ROHM’s New General-Purpose Chip Resistors Contribute to Greater Miniaturization
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ROHM’s New General-Purpose Chip Resistors Contribute to Greater Miniaturization

　　ROHM has expanded its portfolio of general-purpose chip resistors with the MCRx family. It is designed to achieve greater miniaturization and enhanced performance across a variety of applications. The new lineup includes the high-power MCRS series and low-resistance, high-power MCRL series.　　In today's era of advancing functionality and electrification, the increased miniaturization and improved performance of electronic components have become critical issues. This is especially evident in the automotive market, where the proliferation of electric vehicles (xEVs) is accelerating the use of electronic components. Similarly, the industrial equipment market is experiencing growing demand for compact, high performance electronic components as machinery becomes more functional and efficient. ROHM addresses both of these needs with the MCRx family of compact, high-performance resistors.　　The MCRS series improves rated power and TCR (Temperature Coefficient of Resistance) characteristics by optimizing the internal structure and incorporating new materials, enabling use in a smaller size compared to conventional products. A broad lineup in sizes ranging from 0402-size (0.04inch × 0.02inch) / 1005-size (1.0mm × 0.5mm) to 2512-size (0.25inch × 0.12inch) / 6432-size (6.4mm × 3.2mm) is available, making it possible to select the ideal product based on mounting space requirements. This leads to a compact, efficient circuit design, significantly increasing design flexibility. Meanwhile, the MCRL series, a low-resistance variant of the MCRS series, is offered in sizes ranging from 0805-size (0.08inch × 0.05inch) / 2012-size (2.0mm × 1.2mm) to 2512-size (0.25inch × 0.12inch) / 6432-size (6.4mm × 3.2mm) ideal for current detection applications.　　The MCRx family adopts a redesigned internal structure, improving production efficiency, quality, and product reliability across all sizes. Compliant with the AEC-Q200 automotive reliability standard, this series meets the increasing demand for electric vehicles (xEVs) while contributing to market expansion in communications infrastructure such as base stations and servers as well as factory automation equipment. In addition, the products are designated for long-term stable supply, supporting continuous use in long-life applications such as industrial equipment.　　The MCRS series will be expanded to include compact 0201-size (0.024inch × 0.012inch) / 0603-size (0.6mm × 0.3mm) products capable of withstanding temperatures up to +155°C. At the same time, the MCRE series will soon offer completely lead-free 01005-size (0.016inch × 0.008inch) / 0402-size (0.4mm × 0.2mm) products. These additions will allow ROHM to respond to the demand for further miniaturization while complying with environmentally-driven voluntary regulations and export restrictions.　　Going forward, ROHM is focused on developing and manufacturing products that cater to the diverse needs of customers worldwide. In particular, ROHM will continue to expand its lineup of resistors (its founding products) that improve miniaturization and reliability while ensuring long-term stable supply. By consistently delivering new value through technological innovation, ROHM seeks to solidify its market position and drive the evolution of electronic components.　　Application Examples        Suitable for a wide range of applications (excluding medical, military, aerospace, and nuclear control equipment)　　Automotive　　・Electric vehicles (xEVs): Battery Management Systems (BMS), powertrain control, Advanced Driver Assistance Systems (ADAS)　　・In-vehicle electronics: Engine Control Units (ECUs), infotainment systems, and more　　Industrial Equipment　　・Robotics: Control systems for industrial robots　　・Factory Automation (FA): Automated product line control systems　　・Power conversion equipment: Inverters, converters, and more　　Consumer Devices　　・Smart devices: Smartphones, tablets, wearables　　・Home appliances: TVs, refrigerators, washing machines　　Communication Equipment　　・Network equipment: Routers, switching hubs, communication equipment for data centers, etc.　　Online Sales Information        Sales Launch Date: October 2024　　The products will be offered at other online distributors as they become available.　　Products for Sale: MCR01S、MCR03S、MCR10S、MCR18S、MCR25S、MCR50S、MCR100S、MCR10L、MCR18L、MCR25L、MCR50L、MCR100L　　Additional resistance values will be added as needed.　　Resistance Value Search Page        Users can now search by series or resistance value and purchase samples on product pages.　　https://www.rohm.com/products/resistors　　Terminology        Temperature Coefficient of Resistance (TCR)　　An index of how much the resistance value changes with temperature. The lower the TCR, the less the resistance value fluctuates with temperature changes, resulting in more stable performance.　　AEC-Q200　　AEC stands for Automotive Electronics Council, a reliability standard for automotive electronic components established by major automotive manufacturers and US electronic component makers. Compliance with this standard by automotive components ensures reliable performance even under harsh environmental conditions. Q200 is a standard specifically intended for passive components such as resistors, capacitors, and inductors.　　xEV (Electric Vehicles)　　A collective term for vehicles primarily powered by electric motors, such as Hybrid Electric Vehicles (HEVs), Plug-in Hybrid Electric Vehicles (PHEVs), and Electric Vehicles (EVs).
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Release time：2025-03-12 10:22 reading：640 Continue reading>>
ROHM’s New TVS Diodes: Supporting High-Speed CAN FD In-Vehicle Communication Systems for Autonomous Driving
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ROHM’s New TVS Diodes: Supporting High-Speed CAN FD In-Vehicle Communication Systems for Autonomous Driving

　　ROHM has developed bidirectional TVS (ESD protection) diodes compatible with CAN FD (CAN with Flexible Data rate) high-speed in-vehicle communication. Such protocols are seeing an increased demand in line with the ongoing advancement in autonomous driving and advanced driver assistance systems (ADAS). CAN FD is a crucial communication technology for safe, real-time data transmission between ECUs (Electronic Control Units) in vehicles. The new products achieve high-quality in-vehicle transmission by protecting electronic devices such as ECUs from surges and electrostatic discharge (ESD) while maintaining signal integrity in high-speed communication systems such as CAN FD.　　The rapid evolution of autonomous driving technology and ADAS is boosting the demand for faster, more reliable automotive communication. Autonomous driving in particular requires quick and accurate processing of vast amounts of data from sensors such as cameras, LiDAR and radar - leading to the adoption of CAN FD that enables faster, higher capacity data transfer compared to traditional CAN used in automotive communication.　　At the same time, to achieve high-speed in-vehicle communication, it is necessary to ensure stable transmission even under harsh environments. This has led to a growing demand for protection components that offer low terminal capacitance along with superior surge current rating and clamping voltage performance. As a result, the market for TVS diodes for automotive communication is expected to continue to grow in the future.　　To meet market needs, ROHM developed the ESDCANxx series that combines low terminal capacitance with excellent surge tolerance. Two package types are available: SOT-23 (2.9mm × 2.4mm) and DFN1010 (1.0mm × 1.0mm), both supporting standoff voltages (VRWM) of 24V and 27V. The SOT-23 package includes four models: 24V ESDCAN24HPY / ESDCAN24HXY and 27V ESDCAN27HPY / ESDCAN27HXY. Similarly, the DFN1010 package is also offered in four models: 24V ESDCAN24YPA / ESDCAN24YXA and 27V ESDCAN27YPA / ESDCAN27YXA, totaling 8 products in the lineup.　　The new products feature an optimized element structure that reduces terminal capacitance to a maximum of 3.5pF, preventing signal degradation during high-speed communication. High surge tolerance is also achieved, significantly improving the protection of electronic devices in automotive environments. For example, the 27V products of the DFN1010 package delivers approx. 3.2 times higher surge current rating and 16% lower clamping voltage compared to standard CAN FD-compatible products. This effectively safeguards expensive surge-sensitive electronic devices such as in-vehicle ECUs, ensuring high reliability even under harsh automotive environments. Going forward, ROHM will continue to develop products that support even faster in-vehicle communication in autonomous driving and communication environments - contributing to realizing a safer, more advanced mobility society.　　Application Examples        • Autonomous driving and Advanced Driver Assistance Systems (ADAS)　　• Automotive electric powertrain systems　　• In-vehicle infotainment systems　　Online Distributor Information        Sales Launch Date: December 2024　　Pricing: $0.9/unit (excluding tax)　　Target Products　　SOT23 Package: ESDCAN24HPY, ESDCAN24HXY, ESDCAN27HPY, ESDCAN27HXY　　DFN1010 Package: ESDCAN24YPA, ESDCAN24YXA, ESDCAN27YPA, ESDCAN27YXA　　Terminology         CAN FD (CAN with Flexible Data Rate)　　An extension of the CAN (Controller Area Network) standard, CAN FD offers faster data transfer speeds compared to conventional CAN, enabling the exchange of large volumes of data. Real-time communication between multiple in-vehicle electronic units (ECUs) is essential in systems like autonomous driving and ADAS.　　TVS Diode (Transient Voltage Suppression Diode)　　A semiconductor device designed to protect circuits from overvoltage, surges, and electrostatic discharge (ESD). TVS diodes absorb sudden voltage and current spikes (surges) to prevent circuit damage and malfunction. In automotive environments, safeguarding against severe electrical fluctuations is crucial.　　Terminal Capacitance　　Unwanted capacitance components that arise in electronic parts. When terminal capacitance is high, signal degradation occurs during high-speed transmission, making it important to reduce terminal capacitance for in-vehicle communication　　Surge Current Rating　　The maximum surge current a TVS diode can withstand. The higher the surge current rating, the stronger the protection against severe electrical fluctuations in automotive environments.　　Clamping Voltage　　The voltage maintained in the circuit when the TVS diode suppresses overvoltage caused by surges or other transient events. A lower clamping voltage provides more effective protection for circuits and devices, increasing the reliability of automotive equipment.
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Release time：2025-03-11 09:29 reading：647 Continue reading>>
Leading Performance for High Voltage Applications: NOVOSENSE Launches the NSI67X0 Series of Smart Isolated Drivers
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Leading Performance for High Voltage Applications: NOVOSENSE Launches the NSI67X0 Series of Smart Isolated Drivers

　　NOVOSENSE has officially launched the NSI67X0 series of smart isolated drivers with Isolated Analog Sensing function. Suitable for driving power devices such as SiC, IGBTs and MOSFETs, and available in both automotive (AEC-Q100 compliant) and industrial variants, this series can be widely used in new energy vehicles, air conditioners, power supplies, photovoltaics and other applications.　　This series of isolated gate drivers equates an isolated analog to PWM sensor, which can be used for temperature or voltage detection. The design further enhances driver versatility, simplifies system design, effectively reduces system size and lowers overall cost.　　High-voltage Drive and Ultra-high Common-mode Immunity　　Designed to drive IGBTs or SiC up to 2121V DC operating voltage, NSI67X0 offers advanced protection functions, excellent dynamic performance, and outstanding robustness. This series uses SiO2 capacitor isolation technology to isolate the input side from the output side, providing ultra-high common-mode immunity (CMTI>150kV/μs) while ensuring extremely small offset between devices, which is at the leading level in the industry.　　Powerful Output Capability and Miniaturized Package　　The NSI67X0 series has powerful output capability, supporting ±10A drive current and a maximum output drive voltage of 36V, far exceeding most similar products. Its SOW16 package design further enhances safety by achieving a creepage distance of more than 8mm while maintaining miniaturization.　　Comprehensive Protection Functions and Automotive Certification　　With comprehensive protection functions, including fast overcurrent protection, short-circuit protection, fault soft turn off, 4.5A Miller clamp, and undervoltage protection, this series is a reliable choice for driving power devices such as IGBTs. The entire product family meets the AEC-Q100 standard for automotive applications and can be widely used in new energy vehicles, industrial control and energy management.　　Features of NSI67X0 Series　　◆ Smart isolation drivers up to 2121Vpk for driving SiC and IGBTs　　◆ High CMTI: 150 kV/μs　　◆ Input side supply voltage: 3V ~ 5.5V　　◆ Driver side supply voltage: up to 32V　　◆ Rail-to-rail output　　◆ Peak source and sink current: ±10A　　◆ Typical propagation delay: 90ns　　◆ Operating ambient temperature: -40°C ~ +125°C　　◆ Compliant with AEC-Q100 for automotive applications　　◆ RoHS compliant package type: SOW16, creepage distance > 8mm　　Protection Functions　　◆ Fast over-current and short-circuit protection, with optional DESAT threshold voltage of 9V and 6.5V and OC threshold voltage of 0.7V　　◆ Integrated soft turn off function in case of fault, with optional soft turn off current of 400mA and 900mA　　◆ Integrated Miller clamp function, with clamp current up to 4.5A　　◆ Independent undervoltage protection UVLO on both HV and LV sides　　◆ Fault alarm (FLT/RDY pin indication)　　Isolated Analog Sampling Function　　◆ Isolated analog sampling function　　◆ AIN input voltage range: 0.2V ~ 4.7V　　◆ APWM output duty cycle: 96% ~ 6%　　◆ Duty cycle accuracy: 1.6%　　◆ APWM output frequency: 10kHz　　◆ Optional AIN integrated constant current source output　　Safety Related Certification　　◆ UL Certification: 1 minute 5700Vrms　　◆ VDE Certification: DIN VDE V 0884-11:2017-01　　◆ CSA Certification: Approved under CSA Component Acceptance Notice 5A　　◆ CQC Certification: Compliant with GB4943.1-2011　　Introduction to Principle of High-precision Temperature Sampling of NSI67X0 Series　　The AIN interface of the NSI6730 has a built-in 200uA current source. When an external NTC is connected, a voltage drop will be generated and demodulated into a 10kHz PWM signal for isolated output. The PWM signal is captured by the processor MCU, and the corresponding voltage value and temperature are obtained by calculating the duty cycle.　　When the AIN voltage is in the range of 0.2V ~ 4.7V, the AIN input voltage and APWM output duty cycle are linearly related. When the AIN voltage is converted to a PWM signal, the PWM duty cycle conforms to the following formula:　　That is, the AIN voltage of 0.2V ~ 4.7V corresponds to a PWM duty cycle of 96% ~ 6%.　　Model Selection Chart of NSI67X0 Series　　This series offers a variety of models to meet the needs of different applications. Specifically, in the NSI67X0 series, when X is 3, the AIN interface integrates a constant current source; when X is 7, the AIN interface does not integrate a constant current source.
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Release time：2025-02-24 16:18 reading：1323 Continue reading>>
NOVOSENSE Launches NSIP3266 Full-Bridge Transformer Driver with Integrated Crystal Oscillator, Simplifying Isolated Driver Power Supply Design
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NOVOSENSE Launches NSIP3266 Full-Bridge Transformer Driver with Integrated Crystal Oscillator, Simplifying Isolated Driver Power Supply Design

　　NOVOSENSE today announced the launch of the NSIP3266 full-bridge transformer driver with integrated crystal oscillator, multiple protection functions and soft start support, which can be widely used in isolated driver power supply circuits in automotive on-board chargers (OBCs), traction inverters and charging piles, photovoltaic power generation and energy storage, server power supply and other systems. NSIP3266 supports a full-bridge topology with a wide range of inputs, and with clever pin and function design, it greatly simplifies the design of isolated driver’s power supply circuits, facilitating system manufacturers to optimize system circuits and shorten product time to market.　　Currently, isolated driver's power supply in high-voltage systems is available in three architectural forms: centralized, fully distributed, and semi-distributed. Centralized architecture has only one stage of power supply, and the auxiliary power input voltage has a wide input range, requiring closed-loop operation. At the same time, the transformer design is complicated, and especially when a single low-cost isolated power supply is used, there are problems of multi-output load regulation and long wiring, which increase the difficulty of system design and debugging.　　Fully distributed architecture uses independent isolated power modules to supply power to isolated drivers. The advantage is that 1-to-1 power supply and targeted protection can be achieved for isolated drivers, but a corresponding number of isolated power modules need to be configured, and the system cost is high.　　Semi-distributed architecture adopts a balanced strategy. Through a two-stage auxiliary power architecture, the first stage uses devices with a wide input voltage range to generate regulated rails, and the second stage can be a compact open-loop form using other devices to provide isolated power supply for isolated drives. Semi-distributed architecture is gaining popularity among engineers because of its simplicity in design and balance of system cost, performance, and protection requirements.　　Simplified circuit design with full-bridge topology　　NOVOSENSE's NSIP3266 full-bridge transformer driver is designed for semi-distributed architecture with isolated driver power supply. Common topology options for semi-distributed architecture include push-pull, LLC, and full-bridge. NSIP3266 adopts full-bridge topology. Compared with other solutions, the principle of full-bridge topology is simple, the transformer structure does not require a center tap, the working principle does not involve the design and selection of external L and C, and the peripheral BOM is often minimal. At the same time, the full-bridge topology is more tolerant to transformer design, including leakage inductance and parasitics, which saves engineers' efforts in system design and debugging.　　Ingenious design releases MCU resources　　It is worth mentioning that NSIP3266, through the internal integrated crystal oscillator circuit and RT pin design, allows engineers to complete the switching frequency configuration with only external resistors, achieving decoupling of MCU control and more flexible layout. At the same time, it can still provide safe power supply when the MCU fails, promoting higher system safety. In addition, the built-in soft-start function of NSIP3266 also eliminates the need for MCU control. While not requiring MCU domain routing, it saves secondary-side current limiting resistors, greatly simplifying board design and improving architectural flexibility.　　Wide voltage input and comprehensive protection　　NSIP3266 supports a wide operating voltage range of 6.5V~26V. No additional TVS protection tube is required in the system circuit, allowing engineers to choose the pre-stage power supply more flexibly. In addition, NSIP3266 provides multiple protection functions, including undervoltage protection, overcurrent protection, over-temperature protection, etc. The comprehensive protection functions enable engineers to focus on the optimization and innovation of the core system functions, and to design the system quickly and efficiently to meet the reliability requirements.　　Packaging and selections　　NSIP3266 is available in EP-MSOP8 package (3.0 x 3.0mm x 0.65mm, with thermal pad). The industrial version, NSIP3266-D, and the automotive version, NSIP3266-Q1, which meets the requirements of AEC-Q100, will be mass-produced in the first half of 2025. Please contact NOVOSENSE's sales team (sales@novosns.com) for product details or to request samples.　　Rich isolation products meet diverse needs　　With its expertise and leadership in isolation technology, NOVOSENSE provides a series of isolation and "isolation+" products covering digital isolators, isolated sampling, isolated interfaces, isolated power supply, and isolated drivers. NSIP3266 is a new addition to NOVOSENSE's isolated power supply family. NOVOSENSE also offers a selection of other cost-effective and high-performance, high-integration options, including: the NSIP605x series of push-pull transformer drivers; the NSIP88/89xx and NIRSP31x series with integrated transformers and multi-channel digital isolators; the NSIP83086 isolated RS485 transceiver and the NSIP1042 isolated CAN transceiver with integrated transformers and isolated interfaces. NOVOSENSE's comprehensive "isolation+" product portfolio can meet the diverse system design needs of various types of customers and provide one-stop chip solutions for them.
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Release time：2025-02-19 09:59 reading：1529 Continue reading>>
ROHM’s PMICs for SoCs have been Adopted in Reference Designs for Telechips’ Next-Generation Cockpits
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ROHM’s PMICs for SoCs have been Adopted in Reference Designs for Telechips’ Next-Generation Cockpits

　　ROHM has announced the adoption of its PMICs in power reference designs focused on the next-generation cockpit SoCs ‘Dolphin3’ (REF67003) and ‘Dolphin5’ (REF67005) by Telechips, a major fabless semiconductor manufacturer for automotive applications headquartered in Pangyo, South Korea. Intended for use inside the cockpits of European automakers, these designs are scheduled for mass production in 2025.　　ROHM and Telechips have been engaged in technical exchanges since 2021, fostering a close collaborative relationship from the early stages of SoC chip design. As a first step in achieving this goal, ROHM’s power supply solutions have been integrated into Telechips’ power supply reference designs. These solutions support diverse model development by combining sub-PMICs and DrMOS with the main PMIC for SoCs.　　For infotainment applications, the Dolphin3 application processor (AP) power reference design includes the BD96801Qxx-C main PMIC for SoCs. Similarly, the Dolphin5 AP power reference design developed for next-generation digital cockpits combines the BD96805Qxx-C and BD96811Fxx-C main PMICs for SoC with the BD96806Qxx-C sub-PMIC for SoC, improving overall system efficiency and reliability.　　Modern cockpits are equipped with multiple displays, such as instrument clusters and infotainment systems, with each automotive application becoming increasingly multifunctional. As the processing power required for automotive SoCs increases, power ICs like PMICs must be able to support high currents while maintaining high efficiency. At the same time, manufacturers require flexible solutions that can accommodate different vehicle types and model variations with minimal circuit modifications. ROHM SoC PMICs address these challenges with high efficiency operation and internal memory (One Time Programmable ROM) that allows for custom output voltage settings and sequence control, enabling compatibility with large currents when paired with a sub-PMIC or DrMOS.　　Moonsoo Kim,　　Senior Vice President and Head of System Semiconductor R&D Center, Telechips Inc.“Telechips offers reference designs and core technologies centered around automotive SoCs for next-generation ADAS and cockpit applications. We are pleased to have developed a power reference design that supports the advanced features and larger displays found in next-generation cockpits by utilizing power solutions from ROHM, a global semiconductor manufacturer. Leveraging ROHM’s power supply solutions allows these reference designs to achieve advanced functionality while maintaining low power consumption. ROHM power solutions are highly scalable, so we look forward to future model expansions and continued collaboration.”　　Sumihiro Takashima,　　Corporate Officer and Director of the LSI Business Unit, ROHM Co., Ltd.“We are pleased that our power reference designs have been adopted by Telechips, a company with a strong track record in automotive SoCs. As ADAS continues to evolve and cockpits become more multifunctional, power supply ICs must handle larger currents while minimizing current consumption. ROHM SoC PMICs meet the high current demands of next-generation cockpits by adding a DrMOS or sub-PMIC in the stage after the main PMIC. This setup achieves high efficiency operation that contributes to lower power consumption. Going forward, ROHM will continue our partnership with Telechips to deepen our understanding of next-generation cockpits and ADAS, driving further evolution in the automotive sector through rapid product development.”　　・ Telechips SoC [Dolphin Series]　　The Dolphin series consists of automotive SoCs tailored to In-Vehicle Infotainment (IVI), Advanced Driver Assistance Systems (ADAS), and Autonomous Driving (AD) applications. Dolphin3 supports up to four displays and eight in-vehicle cameras, while Dolphin5 enables up to five displays and eight cameras, making highly suited as SoCs for increasingly multifunctional next-generation cockpits. Telechips is focused on expanding the Dolphin series of APs (Application Processors) for car infotainment, with models like Dolphin+, Dolphin3, and Dolphin5, by leveraging its globally recognized technical expertise cultivated over many years.　　・ ROHM 's Reference Design Page　　Details of ROHM’s reference designs and information on equipped products are available on ROHM’s website, along with reference boards. Please contact a sales representative or visit ROHM’s website for more information.　　https://www.rohm.com/contactus　　■ Power Supply Reference Design [REF67003] (equipped with Dolphin3)　　Reference Board No. REF67003-EVK-001　　https://www.rohm.com/reference-designs/ref67003　　■ Power Supply Reference Design [REF67005] (equipped with Dolphin5)　　Reference Board No. REF67005-EVK-001　　https://www.rohm.com/reference-designs/ref67005　　About Telechips Inc.Telechips is a fabless company specialized in designing system semiconductors that serve as the “brains” of automotive electronic components. The South Korean firm offers reliable, high-performance automotive SoCs. In response to the industry’s transition toward SDVs (Software Defined Vehicles), Telechips is broadening its core portfolio beyond car infotainment application processors (APs) to include MCUs, ADAS, network solutions, and AI accelerators.　　As a global, comprehensive automotive semiconductor manufacturer, Telechips adheres to international standards such as ISO 26262, TISAX, and ASPICE, leveraging both hardware and software expertise for future mobility ecosystems, including not only automotive smart cockpits, but also E/E architectures. What’s more, Telechips provides optimal solutions for In-Vehicle Infotainment systems (IVI), digital clusters, and ADAS, all compliant with key automotive standards (AEC-Q100, ISO 26262). Telechips has established business relationships with major automakers both domestically and internationally, supported by a strong track record of shipments.　　One flagship product is the Dolphin5 automotive SoC that integrates an Arm®-based CPU, GPU, and NPU to meet high-performance requirements. As a fabless company, Telechips outsources the manufacturing of its SoCs to Samsung Electronics’ foundry, delivering high-quality semiconductor products to domestic and overseas manufacturers. For more information, please visit Telechips’ website:　　https://www.telechips.com/　　*Arm® is a trademark or registered trademark of Arm Limited.　　TerminologyPMIC (Power Management IC)　　An IC that contains multiple power supply systems and functions for power management and sequence control on a single chip. It is becoming more commonplace in applications with multiple power supply systems in both the automotive and consumer sectors by significantly reducing space and development load vs conventional circuit configurations using individual components (i.e. DC-DC converter ICs, LDOs, discretes).　　SoC (System-on-a-Chip)　　A type of integrated circuit that incorporates a CPU (Central Processing Unit), memory, interface, and other elements on a single substrate. Widely used in automotive, consumer, and industrial applications due to its high processing capacity, power efficiency, and space savings.　　AP (Application Processor)　　Responsible for processing applications and software in devices such as smartphones, tablets, and automotive infotainment systems. It includes components such as a CPU, GPU, and memory controller to efficiently run the Operating System (OS), process multimedia, and render graphics.　　DrMOS (Doctor MOS)　　A module that integrates a MOSFET and gate driver IC. The simple configuration is expected to reduce design person-hours along with mounting area and to achieve efficient power conversion. At the same time, the built-in gate driver ensures high reliability by stabilizing MOSFET drive.
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Release time：2024-12-20 13:56 reading：1031 Continue reading>>
Fibocom Fosters Local 5G AIoT Market with Newly Launched 5G Module FG370-KR at AIoT Korea 2024
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Fibocom Fosters Local 5G AIoT Market with Newly Launched 5G Module FG370-KR at AIoT Korea 2024

　　wireless communication modules, announces the launch of FG370-KR, a regional version of the FG370 series module, which is positioned to accelerate the commercial development of Korean’s 5G AIoT industries such as Fixed Wireless Access (FWA), live streaming, and industrial automation, etc. By adopting the advancements from FG370-KR, the solution allows local customers to benefit from the seamless 5G experience and fast-to-market industry solutions.　　5G subscribers in South Korea reached around 33 million as of the end of March 2024, according to the latest report from Statista. SK Telecom accounted for 15.9 million of the total 5G subscribers, followed by KT with 9.9 million and LG U+ with 7.2 million. At present, the country accelerates the rollout of commercial 5G services to industry-related field and shows strong growing trends. Fibocom's 5G Sub-6GHz module FG370-KR is compatible with Korea's mainstream 5G frequency bands, supports both 5G SA and NSA network architecture, making it an ideal 5G solution for industry customers that require high-transmission speed, large capacity, and ultra-low latency.　　Developed from the MediaTek T830 chipset platform, the FG370-KR is a 3GPP Release 16 compliant module that adopts a 4nm process integrated with an Arm Cortex-A55 quad-core CPU, leading to a 10% improvement in speed performance compared to the previous generation. In terms of data transmission, FG370-KR supports NR 4CA (Carrier Aggregation) with up to 300MHz bandwidth on the downlink, and NR 2CA in FDD and TDD hybrid mode on the uplink, reaches a maximum speed of up to 7.01Gbps DL and 1.25Gbps UL. In addition, it also supports PC2 of HPUE (High Power User Equipment) technology, significantly enhances 5G uplink capability and network coverage. It is worth highlighting that, FG370-KR can greatly reducing the time-to-market of customers’ devices with the support of a wide range of peripheral interfaces, including three PCI-Express, USB 3.2, two USXGMII interfaces along with software features such as Kernel, OpenWRT drivers.　　“The launch of the FG370-KR signifies that Fibocom will provide a Korea-dedicated solution for local customers, boosting the 5G adoption towards a larger-scale of industries with optimal network connectivity and enhanced operational efficiency, said Simon Tao, VP of Product Management Dept., Head of MBB BU at Fibocom. “We have the confidence in helping enterprises to accomplish the 5G commercialization with our industry know-how and expertise accumulated, without doubt, Korea’s 5G deployment will keep experiencing a fast-growing rate and Fibocom will continually invest in cutting-edge 5G module solutions and delivering superior wireless experience.”　　To learn more about 5G Sub-6GHz module and its demos, welcome to visit Fibocom booth #G101 on the 3rd Floor of Hall D in COEX at the AIoT Korea from October 30 to November 1 2024.
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Release time：2024-12-13 10:55 reading：1279 Continue reading>>
Fibocom Accelerates 5G RedCap FWA Commercialization by Offering Wi-Fi-Ready Solutions
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Fibocom Accelerates 5G RedCap FWA Commercialization by Offering Wi-Fi-Ready Solutions

　　Shenzhen,China – November 25th 2024 – Fibocom (Stock code: 300638), a global leading provider of wireless communication modules and solutions, today debuts the ready-to-market 5G RedCap plus Wi-Fi 5/6 solution developed from the 5G RedCap module FG131, which is positioned to accelerate the commercialization of 5G FWA in the form of CPE, mobile hot-spot, and USB dongle, etc., satisfying the diverse market demands.　　According to a report updated in September 2024, GSA has identified 143 operators in 61 countries and territories worldwide that have been investing in public 5G SA networks through trials, planned or actual deployments. With the implementation of 5G SA network infrastructure, 5G-enabled FWA shipments became mainstream, reaching 10.2 million in 2023. The growth of 5G FWA CPE shipments is expected to accelerate further, accounting for 42% of shipments in 2024 compared with 34% in 2023, according to the CPE Vendor Survey released by GSA in August 2024.The launch of Fibocom’s ready-to-market 5G RedCap plus Wi-Fi 5/6 solution is the ideal 5G lightweight solution accelerating the migration from 4G FWA to 5G FWA, elevating the Quality-of-Service with faster network connection, more-agile network slices services and reliability in 5G SA network environment.　　Key takeaways　　Advanced 5G RedCap plus Wi-Fi 6 (AX3600): The FG131 5G RedCap module integrates with a Wi-Fi 6 module developed from the Qualcomm WCN6856, reaching maximum 3600Mbps data throughput with the support of 2x2-40MHz@2.4GHz and 2x2-160MHz@5/6GHz dual-band concurrently and the support of 4K QAM for enhanced data transmission efficiency.　　Medium 5G RedCap plus Wi-Fi 6 (AX1800): The FG131 5G RedCap module integrates with a Wi-Fi 6 module developed from the Qualcomm QCA2064, reaching maximum 1800Mbps data throughput with the support of 2x2-40MHz@2.4GHz and 2x2-80MHz@5/6GHz dual-band concurrently.　　Entry-level 5G RedCap plus Wi-Fi 5: The FG131 5G RedCap module integrates with a Wi-Fi module developed from the Qualcomm QCA6174 through a serial port, delivers maximum 867Mbps speed with the support of dual-band 2.4GHz and 5GHz simultaneously.　　Leveraging 5G SA network coverage, optimized power-saving, and reduced complexity, 5G RedCap is gaining more and more attention within the IoT industry. The Fibocom5G RedCap module FG131 offers a high-performance and ultra-reliable wireless solution for application scenarios that are cost-sensitive and power-enduring. Packaged in LGA form factor at the size of 37mm*39.5mm, Fibocom FG131 is pin-compatible with Fibocom LTE Cat 6 module FG101 and FG621 series that allows smooth migration from 4G to 5G RedCap. Compliant with 3GPP Release 17, it supports 5G SA and reaches peak rates of up to 223Mbps downlink and 123Mbps uplink theoretically. With these key features combined, the Fibocom 5G RedCap module FG131 series delivers a new level of 5G network experience while maintaining high reliability and cost-effectiveness, especially for terminal devices used in mobile scenarios. Apart from the hardware optimization, FG131also supports the OpenCPU and OpenWRT software features and an abundant of rich interfaces to realize the flexible and easy integration of FWA devices.
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Release time：2024-12-11 13:26 reading：1202 Continue reading>>
Renesas Introduces USB PD EPR Solution Featuring Type-C Port Controller and Buck-Boost Battery Charger
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Renesas Introduces USB PD EPR Solution Featuring Type-C Port Controller and Buck-Boost Battery Charger

　　Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today introduced the RAA489118 buck-boost battery charger and the RAA489400 USB Type-C® port controller. The two new ICs combine to provide a premier Extended Power Range (EPR) USB Power Delivery (PD) solution.　　Renesas is a worldwide leader in USB-PD solutions, offering a comprehensive range of products including turnkey solutions for various applications. Renesas helps customers shorten their time-to-market with an extensive development environment and pre-certified USB-IF reference designs, Renesas USB-PD solutions offer superior quality and safety, along with high efficiency and power density.　　The RAA489118 functions as either a battery charger supporting two to seven battery cells in series or as a voltage regulator supporting 30V input and 30V output. It employs Renesas’ patented R3™ (Robust Ripple Regulator) technology, which combines the best features of fixed-frequency and hysteretic Pulse-Width Modulation (PWM) technologies. R3 modulation technology delivers acoustic noise-free operation, fast dynamic response, and best-in-class light-load efficiency for longer battery life.　　The RAA489118 includes an SMBus (System Management Bus) interface that is widely employed in power tools, home appliances and light industrial products. The SMBus interface, combined with the buck-boost and bidirectional features, allows the RAA489118 to work seamlessly with the RAA489400 and other components in USB-C PD implementations. Its input and output voltage levels also match mainstream solar power voltage levels, making it an ideal fit for solar portable power station applications.　　The RAA489400 port controller supports USB-PD VBUS power up to 48V/5A. It features an integrated PHY, both Sink and Source Power Path Gate Drivers with external NFETs, short-circuit protection, VBUS discharge, a VCONN MUX and dead battery support.　　“Renesas has been a worldwide leader in battery charging for many years based on advanced technology, adaptability, and exceptional value,” said Chris Allexandre, Senior Vice President and General Manager of Power at Renesas. “The RAA489118 and RAA489400 bring those strengths along with Renesas’ strong legacy of safety and reliability to new applications such as power tools and light industrial products. We expect to see strong demand from customers across multiple markets.”　　Key Features of the Renesas USB EPR PD Solution　　Battery charger supporting two to seven battery cells in series　　Buck-boost voltage regulator supporting 30V input and 30V output　　Renesas R3™ technology ensures minimal power loss and improved efficiency　　Advanced control scheme delivers fast transient response and system performance　　Robust thermal management and protection features for safety and reliability　　Adaptable configurations support a wide range of applications　　Built-in protection against overcharging, overheating, and voltage anomalies　　Bidirectional power flow　　USB-IF certified reference design reduces compliance testing time and effort　　Comprehensive design support and tools　　Winning Combinations　　Along with other USB-PD controllers, battery management ICs, and Type-C port management products, Renesas offers a turnkey USB-PD Charger Winning Combination that minimizes the effort required for customers to integrate USB-PD and battery management system features into their products. Winning Combinations are technically vetted system architectures from mutually compatible devices that work together seamlessly to bring an optimized, low-risk design for faster time to market. Renesas offers more than 400 Winning Combinations with a wide range of products from the Renesas portfolio to enable customers to speed up the design process and bring their products to market more quickly. They can be found at renesas.com/win.　　Device Availability　　The RAA489118 comes in a 4×4 mm 32-lead TQFN package, and the RAA489400 is packaged in a 32-Ld 3x5 mm FCQFN. Both products are available today from Renesas. Comprehensive design support and tools, including VIDWriter configuration tools and battery charger GUI software to configure designs, are also available.　　Renesas Power Management Leadership　　A world leader in power management ICs, Renesas ships more than 1.5 billion units per year, with increased shipments serving the computing industry, and the remainder supporting industrial and Internet of Things applications as well as data center and communications infrastructure. Renesas has the broadest portfolio of power management devices, delivering unmatched quality and efficiency with exceptional battery life. As a trusted supplier, Renesas has decades of experience designing power management ICs, backed by a dual-source production model, the industry’s most advanced process technology, and a vast network of more than 250 ecosystem partners.　　About Renesas Electronics Corporation　　Renesas Electronics Corporation (TSE: 6723) empowers a safer, smarter and more sustainable future where technology helps make our lives easier. A leading global provider of microcontrollers, Renesas combines our expertise in embedded processing, analog, power and connectivity to deliver complete semiconductor solutions. These Winning Combinations accelerate time to market for automotive, industrial, infrastructure and IoT applications, enabling billions of connected, intelligent devices that enhance the way people work and live.　　(Remarks). USB Type-C® and USB-C® are registered trademarks of USB Implementers Forum. All names of products or services mentioned in this press release are trademarks or registered trademarks of their respective owners.
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Release time：2024-12-10 14:06 reading：1397 Continue reading>>
Renesas Introduces Industry’s First Complete Memory Interface Chipset Solutions for Second-Generation DDR5 Server MRDIMMs
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Renesas Introduces Industry’s First Complete Memory Interface Chipset Solutions for Second-Generation DDR5 Server MRDIMMs

　　Renesas Electronics Corporation (TSE: 6723), a premier supplier of advanced semiconductor solutions, today announced that it has delivered the industry’s first complete memory interface chipset solutions for the second-generation DDR5 Multi-Capacity Rank Dual In-Line Memory Modules (MRDIMMs).　　The new DDR5 MRDIMMs are needed to keep pace with the ever-increasing memory bandwidth demands of Artificial Intelligence (AI), High-Performance Compute (HPC) and other data center applications. They deliver operating speeds up to 12,800 Mega Transfers Per Second (MT/s), a 1.35x improvement in memory bandwidth over first-generation solutions. Renesas has been instrumental in the design, development and deployment of the new MRDIMMs, collaborating with industry leaders including CPU and memory providers, along with end customers.　　Renesas has designed and executed three new critical components: the RRG50120 second-generation Multiplexed Registered Clock Driver (MRCD), the RRG51020 second-generation Multiplexed Data Buffer (MDB), and the RRG53220 second-generation Power Management Integrated Circuit (PMIC). Renesas also offers temperature sensor (TS), and serial presence detect (SPD) hub solutions in mass production, making it the only memory interface company that offers the complete chipset solutions for industry standard next-generation MRDIMMs as well as all other server and client DIMMs.　　“The demand for higher performance systems driven by AI and HPC applications is relentless,” said Davin Lee, Senior Vice President and General Manager of Analog & Connectivity and Embedded Processing. “Renesas is at the forefront of this trend, working with industry leaders to develop next-generation technology and specifications. These companies depend on Renesas to deliver the technical know-how and the production capabilities they require to meet unprecedented demand. Our latest chipset solutions for second-generation DDR5 MRDIMMs showcase our leadership in this market.”　　Renesas’ RRG50120 second-generation MRCD is used on the MRDIMMs to buffer the Command/Address (CA) bus, chip selects and the clocks between the host controller and DRAMs. It consumes 45% less power compared to the first-generation device, a critical specification for heat management in very high-speed systems. The RRG51020 Gen2 MDB is the other key device used in the MRDIMMs to buffer data from the host CPU to DRAMs. Both the new Renesas MRCD and MDB support speeds up to 12.8 Gigabytes per Second (GB/s). Additionally, Renesas’ RRG53220 next-generation PMIC offers best-in-class electrical-over-stress protection and superior power efficiency and is optimized for high-current and low-voltage operation.　　Availability　　Renesas is sampling the RRG50120 MRCD, the RRG51020 MDB, and the RRG53220 PMIC now, and expects the new products to be available for production in the first half of 2025. More information on these new products is available at www.renesas.com/DDR5.　　About Renesas Electronics Corporation　　Renesas Electronics Corporation (TSE: 6723) empowers a safer, smarter and more sustainable future where technology helps make our lives easier. A leading global provider of microcontrollers, Renesas combines our expertise in embedded processing, analog, power and connectivity to deliver complete semiconductor solutions. These Winning Combinations accelerate time to market for automotive, industrial, infrastructure and IoT applications, enabling billions of connected, intelligent devices that enhance the way people work and live. Learn more at renesas.com. Follow us on LinkedIn, Facebook, X, YouTube, and Instagram.　　(Remarks) Intel, the Intel logo, and other Intel marks are trademarks of Intel Corporation or its subsidiaries. All names of products or services mentioned in this press release are trademarks or registered trademarks of their respective owners.　　The content in the press release, including, but not limited to, product prices and specifications, is based on the information as of the date indicated on the document, but may be subject to change without prior notice.
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Release time：2024-12-03 14:43 reading：1033 Continue reading>>
Renesas Extends Line-up For Industrial Ethernet and Multi-Axis Motor Control Solutions with High Performance Quad-Core Application Processor
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Renesas Extends Line-up For Industrial Ethernet and Multi-Axis Motor Control Solutions with High Performance Quad-Core Application Processor

　　Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today launched the RZ/T2H, the highest performance microprocessor (MPU) offered by Renesas for industrial equipment. Thanks to its powerful application processing and real-time performance, the RZ/T2H is capable of high-speed, high-precision control of industrial robot motors for up to 9 axes. It supports a variety of network communications including Industrial Ethernet on a single chip. The MPU targets industrial controller equipment such as programmable logic controllers (PLCs), motion controllers, distributed control systems (DCSs), and computerized numerical controls (CNCs).　　With the growing demand for unmanned and labor-saving manufacturing, industrial robots such as vertically articulated robots, and industrial controller equipment are being deployed to accelerate automated production. The Renesas RZ/T2H MPU combines all the functionality and performance required for developing these applications. While industrial systems traditionally required multiple MPUs or a combination of field programmable gate arrays (FPGAs) to control these applications, the RZ/T2H MPU can now meet all the requirements on a single chip. This reduces the number of components and saves time and costs of FPGA program development.　　“We have enjoyed outstanding market success with RZ/T2M and RZ/T2L,” said Daryl Khoo, Vice President of Embedded Processing 1st Business Division at Renesas. “The RZ/T2H builds on that momentum, allowing our industrial customers to leverage their existing design assets while addressing even more innovative, demanding industrial motor control and Linux applications. Our customers have been particularly impressed that the RZ/T2H enables them to implement a 9-axis motor control all on just one chip!”　　High-Performance Application Processing and Fast Real-Time Control on a Single Chip　　The RZ/T2H is equipped with four Arm® Cortex®-A55 application CPUs with a maximum operating frequency of 1.2 GHz. For external memory, it supports 32-bit LPDDR4-3200 SDRAM. Two Cortex-R52 CPUs with a maximum operating frequency of 1 GHz handle the real-time processing, with each core equipped with a total of 576 KB of high-capacity tightly coupled memory (TCM). This allows high CPU- and memory-intensive tasks such as running Linux applications, robot trajectory generation, and PLC sequence processing, to be executed on a single chip. At the same time, the RZ/T2H can handle fast and precise real-time control such as motor control and Industrial Ethernet protocol processing.　　Motor control of up to 9 axes reduces component costs and development time　　The Renesas RZ/T2H controls up to 9-axis servo motors in industrial robots with high-speed and accurate operation. The RZ/T2H comes with everything required for up to 9 axes of motor control including 3-phase PWM timers, delta-sigma interfaces for measuring current values, and encoder interfaces (A-format™, EnDat, BiSS®, Hyperface DSL, and FA-CODER are all supported). Furthermore, peripheral functions for motor control are placed on a Low Latency Peripheral Port (LLPP) bus of the Cortex-R52 real-time CPU core, allowing high-speed access from the CPU.　　Flexible support for network communications including Industrial Ethernet　　The RZ/T2H has four Ethernet ports, three Gigabit Ethernet MAC (GMAC), plus an Ethernet switch. It also supports EtherCAT, PROFINET, EtherNet/IP, OPC UA, and the next-generation Time-Sensitive Networking (TSN) standard. The combination of these Ethernet switches and GMAC allows the MPU to support multiple Industrial Ethernet controllers and devices, providing flexibility to adapt to a wide range of controller requirements, such as upper-layer Ethernet communications.　　Specialized boards and software available for industrial robots and controllers　　The RZ/T2H comes with the Renesas Flexible Software Package (FSP), as with all Renesas MPUs, together with a Linux package that comes with long term support. An out-of-the-box multi-axis motor control evaluation solution is available including inverter boards for driving 9-axis motors, a multi-axis motor control software package, and Motion Utility Tool (a motor control software tool). Sample protocols for industrial Ethernet and software PLC package are also included to kick-start system development.　　“As industrial equipment continues to evolve, these systems increasingly require more complex functions and performance,” said Micael Borgefeldt, Product Manager at IAR Systems. “Including the latest RZ/T2H MPU from Renesas, we empower the developers to unlock flexible application configurations across 32-bit MCUs and 64-bit high-end MPUs multi-core environments. Our IAR development solution enables engineers to accelerate next-generation industrial innovation, streamlining development and boosting efficiency like never before.”　　Winning Combinations　　Renesas also offers “9-axis Industrial Motor Control with Ethernet” solution that combined the RZ/T2H with numerous compatible devices such as the RV1S9231A IGBT Drive Photocoupler and RV1S9353A Optically Isolated Delta-Sigma Modulator to offer a wide array of Winning Combinations. These Winning Combinations are technically vetted system architectures from mutually compatible devices that work together seamlessly to bring an optimized, low-risk design for faster time to market. Renesas offers more than 400 Winning Combinations with a wide range of products from the Renesas portfolio: renesas.com/win.　　Availability　　The RZ/T2H is available today. Renesas plans to release the new RZ/N2H device in Q1/2025, which offers the same performance as the RZ/T2H in a smaller package. This is ideal for industrial controller equipment such as PLCs and motion controllers.　　The RZ/T2H is managed under the Product Longevity Program (PLP) for industrial equipment that requires long life cycles. For more information on the RZ/T2H, visit: https://www.renesas.com/rzt2h.　　About Renesas Electronics Corporation　　Renesas Electronics Corporation (TSE: 6723) empowers a safer, smarter and more sustainable future where technology helps make our lives easier. A leading global provider of microcontrollers, Renesas combines our expertise in embedded processing, analog, power and connectivity to deliver complete semiconductor solutions. These Winning Combinations accelerate time to market for automotive, industrial, infrastructure and IoT applications, enabling billions of connected, intelligent devices that enhance the way people work and live. Learn more at renesas.com. Follow us on LinkedIn, Facebook, X, YouTube, and Instagram.　　(Remarks) Arm and Arm Cortex are trademarks or registered trademarks of Arm Limited in the EU and other countries. All names of products and services mentioned in this release are trademarks or registered trademarks of their respective owners.
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Release time：2024-12-02 14:31 reading：1409 Continue reading>>

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