCRs are documented internal rules that define the group's personal data protection policies, written in accordance with the EU's General Data Protection Regulation (GDPR). IIJ Group received approval for its BCRs, from the Data Protection Authority for the German state North Rhine-Westphalia in 2021.　　Murata in Brief　　Murata Manufacturing Co., Ltd. is a worldwide leader in the design, manufacture and sale of ceramic-based passive electronic components & solutions, communication modules and power supply modules. Murata is committed to the development of advanced electronic materials and leading edge, multi-functional, high-density modules. The company has employees and manufacturing facilities throughout the world.
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Release time：2023-12-14 13:53 reading：1934 Continue reading>>
Fibocom Unveils 4G Premium Smart Module SC228 to Drive A<span style='color:red'>IoT</span> Applications in the Global Market
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Fibocom Unveils 4G Premium Smart Module SC228 to Drive AIoT Applications in the Global Market

　　Fibocom (Stock code: 300638), a global leading provider of IoT (Internet of Things) wireless solutions and wireless communication modules, announces the release of a new LTE smart module SC228 for the acceleration of digital transformation in smart retailing, smart wearable camera, Industrial IoT, In-vehicle infotainment market. Integrated with a 6nm processor, the module utilizes the powerful CPU and GPU to deliver superior multimedia performance while conserving power. Compatible with frequency bands worldwide, the module also supports Bluetooth and dual-band Wi-Fi for short-distance wireless communication.　　The integration of AI and IoT is reshaping the way that decision-makers from various industries operate and respond to real-time information. The highly integrated smart module SC228 is capable of offering a comprehensive solution for industry customers to improve product performance and facilitate the decision-making process. Equipped with a powerful CPU, SC228 can support the smooth running of AI algorithms, which ensures the terminals realize a bunch of functionalities such as facial recognition, HMI (Human-machine Interaction), etc. In terms of multimedia processing, the SC228 is integrated with a low-power island DSP (Digital Signal Processors) for sensors and audio, furthermore, it also supports multi-camera input and output with up to three of them working simultaneously. To cater to diverse IoT application scenarios, the SC228 is designed with rich interfaces including MIPI/ USB/ UART/ SPI/ I2C to help customers develop the terminals flexibly. In software design, the SC228 is preset with an upgradable Android 14 operating system in cope with the ever-evolving software innovations, which can help our customers quickly meet the requirements for GMS (Google Mobile Service) certification and continuous development for long lifecycle terminals. Notably, the premium smart module is also built-in with GNSS for fast and accurate positioning for mobile scenarios.　　“AI-driven productivity is inevitably evolving as an essential to extend the capabilities of IoT devices, significantly improve the operational efficiency by enriching the IoT device with edge computing,” said Eden Chen, General Manager of MC BU at Fibocom. “We are pleased to be at the forefront of the AIoT market to provide a comprehensive, highly integrated SC228 smart module solution for various industries, looking forward, we are optimistic to unleash the interconnected intelligence with our powerful smart module portfolio.”　　Engineering sample will be available by late December 2023.
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Release time：2023-11-21 10:22 reading：2323 Continue reading>>
ingenic：Multi-core Crossover <span style='color:red'>IoT</span> Micro-processor — X2600
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ingenic：Multi-core Crossover IoT Micro-processor — X2600

　　• MIPS core for advanced compute, RISC-V core for realt-time control　　• Low power consumption　　• SIP DRAM 64M~512M Bytes　　• Multiple interfaces for display and connectivity　　•Self-developed printer controller inside　　Applications　　• Smart Commercial Display　　• Vacuum Robots　　• Industrial Robots　　• Commercial Printers　　• Smart Home　　• Industrial Control　　Block Diagram　　Specifications
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Release time：2023-10-16 13:32 reading：1830 Continue reading>>
Murata’s Latest Wireless Module Utilizes Wi-Fi 6E & Bluetooth 5.3 to Deliver Enhanced Performance for <span style='color:red'>IoT</span> Implementations
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Murata’s Latest Wireless Module Utilizes Wi-Fi 6E & Bluetooth 5.3 to Deliver Enhanced Performance for IoT Implementations

　　Murata, an industry leading electronics manufacturer, has further expanded its range of state-of-the-art wireless communication modules. The new LBEE5XV2EA (Type 2EA) module utilises Infineon’s CYW55573 system-on-chip (SoC), providing Bluetooth® 5.3 and triband Wi-FiTM operation – which includes both 2.4GHz and 5GHz bands as well as 6GHz band, Wi-Fi 6E, support.　　With many areas of the RF spectrum becoming increasingly overcrowded, Wi-Fi communication speeds can often suffer. The latest Wi-Fi 6E standard allows the same 9.6Gbps data rate as 5GHz Wi-Fi 6, but overall performance is more consistent thanks to less congestion and interference at 6GHz frequencies. Furthermore, Wi-Fi 6E provides additional (and wider) broadcast radio channels, which helps to increase data throughput in high-traffic areas.　　The module supports Wi-Fi 6’s target wake time (TWT) feature. This ensures that the device spends more time in standby mode, only communicating when necessary to reduce overall energy consumption and optimise network efficiency.　　The Type 2EA is equipped with on-board Bluetooth 5.3 functionality, including Bluetooth LE (low energy) Audio. This standard employs a new audio codec known as low complexity communications codec (LC3), which provides enhanced high-quality audio at a lower power requirement than Bluetooth Classic.　　20/40/80MHz channels are all incorporated into the module, with 1024-QAM modulation and a 2x2 MIMO antenna arrangement, helping to achieve heightened levels of data throughput. The Type 2EA’s wireless specification meets the latest IoT demands, making it ideal for low-latency communication applications such as video streaming, conference systems, virtual reality (VR) and augmented reality (AR) equipment, surveillance camaras, high resolution digital still camara, and alarm systems.　　Compared to other Wi-Fi 6E solutions available on the market, the Type 2EA has a better optimised design, thanks to utilising Murata’s high-performance components and miniaturisation expertise. With its surface mount device (SMD) design and compact size of just 12.5mm x 9.4mm x 1.2mm, the wireless module allows for easy system integration.　　While FCC certification is in preparation, the availability of ISED and MIC certification, along with conductive tests for CE, also helps to simplify any compliance process. This means that fewer engineering resources need to be committed, delivering both time and cost savings.
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Release time：2023-09-12 10:20 reading：2532 Continue reading>>
Diotec Semiconductor MMFTP3334K P-Channel Enhancement Mode FET
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Diotec Semiconductor MMFTP3334K P-Channel Enhancement Mode FET

　　Diotec Semiconductor MMFTP3334K P-Channel Enhancement Mode FET offers fast switching times, high drain current (4A maximum), and low on-state resistance in a SOT-23 (TO-236) package. The MMFTP3334K FET features a 30V maximum drain-source voltage, 1000mW maximum power dissipation, and 5.9nC typical total gate charge in a -50°C to +150°C junction temperature range. The Diotec Semiconductor MMFTP6312D Dual P-Channel MOSFET is ideal for signal processing, drivers, and logic-level converters.　　FEATURES　　ESD protected gate　　High drain current　　Low on-state resistance　　Fast switching times　　Commercial-grade　　UL 94V-0 case material　　SOT-23 (TO-236) package style　　Moisture Sensitivity Level (MSL) 1　　AEC-Q101 qualified (-AQ only)　　Lead-free, RoHS and REACH compliant　　APPLICATIONS　　Signal processing　　Logic level converters　　Drivers　　SPECIFICATIONS　　30V maximum drain-source voltage　　±20V maximum gate-source voltage　　1000mW maximum power dissipation　　4A maximum drain current　　16A maximum peak drain current　　1?A maximum drain-source leakage current　　10?A maximum gate-source leakage current　　0.8V to 2V gate threshold voltage range　　71mΩ to 136mΩ maximum drain-source on-state resistance range　　280pF typical input capacitance　　55pF typical output capacitance　　40pf typical reverse transfer capacitance　　5.9nC typical total gate charge　　0.8nC typical gate-source charge　　1.2nC typical gate-drain charge　　13ns typical turn-on delay/rise time　　22ns typical turn-off delay/fall time　　1.2V maximum forward voltage　　125K/W typical junction-to-ambient thermal resistance　　-55°C to +150°C junction temperature range
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Release time：2023-02-28 14:42 reading：1691 Continue reading>>
Ameya360:How to Select Wireless SoCs for Your <span style='color:red'>IoT</span> Designs
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Ameya360:How to Select Wireless SoCs for Your IoT Designs

　　Selecting a wireless system-on-chip (SoC) for your design isn’t easy. It requires careful consideration around several factors, including power consumption, size and cost. The SoC also needs to support the right wireless protocols for the IoT application and network, which then entails factors like range, latency and throughput.　　Max Palumbo, product marketing manager for wireless connectivity, secure connected edge, at NXP Semiconductors.　　One way to ensure that your IoT design is optimized for the application is by carefully considering your choice of wireless SoCs. It also requires a careful evaluation of the key requirements of your design—including battery life, compute and memory resources, and footprint—because there will be performance tradeoffs, depending on the application.　　Designers have many factors to consider when selecting wireless SoCs for their products, said Max Palumbo, product marketing manager for wireless connectivity, secure connected edge, at NXP Semiconductors. “There is no right answer in terms of what device or architecture to choose, as this depends on the series of engineering tradeoffs that the product designer is willing to make to satisfy the needs of their end customer.”　　There is also industry agreement that a strong development ecosystem with comprehensive support tools and service is paramount. These product and prototyping tools and services can help designers reduce their time to market and cost.　　So let’s address some of the top-of-mind design issues that engineers should consider when selecting wireless SoCs for their IoT designs, as well as some of the biggest challenges and tradeoffs.　　Use cases dictate design　　Most wireless SoC manufacturers agree that the application requirements determine the selection of the wireless SoC and help narrow down the options for the IoT design. One of the most critical factors is power consumption, they said, followed by a host of other considerations, such as wireless protocols, performance, cost, size, tool support and ease of integration.　　While power consumption is tapped as one of the most critical factors in selecting wireless SoCs, choice of the wireless protocol is governed by the application.　　The end application determines the priorities, said Brandon Bae, senior director of product marketing for wireless connectivity at Synaptics Incorporated.　　He cited a few application examples in which design priorities define the selection of the wireless SoC.　　“For example, if it’s a battery-powered device, such as a wearable with a single Bluetooth connection, they may choose our SYN20703P [single-chip Bluetooth transceiver and baseband processor],” Bae explained. “If it’s a drone, they may need our SYN43400 Wi-Fi SoC, as power consumption and size—and weight—are very important and developers have to make the decision based on their go-to-market strategy.　　“A drone may also need both Wi-Fi and Bluetooth,” he added. “At that point, the number of wireless interfaces required for the application becomes important, and an integrated SoC with both is typically the best approach. Our SYN43756 [single-chip IEEE 802.11ax 2 × 2 MAC/baseband/radio with integrated Bluetooth 5.2] is a good solution for that.”　　Bae also noted that “application dependency can be extrapolated to include aggregation points or gateways for the IoT where multiple heterogeneous wireless networks come together.” This would benefit from a higher level of integration, with Bluetooth, Wi-Fi and Zigbee/Thread (IEEE 802.15.4 PHY), such as that provided by the Triple Combo SYN4381 wireless SoC, he said.　　Dhiraj Sogani, senior director of wireless product marketing at Silicon Labs, agreed: “Every wireless protocol is playing a different role, and the end-application use cases are the most important in deciding one or more of these protocols for an IoT device.”　　Sogani said there are several key factors in selecting a wireless SoC for an IoT device, which vary by the application. His top five considerations, which are important for all kinds of IoT devices, include wireless protocols; security; battery life; hardware and software support, including peripherals, GPIOs, IDE support, cloud support and networking/wireless stack integration; and compute and memory resources available for the application after the OS, networking stacks and the wireless stacks have been integrated into the wireless SoC.　　For wireless protocols, requirements include application throughput, latency, number of network nodes and range, he said. “IoT devices are becoming more complicated every day as more functionality is getting integrated into the devices. Adding wireless to the IoT devices increases the complexity manifold. There are many wireless protocols being used in IoT devices, including Wi-Fi, BT, BLE, Zigbee, Thread, Z-Wave and cellular. The choice of wireless communication protocols for a particular device depends upon the application, size, cost, power and several other factors.”　　Sogani cited several examples in which the application, together with the performance requirements, are key to the decision-making.　　“BLE is a good protocol to use for a home-temperature sensor, as it consumes low power, it is lower in cost than some other protocols and it provides the necessary range in a typical home environment,” he said. “NFC provides the lowest throughput and the shortest range, making it ideal for contactless-payment–like applications. Wi-Fi provides higher application throughput needed for several applications, such as security cameras.”　　Design challenges　　Most chipmakers agree that wireless SoCs can simplify designs by integrating the different wireless protocols and handling the coexistence challenges between multiple protocols. They also deliver space savings, a key concern in many IoT designs. However, there are use cases where discrete solutions could offer the best value in terms of both performance and cost.　　“The benefits of a wireless SoC are many and include the assurance of a proven design, shorter time to market, smaller overall footprint, lower bill of materials [BOM] and lower inventory management costs,” said Synaptics’ Bae. “These advantages apply to mostly all end applications, but there may be instances where a discrete solution may work better if the customer has specific requirements and has the RF design skills and resources to implement in that direction.”　　NXP’s Palumbo said that when determining how to architect an end product that includes wireless connectivity, “one of the first decisions a product designer must make is whether they will use a single, integrated wireless SoC or separate the wireless from the processor. An equally important decision that needs to be made is which operating system will be used. The decision of the operating system will quickly shift designers either to lower-cost, RTOS-based microcontrollers or toward larger, more scalable, Linux-based processors.”　　Integrated wireless SoCs are physically smaller and may be lower-cost due to the integration, enabling the end-product designer to deliver a smaller product or a more innovative form factor, said Palumbo.　　“However, the challenge with an integrated wireless SoC is that the designer lacks flexibility to optimize the compute performance or the wireless performance independently and the capabilities of the wireless SoC itself are invariant, so there is not as much ability to optimize individual components of the product,” he said.　　Whether using an integrated or discrete solution, power consumption is still a key factor that is influenced by the system architecture and use cases. “This means in some cases, multi-chip solutions involving separate radio and processor chips may be easier to optimize,” said Palumbo. “In other cases, wireless processors may provide all the necessary flexibility needed for specific applications and use cases.”　　Palumbo provided some key examples in which power consumption plays a critical role. “For example, simple end applications like a sensor or actuator that have a low communications duty cycle and do not perform any ancillary networking functionality, such as routing, designers will see the lowest power consumption when using an integrated wireless SoC.” This type of application can be addressed with devices like NXP’s K32W148 wireless microcontroller.　　“However, for more complex devices—a thermostat, for example—where packet routing is an important feature for the overall user experience of the end device and the target ecosystem, a discrete solution may be lower power,” he said. “If a network co-processor [NCP] is included alongside the primary compute SoC, then this allows the networking stacks to be offloaded so that only the co-processor itself is required to wake up to route packets.”　　In this example, an NXP i.MX microprocessor like the i.MX 8M Mini can be used as the compute SoC, the NXP RW612 wireless MCU can be used as an NCP and the IW612 tri-radio solution can be used as a radio co-processor. “This can help reduce the power consumption of the system significantly—especially when an NCP is used with a Linux-based microprocessor as the primary compute platform,” said Palumbo.　　The product designer has to analyze these tradeoffs and select the architecture that makes the most sense for the value they are trying to bring to their customers, he added.　　Design tradeoffs　　Wireless integration can be quite challenging especially as it relates to RF circuitry, according to manufacturers of wireless SoCs, and all tradeoffs are driven by the use cases.　　The challenge is often about the radio-integration part of the solution to deliver good-quality product performance and to meet regulatory and protocol certification requirements, said Nathalie Vallespin, wireless product line marketing manager at STMicroelectronics.　　Nathalie Vallespin, wireless product line marketing manager, STMicroelectronics.　　“A wireless SoC simplifies the integration phase, as most customers first moving to wireless solutions are not RF experts, so integration simplifies and accelerates their development and production,” she said. “Product sourcing for end customers is also simplified by an integrated solution [SoC] and can be even further simplified using a module, which includes the whole reference design.”　　In addition, Vallespin said that “an SoC also ensures more efficient power and performance levels of the radio protocol and application, while a multi-chip solution creates connection interface constraints and complexity for software management. A discrete/multi-chip approach can also potentially lead to overconsumption to keep both host and radio running to communicate properly.”　　Synaptics’ Bae said there are many challenges with RF, but “they can be addressed through careful consideration of board layout, grounding, relative positioning of other digital ICs in the design to avoid interference, and antenna placement and routing. Aside from layout, the designers or developers need to be cognizant of the impact on the SoC from power-source switching, other sources of electromagnetic interference and materials choice for enclosures.”　　Wireless SoC integration can become challenging, depending on the number of wireless protocols it supports and the use cases, said Silicon Labs’ Sogani.　　He cited several challenges, including hardware integration (antenna placement, RF design, etc.), software development (wireless stacks, networking stacks, cloud connectivity, application development), RF testing (including extreme conditions), interoperability testing (with other devices it is supposed to connect to), wireless coexistence (multiple protocols need to co-exist), production testing (minimizing the test time and yield), regulatory certifications (for countries to be supported), protocol compliance (for protocols integrated in the device), power optimization (based on the battery requirements), system security (to ensure device and data security) and solution cost (based on the target).　　Designers need to make a tradeoff at every step to optimize between various parameters, and all of these tradeoffs are eventually drive by the application use cases, said Sogani.　　“With IoT devices needing to support multiple protocols, wireless SoCs provide an integrated solution that simplifies designs by integrating these protocols and handling the coexistence challenges between multiple protocols on the same ISM band internally, as well as not having to worry about managing and worrying about RF design for multiple devices,” he added. “This helps in faster development cycles and more seamless functionality between the various protocols. End applications do play a role, as it may be possible to use discrete chips for simpler applications, but as applications become complicated, it makes more sense to use integrated solutions.”　　Vallespin said understanding and selecting the right technology that will be the best fit for the application and market demand is a key challenge. Another challenge is understanding the chosen radio protocols and picking the right hardware (antenna, routing, BOM selection) and matching software, which can be specific to each technology, she said.　　The key tradeoffs are balancing price versus features as well as choosing the architecture—a host + co-processor approach or a single application processor, Vallespin added.　　Support and availability　　In addition to performance concerns, development and design support along with supply-chain issues like continued availability are priorities for many IoT designers.　　Key concerns include how effectively the product and its development ecosystem can reduce their time to market and cost, the availability of the product and prototyping tools and the long-term availability of the product, said Vallespin.　　There are also several questions that designers need to ask, such as if there are guarantees that the SoC will be available as long as their product is in the market, what the roadmap of the SoC is and if it aligns with their product development plan, and if there is sufficient support availability, including for documentation, ecosystem and contact to ensure success, she added.　　NXP’s Palumbo believes longevity requirements are part of the tradeoff equation.　　“Once a product has shipped, the hardware itself is unchanging; however, there is an expectation from the end customer that the product will continue to be supported and receive updates for some time after their purchase,” said Palumbo. “Selecting a device—and a product architecture—that enables product designers to provide updates for the lifetime of the product is a criterion that is gaining importance.”　　The software architecture is also another critical consideration when selecting a wireless SoC, said Palumbo. “Regardless of the product architecture—be it integrated wireless SoC or discrete—the software tools and environment for these SoCs are equally important components to the hardware. Whether a device is Linux-based, Android-based, or RTOS-based—even without considering the wrinkle of which RTOS to use from the myriad of solutions available—makes a massive impact on the end product.”
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Release time：2023-02-24 15:30 reading：1867 Continue reading>>
Ameya360:Fibocom Showcased Latest Innovations in 5G A<span style='color:red'>IoT</span> at Electronica 2022
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Ameya360:Fibocom Showcased Latest Innovations in 5G AIoT at Electronica 2022

　　Fibocom has exhibited at Electronica 2022 from November 15th to 18th 2022, demonstrating embedded wireless communication modules, 5G AIoT solutions as well as wireless solutions for FWA, smart utility, IIoT and more.　　Munich, Germany – November 18th,2022 - Fibocom Wireless Inc., a global leading provider of IoT (Internet of Things) wireless solutions and wireless communication modules, has presented its latest innovations in 5G AIoT at Electronica 2022 from November 15 to 18 at Booth 139 in Hall B5, Munich Trade Fair Center, Germany. Apart from leading-edge wireless communication modules, Fibocom has showcased high-performance connectivity solutions for verticals such as FWA, smart utilities, Industrial IoT (IIoT), etc.　　Connectivity is the key to implement IoT infrastructure worldwide, scenarios that require broader bandwidth and lower latency can certainly benefit from advanced 5G technologies. With its first 5G module launched in 2019, Fibocom has more than 20+ 5G modules being deployed in100+ customer devices in the global market, and keep creating industry value through leading-edge wireless module solutions.　　Utilizing5G FWA to Close the Urban-Rural Deviation　　Wireless broadband service providers constantly face challenges in deploying robust and reliable broadband services in rural areas. Integrated with Fibocom 5G module FG360, Greenpacket outdoor CPE (ODU) O5M’s 2NR CA capability offers up to 4.67 Gbps data rate, it is also equipped with the best-in-class directional antenna, with a peak gain of up to13 dBi. This innovative design enables O5M’s radius coverage distance can be 2X further than the other outdoor CPE. With bridge mode and routing capability, the connected terminal equipment can be remotely managed to create a richvariety of 5G application scenarios for home and business sectors.　　Aetina AN810-XNX, embedded with Fibocom 5G module FM160, is the world's leading platform for high-performance and energy-efficient AI computing. It leverages the 5G network for faster, seamless, and real-time connectivity, creating a new possibility for edge devices.　　LTE and LPWA Technologies Bringing Convenience and Energy-saving to the Utility Sectors　　Fibocom has also demonstrated empowerment in the smart utility field. The electric concentrator, embedded with Fibocom LTE module NL668, can receive, store, analyze and transmit the metering data via 4G network, helping to save resources and improve customer service. Water metering, coming with Fibocom NB-IoT module N510, enables continuous meter reading, immediate fault detection, and remote management.　　Endrich IoT sensor network infrastructure, powered by Fibocom LTE Cat M module MA510, is able to collect data such as vibration, altitude, air pressure, ambient of lights, temperature, then send it to the cloud platform, achieving data visualization.　　Fibocom’s leading-edge wireless module solution is high-efficient, reliable, and scalable for IoT connectivity in various scenarios. Deploying Fibocom high-speed 5G, 4G, smart module solutions, IoT implementers can easily connect any number of IoT devices seamlessly worldwide, further accelerating the digital transformation in industries.
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Release time：2023-02-14 15:06 reading：2922 Continue reading>>
Ameya360:Ubiik and Realtek Partner on Dedicated NB-<span style='color:red'>IoT</span> Module for 3GPP Band 103
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Ameya360:Ubiik and Realtek Partner on Dedicated NB-IoT Module for 3GPP Band 103

　　Ubiik Inc. has joined forces with Realtek Semiconductor Corp. to develop Nimbus 220, an NB-IoT module based on Realtek RTL9518 chipset, and optimized for operation in Upper 700MHz A Block band. This is an important development for the utility and IoT markets in the United States, as the joint development will allow license holders of Band 103 to fully utilize this prime 1MHz paired spectrum by leveraging advanced features such as non-anchor carriers and Non-IP Data Delivery (NIDD).　　After Select Spectrum and Access Spectrum have announced that the Upper 700MHz A Block is officially designated in 3GPP Release 16 as “NB-IoT Band 103” for 4G and 5G services, Ubiik and Realtek are now partnering on the development of this NB-IoT module allowing Ubiik’s cellular base station goRAN to address current gaps in the North American market for band 103 (787-788MHz uplink and 757-758MHz downlink). With NB-IoT using as little as 180kHz of spectrum, and being able to scale up by utilizing multiple carriers simultaneously, companies who are currently utilizing this band now have the possibility to add standard-compliant NB-IoT to deliver affordable, long-range connectivity to low-power or low-throughput devices.　　“We are excited to collaborate with Realtek in bringing forth Nimbus 220 that supports Band 103,” said Tienhaw Peng, Founder and CEO of Ubiik. “This advanced module, when paired with our Ubiik goRAN base station, offers a cost-efficient 3GPP solution for implementing smart grid, AMI, and other IoT applications within the Upper 700MHz spectrum. At Ubiik, we are dedicated to supporting the 3GPP ecosystem and helping our clients fully leverage the capabilities of their IoT investments.”　　With this partnership, Ubiik aims to expand its reach in the North American market and provide customers with reliable private LTE connectivity. The module, whose embedded processing unit can support ANSI meters and other applications/protocols, will be launched together with goRAN base stations and showcased at Distributech 2023 in San Diego from February 7–9, 2023.
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Release time：2023-02-06 15:03 reading：3063 Continue reading>>
Ameya360:2023 a Bumper Year for <span style='color:red'>IoT</span> Energy Harvesting Startups
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Ameya360:2023 a Bumper Year for IoT Energy Harvesting Startups

　　As 2023 kicks off, predictions abound on the technology innovations expected in the year ahead. In its new whitepaper, 74 Technology Trends That Will—and Will Not—Shape 2023, analysts from global technology intelligence firm ABI Research identify 41 trends that will shape the technology market and 33 others that, although attracting vast amounts of speculation and commentary, are less likely to move the needle over the next twelve months. In the IoT Markets space, 2023 will be an excellent year for energy harvesting startups, but printed electronics will not reach the mass market – yet.　　“War, inflation, political upheaval, energy shortages, and the ongoing fallout from a global pandemic are still creating a persistent sense of uncertainty. Labor shortages, supply chain issues, falling consumer sentiment, and rising input costs are squeezing many markets. However, the common aspect between all of these is that technology can either be the anchor dragging down operations or the mainsail powering companies forward. The devil is in the detail of the how, who, what, and when of technology investment and implementation. This whitepaper serves as a helpful blueprint for building realistic expectations of key technology markets and verticals,” says Stuart Carlaw, Chief Research Officer at ABI Research.　　What Will Happen in 2023　　A Bumper Year for IoT Energy Harvesting Startups　　Energy and batteries for the IoT will continue to be an important topic for 2023 and will become a more central consideration for IoT designers. In the past three years, energy harvesting companies for the IoT have started to proliferate. During this time, these companies have all tended to be engineering experiments; however, many are reaching a stage when products are being commercialized at scale. In 2022, around US$110 million was invested in energy harvesting startups. In 2023, this number will continue to grow with ever larger funding rounds, helping to scale the technologies and popularize the concepts of Massive IoT and Ambient IoT. In addition, as the technology approaches and production processes mature, semiconductor manufacturers’ acquisition of energy harvesting companies is expected in the 2023 to 2024 period.　　What Won’t Happen in 2023　　Printed Electronics　　One of the most exciting areas of growth for the IoT will come from printed electronic designs. This has multiple components: conductive inks, metal etching, or Laser-Direct Structuring (LDS) for electronic circuit designs or developments in printed batteries. Each of these will revolutionize what is possible from the IoT, enabling no-touch IoT embedded in various types of assets, such as envelopes or packages, at the production line, and at massive volumes.  The market is still in its infancy, and 2023 will not be the year when the industry is transformed; however, 2022 has given us some of the first glimpses into what new printing technologies could bring to the IoT, and as the market matures in the coming years, technology vendors and adopters should start assessing considering what position they want to occupy.
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Release time：2023-01-31 11:03 reading：1854 Continue reading>>

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