ROHM launches SiC MOSFETs in TOLL package that achieves both miniaturization and high-power capability
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ROHM launches SiC MOSFETs in TOLL package that achieves both miniaturization and high-power capability

　　ROHM has begun mass production of the SCT40xxDLL series of SiC MOSFETs in TOLL (TO-Leadless) packages. Compared to conventional packages (TO-263-7L) with equivalent voltage ratings and on-resistance, these new packages offer approximately 39% improved thermal performance. This enables high-power handling despite their compact size and low profile. It is ideal for industrial equipment such as server power supplies and ESS (Energy Storage Systems) where the power density is increasing, and low-profile components are required to enable miniaturized product design.　　In applications like AI servers and compact PV inverters, the trend toward higher power ratings is occurring simultaneously with the contradictory demand for miniaturization, requiring power MOSFETs to achieve higher power density. Particularly in totem pole PFC circuits for slim power supplies, often called “the pizza box type,” stringent requirements demand thicknesses of 4mm or less for discrete semiconductors.　　ROHM's new product addresses these needs by reducing component footprint by approximately 26% and achieving a low profile of 2.3mm thickness – roughly half that of conventional packaged products. Furthermore, while most standard TOLL package products are limited by a drain-source rated voltage of 650V, ROHM's new products support up to 750V. This allows for lower gate resistance and increased safety margin for surge voltages, contributing to reduced switching losses.　　The lineup consists of six models with on-resistance ranging from 13mΩ to 65mΩ, with mass production started in September 2025 (sample price: $37.0/unit, tax excluded). 　　Product Lineup　　Application Examples　　・Industrial equipment: Power supplies for AI servers and data centers, PV inverters, ESS (energy storage systems)　　・Consumer equipment: General power supplies　　EcoSiC™ Brand　　EcoSiC™ is a brand of devices that utilize silicon carbide (SiC), which is attracting attention in the power device field for performance that surpasses silicon (Si). ROHM independently develops technologies essential for the evolution of SiC, from wafer fabrication and production processes to packaging, and quality control methods. At the same time, we have established an integrated production system throughout the manufacturing process, solidifying our position as a leading SiC supplier.• EcoSiC™ is a trademark or registered trademark of ROHM Co., Ltd.　　Terminology　　Totem Pole PFC Circuit　　A highly efficient power factor correction circuit configuration that reduces diode losses by using MOSFETs as rectifier elements. The adoption of SiC MOSFETs enables high voltage withstand capability, high efficiency, and high-temperature operation for the power supply.
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Release time：2025-12-04 17:10 reading：220 Continue reading>>
ROHM launches RPR-0730: High-Speed, High-Precision Optical Sensor Featuring VCSEL Technology
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ROHM launches RPR-0730: High-Speed, High-Precision Optical Sensor Featuring VCSEL Technology

　　ROHM has developed the “RPR-0730”, analog compact optical sensor, capable of high-precision detection of fast-moving objects. This sensor can be widely utilized in consumer and industrial equipment applications, including printers and conveyor systems.　　As industrial and office equipment becomes increasingly sophisticated and automated, there is a growing demand for improved sensing technology accuracy. In applications such as label printers, material or product transport systems, and copiers, the need for technology that can identify objects more accurately is essential. Moreover, increased speed driven by productivity improvements makes the introduction of high-speed, high-precision optical sensors crucial.　　The RPR-0730 is a compact reflective optical sensor (photo reflector). It employs an infrared VCSEL, which offers higher directionality than LEDs, enabling detection of finer objects. Furthermore, by using a phototransistor with analog output as the receiver, the sensor achieves a response time of 10µs. This dual combination enables high-speed, accurate identification of fine lines as narrow as 0.1mm - previously difficult to detect with conventional LED light sources. As an addition to the existing digital output sensor “RPR-0720” series, RPR-0730 expands capability to applications requiring faster sensing, such as print detection in copiers, label printers, or rotational detection in motors and gears.　　The package is ultra-compact at 2.0mm × 1.0mm × 0.55mm and employs a visible light filtering resin to suppress interference from ambient light or sunlight. This enables stable detection even in environments with varying light conditions, such as factories or outdoors. The sensor can also be easily integrated into equipment requiring installation in small, confined spaces, like inside conveyors or precision instruments, making it suitable for a wider range of applications.　　Mass production of the new product commenced in October 2025 (sample price: $2.2/unit, tax excluded).　　Going forward, ROHM will continue to leverage its development expertise in light-emitting and light-receiving elements to create sensing products that meet customer needs, contributing to the miniaturization and enhanced convenience of various devices.　　Application Examples　　•Print detection, paper feed/jam detection in label printers, copiers, shredders, etc.　　•Object detection of packages/specimens, workpiece position detection in conveyance systems, automatic inspection equipment, etc.　　•Motor/gear rotational detection in industrial robots, etc.　　Terminology　　Photo reflector　　A type of optical sensor combining an emitting element and a receiving element. It illuminates an object and detects the intensity of the reflected light to measure the presence or distance of an object.　　VCSELL　　Abbreviation for Vertical Cavity Surface Emitting LASER. A type of laser light source, it is a semiconductor laser that can emit light directly from its surface. Compared to LEDs, it offers higher directionality and is suitable for high-precision sensing. Originally adopted for optical communication applications, its use as a light source for proximity sensors and distance sensors has been expanding in recent years.　　Phototransistor　　A transistor-type photoelectric conversion element that converts optical signals into electrical signals. It integrates a photodiode and a transistor, controlling the base current with light to output an amplified collector current.
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Release time：2025-12-04 17:04 reading：206 Continue reading>>
Murata develops integrated passive device for Semtech’s SX126X family
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Murata develops integrated passive device for Semtech’s SX126X family

　　Murata Manufacturing Co., Ltd. has developed a new integrated passive device (IPD) for use with the Semtech LoRa Connect™ SX126x family, which includes the SX1261, SX1262, and LLCC68 products. Using a proprietary low-temperature co-fired ceramic (LTCC) process, Murata has successfully replaced a series of discrete matching components of the SX1261/2 reference design with a single 2.00mm x 1.25mm size LTCC component.　　The IPD enables SX1261/2 radio designers to optimize for both size and performance using two dedicated parts. The LFB21892MDZ7F957 is optimized for US and European ISM bands, delivering the full output power for the US FCC bands. The LFB21892MDZ7F821 is optimized for Eurocentric designs that need to maximize the efficiency performance.　　“The Murata IPD offers the most efficient development path to realizing the full performance of the SX1261/2, featuring a miniaturized form factor that can significantly reduce board space,” says Arthur Kiang, Product Manager, RF Components, Murata. “The reduction in the number of matching components enables lower material costs and simplifies the design process, leading to shorter lead times. This integration also lowers the probability of soldering and manufacturing issues, as there is only one component to monitor in production.”　　“Semtech’s LoRa Connect™ SX126x family has become the trusted choice for LoRaWAN® networks and long-range IoT connectivity in applications from smart metering to industrial sensing,” says Carlo Tinella, product marketing director of wireless and sensing products at Semtech. “Murata’s IPD solution demonstrates the strength of our LoRa® ecosystem, helping radio engineers accelerate development while optimizing for both miniaturization and regulatory compliance. This partnership streamlines the path from design to deployment for millions of IoT devices being deployed globally.”　　Product samples are currently available, with mass production of the IPD commencing shortly.
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Release time：2025-11-28 17:33 reading：299 Continue reading>>
ROHM’s Three-Phase Brushless DC Motor Gate Driver Achieving FET Heat Reduction while Suppressing EMI
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ROHM’s Three-Phase Brushless DC Motor Gate Driver Achieving FET Heat Reduction while Suppressing EMI

　　ROHM has developed the “BD67871MWV-Z” three-phase brushless DC motor gate driver for medium voltage applications (12 to 48V systems). By incorporating ROHM’s proprietary gate drive technology TriC3™, it greatly reduces FET’s switching loss while maintaining low EMI – traditionally a trade-off in motor driver ICs.　　Motors account for approximately 60% of global electricity consumption, making control technology which affects energy efficiency, increasingly critical. In 12V to 48V motor drive applications, a simple configuration where an MCU controls three gate drivers has been the mainstream. However, in recent years, demands for high efficiency and precise control have grown, accelerating the adoption of solutions combining an MCU with an integrated three-phase motor driver. Further, a technical challenge in three-phase motor drivers has been the trade-off between “power consumption reduction” and “noise / EMI (electro-magnetic interference) reduction,”.　　BD67871MWV-Z features ROHM's proprietary Active Gate Drive technology “TriC3™”, which rapidly senses voltage information from the external power FETs and adjust gate drive current accordingly in real-time. This greatly reduces FETs’ switching loss (and hence heat generation) FET power consumption during switching while simultaneously suppressing ringing to achieve low EMI.　　Compared to ROHM's conventional constant-current drive products, TriC3™ gate drive has been demonstrated in actual motors that FET heat generation by approximately 35% while maintaining equivalent EMI levels. Furthermore, BD67871MWV-Z adopts UQFN28 package and pin layout which are commonly used in motor driver ICs for medium-voltage industrial equipment applications, contributing to reduced engineering effort required in circuit modifications and new designs.　　Mass production of the new product commenced in September 2025 (sample price: $5.5/unit, tax excluded).　　ROHM also offer general-purpose motor drivers (BD67870MWV-Z, BD67872MWV-Z) with the same package and pin configuration as the new product, designed for constant-voltage drive. From general-purpose types to the value-added types featuring the new TriC3™, we offer a comprehensive product lineup to supports a wide variety of applications and use cases. We are committed to contributing to improved motor efficiency, enhanced application functionality, and reduced power consumption.　　Application Examples　　•Industrial Equipment: Various motors such as electric drills/drivers and industrial fans　　•Consumer Appliances: Various motors used in vacuum cleaners, air purifiers, air conditioners, ventilation fans and E-bikes (electric-assist sports bicycles)　　TriC3™　　A multi-step constant current drive technology developed by ROHM. By controlling gate current in three steps, it achieves high-speed, high-efficiency operation while minimizing EMI by suppressing ringing.　　• TriC3™ is a trademark or registered trademark of ROHM Co., Ltd.　　Terminology　　EMI (Electromagnetic Interference)　　EMI is used as an indicator of how much noise a product generates during operation, potentially causing malfunctions in surrounding ICs or systems. “Low EMI” means the product generates less noise.　　Ringing　　High-frequency oscillations or overshoot occurring during switching. This arises from the resonation between inductance and capacitance, including parasitic elements in the circuit. In the context of motor driving, ringing happens when the power MOSFETs are turned on and off.
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Release time：2025-11-21 16:54 reading：344 Continue reading>>
Now Standard in Siemens’ Flotherm™! ROHM Expands Its High-Accuracy EROM Models for Shunt Resistors
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Now Standard in Siemens’ Flotherm™! ROHM Expands Its High-Accuracy EROM Models for Shunt Resistors

　　ROHM has expanded its lineup of EROM (Embeddable BCI-ROM) models for shunt resistors and has made them available on ROHM’s website. In addition, these models are now standard in Siemens’ electronic thermal design software, Simcenter™ Flotherm™*.　　ROHM’s shunt resistors are widely used in automotive and industrial equipment applications, where their high-accuracy current detection and superior reliability are highly valued. We have added the PMR series to the EROM lineup, alongside the previously available PSR series.　　The EROM models achieve high accuracy with a measurement deviation within ±5% for both surface temperature (ΔT) and thermal resistance, enabling thermal analysis that closely reflects actual operating conditions. This contributes to improved simulation accuracy in the thermal design phase and enhances overall development efficiency.　　Furthermore, by standard implementation in Simcenter™ Flotherm™, these models make it easier for component manufacturers and set manufacturers to share thermal analysis data. This allows for highly accurate and efficient simulations while maintaining the confidentiality of proprietary information.　　Going forward, ROHM will continue to enhance the support for customers’ design and development activities through both its high-performance components and advanced simulation models.　　*Standard in Simcenter™ Flotherm™ 2510 and later.　　Terminology　　EROM (Embeddable BCI-ROM)　　A reduced-order model that can be used within Simcenter™ Flotherm™ to perform thermal simulations. It allows sharing while keeping internal component structures (confidential design data) hidden, enabling fast and highly accurate analysis.　　Simcenter™ Flotherm™　　A CFD (Computational Fluid Dynamics) simulator developed by Siemens, specialized in thermal and cooling design for electronic devices. It enables fast and accurate thermal analysis from the early design stage through validation, supporting exceptionally reliable thermal design.　　Simcenter™ Flotherm™ is a registered trademark of Siemens.
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Release time：2025-11-21 16:50 reading：321 Continue reading>>
Murata expands lineup of high cutoff frequency chip common mode choke coils in 0504-inch size for automotive high-speed differential interfaces
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Murata expands lineup of high cutoff frequency chip common mode choke coils in 0504-inch size for automotive high-speed differential interfaces

　　Murata Manufacturing Co., Ltd. (hereinafter ‘Murata’) has added a high cutoff frequency*1 product to its lineup of noise suppression components, the 0504-inch size (1.25 x1.0mm) chip common mode choke coils ‘‘DLM11C_HH2 Series’’ (hereinafter, ‘the product’), suitable for automotive high-speed differential interfaces such as LVDS*2, SerDes*3, USB, and HDMI. Murata has already started mass production of this product.　　*1High cutoff frequency: Reduces high-frequency noise.　　*2LVDS (Low Voltage Differential Signaling): An interface used for LCD panels.　　*3SerDes (Serializer/Deserializer): Circuits that convert between the serial and parallel signals in each direction.　　In recent years, the automotive market has seen multiple USB ports installed in each vehicle seat as interfaces for connecting smartphones and PCs, and data transfer speeds have increased from conventional USB 2.0 to Gbps-class USB 3.2. For these differential interfaces, common mode noise suppression is essential, and small common mode choke coils that support high-speed signals are required. In response, Murata developed this product using proprietary lamination technology to reduce high-frequency noise above 7.5 GHz in a compact 0504-inch size.　　Specifications　　*4AEC-Q200: One of the standards defined by the Automotive Electronics Council (AEC).
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Release time：2025-11-10 17:12 reading：400 Continue reading>>
TAIYO YUDEN Commercializes 1005M-Size Embeddable Multilayer Ceramic Capacitor with 22-μF Capacitance for AI Servers
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TAIYO YUDEN Commercializes 1005M-Size Embeddable Multilayer Ceramic Capacitor with 22-μF Capacitance for AI Servers

　　TAIYO YUDEN CO., LTD. has commercialized and begun mass production of embeddable multilayer ceramic capacitor (MLCC) that achieves a capacitance of 22-μF in a 1005M size (1.0 x 0.5 mm).　　This ceramic capacitor is an MLCC designed for decoupling applications on IC power lines used in AI servers and other types of information devices.　　Components embedded in a board require high precision in terms of flatness of the external electrodes for connection to the circuit. With respect to this requirement, TAIYO YUDEN has commercialized an embeddable MLCC that achieves a 22-μF capacitance in a 1005M size by enhancing external electrode formation technology and other elemental technologies.　　Mass production of the capacitor began at our Tamamura Plant (Sawa District, Gunma Prefecture) in August 2025. Samples are available for 20 yen per unit.　　Technology Background　　AI servers and other types of devices with advanced information processing capabilities are equipped with ICs that consume extremely large amounts of power. For decoupling purposes in such power supply circuits, small, high-capacity MLCCs are required to handle large currents.　　Additionally, to minimize circuit loss and noise, it is important to route the power supply circuit close to the ICs. Traditional power supply circuits are routed around ICs. But, technological developments are progressing, allowing them to be placed closer, such as on the back of the board or directly under the ICs. Thus, embeddable MLCCs need to be equipped with high-precision external electrodes to connect to the lines.　　To satisfy this need, TAIYO YUDEN has improved its external electrode formation technology and commercialized 1005M-size embeddable MLCC with a capacitance of 22 μF.　　TAIYO YUDEN is continuing to develop new MLCCs with higher capacitance and other distinguishing features.　　■ Application　　Decoupling applications on IC power lines used in AI servers and other types of information devices
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Release time：2025-10-20 16:40 reading：459 Continue reading>>
ROHM and Infineon collaborate on silicon carbide power electronics packages to enhance flexibility for customers
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ROHM and Infineon collaborate on silicon carbide power electronics packages to enhance flexibility for customers

　　ROHM and Infineon Technologies AG have signed a Memorandum of Understanding to collaborate on packages for silicon carbide (SiC) power semiconductors used in applications such as on-board chargers, photovoltaics, energy storage systems, and AI data centers. Specifically, the partners aim to enable each other as second sources of selected packages for SiC power devices, a move which will increase design and procurement flexibility for their customers. In the future, customers will be able to source devices with compatible housings from both ROHM and Infineon. The collaboration will ensure seamless compatibility and interchangeability to match specific customer needs.　　"We are excited about working with ROHM to further accelerate the establishment of SiC power devices," said Dr. Peter Wawer, Division President Green Industrial Power at Infineon. "Our collaboration will provide customers with a wider range of options and greater flexibility in their design and procurement processes, enabling them to develop more energy-efficient applications that will further drive decarbonization."　　"ROHM is committed to providing customers with the best possible solutions. Our collaboration with Infineon constitutes a significant step towards the realization of this goal, since it broadens the portfolio of solutions," said Dr. Kazuhide Ino, Member of the Board, Managing Executive Officer, in charge of Power Devices Business at ROHM. "By working together, we can drive innovation, reduce complexity, and increase customer satisfaction, ultimately shaping the future of the power electronics industry."Dr. Peter Wawer, Division President Green Industrial Power at Infineon (left)and Dr. Kazuhide Ino, Member of the Board and Managing Executive Officer at ROHM　　As part of the agreement, ROHM will adopt Infineon’s innovative top-side cooling platform for SiC, including TOLT, D-DPAK, Q-DPAK, Q-DPAK dual, and H-DPAK packages. Infineon's top-side cooling platform offers several benefits, including a standardized height of 2.3 mm for all packages. This facilitates designs and reduces system costs for cooling, while also enabling better board space utilization and up to two times more power density.　　At the same time, Infineon will take on ROHM’s DOT-247 package with SiC half-bridge configuration to develop a compatible package. That will expand Infineon’s recently announced Double TO-247 IGBT portfolio to include SiC half-bridge solutions. ROHM's advanced DOT-247 delivers higher power density and reduces assembly effort compared to standard discrete packages. Featuring a unique structure that integrates two TO-247 packages, it enables to reduce thermal resistance by approximately 15 percent and inductance by 50 percent compared to the TO-247. The advantages bring 2.3 times higher power density than the TO-247.　　ROHM and Infineon plan to expand their collaboration in the future to include other packages with both silicon and wide-bandgap power technologies such as SiC and gallium nitride (GaN). This will further strengthen the relationship between the two companies and provide customers with an even broader range of solutions and sourcing options.　　Semiconductors based on SiC have improved the performance of high-power applications by switching electricity even more efficiently, enabling high reliability and robustness under extreme conditions, while allowing for even smaller designs. Using ROHM’s and Infineon’s SiC products, customers can develop energy-efficient solutions and increase power density for applications such as electric vehicle charging, renewable energy systems and AI data centers.　　About ROHM　　ROHM, a leading semiconductor and electronic component manufacturer, was established in 1958. From the automotive and industrial equipment markets to the consumer and communication sectors, ROHM supplies ICs, discretes, and electronic components featuring superior quality and reliability through a global sales and development network. Our strengths in the analog and power markets allow us to propose optimized solutions for entire systems that combine peripheral components (i.e., transistors, diodes, resistors) with the latest SiC power devices as well as drive ICs that maximize their performance.　　Further information is available at https://www.rohm.com　　About Infineon　　Infineon Technologies AG is a global semiconductor leader in power systems and IoT. Infineon drives decarbonization and digitalization with its products and solutions. The company has around 58,060 employees worldwide and generated revenue of about €15 billion in the 2024 fiscal year (ending 30 September). Infineon is listed on the Frankfurt Stock Exchange (ticker symbol: IFX) and in the USA on the OTCQX International over-the-counter market (ticker symbol: IFNNY).
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Release time：2025-09-29 14:53 reading：594 Continue reading>>
ROHM Launches 2-in-1 SiC Molded Module “DOT-247”
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ROHM Launches 2-in-1 SiC Molded Module “DOT-247”

　　ROHM has developed the "DOT-247," a 2-in-1 SiC molded module (SCZ40xxDTx, SCZ40xxKTx), ideal for industrial applications such as PV inverters, UPS systems, and semiconductor relays. The module retains the versatility of the widely adopted "TO-247" package while achieving high design flexibility and power density.　　The DOT-247 features a combined structure consisting of two TO-247 packages. This design enables the use of large chips, which were structurally difficult to accommodate in the TO-247 package, and achieves low on-resistance through an unique internal structure. Additionally, through optimized package structure, thermal resistance has been reduced by approximately 15% and inductance by approximately 50% compared to the TO-247. This enables a power density 2.3 times higher than the TO-247 in a half-bridge configuration –achieving the same power conversion circuit in approximately half the volume.　　The new products featuring the DOT-247 package are available in two topologies: half-bridge and common-source. Currently, two-level inverters are the mainstream in PV inverters, but there is growing demand for multi-level circuits such as three-level NPC, three-level T-NPC, and five-level ANPC to meet the need for higher voltages. In the switching sections of these circuits, topologies such as half-bridge and common-source are mixed –making custom products necessary in many cases when using conventional SiC modules.　　To address this challenge, ROHM has developed each of these two topologies—the smallest building blocks of multi-level circuits—into a 2-in-1 module. This enables flexibility to support various configurations such as NPC circuits and DC-DC converters, while significantly reducing the number of components and mounting area, and achieving circuit miniaturization compared to discrete components.　　Evaluation boards will also be made available progressively to facilitate evaluation during application design. For more information, please contact a sales representative or visit the contact page on ROHM’s website.　　Product Lineup　　☆:Under Development　　AEC-Q101 is an automotive electronics reliability standard established by the Automotive Electronics Council (AEC).　　The Q101 standard is specifically focused on discrete semiconductor components.　　Application Examples　　PV inverters, semiconductor relays, UPS (uninterruptible power supply), ePTO, and boost converters for FCVs (fuel cell vehicles).　　AI servers (eFuse), EV charging stations, etc.　　Sales Information　　Pricing: $140/unit (samples, excluding tax)　　Availability: ROHM construct mass production (September 2025)　　Products compliant with the automotive reliability standard AEC-Q101 are scheduled to begin sample shipments in October 2025.　　Comprehensive Support　　ROHM is committed to providing application-level support, including the use of in-house motor testing equipment. A variety of supporting materials are also offered, such as simulations and thermal designs that enable quick evaluation and adoption of DOT-247 products. An evaluation kit for double-pulse testing is already available, allowing immediate testing, while an evaluation kit for 3-phase inverters is currently under preparation, with reference designs scheduled to be released from November 2025.　　• About the DOT-247 design models　　SPICE models: Available on the product web pages for each part number　　LTspice® models: Scheduled to be available for three-level NPC from October 2025 on the web pagesLTspice® is a registered trademark of Analog Devices, Inc.When using third-party trademarks, please adhere to the usage guidelines specified by the rights holder.　　For details, please contact a sales representative or visit the contact page on ROHM’s website.　　EcoSiC™ Brand　　EcoSiC™ is a brand of devices that utilize silicon carbide (SiC), which is attracting attention in the power device field for performance that surpasses silicon (Si). ROHM independently develops technologies essential for the evolution of SiC, from wafer fabrication and production processes to packaging, and quality control methods. At the same time, we have established an integrated production system throughout the manufacturing process, solidifying our position as a leading SiC supplier.• EcoSiC™ is a trademark or registered trademark of ROHM Co., Ltd.　　Terminology　　Half-bridge/ Common-source　　A basic configuration of a power conversion circuit consisting of two MOSFETs. In a half-bridge configuration, the MOSFETs are connected in series, one above the other, and the output is taken from the connection point. By switching the upper and lower MOSFETs alternately, the output voltage can be switched between positive and negative, making this configuration widely used as the basic structure for high-efficiency power conversion in inverters and motor drive circuits.　　Common Source is a configuration where the source terminals of the two MOSFETs are connected, and the output is taken from each drain. By grouping the source terminals, the gate drive circuit can be simplified, making it suitable for applications such as multilevel inverters.　　Types of NPC-type multi-level circuits　　NPC (Neutral Point Clamped) is a multi-level circuit configuration that divides the output voltage into three levels (+, 0, and -) to reduce voltage stress on the switching devices. The "0V" state is created by the neutral point, which is the contact point located between the positive and negative voltages.　　T-NPC (T-type NPC) replaces the diode used to stabilize the neutral point with switching devices such as MOSFETs, enabling more efficient operation. ANPC (Active NPC) actively controls the potential of the neutral point itself using a switch, achieving smoother output waveforms and high-precision power conversion. T-NPC and ANPC are suitable for applications requiring higher output and efficiency.　　ePTO (electric Power Take-Off)　　A system that uses the power from an electric vehicle's motor or battery to drive external work machinery or equipment (such as hydraulic pumps or compressors). This is an electrified version of the PTO (Power Take-Off) used in conventional engine vehicles, and its adoption is advancing in environmentally friendly commercial vehicles and work vehicles.
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Release time：2025-09-17 13:11 reading：627 Continue reading>>
ROHM’s SiC MOSFETs Adopted in Schaeffler’s Inverter Brick, Now in Mass Production
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ROHM’s SiC MOSFETs Adopted in Schaeffler’s Inverter Brick, Now in Mass Production

　　ROHM and Schaeffler, a leading German automotive supplier, have started mass production of a new high-voltage inverter brick equipped with ROHM’s SiC (silicon carbide) MOSFET bare chips as part of their strategic partnership. The inverter brick is intended for a major Chinese car manufacturer.High voltage inverter brickSiC MOS Wafer　　The Schaeffler inverter subassembly is the essential power device building block (brick) to control the electric drive via logic signals. This is where the high-frequency current pulses are produced that set the vehicle’s electric motor in motion. The performance characteristics of the inverter brick now being produced are impressive: Schaeffler increased the output of the brick by increasing the maximum possible battery voltage to much more than the usual 800 V – and with RMS currents of up to 650 A, which turn the sub-module into a compact power pack.　　“Through our strategic approach of incorporating scalability and modularity into our e-mobility solutions – from individual components to a highly integrated electric axle – we developed the readily integrated inverter brick. Based on our generic platform development, it took us just one year to bring this optimal product for the popular X-in-1 architectures to volume production readiness,” says Thomas Stierle, CEO of the E-Mobility Division at Schaeffler.　　Modularity and scalability as the key to easy integration　　As a core component of an inverter, a brick has to meet strict requirements. The characteristics of the sub-module are indicative of the factors behind the current sales success and start of volume production: ROHM’s silicon carbide (SiC) power semiconductors enable the frame-mounted sub-module with high power density to be compact, efficient, and readily integrated into various inverters through its modular and scalable design. The sub-module incorporates the power module for pulse width modulation (PWM) of the current pulses, the DC link capacitor, a DC link and a cooler. Moreover, the brick has a DC boost function, thanks to which a vehicle with 800 V architecture can also be charged at a 400 V charging station at a charging speed of 800 V.　　“We are glad about the launch of volume production for Schaeffler’s inverter brick with our 4th generation SiC MOSFET,” says Dr. Kazuhide Ino, Member of the Board and Managing Executive Officer at ROHM. “With our SiC technology we are making a substantial contribution to increasing the efficiency and performance of electric cars. Working with Schaeffler as our partner, we are thus fostering innovation and sustainability in the automotive industry,” Dr. Ino adds.　　The strategic partnership of Schaeffler (originally initiated under Vitesco Technologies) with ROHM has existed since 2020 and serves to secure capacity for energy-efficient SiC power semiconductors.Thomas Stierle, CEO E-Mobility Division at Schaeffler (left) and Dr. Kazuhide Ino, Member of the Board and Managing Executive Officer at ROHM　　About Schaeffler Group　　The Schaeffler Group has been driving forward groundbreaking inventions and developments in the field of motion technology for more than 75 years. With innovative technologies, products and services for electric mobility, CO₂-efficient drives, chassis solutions and renewable energies, the company is a reliable partner for making motion more efficient, intelligent and sustainable – over the entire life cycle. Schaeffler describes its comprehensive range of products and services in the mobility ecosystem by means of eight product families, from bearing solutions and linear guidance systems of all kinds to repair and monitoring services. With around 120,000 employees at more than 250 locations in 55 countries, Schaeffler is one of the world’s largest family-owned companies and ranks among Germany’s most innovative companies.
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Release time：2025-09-05 16:57 reading：617 Continue reading>>

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