ROHM at electronica India 2025: Power and Analog Devices Contributing to the Evolution of <span style='color:red'>Industrial</span> and E-Mobility applications
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ROHM at electronica India 2025: Power and Analog Devices Contributing to the Evolution of Industrial and E-Mobility applications

　　From September 17th to 19th, ROHM will exhibit at electronica India 2025, South Asia's leading trade fair for electronic components, systems, applications, and solutions, taking place at the Bangalore International Exhibition Centre (BIEC). At booth H3-E25, ROHM will showcase its latest SiC and GaN technologies, featuring reference designs and evaluation systems that address today’s power and thermal challenges in both industrial equipment and automotive drive systems. Additionally, we will also showcase analog solutions such as power ICs for industrial equipment and automotive LED drivers.　　"electronica India 2025 will be the right place to explore real-world applications powered by ROHM’s advanced power semiconductors. With our local design expertise and close cooperation with key players in the Indian market, we are uniquely positioned to support the country’s shift toward more sustainable and efficient electronics," says Makoto Terada, Managing Director, ROHM Semiconductor India.　　Highlights of ROHM’s presence at electronica India 2025 include:　　For Industrial Applications　　・Locally co-developed reference designs, as part of ROHM’s 'Made in India' initiative, emphasizing faster prototyping and region-specific design optimization, which will be unveiled for the first time.　　・A full lineup of GaN reference designs ranging from 45W to 5.5kW, including compact AC adapters, Totem Pole PFC designs, and server power supplies.　　・ROHM’s 2kV SiC MOSFETs, adopted in SEMITRANS® 20 modules by Semikron Danfoss, powering SMA Solar Technology’s Sunny Central FLEX for utility-scale PV and battery systems.　　* SEMITRANS® is a trademark or registered trademark of Semikron Danfoss Elektronik GmbH　　For Automotive and E-Mobility　　・TRCDRIVE pack™, a molded SiC module designed for the traction inverter of EVs.　　・New 2-in-1, 4-in-1 and 6-in-1 molded SiC modules for compact and cost-optimized drive solutions.　　・TO-247 discrete SiC MOSFETs shown through practical 3-phase inverter boards for affordable traction systems.　　More Information　　For additional highlights of ROHM at electronica India 2025, please visit:　　www.rohm.com/electronica-india　　ROHM’s Power Eco Family: Reliable Solutions Across a Wide range of Applications　　ROHM will also feature its Power Eco Family, a branding concept that unites its key power device lines: Each product line will be represented through live demonstrations, adoption cases, and hands-on evaluation tools available at the booth.
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Release time：2025-09-01 15:11 reading：659 Continue reading>>
BIWIN Spec TDP200 Series <span style='color:red'>Industrial</span>-Grade PCIe SSD Hits the Market
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BIWIN Spec TDP200 Series Industrial-Grade PCIe SSD Hits the Market

　　With profound insights into the strict requirements for stability, reliability, and uninterrupted operations under industrial-based scenarios, BIWIN Spec introduces newly-available TDP200 series industrial-grade M.2 PCIe SSD designed for industrial data transfer demands. Featured with industrial-grade hardware and software design and optimized firmware algorithms, this innovation supports 24/7 high-frequency writes and is especially resistant to strong mechanical impacts and shocks, serving as efficient and reliable storage solutions for data communications, smart healthcare, industrial automation, industrial robots and AIoT.　　Tough and Reliable Industrial-Grade Design　　Engineered with selected industrial hardware and optimized circuit design, the TDP200 series supports stable operations under temperature ranging from -20℃ to +70℃, helping keep data safe and secure. More specialized designs such as high-quality 3D TLC NAND, high performance controller and capacity up to 2TB make the SSD qualified to handle massive, data-intensive workloads.　　Specialized Firmware for Long-Lasting Reliability　　Packed with advanced reliability features like 4K LDPC, SRAM ECC, RAID, and power loss protection, the TDP200 series boasts an impressive 3000 P/E cycles endurance, making it ideal for relentless 24/7 operations without downtime. A high-precision thermal sensor paired with S.M.A.R.T. health monitoring tracks temperature in real time, automatically adjusting performance to ensure consistent reliability under heavy workloads.　　Rigorous Testing for Uncompromising Quality　　The TDP200 series has been verified with robust quality through over 1000 tests of aging, extreme temperatures and reliability. While strictly in line with the international standards, the product is also continuously monitored in all aspects of performance, reliability and quality through ORT, ensuring top-tier excellence throughout its lifecycle. Moreover, the Series is tested seamlessly compatible with global mainstream platforms and operating systems.　　From product design and hardware architecture to component selection, firmware algorithms, and manufacturing, every detail of BIWIN’s industrial-grade SSD is crafted to deliver a stable, reliable, and durable foundation for industrial data.
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Release time：2025-07-29 15:40 reading：851 Continue reading>>
BIWIN <span style='color:red'>Industrial</span>-Grade TDC200 Series Storage Cards: Built for Multi-Channel 4K Surveillance
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BIWIN Industrial-Grade TDC200 Series Storage Cards: Built for Multi-Channel 4K Surveillance

　　Designed for high-definition, multi-channel video surveillance, the BIWIN Spec TDC200 Series Industrial-Grade SD Cards & microSD Cards come equipped with various self-developed firmware algorithms featuring high-reliable design and multichannel write optimizations to achieve stable write speeds across multiple video channels. And with design upgrades in physical structure and reliability, these cards are able to support operating temperature within -25°C to 85°C, as well as more protective capabilities like water-, dust-, shock-, wear-, X-ray-resistance and anti-magnetism. They are ideal for intensive scenarios such as vehicle surveillance, security systems, industrial inspection, and medical monitoring applications.　　Reliable Multi-Channel 4K Recording，10 Channels of Continuous Recording Without Frame Drops　　The BIWIN TDC200 series SD Card & microSD Card are equipped with smart data flow technologies which help to distinguish video stream data from system data and allocate them into separate storage zones. This optimized data structure through partitioned storage assists to reduce data fragmentation and write amplification caused by garbage collection (GC) during full-drive write scenarios, so as to extend products’ lifespan. Additionally, the built-in intelligent cache management system minimizes wear from high-frequency access, ensuring stability and reliability during high-load, continuous writing scenarios. The cards support 10 channels of 4K high-definition recording equipment with 7×24-hour stable continuous writing, ensuring no frame drops or stuttering in surveillance and high-definition recording scenarios, with no frame skipping or data loss during playback.　　Adaptive Power Saving for Extended Endurance，Ideal for Demanding Industrial Tasks　　Featured with smart low-power management technology, the TDC200 Series SD Card & microSD Card automatically switches to low power mode under standby state, reducing power consumption from milliamps (mA) to microamps (μA)—a drop of up to 85% in sleep mode. With microsecond-level wake-up response, the cards are especially suited for battery-powered or energy-sensitive applications, such as body-worn cameras, portable surveillance units, and inspection devices, significantly extending device uptime in the field.　　Comprehensive Protection from the Inside Out，Engineered for Harsh Industrial Environments　　In automotive and industrial settings, storage devices must withstand shocks, drops, vibrations, and extreme temperatures. The BIWIN TDC200 Series cards feature a reinforced physical design that ensures stable performance in environments ranging from -25℃ to 85℃. They are built to resist impact, vibration, water, dust, X-rays, and magnetic interference that can lead to circuit shorts or signal loss. Tested under rigorous reliability protocols, the TDC200 achieves a Mean Time Between Failures (MTBF) of up to 3 million hours, greatly reducing the risk of downtime and lowering maintenance costs in mission-critical deployments.　　Built with 3D TLC direct write and multiple software optimization technologies, BIWIN TDC200 Series SD Card & micro SD Card include capabilities of VDT (Voltage Detection Technology), S.M.A.R.T. health monitoring, Power Loss Protection, Intelligent Thermal Throttling and advanced ECC algorithms. VDT and S.M.A.R.T. provide predictive failure analysis and real-time health feedback, while intelligent thermal throttling and data retention safeguard data integrity under high-temperature conditions. These features work together to ensure long-term stability and durability even in the most demanding industrial environments.　　Conclusion　　In application scenarios requiring high-volume, multi-channel video recording, the BIWIN TDC200 Series Industrial-Grade SD & microSD Cards deliver exceptional stability and performance. With zero frame loss and uninterrupted data streams, every critical moment is captured in full. Thanks to superior shock and vibration resistance, these cards are the ideal choice for use in dashcams, in-vehicle DVRs, body-worn cameras, panoramic cameras, smart medical devices, industrial tablets, and industrial UAVs where data integrity is paramount.
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Release time：2025-07-29 15:33 reading：828 Continue reading>>
Renesas Strengthens Power Leadership with New GaN FETs for High-Density Power Conversion in AI Data Centers, <span style='color:red'>Industrial</span> and Charging Systems
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Renesas Strengthens Power Leadership with New GaN FETs for High-Density Power Conversion in AI Data Centers, Industrial and Charging Systems

　　Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, introduced three new high-voltage 650V GaN FETs for AI data centers and server power supply systems including the new 800V HVDC architecture, E-mobility charging, UPS battery backup devices, battery energy storage and solar inverters. Designed for multi-kilowatt-class applications, these 4th-generation plus (Gen IV Plus) devices combine high-efficiency GaN technology with a silicon-compatible gate drive input, significantly reducing switching power loss while retaining the operating simplicity of silicon FETs. Offered in TOLT, TO-247 and TOLL package options, the devices give engineers the flexibility to customize their thermal management and board design for specific power architectures.　　The new TP65H030G4PRS, TP65H030G4PWS and TP65H030G4PQS devices leverage the robust SuperGaN® platform, a field-proven depletion mode (d-mode) normally-off architecture pioneered by Transphorm, which was acquired by Renesas in June 2024. Based on low-loss d-mode technology, the devices offer superior efficiency over silicon, silicon carbide (SiC), and other GaN offerings. Moreover, they minimize power loss with lower gate charge, output capacitance, crossover loss, and dynamic resistance impact, with a higher 4V threshold voltage, which is not achievable with today’s enhancement mode (e-mode) GaN devices.　　Built on a die that is 14 percent smaller than the previous Gen IV platform, the new Gen IV Plus products achieve a lower RDS(on) of 30 milliohms (mΩ), reducing on-resistance by 14 percent and delivering a 20 percent improvement in on-resistance output-capacitance-product figure of merit (FOM). The smaller die size reduces system costs and lowers output capacitance, which results in higher efficiency and power density. These advantages make the Gen IV Plus devices ideal for cost-conscious, thermally demanding applications where high performance, efficiency and small footprint are critical. They are fully compatible with existing designs for easy upgrades, while preserving existing engineering investments.　　Available in compact TOLT, TO-247 and TOLL packages, they provide one of the broadest packaging options to accommodate thermal performance and layout optimization for power systems ranging from 1kW to 10kW, and even higher with paralleling. The new surface-mount packages include bottom side (TOLL) and top-side (TOLT) thermal conduction paths for cooler case temperatures, allowing easier device paralleling when higher conduction currents are needed. Further, the commonly used TO-247 package provides customers with higher thermal capability to achieve higher power.　　“The rollout of Gen IV Plus GaN devices marks the first major new product milestone since Renesas’ acquisition of Transphorm last year,” said Primit Parikh, Vice President of the GaN Business Division at Renesas. “Future versions will combine the field-proven SuperGaN technology with our drivers and controllers to deliver complete power solutions. Whether used as standalone FETs or integrated into complete system solution designs with Renesas controllers or drivers, these devices will provide a clear path to designing products with higher power density, reduced footprint and better efficiency at a lower total system cost.”　　Unique d-mode Normally-off Design for Reliability and Easy Integration　　Like previous d-mode GaN products, the new Renesas devices use an integrated low-voltage silicon MOSFET – a unique configuration that achieves seamless normally-off operation while fully capturing the low loss, high efficiency switching benefits of the high- voltage GaN. As they use silicon FETs for the input stage, the SuperGaN FETs are easy to drive with standard off-the-shelf gate drivers rather than specialized drivers that are normally required for e-mode GaN. This compatibility simplifies design and lowers the barrier to GaN adaptation for system developers.　　GaN-based switching devices are quickly growing as key technologies for next-generation power semiconductors, fueled by demand from electric vehicles (EVs), inverters, AI data center servers, renewable energy, and industrial power conversion. Compared to SiC and silicon-based semiconductor switching devices, they provide superior efficiency, higher switching frequency and smaller footprints.　　Renesas is uniquely positioned in the GaN market with its comprehensive solutions, offering both high- and low-power GaN FETs, unlike many providers whose success in the field has been primarily limited to lower power devices. This diverse portfolio enables Renesas to serve a broader range of applications and customer needs. To date, Renesas has shipped over 20 million GaN devices for high- and low-power applications, representing more than 300 billion hours of field usage.
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Release time：2025-07-04 15:04 reading：800 Continue reading>>
GigaDevice Launches New EtherCAT® SubDevice Controller Chip An Excellent Choice for <span style='color:red'>Industrial</span> Automation
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GigaDevice Launches New EtherCAT® SubDevice Controller Chip An Excellent Choice for Industrial Automation

　　GigaDevice (Stock Code: 603986), a leading semiconductor supplier, announced today the official launch of its EtherCAT® SubDevice Controller chip.　　GigaDevice has received official authorization from Beckhoff and launched its first EtherCAT® SubDevice Controller, GDSCN832, along with the ultra-high performance industrial automation MCU series GD32H75E, which incorporates the EtherCAT® SubDevice Controller. These new products are tailored to meet the demands of the industrial automation market, providing optimal solutions for applications such as servo control, variable frequency drives, industrial PLCs, and communication modules, thanks to their exceptional processing power and extensive interface resources. Samples and development boards are now available, with mass production scheduled for 2nd quarter of 2025.　　GigaDevice EtherCAT® SubDevice Controller Chip　　EtherCAT® SubDevice Controller: Achieving Ultra-Fast Response Time　　The GDSCN832 series is a 2/3-port EtherCAT® SubDevice Controller integrating two internal PHYs and one MII extension interface. It has a dual-channel integrated Ethernet physical layer device, with each channel offering a full-duplex 100BASE-TX transceiver supporting 100 Mbps operation. This series supports eight Fieldbus Memory Management Units (FMMU), enhancing data processing performance and security while effectively reducing memory access latency to improve system response time and real-time performance, providing users with high flexibility in data mapping. Additionally, it supports eight Sync Manager entities for efficient memory management.　　The GDSCN832 series includes up to 8 KB of Dual-Port RAM (DPRAM), facilitating large data processing capabilities for complex control systems. It incorporates a 64-bit distributed clock with a host bus interface that achieves equivalent functionality through high-speed synchronous/asynchronous device interfaces, with a precision below 1 µs. This product series supports 8/16-bit serial/parallel port communication, SPI/QSPI/OSPI device interfaces with communication speeds up to 100 MHz, and EXMC synchronous mode. Its diverse interface options provide users with greater flexibility in interface configuration. An integrated 1.1V core regulator supports operation with a single 3.3V power supply and allows for variable voltage I/O from 1.8V to 3.3V. The GDSCN832 supports HP Auto-MDIX, enabling direct or crossover LAN cable connections. Four low-power modes are available to balance energy efficiency and power consumption.　　With its high integration, flexibility, and stability, the GDSCN832 is ideal for applications such as motor motion control, data acquisition, industrial automation, communication modules, and sensors. The series comes in a compact QFN64 package, along with a development and evaluation board, providing a cost-effective EtherCAT® SubDevice Controller device solution for developers.　　GD32H75E Series EtherCAT® Industrial Automation MCUs: Combining Superior Control and Efficient Communication Capabilities　　GigaDevice has launched the GD32H75E series, its first high-performance MCU product authorized by Beckhoff to integrate the EtherCAT® SubDevice Controller. Combining the GDSCN832 series chip with a high-performance MCU, this product offers a seamless solution for diverse industrial automation applications, including servo motor control, variable frequency drives, industrial PLCs, and communication modules.　　Building on the exceptional features of the GD32H7 series, the GD32H75E series uses an Arm® Cortex®-M7 high-performance core with a frequency of up to 600 MHz. It includes an advanced DSP hardware accelerator, a double-precision floating-point unit (FPU), a hardware trigonometric accelerator (TMU), and a filter algorithm accelerator (FAC). The series offers on-chip Flash memory ranging from 1024 KB to 3840 KB and 1024 KB of SRAM, with 512 KB configurable tightly coupled memory (ITCM, DTCM) for zero-wait execution of critical instructions and data. All Flash and SRAM regions support ECC verification, enhancing system reliability. Additionally, it features a 64 KB L1-Cache (I-Cache, D-Cache) to further improve CPU efficiency and real-time performance.　　The GD32H75E provides a wealth of peripheral resources, including 8 USARTs, 4 I2Cs, 6 SPIs, 4 I2S, and an 8-line OSPI (backward compatible with 4-line QSPI). It supports 2 USB 2.0 OTG interfaces with Full Speed and High Speed modes and includes 3 CAN-FD controllers. The series also features four 32-bit general-purpose timers, twelve 16-bit general-purpose timers, four 64-bit/32-bit basic timers, and two advanced PWM timers. Two 14-bit ADCs provide sampling rates up to 4 MSPS, with one 12-bit ADC reaching 5.3 MSPS, along with a fast comparator (COMP) and DAC for high-precision analog functions. A high-performance digital filter module (HPDF) for external Σ-Δ modulators and an encoder divide output controller (EDOUT) are also integrated, making it ideal for high-precision motion control systems.
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Release time：2025-05-21 16:53 reading：1044 Continue reading>>
GigaDevice launches the GD32G5 series high-performance MCUs with Cortex®-M33 core, unleashing innovation potential in industrial applications
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GigaDevice launches the GD32G5 series high-performance MCUs with Cortex®-M33 core, unleashing innovation potential in industrial applications

　　GigaDevice (Stock Code: 603986), a leading semiconductor supplier, today officially announced the launch of the GD32G5 series high-performance microcontrollers, based on the Arm® Cortex®-M33 core.　　The GD32G5 series MCUs, featuring exceptional processing performance, a wide range of digital and analog interface resources, and enhanced security capabilities, can be widely applied across diverse scenarios such as digital power systems, charging stations, energy storage inverters, frequency converters, servo motors, and optical communication. This new product lineup offers 14 models across 7 package types, including LQFP, QFN, and WLCSP. 　　Powerful Performance Empowering the Industrial Market　　The GD32G5 series MCUs are powered by the high-performance Arm® Cortex®-M33 core, with a clock frequency of up to 216 MHz. These MCUs feature an advanced DSP hardware accelerator and a single-precision floating-point unit (FPU). They also integrate a hardware trigonometric function accelerator (TMU), supporting 10 types of function calculations, along with various other hardware acceleration units, including filter algorithms (FAC) and Fast Fourier Transform (FFT), which significantly enhance processing efficiency. At maximum frequency, the GD32G5 series MCUs deliver performance of up to 316 DMIPS, achieving an impressive CoreMark® score of 694.　　The GD32G5 series MCUs are equipped with 256KB to 512KB of embedded Flash memory, supporting the dual-bank Flash feature, and 128KB of SRAM, which includes 32KB Tightly Coupled Memory RAM (TCMRAM) for zero-wait execution of critical instructions and data. Additionally, they feature high-speed cache memory, with up to 2KB I-Cache and 512B D-Cache, further boosting core processing performance.　　Extensive Peripherals Enable Development Innovation　　The GD32G5 series MCUs integrate a comprehensive range of peripheral resources. They support four 12-bit ADCs with a sampling rate of up to 5.3 MSPS and up to 42 channels, as well as four 12-bit DACs, two of which offer sampling rates as high as 15 MSPS. Additionally, the series includes eight high-speed comparators (COMPs) and a suite of high-precision analog peripherals designed to meet the demands of motor and power control applications. The GD32G5 series also features a 16-channel high-precision timer (HRTimer) with accuracy reaching 145 ps, along with three advanced 8-channel timers, two 32-bit general-purpose timers, five 16-bit general-purpose timers, two 16-bit basic timers, and one low-power timer.　　In terms of communication interfaces, the GD32G5 series offers five U(S)ARTs, four I2Cs, three SPIs, and one QSPI supporting up to 200 MHz DDR/SDR interfaces. The MCUs are equipped with three CAN-FD modules, ideal for high-speed communication applications. Additionally, they integrate one HPDF (high-performance digital filter) supporting 8 channels and 4 filters, with external Σ-Δ modulator support. The series also includes four configurable logic modules (CLAs) and the Trigsel module, which allows flexible configuration of trigger sources. Designed to operate in a wide temperature range from -40°C to 105°C, the GD32G5 series is well-suited for demanding applications such as optical modules, industrial power supplies, and high-speed motor control, where stringent temperature requirements must be met.
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Release time：2025-05-21 16:47 reading：1129 Continue reading>>
ROHM at PCIM Europe 2025: Powerful Highlights for E-Mobility and <span style='color:red'>Industrial</span> Applications
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ROHM at PCIM Europe 2025: Powerful Highlights for E-Mobility and Industrial Applications

　　From May 6th to 8th ROHM will exhibit at the PCIM Expo & Conference, the leading international event for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management, taking place in Nuremberg. On its booth 304 in hall 9, ROHM will showcase reference projects with renowned partners and present the evolution of its package designs and evaluation boards.　　"PCIM 2025 in Nuremberg is the meeting place for innovation and progress in power electronics. This is where the brightest minds in the industry come together to shape the future of e-mobility and industrial applications. We will be presenting great customer applications to showcase the possibilities offered by our products in the best possible way. Whether in the PV industry or e-mobility sectors – we are involved and would like to talk to our customers on site about the key projects of the future," says Wolfram Harnack, President at ROHM Semiconductor Europe.　　Highlights of ROHM’s presence at PCIM 2025 include:　　For automotive applications, ROHM will exhibit an inverter unit utilizing the TRCDRIVE pack™ that consists of a 2-in-1 SiC Molded Module. Valeo and ROHM have been collaborating since 2022, initially focusing on technical exchange to enhance the performance and efficiency of motor inverters, a key component in the propulsion systems of electric vehicles (EVs) and plug-in hybrids (PHEVs).　　Power solutions for on-board chargers (OBCs), essential for e-mobility applications, will also be on the booth. ROHM will showcase the new EcoSiC™ molded power modules suitable for OBCs, along with OBC applications adopting ROHM’s power semiconductor devices.　　ROHM’s Power Eco Family products: ROHM has grouped the four product lines of power semiconductors under the brand concept “Power Eco Family” and is contributing to the development of a sustainable ecosystem through improved application performance. We will show featured solutions and case studies at the booth.　　In this context, one application example is the new GaN Lineup: ROHM’s EcoGaN™ series of 650V GaN HEMTs in the TOLL package has been adopted for AI server power supplies by Murata Power Solutions, a subsidiary of the Murata Manufacturing Group and a leading supplier of electronic components, batteries and power supplies in Japan. Integrating ROHM’s GaN HEMTs, which combine low loss operation with high-speed switching performance, in Murata Power Solutions’ 5.5kW AI server power supply unit achieves greater efficiency and miniaturization.　　For more information, please refer to AMEYA360’s related news release.　　The details of the Power Eco Family are as follows.　　●　EcoSiC™ is a brand of devices leveraging silicon carbide which is attracting attention in the power device field for performance that surpasses silicon.　　●　EcoGaN™ comprises compact, energy-efficient devices that utilize the low ON resistance, high-speed switching characteristics of GaN to achieve lower application power consumption, smaller peripheral components, and simpler designs requiring fewer parts.　　●　EcoIGBT™ is ROHM’s brand of IGBTs consisting of both devices and modules designed to meet the needs of high-voltage applications in the power device field.　　●　EcoMOS™ is ROHM's brand of silicon power MOSFETs designed for energy-efficient applications in the power device sector.　　During the fair, ROHM’s power experts will participate in several panel discussions and conference presentations. Additionally, they will hold poster sessions at the PCIM Europe 2025 conference.　　More information regarding ROHM’s key highlights at PCIM 2025 is available here: www.rohm.com/pcim　　*EcoSiC™, EcoGaN™, EcoIGBT™, EcoMOS™ and TRCDRIVE pack™ are trademarks or registered trademarks of ROHM Co., Ltd.
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Release time：2025-04-23 17:01 reading：528 Continue reading>>
BIWIN Spec <span style='color:red'>Industrial</span>-Grade Wide-Temperature eMMC Wins the <span style='color:red'>Industrial</span> Core
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BIWIN Spec Industrial-Grade Wide-Temperature eMMC Wins the Industrial Core "New Quality" Award

　　Recently, the results of the 23rd Chinese Automation & Digitalization "New Quality Award" selection, hosted by gongkong®, were officially announced. BIWIN Spec, the industrial and automotive-grade storage brand under BIWIN, clinched the Industrial Core "New Quality" Award for its innovatively developed Industrial-Grade Wide-Temperature eMMC storage solution.　　Backed by BIWIN’s technological expertise and competitive advantages in embedded storage sector, the award-winning TGE208/TGE218 series industrial-grade eMMCs are featured with industrial-grade controllers and NAND Flash, along with proprietary firmware architectures and in-house advanced packaging/testing and manufacturing processes, delivering exceptional performance, ultimate stability, and industrial-grade reliability.　　Furthermore, the products are certified with over 200 rigorous validation tests through BIWIN’s automatic testing system, and also passed the HTOL and ELFR tests under JEDEC standards. Designed for consistent and stable operation in extreme environments, the products are widely applicable across diverse industrial scenarios, including smart security surveillance, data communication, industrial automation, rail transportation, smart power systems, smart healthcare, and IoT terminals.　　In terms of technical specifications, the products strictly follow the eMMC5.1 standards, support the HS400 high speed mode (with data transfer rates up to 400MB/s), and deliver outstanding performance under industrial wide-temperature conditions ranging from -40℃ to +85℃. In addition, the pSLC firmware technical support is also enabled to enhance the capability for data retention, so as to meet the high-frequency read/write needs in industrial scenarios.　　With aims to satisfy the 24/7 uninterrupted operation requirements of industrial equipment, the BIWIN eMMCs are also specifically built with five intelligent management functionalities: the Field Firmware Upgrade (FFU) for remote maintenance, Boot Partition for secure system loading, Replay Protected Memory Block (RPMB) for enhanced data security, idle data acceleration for optimized storage efficiency, and a health monitoring system equipped. Customers can monitor the storage unit’s operational status in real time through a customized interface and dynamically optimize adjustments based on specific application scenarios.　　BIWIN has established stable and close partnerships with supply chain collaborators, providing customers with reliable supply assurances and comprehensive after-sales support throughout the product lifecycle. With years of technical R&D accumulation and an intelligent production and testing system, combined with tiered BOM (Bill of Materials) control and manufacturing process management, the products achieve higher reliability and sustained operational stability.
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Release time：2025-04-07 13:20 reading：1113 Continue reading>>
BIWIN SPEC TGS20x <span style='color:red'>Industrial</span>-Grade SSD: Built for Extreme Conditions with High Reliability
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BIWIN SPEC TGS20x Industrial-Grade SSD: Built for Extreme Conditions with High Reliability

　　Industrial equipment demands uninterrupted long-term operation while enduring extreme environmental conditions such as frequent vibrations, wide temperature and humidity variations, and unexpected power failures. These conditions impose stringent requirements on data processing reliability and durability to ensure continuous and stable system operation.　　BIWIN Spec has specifically designed the TGS20x and TGP20x series of wide-temperature industrial-grade SSDs to address these extreme environments. Compatible with SATA III, PCIe 3.0, and other interface standards, these solutions cover multiple form factors including 2.5", mSATA, and M.2 2280/2242, catering to diverse industrial scenarios. The TGS20x series SSDs have been widely adopted in industrial control, rail transit, data communications, and electric power sectors, providing highly reliable data storage support for various high-demand equipment.　　【Supporting Wide Temperature -40℃~85℃ to Ensure Stable Operation】　　Utilizes flash memory chips, controllers, and components that meet wide-temperature standards; supports operational temperatures from -40°C to 85°C and storage temperatures from -55°C to 95°C　　Rigorously tested with Mean Time Between Failures (MTBF) exceeding 3 million hours　　Enhanced through multiple firmware and hardware optimizations, including RAID, SRAM ECC, E2E, 4K LDPC, and power loss protection　　【Domestic Core Components with Customized Technical Support】　　Employs domestic NAND and controllers; leverages in-house firmware and hardware design with advanced packaging and testing; Achieves read/write speeds of up to 560MB/s and 510MB/s respectively; Supports capacities up to 2TB　　P/E cycles up to 3,000 times, featuring high durability　　Offers customized protective technologies including anti-sulfuration, protective coating, anddispensing reinforcement　　【5-Year Supply Cycle with Nationwide Efficient Service】　　Ensures high quality and consistency through fixed-BOM, automated production, rigorous testing, and comprehensive product lifecycle management　　Service centers located in major cities nationwide, including Beijing, Xi'an, Chengdu, Shanghai, Shenzhen, and Hangzhou, providingrapid response and FAE technical support
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Release time：2024-12-23 15:51 reading：1396 Continue reading>>
Renesas Extends Line-up For <span style='color:red'>Industrial</span> Ethernet and Multi-Axis Motor Control Solutions with High Performance Quad-Core Application Processor
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Renesas Extends Line-up For Industrial Ethernet and Multi-Axis Motor Control Solutions with High Performance Quad-Core Application Processor

　　Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today launched the RZ/T2H, the highest performance microprocessor (MPU) offered by Renesas for industrial equipment. Thanks to its powerful application processing and real-time performance, the RZ/T2H is capable of high-speed, high-precision control of industrial robot motors for up to 9 axes. It supports a variety of network communications including Industrial Ethernet on a single chip. The MPU targets industrial controller equipment such as programmable logic controllers (PLCs), motion controllers, distributed control systems (DCSs), and computerized numerical controls (CNCs).　　With the growing demand for unmanned and labor-saving manufacturing, industrial robots such as vertically articulated robots, and industrial controller equipment are being deployed to accelerate automated production. The Renesas RZ/T2H MPU combines all the functionality and performance required for developing these applications. While industrial systems traditionally required multiple MPUs or a combination of field programmable gate arrays (FPGAs) to control these applications, the RZ/T2H MPU can now meet all the requirements on a single chip. This reduces the number of components and saves time and costs of FPGA program development.　　“We have enjoyed outstanding market success with RZ/T2M and RZ/T2L,” said Daryl Khoo, Vice President of Embedded Processing 1st Business Division at Renesas. “The RZ/T2H builds on that momentum, allowing our industrial customers to leverage their existing design assets while addressing even more innovative, demanding industrial motor control and Linux applications. Our customers have been particularly impressed that the RZ/T2H enables them to implement a 9-axis motor control all on just one chip!”　　High-Performance Application Processing and Fast Real-Time Control on a Single Chip　　The RZ/T2H is equipped with four Arm® Cortex®-A55 application CPUs with a maximum operating frequency of 1.2 GHz. For external memory, it supports 32-bit LPDDR4-3200 SDRAM. Two Cortex-R52 CPUs with a maximum operating frequency of 1 GHz handle the real-time processing, with each core equipped with a total of 576 KB of high-capacity tightly coupled memory (TCM). This allows high CPU- and memory-intensive tasks such as running Linux applications, robot trajectory generation, and PLC sequence processing, to be executed on a single chip. At the same time, the RZ/T2H can handle fast and precise real-time control such as motor control and Industrial Ethernet protocol processing.　　Motor control of up to 9 axes reduces component costs and development time　　The Renesas RZ/T2H controls up to 9-axis servo motors in industrial robots with high-speed and accurate operation. The RZ/T2H comes with everything required for up to 9 axes of motor control including 3-phase PWM timers, delta-sigma interfaces for measuring current values, and encoder interfaces (A-format™, EnDat, BiSS®, Hyperface DSL, and FA-CODER are all supported). Furthermore, peripheral functions for motor control are placed on a Low Latency Peripheral Port (LLPP) bus of the Cortex-R52 real-time CPU core, allowing high-speed access from the CPU.　　Flexible support for network communications including Industrial Ethernet　　The RZ/T2H has four Ethernet ports, three Gigabit Ethernet MAC (GMAC), plus an Ethernet switch. It also supports EtherCAT, PROFINET, EtherNet/IP, OPC UA, and the next-generation Time-Sensitive Networking (TSN) standard. The combination of these Ethernet switches and GMAC allows the MPU to support multiple Industrial Ethernet controllers and devices, providing flexibility to adapt to a wide range of controller requirements, such as upper-layer Ethernet communications.　　Specialized boards and software available for industrial robots and controllers　　The RZ/T2H comes with the Renesas Flexible Software Package (FSP), as with all Renesas MPUs, together with a Linux package that comes with long term support. An out-of-the-box multi-axis motor control evaluation solution is available including inverter boards for driving 9-axis motors, a multi-axis motor control software package, and Motion Utility Tool (a motor control software tool). Sample protocols for industrial Ethernet and software PLC package are also included to kick-start system development.　　“As industrial equipment continues to evolve, these systems increasingly require more complex functions and performance,” said Micael Borgefeldt, Product Manager at IAR Systems. “Including the latest RZ/T2H MPU from Renesas, we empower the developers to unlock flexible application configurations across 32-bit MCUs and 64-bit high-end MPUs multi-core environments. Our IAR development solution enables engineers to accelerate next-generation industrial innovation, streamlining development and boosting efficiency like never before.”　　Winning Combinations　　Renesas also offers “9-axis Industrial Motor Control with Ethernet” solution that combined the RZ/T2H with numerous compatible devices such as the RV1S9231A IGBT Drive Photocoupler and RV1S9353A Optically Isolated Delta-Sigma Modulator to offer a wide array of Winning Combinations. These Winning Combinations are technically vetted system architectures from mutually compatible devices that work together seamlessly to bring an optimized, low-risk design for faster time to market. Renesas offers more than 400 Winning Combinations with a wide range of products from the Renesas portfolio: renesas.com/win.　　Availability　　The RZ/T2H is available today. Renesas plans to release the new RZ/N2H device in Q1/2025, which offers the same performance as the RZ/T2H in a smaller package. This is ideal for industrial controller equipment such as PLCs and motion controllers.　　The RZ/T2H is managed under the Product Longevity Program (PLP) for industrial equipment that requires long life cycles. For more information on the RZ/T2H, visit: https://www.renesas.com/rzt2h.　　About Renesas Electronics Corporation　　Renesas Electronics Corporation (TSE: 6723) empowers a safer, smarter and more sustainable future where technology helps make our lives easier. A leading global provider of microcontrollers, Renesas combines our expertise in embedded processing, analog, power and connectivity to deliver complete semiconductor solutions. These Winning Combinations accelerate time to market for automotive, industrial, infrastructure and IoT applications, enabling billions of connected, intelligent devices that enhance the way people work and live. Learn more at renesas.com. Follow us on LinkedIn, Facebook, X, YouTube, and Instagram.　　(Remarks) Arm and Arm Cortex are trademarks or registered trademarks of Arm Limited in the EU and other countries. All names of products and services mentioned in this release are trademarks or registered trademarks of their respective owners.
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