<span style='color:red'>Intel</span> Patent Reveals XBM Matching HBM4 Footprint Without Interposers; Commercialization Seen After 2030
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Intel Patent Reveals XBM Matching HBM4 Footprint Without Interposers; Commercialization Seen After 2030

　　As AI chip demand surges, existing high-bandwidth memory (HBM) is facing supply and cost challenges, prompting the search for alternative memory technologies. According to Tom’s Hardware, an Intel patent application published on July 2, 2026 reveals the company’s proposed cross-batch memory (XBM) architecture, designed to ease the packaging and cost bottlenecks of today’s interposer-based HBM. The report states that the design aims to match HBM4’s footprint while replacing conventional DRAM and its ultra-wide interface with back-end-of-line (BEOL) transistors and serial Universal Chiplet Interconnect Express (UCIe) links.　　As noted by Wccftech, XBM is expected to target commercialization after 2030, in line with ZAM, the memory architecture Intel is co-developing with SoftBank subsidiary SAIMEMORY.　　XBM Architecture and Advantages　　The proposed architecture centers on DRAM blocks connected to a UCIe I/O block operating at 32 GT/s, with the I/O routed through the base die. According to Wccftech, each XBM stack provides a die capacity ranging from 0.5GB to 5GB. Each sub-channel consists of 12 data blocks, with up to 96 data blocks in an 8-high XBM stack and 192 in a 16-high stack. These channels operate at 2GHz. The report also notes that XBM can be implemented in multiple package configurations, including Memory-on-Package (MoP), enabling higher bandwidth and capacity in smaller form-factor designs.　　Notably, the memory die uses 1T1C (one transistor, one capacitor) back-end DRAM, with transistors fabricated in the back-end-of-line (BEOL) metal layers rather than front-end silicon, Wccftech says. According to the report, this significantly improves area efficiency, allowing more space for TSVs (Through-Silicon Via) and enabling higher memory density and bandwidth.　　Competitive and Ecosystem Challenges　　The global HBM market is currently dominated by South Korean suppliers. As Global Economic News points out, conventional HBM incurs high manufacturing costs due to the micro-bump processes used to vertically stack DRAM dies, while silicon interposers add significant routing complexity and cost. Intel’s proposed XBM architecture is designed to address these limitations.　　However, Global Economic News also notes that Intel’s proposal is unlikely to immediately shift the industry’s competitive landscape. SK hynix and Samsung Electronics have spent several years developing cost-saving technologies, including standard chiplets, UCIe, and fan-out packaging, to reduce interposer costs. The report further notes that platform compatibility and software ecosystems remain major barriers to adoption. The global AI accelerator ecosystem, led by NVIDIA, is currently optimized for the existing HBM architecture and wide-bandwidth parallel interfaces, making a transition to alternative memory architectures more challenging.
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Release time：2026-07-09 11:24 reading：345 Continue reading>>
<span style='color:red'>Intel</span> Reportedly Weighs Dual-Side Power Delivery for 14A2 to Boost Chip Density in Race With TSMC, Samsung
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Intel Reportedly Weighs Dual-Side Power Delivery for 14A2 to Boost Chip Density in Race With TSMC, Samsung

　　Intel is reportedly refining its 1.4nm roadmap with a new power delivery architecture. According to ETNews, sources say the company originally planned to rely exclusively on its PowerDirect back-side power delivery network (BSPDN) for the baseline 14A node. However, Intel is now reportedly considering a dual-side architecture for the follow-on 14A2 process that combines both front-side and back-side power delivery.　　The report says the architectural change is driven by lithography limitations as Intel pushes the pitch of its lowest metal layer (M0) to around 21nm, where stochastic defects become increasingly difficult to manage.　　Intel has previously said it aims to increase chip density by 1.3× over 18A to compete with TSMC’s N2/A14 and Samsung’s SF2Z. While 14A targets an M0 pitch of approximately 28nm, industry analysis cited by the report suggests the follow-on 14A2 could reduce it to around 21nm. The report says the resulting density gains would help justify the use of High-NA EUV lithography systems, despite requiring double patterning, which cost hundreds of billions of Korean won.　　The challenge, however, is that shrinking circuit lines below 21nm causes interconnect resistance to rise exponentially. The report says the nano Through-Silicon Via (nTSV) infrastructure built for back-side power delivery alone may no longer meet the current density requirements of the transistors, leading to severe IR drop, or voltage loss. Intel is therefore expected to keep the back-side power delivery network as the primary power path while repurposing portions of the front-side metal layers to carry supplemental power and clock signals.　　The report says the hybrid architecture is a design compromise aimed at preserving sufficient power margin as Intel pushes toward more aggressive scaling while confronting lithography limitations. Although it adds routing complexity, the approach is viewed as necessary to achieve the targeted 21nm M0 pitch.　　Intel’s reported move also comes as TSMC advances its Super Power Rail (SPR) backside power delivery roadmap, with A16 slated for volume production in 2027 and A12 targeted for 2029, both incorporating the technology for AI and HPC applications, according to Tom’s Hardware.　　Roadmap Comparison　　The ETNews report also highlights Intel’s tight development timeline. According to its roadmap, the 14A process is scheduled to enter risk production in 2028, followed by volume production in 2029. Intel is also expected to distribute version 0.9 of its 14A Process Design Kit (PDK) to external customers in October, the report adds.　　By the time Intel reaches risk production, however, TSMC is expected to already be shipping commercial products built on its A14 process. The report notes that TSMC had already achieved stable yields on its N2 process during 2025–2026 and entered the market in line with Apple’s product launch schedule. As for Samsung, The Elec reports that the company has recently reaffirmed plans to begin mass production of its 1.4nm process in 2029, followed by the enhanced SF1.4+ node in 2030.
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Release time：2026-07-07 11:21 reading：383 Continue reading>>
Samsung Reportedly Restarts 1.4nm Push, Targets 2029 Mass Production to Close Gap with TSMC, <span style='color:red'>Intel</span>
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Samsung Reportedly Restarts 1.4nm Push, Targets 2029 Mass Production to Close Gap with TSMC, Intel

　　As Intel and TSMC both target 1.4nm mass production around 2028-29, Samsung—after reportedly delaying its own roadmap—is now re-entering the race. According to The Bell, the company has resumed efforts to commercialize its 1.4nm (SF1.4) foundry process, with mass production now slated for 2029, placing it slightly behind its leading rivals.　　Samsung is also understood to have recently requested early development of process equipment from domestic and overseas partners. As noted by the report, it has recently shared its 1.4nm process roadmap with major semiconductor equipment makers, including Applied Materials and Lam Research.　　Notably, the report, citing industry sources, points out that Samsung Electronics has already installed ASML’s next-generation High-NA extreme ultraviolet (EUV) lithography equipment at its NRD-K facility. The High-NA EUV tools are understood to be applied to select layers starting from the 1.4nm process, the report explains.　　Why Samsung Delayed 1.4nm Plans　　The Bell adds that the original 2027 target has been pushed back to 2029, as Samsung redirects focus toward strengthening its 2nm (SF2) and derivative SF2P processes, signaling a shift toward yield stabilization and process optimization over aggressive node advancement.　　This strategic pivot is also reflected at the product level. A previous Global Economic News report suggested that Samsung has shifted the manufacturing process for its next-generation flagship smartphone processor, the Exynos 2800, from the originally planned 1.4nm node to an advanced version of its 2nm process.　　A Closer Look at 1.4nm Plans for Intel, TSMC　　Samsung Electronics’ renewed push into its 1.4nm process is drawing attention over whether it can narrow the technology gap with rivals such as TSMC and Intel. According to Economic Daily News, TSMC is targeting 1.4nm pilot production as early as 3Q27, with mass production planned for 2H28.　　However, Tom’s Hardware notes that TSMC is expected to skip ASML’s High-NA EUV tools through 2029, meaning its 1.4nm node would proceed without the advanced system being adopted by Intel and Samsung.　　For Intel, Reuters reports that its 18A-P process has already entered pilot production, with the company reportedly targeting 14A risk production in 2028, followed by high-volume manufacturing in 2029.
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Release time：2026-07-01 11:39 reading：514 Continue reading>>
<span style='color:red'>Intel</span> Taps SK hynix Ex-CEO as Foundry EVP to Lead Advanced Packaging Push as EMIB, HBI Scale Up
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Intel Taps SK hynix Ex-CEO as Foundry EVP to Lead Advanced Packaging Push as EMIB, HBI Scale Up

　　Intel CEO Lip-Bu Tan is accelerating the company’s foundry ambitions, continuing to recruit seasoned talent from across the chip industry. The latest move is the appointment of Seok-Hee Lee as Executive Vice President of Intel Foundry, according to an Intel announcement on June 18.　　Notably, Lee joins Intel after serving as president and CEO of SK On and previously leading SK hynix. A semiconductor industry veteran, he also held engineering leadership roles at Intel and in academia, bringing deep expertise in advanced process technologies and large-scale manufacturing, according to the press release.　　Reporting directly to Tan, Lee will oversee advanced packaging, system integration, back-end technology development, and manufacturing, as noted by the company. Intel said the appointment is aimed at strengthening its system-level innovation capabilities and supporting the next phase of its foundry expansion.　　Tan also underscored Lee’s pivotal role in advancing Intel’s next-generation packaging strategy.“As we prepare to scale advanced packaging technologies, including EMIB-T and HBI, for high-volume production, Seok-Hee is the ideal leader to drive the growth of this strategically important business,” Tan said.　　The appointment, as Reuters points out, comes after U.S. President Donald Trump announced earlier that Apple had agreed to collaborate with Intel on designing and manufacturing chips in the United States, providing a potential boost to Intel’s foundry business.　　A previous Reuters report, citing The Information, also reported that Google has tapped Intel to manufacture more than 3 million TPUs in 2028, while NVIDIA is evaluating Intel’s 18A process and advanced packaging technologies for a next-generation multi-die GPU design.　　Meanwhile, Intel Foundry EVP Naga Chandrasekaran will continue reporting to CEO Lip-Bu Tan, overseeing front-end technology development and manufacturing as Intel accelerates the ramp of Intel 18A, Intel 14A and future process nodes. He will also retain responsibility for design enablement and customer-facing business operations, supporting Intel Foundry’s long-term growth.　　Intel’s Talent Offensive Continues　　Lee’s appointment marks the latest in a series of high-profile hires since Lip-Bu Tan took the helm at Intel. Reuters notes that the company bolstered its foundry ambitions in April by recruiting Samsung foundry veteran Shawn Han to support its contract manufacturing business.　　The hiring drive began earlier. In late 2025, Intel brought in former TSMC senior vice president Wei-Ren Lo as executive vice president overseeing manufacturing and packaging amid controversy surrounding alleged sub-2nm trade secrets. Intel said Lo’s return was part of its broader transformation effort, with the veteran executive bringing back nearly two decades of experience gained at Intel before joining TSMC.
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Release time：2026-06-22 10:51 reading：424 Continue reading>>
Apple A22 Pro May Adopt 1.4nm in 2028; TSMC Remains Primary Supplier, <span style='color:red'>Intel</span> Reportedly Considered
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Apple A22 Pro May Adopt 1.4nm in 2028; TSMC Remains Primary Supplier, Intel Reportedly Considered

　　Apple is expected to use TSMC’s 2nm for its A20 and A20 Pro chips, but industry discussions are already shifting to the A22 Pro and a potential move to 1.4nm. According to Bloomberg, Apple is expected to adopt a 1.4nm process for the A22 Pro, which is slated for high-end iPhone models in 2028. While TSMC is expected to remain Apple’s primary manufacturing partner, the report notes that the company is also evaluating Intel as a potential secondary production source.　　Based on the reported timeline, the A21 Pro is expected to remain on TSMC’s 2nm, potentially transitioning to the enhanced N2P variant, which offers incremental improvements over N2, according to Wccftech.　　Wccftech also notes that costs could rise significantly, with TSMC’s 1.4nm wafers estimated to cost around US$45,000 each. As a result, the report suggests that only the A22 Pro, rather than the standard A22, will be manufactured on the 1.4nm node.　　As noted by MacRumors, current rumors suggest Intel could manufacture lower-end chips for products such as the iPad and Mac. At the same time, Intel CEO Lip-Bu Tan is seeking to revive the company’s foundry business by focusing on leading-edge nodes. According to TechPowerUp, Intel expects its 14A node to enter risk production in 2028, followed by high-volume manufacturing in 2029.　　Beyond the possibility of Apple adopting TSMC’s 1.4nm node for its A22 chips, the company is reportedly preparing three major product launches for late 2027. According to 9to5Mac, citing Bloomberg, these include a 20th-anniversary iPhone featuring a nearly edge-to-edge display and curved glass that wraps around the sides, a second-generation foldable iPhone, and AirPods equipped with built-in cameras.　　TSMC’s A14 Roadmap Takes Shape　　TSMC has been accelerating construction of its 1.4nm fab at the Central Taiwan Science Park. According to Economic Daily News, foundation piling for the first phase has largely been completed, with progress reportedly ahead of schedule. Trial production could begin as early as 3Q27, with mass production targeted for the second half of 2028.　　Compared with N2, A14 is expected to deliver a 10–15% performance improvement at the same power level, or reduce power consumption by 25–30% at the same performance level, while increasing logic density by more than 20%, according to TSMC.
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Release time：2026-06-18 10:15 reading：715 Continue reading>>
<span style='color:red'>Intel</span> Says 18A May Reach Strong Margins by 2027; Notebook Chips on the Node Mark Fastest Ramp in 5 Years
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Intel Says 18A May Reach Strong Margins by 2027; Notebook Chips on the Node Mark Fastest Ramp in 5 Years

　　Intel is betting heavily on 18A to support the company’s turnaround plan. According to The Register, Chief Financial Officer David Zinsner said that early last year Intel faced the challenge of trying to improve both performance and yield at the same time. The company later shifted its focus to stabilizing performance first, and with that objective largely achieved, it is now concentrating on improving yield month by month.　　Zinsner said Intel’s goal is to achieve yield levels that support strong margins, adding that the company is currently ahead of schedule to reach that target by the end of 2027, as the report highlights. He added that after Lip-Bu Tan joined the company, Intel began sharing more manufacturing data with its vendors. The increased collaboration helped improve yields and made a dramatic difference.　　Looking beyond 18A, Zinsner also expressed confidence in Intel’s 14A. According to the report, he said the company has adopted a more aggressive approach than it did with 18A, adding that yield and performance metrics are currently ahead of where 18A was at the same stage of development.　　Intel 3 and 18A Supply Set to Rise Amid Strong CPU Demand　　In addition to providing an update on Intel’s manufacturing roadmap, Zinsner highlighted growing supply from Intel 3 and 18A, according to Seeking Alpha. As cited by the report, he said Intel expects a meaningful increase in supply from both Intel 3 and 18A over the coming quarters to meet rising demand. He added that 18A-based notebook processors are ramping quickly and represent the company’s fastest-ramping product launch in at least the past five years.　　The company is also seeing rising CPU demand. According to The Register, Zinsner said it remains difficult to predict the full extent of future growth, but he expects the market to be substantial. He said the key challenge at present is supply, adding that Intel sees sufficient demand in the market and should be able to grow data center revenue meaningfully if it executes successfully on planned supply ramps.
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Release time：2026-06-05 10:40 reading：637 Continue reading>>
<span style='color:red'>Intel</span> 18A Yields Up 7%–8% Monthly as 2H26 Customers Expected; Said to Push 18A CPUs Amid Shortages
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Intel 18A Yields Up 7%–8% Monthly as 2H26 Customers Expected; Said to Push 18A CPUs Amid Shortages

　　Intel’s turnaround appears to be gaining momentum. According to CNBC, Intel CEO Lip-Bu Tan said the company’s foundry business is making progress, with 18A process yields now improving by 7% to 8% per month, signaling advancement from earlier challenges.　　More significantly, Tan said the improvements are beginning to attract customer interest, with Intel expecting commitments from multiple foundry customers in the second half of 2026, the report highlights. The remarks align with earlier comments from CFO David Zinsner, who said signals from external foundry customers would become “more concrete” in the second half of the year and into early 2027.　　Intel Reportedly Pushes 18A CPUs Amid Supply Tightness　　Recent CPU shortages have also brought renewed attention to Intel, which is reportedly promoting processors built on its 18A technology. According to Nikkei, sources say Intel is encouraging key PC partners across the U.S., China, and Taiwan to increase adoption of CPUs produced using the process, which only became available late last year.　　Sources add that the company has prioritized supply of chips based on its older Intel 7 process for server and industrial applications. Intel’s push to promote its most advanced chips comes as it seeks to capitalize on the AI race and regain leadership in advanced chipmaking, the report adds.　　14A Seen as Intel’s Next Push Against TSMC　　Beyond 18A, according to CNBC, Tan said Intel’s next-generation 14A process could eventually compete with TSMC, adding that it is expected to arrive around the same time as TSMC’s comparable technology — a development he described as a “major, major breakthrough.” As noted by Wccftech, Tan said Intel expects risk production for its 14A technology in 2028, followed by volume production in 2029, placing its timeline alongside TSMC’s. He added that multiple customers are already engaging with Intel as the company has made its 0.5 PDK available.　　EMIB Shows Early Customer Commitment as Substrate Prepayments Emerge　　Another major technology highlighted by Lip-Bu Tan is EMIB, which he described as one of the most advanced chip packaging technologies. According to Wccftech, Tan said customer commitment has become evident, with some customers even prepaying for substrates to secure supply amid ongoing shortages.　　Wccftech notes that EMIB was recently said to have reached 90% yields. By contrast, Commercial Times notes that TSMC’s CoWoS currently mass-produced 5.5-reticle-size version — the world’s largest today — has already achieved yields of 98%.
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Release time：2026-05-20 11:32 reading：927 Continue reading>>
First <span style='color:red'>Intel</span> Wildcat Lake Laptops Near Launch; Reportedly Built on 18A, Taking Aim at Apple’s MacBook Neo
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First Intel Wildcat Lake Laptops Near Launch; Reportedly Built on 18A, Taking Aim at Apple’s MacBook Neo

　　The first laptops powered by Intel’s “Wildcat Lake” Core Series 300 processors for the entry-level PC segment are reportedly nearing launch. According to Wccftech, Intel Core Series 3 laptops could hit retail shelves as early as next week, with initial models including 14-inch and 16-inch designs from Honor and ASUS, while more OEMs are expected to follow.　　Chinese media outlet Mydrivers notes that the Honor Notebook X14 2026 Combat Edition will be the first commercially available laptop based on Intel’s Wildcat Lake platform, featuring an Intel Core 5 320 processor. Another Wccftech report notes that the device comes with 16GB of LPDDR5X 7467 MT/s memory, double the capacity of Apple’s MacBook Neo, along with a 512GB SSD. By comparison, the Neo starts at 256GB of storage and tops out at 512GB.　　Intel’s Wildcat Lake Targets AI PCs With Better Battery Life　　The SoC package integrates two dies, with the primary die built on Intel’s 18A node, according to TechPowerUp. This die features a 6-core CPU configuration, NPU 5 delivering 40 TOPS of INT8 performance, and a GPU with up to two Xe3 cores. It also integrates the memory controller and cache pool. Meanwhile, Intel dedicates the second die to I/O functions, the report adds.　　Wccftech notes that Intel’s Core Series 3 emphasizes AI capability and battery efficiency, marking the company’s first hybrid AI-ready Core Series processor. The report adds that the chips are designed for all-day battery life and everyday productivity, offering up to 2.1 times faster creation and productivity performance, up to 64% lower processor power consumption, and up to 2.7 times higher AI GPU performance compared with previous-generation Intel Core 7 150U processors.　　Looking ahead, Wildcat Lake could see broader adoption across future devices. TechPowerUp reports that Google is likely to pair its rumored “Googlebook” laptops with Intel’s latest Core Series 300 “Wildcat Lake” processors. However, Intel is not expected to be the exclusive platform provider, with Qualcomm and MediaTek also said to be among Google’s partners.
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Release time：2026-05-19 10:42 reading：1101 Continue reading>>
Apple Reportedly Keeps 2nm 5G Modem Orders with TSMC Amid <span style='color:red'>Intel</span> Cooperation Signals
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Apple Reportedly Keeps 2nm 5G Modem Orders with TSMC Amid Intel Cooperation Signals

　　While recent market chatter has focused on a potential shift by Apple between longtime foundry partner TSMC and Intel, the Economic Daily News, citing industry sources, reports that the Cupertino-based company remains heavily dependent on the Taiwanese foundry giant, as it plans to place its entire in-house 5G modem orders with TSMC, leveraging its 2nm process technology.　　The report suggests that Apple’s self-developed 5G modem chips are expected to power future iPhone, iPad, and Apple Watch devices, replacing modems from Qualcomm. The volume used across its product lineup is projected to reach hundreds of millions of units, the report adds.　　Notably, Apple’s iPhone 17 lineup is expected to be the last to ship with Qualcomm Incorporated’s 5G modems, as the company moves toward a full transition to its in-house C2 baseband chip across all iPhone 18 models, according to Wccftech.　　The C2 development builds on Apple’s earlier in-house modem effort. Apple’s C1, first introduced in early 2025 with the iPhone 16e, marked its most complex chip system to date, integrating a 4nm baseband modem and a 7nm transceiver, according to earlier reporting from Reuters. The Economic Daily News further reports that Apple Inc.’s in-house C2 5G modem is expected to add full mmWave support—addressing the Sub-6 GHz limitation of its predecessor—while also incorporating satellite connectivity.　　Supply chain sources cited in the Economic Daily News report say TSMC has already secured foundry orders for Apple’s modem chips. Its back-end testing partner is also reportedly preparing for higher demand, with around 600 test systems being procured, as capacity is set to ramp from 2027.　　Apple’s Chip Tug-of-War: TSMC vs Intel　　Though claims of an Apple order shift to Intel remain unconfirmed, and any such move would not signal a departure from TSMC, cooperation between Apple and Intel appears to be warming. According to The Wall Street Journal, the two companies have reportedly reached a preliminary agreement for Intel to manufacture some of the chips powering Apple devices.　　The two sides have been engaged in intensive talks for more than a year, with a formal deal said to have been hammered out in recent months, the report adds.　　In parallel, Commercial Times reported earlier that Apple is evaluating Intel’s 18A-P process for its M-series chips. Looking further ahead, The New 7 reports that the first Intel-manufactured low-end M-series chips could emerge as early as mid-2027 under contract production, likely targeting entry-level Macs or iPads.　　As highlighted by The Wall Street Journal, Apple’s reported outreach to Intel may reflect growing supply chain pressures, as the Cupertino firm—long TSMC’s top customer—faces tightening access to advanced manufacturing capacity amid surging demand from NVIDIA and other AI chip designers.　　Intel previously played a central role in powering Apple’s Mac lineup, before Apple transitioned in 2020 to its own Arm-based custom chips, the report points out.
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Release time：2026-05-11 11:12 reading：915 Continue reading>>
Apple Reportedly Eyes Samsung, <span style='color:red'>Intel</span> U.S. Foundry for Core Chips Amid TSMC Constraints, Supply Diversification
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Apple Reportedly Eyes Samsung, Intel U.S. Foundry for Core Chips Amid TSMC Constraints, Supply Diversification

　　Apple is reportedly weighing the possibility of having some of its core device chips manufactured by Samsung and Intel. According to Bloomberg, citing sources, the company has held preliminary discussions on using the two as alternative production partners for its main processors—potentially providing a second sourcing option alongside its longstanding supplier, TSMC.　　Sources say the company has held early-stage discussions with Intel about leveraging its foundry services, while Apple executives have also visited a Samsung facility under construction in Texas that is expected to produce advanced chips.　　That said, the report notes that neither effort has led to any orders so far. Engagements with both suppliers remain at a preliminary stage, as Apple continues to have reservations about adopting non-TSMC manufacturing technologies.　　One of the key drivers behind Apple’s potential shift is supply constraints at TSMC, according to Bloomberg. As the report notes, Apple executives addressed the issue during the company’s quarterly earnings call last week, indicating that limited chip availability for iPhone and Mac devices is currently weighing on growth.　　In early 2026, Tim Cook identified access to advanced-node manufacturing as the main bottleneck for Apple’s iPhone output, according to CNBC. He noted that production is constrained by limited capacity for the company’s A-series and M-series system-on-chip (SoC) chips, which are fabricated on TSMC’s 3nm process.　　In addition, it also aims to maintain at least two suppliers for key components, allowing Apple to strengthen its negotiating leverage on pricing while reducing the risk of supply disruptions, Bloomberg adds.　　Apple’s Reported Supplier Talks May Open Door for Intel Comeback, Samsung Gains　　Apple’s talks with both companies reportedly began before the most recent supply constraints emerged. As Bloomberg notes, collaborating with Intel could offer an added advantage, potentially strengthening Apple’s ties with the Donald Trump administration. As for Samsung, the report indicates that it has already been working on supplying more peripheral components for Apple’s devices, including power management parts.　　In an August 2025 press release, Apple also announced a partnership with Samsung to co-develop a new chip manufacturing technology at Samsung’s Austin fab. Citing industry sources, Business Korea adds that the chip Samsung is expected to produce will likely be used as an image sensor in future iPhones and other Apple products.　　Separately, industry momentum appears to be building around Intel’s foundry push. According to Commercial Times, major tech firms including Google and Apple are weighing a shift to Intel’s foundry. The report adds that Apple’s M-series chips are evaluating Intel’s 18A-P node.　　Apple’s potential shift could provide a boost to both Samsung and Intel. As the report notes, securing external customers for its foundry business is central to Intel’s turnaround strategy under CEO Lip-Bu Tan. Winning Apple as a client would mark a major milestone for Tan and could help draw in additional business. Samsung, meanwhile, would also stand to gain significantly from an endorsement by Apple.
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Release time：2026-05-06 14:44 reading：763 Continue reading>>

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