BIWIN SPEC TGS20x Industrial-Grade SSD: Built for Extreme Conditions with High Reliability

Release time：2024-12-23
author：AMEYA360
source：BIWIN
reading：1550

　　Industrial equipment demands uninterrupted long-term operation while enduring extreme environmental conditions such as frequent vibrations, wide temperature and humidity variations, and unexpected power failures. These conditions impose stringent requirements on data processing reliability and durability to ensure continuous and stable system operation.

BIWIN SPEC TGS20x Industrial-Grade SSD: Built for Extreme Conditions with High Reliability

　　BIWIN Spec has specifically designed the TGS20x and TGP20x series of wide-temperature industrial-grade SSDs to address these extreme environments. Compatible with SATA III, PCIe 3.0, and other interface standards, these solutions cover multiple form factors including 2.5", mSATA, and M.2 2280/2242, catering to diverse industrial scenarios. The TGS20x series SSDs have been widely adopted in industrial control, rail transit, data communications, and electric power sectors, providing highly reliable data storage support for various high-demand equipment.

BIWIN SPEC TGS20x Industrial-Grade SSD: Built for Extreme Conditions with High Reliability

　　【Supporting Wide Temperature -40℃~85℃ to Ensure Stable Operation】

　　Utilizes flash memory chips, controllers, and components that meet wide-temperature standards; supports operational temperatures from -40°C to 85°C and storage temperatures from -55°C to 95°C

　　Rigorously tested with Mean Time Between Failures (MTBF) exceeding 3 million hours

　　Enhanced through multiple firmware and hardware optimizations, including RAID, SRAM ECC, E2E, 4K LDPC, and power loss protection

BIWIN SPEC TGS20x Industrial-Grade SSD: Built for Extreme Conditions with High Reliability

　　【Domestic Core Components with Customized Technical Support】

　　Employs domestic NAND and controllers; leverages in-house firmware and hardware design with advanced packaging and testing; Achieves read/write speeds of up to 560MB/s and 510MB/s respectively; Supports capacities up to 2TB

　　P/E cycles up to 3,000 times, featuring high durability

　　Offers customized protective technologies including anti-sulfuration, protective coating, anddispensing reinforcement

BIWIN SPEC TGS20x Industrial-Grade SSD: Built for Extreme Conditions with High Reliability

　　【5-Year Supply Cycle with Nationwide Efficient Service】

　　Ensures high quality and consistency through fixed-BOM, automated production, rigorous testing, and comprehensive product lifecycle management

　　Service centers located in major cities nationwide, including Beijing, Xi'an, Chengdu, Shanghai, Shenzhen, and Hangzhou, providingrapid response and FAE technical support

BIWIN SPEC TGS20x Industrial-Grade SSD: Built for Extreme Conditions with High Reliability

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BIWIN Built-in BGA SSD Plus Mini SSD Make Robots Smarter, Easier to Use, and Longer-Lasting
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BIWIN Built-in BGA SSD Plus Mini SSD Make Robots Smarter, Easier to Use, and Longer-Lasting

　　With the maturation of on-device AI computing, multimodal perception fusion, and reinforcement learning frameworks, robots are evolving from being merely reactive to becoming truly adaptive, with requirements of accumulating experience to achieve autonomous evolution, far beyond just executing commands.　　AI models are growing larger.What to do when data loading is too slow and affects decision-making?　　Devices are becoming increasingly compact, with every bit of internal space at a premium. How to balance tiny size with high-performance transmission?　　Training data keeps piling up, but memorycapacity isn’t enough and can’t be upgraded?　　Conventional embedded storage solutions (such as UFS, eMMC, M.2 SSD, MicroSD cards) are limited by trade-offs among performance, form factor, and scalability, making them insufficient for the evolving demands of humanoid robotics handling sustained high-load operation, long lifecycle, high system integration, and incremental learning.　　BIWIN BGA SSD, with its superior performance, compact form factor and excellent shock-resistance, has become one of the preferred solutions for robots; Mini SSD, positioned as an expandable storage choice with superb upgradability and flexibility, strikes a perfect balance between high performance and compact package. The combination of the built-in BGA SSD plus expandable Mini SSD constructs a new integrated storage architecture, working as a complete solution to provide stability, expandability, and systemic efficiency for intelligent robots.　　Built-in BGA SSD + External Mini SSD　　Supporting high-frequency data writes for advanced perception and decision-making　　The “brain” of a humanoid robot—the core computing motherboard—is the hardware hub for advanced perception, cognitive reasoning, and autonomous decision-making. Relying on high-performance AI computing chips, it runs multimodal large models and processes massive sensor data in real time to understand environments and plan tasks. This process demands fast and reliable storage for the operating system.　　BIWIN BGA SSD uses a PCIe 4.0 ×4 interface, delivering sequential read speeds up to 7350 MB/s and capacities up to 2TB, enabling “second-level” boot times for the OS and AI models.　　Robots operate under write-intensive workloads that far exceed typical consumer SSD applications. In some high-load systems, daily write volumes can reach 300 GB. Once the initial onboard storage (such as UFS or fixed SSD) becomes saturated, there’s no room left for ongoing data feeding and model iteration.　　Designed for effortless scalability, BIWIN Mini SSD features a SIM-card-style, slot-in design that enables a true “plug-and-play” experience. No disassembly or specialized tools are required to add up to 2 TB of high-speed storage (with higher capacities planned), ensuring long-term data accumulation, incremental learning, and intelligent evolution for robotic systems.　　While achieving extreme miniaturization and large capacity, BIWIN Mini SSD also delivers high-performance transfer rates. Equipped with a PCIe 4.0 ×2 interface, its read/write speeds reach up to 3700 MB/s and 3400 MB/s respectively, and future seamless upgrades to higher-performance versions (such as PCIe 5.0) are supported.　　SIM-card-sized, as light as 1g　　Saving device space and reducing weight　　As humanoid robots move toward practical deployment, lightweight design is not just about “shedding weight”; it’s more about simplifying mechanical structures, lowering manufacturing costs, improving mobility, and expanding application scenarios. As an essential hardware component, the size and weight of memory module directly impact overall device design.　　Both the BIWIN BGA SSD and Mini SSD feature a coin-sized footprint with an ultra-slim thickness of just 1.4 mm. The Mini SSD weighs as little as 1 g and can be directly inserted into a pre-designed socket, significantly reducing constraints on mechanical layout and overall system weight. For humanoid robots that demand high dynamic performance and extended battery life, BIWIN BGA SSD and Mini SSD deliver a “minimal physical presence” while enabling a “lightweight system design”—resulting in more compact architectures and greater motion agility.　　Dual Storage, Reshaping Industry Cooperation　　Safeguarding the Full Lifecycle Storage Needs of Robots　　Mini SSD, defined as an expandable memory solution, goes far beyond its storage function; its design concepts of modularization and standardization bring a brand-new product architecture mindset to intelligent terminal industries such as robots and notebooks.　　Manufacturer Enablement: Simplified Design, Faster Iteration　　BIWIN delivers a Mini SSD + socket solution based on a modular integration approach, enabling device manufacturers to optimize internal system layouts, reduce form-factor constraints, and develop thinner, lighter end products with clear differentiated competitiveness.　　The host-side socket offers strong compatibility across multiple capacity SKUs, requiring minimal hardware changes. This significantly lowers development effort, integration complexity, and overall system cost for device manufacturers.　　User Value: Plug-and-Play, Maximum Flexibility　　Storage expansion or replacement can be completed on-site without tools or specialized expertise. Designed for repeated, reliable insertion and removal, the solution allows end users to easily expand or swap TB-class storage, delivering a flexible and efficient storage experience.　　When paired with BIWIN’s in-house RD510 card reader (USB4.0 Type-C), users gain high-performance, portable storage for mobile productivity, content creation, and other data-intensive scenarios.　　Mini SSD has already entered mass production and is now integrated into multiple intelligent devices, including the OneXPlayer X1 Air, APEX, Super X, and GPD Win 5. It is also officially available for purchase in the consumer market.　　Since its debut, Mini SSD has been validated by several international honors, consisting of “Best Inventions of 2025” from TIME, “Best-in-Show” from Embedded World 2025, and “2026 CES Picks Awards” in the TWICE category. And BIWIN is also recognized as a winner of 2025 “China Chip” Outstanding Supporting Service Enterprise by right of this new innovation.　　Currently, BIWIN is collaborating with multiple SoC platforms and terminal brands to jointly promote Mini SSD interface specifications and ecosystem standards, accelerating its large-scale adoption in cutting-edge fields such as AI terminals and humanoid robots.
2026-02-06 17:47 reading：203
BIWIN Mini SSD Earns Dual Honors: TWICE Picks Award and AVRONA Most Innovative Award
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BIWIN Mini SSD Earns Dual Honors: TWICE Picks Award and AVRONA Most Innovative Award

　　Recently, BIWIN’s innovative product Mini SSD was honored with multiple international awards at CES 2026, earning the TWICE 2026 Picks Awards Winner as well as the AVRONA Most Innovative Award.　　With its breakthrough design philosophy and strong technical capabilities, this “small form factor, superior performance” storage solution not only continues BIWIN’s legacy of technological innovation, but also aligns seamlessly with the accelerating evolution of edge AI.　　Technological Breakthroughs Addressing Core Storage Challenges　　Conventional consumer storage solutions have long struggled to balance performance, portability, and expandability. BIWIN Mini SSD overcomes these limitations through three key innovations:　　AdvancedLGA packaging, compressing the form factor to just 15 × 17 × 1.4 mm (approximately the size of half a coin) and supporting capacities from 512GB to 2TB;　　PCIe 4.0 ×2interface with NVMe 1.4 protocol, delivering read speeds of up to 3700MB/s and write speeds of 3400MB/s, far surpassing traditional storage card solutions and rivaling mainstream consumer-grade M.2 SSDs;　　An industry-first standardized slot-in SSD design, enabling effortless TB-level expansion through a simple “open – insert – lock” three-step process, dramatically simplifying storage upgrades.　　Small in Size, Big in Capability: Empowering Two Key Tracks　　For consumers, BIWIN Mini SSD introduces a new level of convenience as no specialized tools are required for individuals to expand storage capacity, and its flagship-class performance is capable of supporting smooth operation of intelligent devices.　　For device manufacturers, its standardized interface, modular architecture, and scalability significantly streamline BOM management, reduce manufacturing, inventory, and after-sales costs, and support optimization across the entire product lifecycle.　　The product has already entered deep collaborations with well-known brands such as One-Netbook (ONEXPLAYER) and GPD, helping partners build differentiated competitive advantages in the market.　　Global Recognition Validating Technical Excellence　　Leveraging its ultra-compact design, high scalability, and reliable performance, BIWIN Mini SSD is redefining the integrated paradigm between AI terminals and storage technologies. Thanks to its disruptive innovation, the product was selected for TIME’s “Best Inventions of 2025”, becoming the only storage product worldwide to make the list.　　It subsequently won the “Best-in-Show” Award at Embedded World North America 2025, earning strong endorsement from industry authorities for both its technological advancement and commercialization potential. The dual awards at CES 2026 further reinforce the product’s real-world value and promising market outlook.　　Most notably, the latest achievement marks another milestone: BIWIN Mini SSD has been shortlisted as a finalist for the 2026 Edison Awards, often referred to as the “Oscars of Innovation.” This prestigious recognition, honoring the world’s most outstanding innovations, adds another heavyweight accolade to BIWIN Mini SSD’s growing global honors portfolio.
2026-02-06 17:44 reading：203
BIWIN Wins
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BIWIN Wins "Solid State Drive Enterprise Gold Award 2025"

　　Recently, BIWIN made a mark in the Flash Memory World 2025 hosted by DOIT, where it showcased its comprehensive enterprise-grade storage portfolio and was honored with the "Solid State Drive Enterprise Gold Award 2025." This recognition further underscores the company’s technical expertise and product excellence in the enterprise storage sector.　　Focus on Enterprise Applications　　Building a Product Ecosystem for Diverse Scenarios　　The rapid growth of AI-driven computing has fueled increasing demand for high-performance, high-density SSDs and large-capacity memory solutions. BIWIN-launched enterprise-grade storage solutions cater to a wide range of applications, covering from traditional servers and data centers to AI servers and from cloud computing platforms to edge computing nodes. These products deliver exceptional performance and stability while meeting stringent customer requirements for data security, system compatibility, and long-term operational reliability.　　SATA SSD: Designed for mainstream server platforms, SATA SSD offers high energy efficiency and low total cost of ownership (TCO) storage solutions.　　PCIe SSD: Available in both Gen4 and Gen5 versions, PCIe SSDs are featured with high performance and low latency, making them ideal for high-performance computing scenarios like AI training, databases, and distributed storage.　　CXL Memory Expansion Modules: Aligned with next-generation computing architectures, CXL modules support higher bandwidth and lower-latency memory access.　　RDIMM Memory Modules: Tailored for server platforms, RDIMM modules provide large-capacity, high-stability memory for various high-end computing scenarios.　　SP Series PCIe SSD　　A Flagship Enterprise Solution Balancing Efficiency and Security　　BIWIN’s SP Series enterprise-grade PCIe SSDs, available in PCIe 4.0 and PCIe 5.0 interfaces, address a wide range of performance requirements.　　Featured with a PCIe 5.0 ×4 interface and a 2.5" U.2 form factor, the SP5 Series demonstrates exceptional throughput and responsiveness, capable of delivering sequential read/write speeds of up to 13,600 MB/s and 10,500 MB/s, and 4K random read/write performance up to 3,200K IOPS and 910K IOPS respectively. In addition, its innovative architectural design enables industry-leading KIOPS-per-Watt performance, providing strong support for the development of green data centers.　　In AI training scenarios, key features such as large capacity, high speed and low latency offered by SP series SSDs contribute to significantly enhancing data training and computational efficiency for large-scale models; while in big data analytic systems, its capability to achieve high-concurrency access plays a large part in elevating critical business data processing efficiency, reducing response times and accelerating decision-making processes.　　The SP Series also integrates advanced functionalities, including AES256 encryption, Sanitize advanced formatting, End-to-End Data Path Protection, Internal RAID, Secure Boot, and TCG Opal 2.0. These help to secure data security and integrity during transmission and storage, making it particularly suitable for applications with stringent data sensitivity requirements.　　Technologies Empowers Market Expansion　　Collaborating with Partners to Create Ecosystem Value　　On the market side, the company’s enterprise-grade products have passed China Mobile’s AVAP test, as well as interoperability tests with over 20 CPU platforms and OEM manufacturers. Strategic partnerships have been established with multiple domestic platform vendors, and the company has also successfully passed audits by several leading internet companies. In terms of technical capabilities, the company boasts an experienced R&D team and holds a broad portfolio of core technology patents in Thermal Management, Wear Leveling, ECC, and Intelligent Storage Management Algorithms, which collectively strengthen the company’s leading role in cutting-edge storage technology.　　Looking ahead, BIWIN will continue to strengthen its Integrated Solutions and Manufacturing (ISM) strategy while pursuing its “52X” mid-to-long-term strategy to enhance product competitiveness and ecosystem influence. With further collaborations with server OEMs, the company aims to advance joint development of high-performance storage solutions for AI and edge computing and deliver customized solutions tailored to customer needs. In parallel, efforts will be concentrated across key verticals, including telecom operators, top domestic internet platforms, and technical co-development initiatives. Through cross-sector collaboration in areas such as technical collaboration, industry applications, and co-development with customers, BIWIN aims to build an open, collaborative, and mutually beneficial ecosystem for enterprise-grade storage segment.
2025-08-04 11:22 reading：982
BIWIN Spec TDP200 Series Industrial-Grade PCIe SSD Hits the Market
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BIWIN Spec TDP200 Series Industrial-Grade PCIe SSD Hits the Market

　　With profound insights into the strict requirements for stability, reliability, and uninterrupted operations under industrial-based scenarios, BIWIN Spec introduces newly-available TDP200 series industrial-grade M.2 PCIe SSD designed for industrial data transfer demands. Featured with industrial-grade hardware and software design and optimized firmware algorithms, this innovation supports 24/7 high-frequency writes and is especially resistant to strong mechanical impacts and shocks, serving as efficient and reliable storage solutions for data communications, smart healthcare, industrial automation, industrial robots and AIoT.　　Tough and Reliable Industrial-Grade Design　　Engineered with selected industrial hardware and optimized circuit design, the TDP200 series supports stable operations under temperature ranging from -20℃ to +70℃, helping keep data safe and secure. More specialized designs such as high-quality 3D TLC NAND, high performance controller and capacity up to 2TB make the SSD qualified to handle massive, data-intensive workloads.　　Specialized Firmware for Long-Lasting Reliability　　Packed with advanced reliability features like 4K LDPC, SRAM ECC, RAID, and power loss protection, the TDP200 series boasts an impressive 3000 P/E cycles endurance, making it ideal for relentless 24/7 operations without downtime. A high-precision thermal sensor paired with S.M.A.R.T. health monitoring tracks temperature in real time, automatically adjusting performance to ensure consistent reliability under heavy workloads.　　Rigorous Testing for Uncompromising Quality　　The TDP200 series has been verified with robust quality through over 1000 tests of aging, extreme temperatures and reliability. While strictly in line with the international standards, the product is also continuously monitored in all aspects of performance, reliability and quality through ORT, ensuring top-tier excellence throughout its lifecycle. Moreover, the Series is tested seamlessly compatible with global mainstream platforms and operating systems.　　From product design and hardware architecture to component selection, firmware algorithms, and manufacturing, every detail of BIWIN’s industrial-grade SSD is crafted to deliver a stable, reliable, and durable foundation for industrial data.
2025-07-29 15:40 reading：1027
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