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TDK extends X2 portfolio with compact 350 V (AC) capacitors for industrial and automotive

　　TDK Corporation (TSE:6762) extends its X2 safety film capacitor portfolio with the new B3292xU/V series,now supporting higher voltages and offering compact lead spacings of 15 mm and 22.5 mm, with capacitance values from 47 nF to 1.8 µF. Rated at 350 V (AC) and robust against peak voltage pulses up to 2.5 kV(IEC 60384-14), the series is designed for interference suppression in demanding, space-constrained industrial and automotive environments in series with the mains. Typical applications are on-board chargers, EV charging systems, PV inverters, energy meters, and capacitive power supplies.　　The entire series is now available with lead spacings from 15 mm to 52.5 mm, covering capacitance values from 47 nF to 20 µF. It passed the THB (temperature, humidity, bias) test at +85 °C, 85% RH, and rated voltage for 1000 h, meeting Grade III, Test Condition B requirements. In addition, the series offers AEC-Q200 compliance, excellent self-healing properties, and a maximum operating temperature of +110 °C, ensuring durability even under severe ambient conditions.　　With their compact dimensions and high DC testing voltage (1505 V for 2 s), the B3292xU/V series provides a balanced solution of performance and size for next-generation industrial drives and automotive power electronics, supporting the growing need for efficient and space-optimized EMI suppression solutions.　　For the B3292xU/V series, TDK offers a range of design tools and SPICE models.　　Main applications　　Capacitive power supplies, energy meters　　Industrial drives　　On-board chargers　　EV charging　　PV inverter　　Main features and benefits　　X2 class for interference (EMI) suppression　　“Across the line” applications　　For connections in series with the mains　　Severe ambient conditions　　Small dimensions　　Good self-healing properties　　AEC-Q200E compliant

Key word：

TDK

Release time：2026-02-27 16:14 reading：201 Continue reading>>

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ROHM’s New Compact, Highly Reliable Package Added to Automotive 40V/60V MOSFET Lineup

　　ROHM has expanded its lineup of low-voltage (40V/60V) MOSFETs for automotive applications – such as main inverter control circuits, electric pumps, and LED headlights – by introducing latest products adopting the new HPLF5060 package (4.9mm × 6.0mm).　　In recent years, automotive low-voltage MOSFETs have been trending toward smaller packages, such as the 5060-size and even more compact options. However, this miniaturization introduces significant challenges for achieving reliable mounting, primarily due to narrow terminal spacing and leadless designs.　　To address these issues, the new HPLF5060 package offers a smaller footprint compared to the widely used TO-252 package (6.6mm × 10.0mm) while enhancing board-mount reliability through the adoption of gull-wing leads. Additionally, the use of copper clip junction technology enables high-current operation, making the HPLF5060 an ideal solution for demanding automotive environments.　　Mass production of new products using this package began in November 2025 (sample price: $3.5/unit, excluding tax).　　In addition to expanding the lineup of products using this package, mass production of the smaller DFN3333 (3.3mm × 3.3mm) package, which employs wettable flank technology, is scheduled to begin around February 2026. Furthermore, development has commenced on a TOLG (TO-Leaded with Gull-wing) package (9.9mm × 11.7mm) to further expand the lineup of high-power, high-reliability packages.　　☆ : Under Development　　Application Examples　　Main inverter control circuits, electric pumps, LED headlights, etc.　　EcoMOS™ Brand　　EcoMOS™ is ROHM's brand of silicon power MOSFETs designed for energy-efficient applications in the power device sector. Widely utilized in applications such as home appliances, industrial equipment, and automotive systems, EcoMOS™ provides a diverse lineup that enables product selection based on key parameters such as noise performance and switching characteristics to meet specific requirements.　　・EcoMOS™ is a trademark or registered trademark of ROHM Co., Ltd.　　Terminology　　Gull-Wing Leads　　A terminal structure that spreads outwards from both sides of the package. It achieves excellent heat dissipation along with increased mounting reliability. It is called “Gull-Wing” because its appearance resembles the wing of a seagull.　　Copper Clip Junction Technology　　A technology that uses copper clips (flat metal bridges) to connect chips and lead frames directly, replacing the conventional wire bonding method.　　Wettable Flank Technology　　A technology for plating the sides of the lead frame on bottom electrode packages such as QFN and DFN to improve mounting reliability.

Key word：

ROHM

Release time：2026-02-25 17:46 reading：194 Continue reading>>

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NOVOSENSE and Inovance Automotive Co-Develop IC Solutions for Next-Generation Electric Drive Platforms

　　NOVOSENSE Microelectronics announced that two highly integrated ICs—an isolated sensing IC and a logic ASC IC—developed in close collaboration with Inovance Automotive, a leading supplier of intelligent electric vehicle components and solutions, have entered mass production on Inovance Automotive’s next-generation electric drive (e-drive) platform. The customized IC solutions offer higher integration and optimized performance, supporting the ongoing shift toward more integrated electric drive systems while enabling designs that meet increasingly stringent functional safety requirements.　　Conventional discrete electric drive designs rely on widely distributed components and complex wiring, often resulting in larger system size, higher power losses, slower response, and constrained reliability. As electric vehicles continue to demand longer driving range and higher output power, electric drive architectures are moving rapidly toward multi-in-one and highly integrated designs. In this context, semiconductor solutions must deliver greater functional integration while maintaining accuracy, reliability, and functional safety margins within limited space, without constraining system-level design flexibility.　　Building on more than a decade of experience in motor controller system architectures and functional safety, Inovance Automotive proactively defined the key functional and performance requirements for the isolated sensing IC and logic ASC IC at an early stage of development. In response to these requirements, NOVOSENSE integrated high-voltage LDO, isolated sensing amplifier, and isolated comparator into a single isolated sensing IC. This integration significantly reduces external component while enabling high-precision isolated voltage sensing, fast OV/UV protection, and more compact electric drive designs.　　The customized logic ASC IC further integrates multiple logic functions and supports frequency detection, enabling centralized handling of interface-related logic. This approach simplifies interface design, improves overall system integration, and supports more compact inverter layouts. At the same time, it helps reduce BOM cost and provides a solid foundation for optimizing functional safety architectures in electric drive and traction inverter systems.　　By replacing mature discrete circuits with integrated IC solutions, the collaboration delivers clear system-level benefits.　　Simplified architectures and fewer components reduce potential failure points and improve overall product robustness.　　Higher integration lowers PCB area requirements, creating additional headroom for increased power density.　　Standardized IC solutions also streamline development by reducing design and validation effort, helping shorten development cycles and accelerate time-to-market.　　"Electric drive systems are entering a phase where higher integration is becoming essential, and progress at the chip level increasingly translates into system-level advantages," said Zheng Chao, Director of the R&D Center at Inovance Automotive. "This collaboration combines our strengths in electric drive systems with NOVOSENSE’s expertise in automotive semiconductors. More importantly, it reflects an important capability upgrade for Inovance Automotive—we are not only developing high-performance power electronics products, but also participating from the outset in defining system architectures and core chips. We look forward to continuing our work with NOVOSENSE to shape next-generation electric drive platforms and deliver more competitive system solutions to OEMs."　　"NOVOSENSE and Inovance Automotive have established a strong foundation for collaboration," said Ye Jian, Product Line Director at NOVOSENSE. "This project demonstrates both our customer's confidence in our technology and our application-driven approach to innovation. By drawing on our long-standing expertise in isolation and interface technologies, we will continue to deliver high-precision, high-performance, and high-reliability IC solutions to support Inovance Automotive's next-generation electric drive platforms."　　NOVOSENSE's Isolation+ portfolio covers digital isolator, isolated sensing, isolated driver, isolated power, and isolated interface, with cumulative shipments exceeding two billion units as of October 2025. The company also offers a broad automotive interface portfolio—including CAN, LIN, SerDes, logic ICs, and level shifters—providing customers with one-stop automotive-grade isolation and interface solutions. Across the new energy vehicle electrical system, NOVOSENSE works with hundreds of component suppliers, delivering semiconductor solutions for traction inverter, onboard charger (OBC), DC/DC converter, and battery management system (BMS), spanning sensor, signal chain, power management IC, and MCU.

Key word：

NOVOSENSE

Release time：2026-02-25 17:36 reading：242 Continue reading>>

Trade news

Fullhan launches FH8626V300: 2M/3M IP Camera SoC

　　FH8626V300 is a cost-effective and easy to develop 2M/3M IP camera solution. The chip integrates a high-performance ISP module and H.264/JPEG encoder, delivering excellent image processing capability, high encoding quality, and low bitrates.It also incorporates 64MB DDR2 memory and provides a complete set of peripheral interfaces required for IP camera applications, including USB, SDIO, and Ethernet, making it suitable for a wide range of network camera products.FH8626V300 features a high-performance 0.5T NPU, enabling intelligent functions such as smart detection.

Key word：

Fullhan

Release time：2026-02-10 16:49 reading：392 Continue reading>>

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BIWIN Built-in BGA SSD Plus Mini SSD Make Robots Smarter, Easier to Use, and Longer-Lasting

　　With the maturation of on-device AI computing, multimodal perception fusion, and reinforcement learning frameworks, robots are evolving from being merely reactive to becoming truly adaptive, with requirements of accumulating experience to achieve autonomous evolution, far beyond just executing commands.　　AI models are growing larger.What to do when data loading is too slow and affects decision-making?　　Devices are becoming increasingly compact, with every bit of internal space at a premium. How to balance tiny size with high-performance transmission?　　Training data keeps piling up, but memorycapacity isn’t enough and can’t be upgraded?　　Conventional embedded storage solutions (such as UFS, eMMC, M.2 SSD, MicroSD cards) are limited by trade-offs among performance, form factor, and scalability, making them insufficient for the evolving demands of humanoid robotics handling sustained high-load operation, long lifecycle, high system integration, and incremental learning.　　BIWIN BGA SSD, with its superior performance, compact form factor and excellent shock-resistance, has become one of the preferred solutions for robots; Mini SSD, positioned as an expandable storage choice with superb upgradability and flexibility, strikes a perfect balance between high performance and compact package. The combination of the built-in BGA SSD plus expandable Mini SSD constructs a new integrated storage architecture, working as a complete solution to provide stability, expandability, and systemic efficiency for intelligent robots.　　Built-in BGA SSD + External Mini SSD　　Supporting high-frequency data writes for advanced perception and decision-making　　The “brain” of a humanoid robot—the core computing motherboard—is the hardware hub for advanced perception, cognitive reasoning, and autonomous decision-making. Relying on high-performance AI computing chips, it runs multimodal large models and processes massive sensor data in real time to understand environments and plan tasks. This process demands fast and reliable storage for the operating system.　　BIWIN BGA SSD uses a PCIe 4.0 ×4 interface, delivering sequential read speeds up to 7350 MB/s and capacities up to 2TB, enabling “second-level” boot times for the OS and AI models.　　Robots operate under write-intensive workloads that far exceed typical consumer SSD applications. In some high-load systems, daily write volumes can reach 300 GB. Once the initial onboard storage (such as UFS or fixed SSD) becomes saturated, there’s no room left for ongoing data feeding and model iteration.　　Designed for effortless scalability, BIWIN Mini SSD features a SIM-card-style, slot-in design that enables a true “plug-and-play” experience. No disassembly or specialized tools are required to add up to 2 TB of high-speed storage (with higher capacities planned), ensuring long-term data accumulation, incremental learning, and intelligent evolution for robotic systems.　　While achieving extreme miniaturization and large capacity, BIWIN Mini SSD also delivers high-performance transfer rates. Equipped with a PCIe 4.0 ×2 interface, its read/write speeds reach up to 3700 MB/s and 3400 MB/s respectively, and future seamless upgrades to higher-performance versions (such as PCIe 5.0) are supported.　　SIM-card-sized, as light as 1g　　Saving device space and reducing weight　　As humanoid robots move toward practical deployment, lightweight design is not just about “shedding weight”; it’s more about simplifying mechanical structures, lowering manufacturing costs, improving mobility, and expanding application scenarios. As an essential hardware component, the size and weight of memory module directly impact overall device design.　　Both the BIWIN BGA SSD and Mini SSD feature a coin-sized footprint with an ultra-slim thickness of just 1.4 mm. The Mini SSD weighs as little as 1 g and can be directly inserted into a pre-designed socket, significantly reducing constraints on mechanical layout and overall system weight. For humanoid robots that demand high dynamic performance and extended battery life, BIWIN BGA SSD and Mini SSD deliver a “minimal physical presence” while enabling a “lightweight system design”—resulting in more compact architectures and greater motion agility.　　Dual Storage, Reshaping Industry Cooperation　　Safeguarding the Full Lifecycle Storage Needs of Robots　　Mini SSD, defined as an expandable memory solution, goes far beyond its storage function; its design concepts of modularization and standardization bring a brand-new product architecture mindset to intelligent terminal industries such as robots and notebooks.　　Manufacturer Enablement: Simplified Design, Faster Iteration　　BIWIN delivers a Mini SSD + socket solution based on a modular integration approach, enabling device manufacturers to optimize internal system layouts, reduce form-factor constraints, and develop thinner, lighter end products with clear differentiated competitiveness.　　The host-side socket offers strong compatibility across multiple capacity SKUs, requiring minimal hardware changes. This significantly lowers development effort, integration complexity, and overall system cost for device manufacturers.　　User Value: Plug-and-Play, Maximum Flexibility　　Storage expansion or replacement can be completed on-site without tools or specialized expertise. Designed for repeated, reliable insertion and removal, the solution allows end users to easily expand or swap TB-class storage, delivering a flexible and efficient storage experience.　　When paired with BIWIN’s in-house RD510 card reader (USB4.0 Type-C), users gain high-performance, portable storage for mobile productivity, content creation, and other data-intensive scenarios.　　Mini SSD has already entered mass production and is now integrated into multiple intelligent devices, including the OneXPlayer X1 Air, APEX, Super X, and GPD Win 5. It is also officially available for purchase in the consumer market.　　Since its debut, Mini SSD has been validated by several international honors, consisting of “Best Inventions of 2025” from TIME, “Best-in-Show” from Embedded World 2025, and “2026 CES Picks Awards” in the TWICE category. And BIWIN is also recognized as a winner of 2025 “China Chip” Outstanding Supporting Service Enterprise by right of this new innovation.　　Currently, BIWIN is collaborating with multiple SoC platforms and terminal brands to jointly promote Mini SSD interface specifications and ecosystem standards, accelerating its large-scale adoption in cutting-edge fields such as AI terminals and humanoid robots.

Key word：

BIWIN

Release time：2026-02-06 17:47 reading：419 Continue reading>>

Trade news

BIWIN Mini SSD Earns Dual Honors: TWICE Picks Award and AVRONA Most Innovative Award

　　Recently, BIWIN’s innovative product Mini SSD was honored with multiple international awards at CES 2026, earning the TWICE 2026 Picks Awards Winner as well as the AVRONA Most Innovative Award.　　With its breakthrough design philosophy and strong technical capabilities, this “small form factor, superior performance” storage solution not only continues BIWIN’s legacy of technological innovation, but also aligns seamlessly with the accelerating evolution of edge AI.　　Technological Breakthroughs Addressing Core Storage Challenges　　Conventional consumer storage solutions have long struggled to balance performance, portability, and expandability. BIWIN Mini SSD overcomes these limitations through three key innovations:　　AdvancedLGA packaging, compressing the form factor to just 15 × 17 × 1.4 mm (approximately the size of half a coin) and supporting capacities from 512GB to 2TB;　　PCIe 4.0 ×2interface with NVMe 1.4 protocol, delivering read speeds of up to 3700MB/s and write speeds of 3400MB/s, far surpassing traditional storage card solutions and rivaling mainstream consumer-grade M.2 SSDs;　　An industry-first standardized slot-in SSD design, enabling effortless TB-level expansion through a simple “open – insert – lock” three-step process, dramatically simplifying storage upgrades.　　Small in Size, Big in Capability: Empowering Two Key Tracks　　For consumers, BIWIN Mini SSD introduces a new level of convenience as no specialized tools are required for individuals to expand storage capacity, and its flagship-class performance is capable of supporting smooth operation of intelligent devices.　　For device manufacturers, its standardized interface, modular architecture, and scalability significantly streamline BOM management, reduce manufacturing, inventory, and after-sales costs, and support optimization across the entire product lifecycle.　　The product has already entered deep collaborations with well-known brands such as One-Netbook (ONEXPLAYER) and GPD, helping partners build differentiated competitive advantages in the market.　　Global Recognition Validating Technical Excellence　　Leveraging its ultra-compact design, high scalability, and reliable performance, BIWIN Mini SSD is redefining the integrated paradigm between AI terminals and storage technologies. Thanks to its disruptive innovation, the product was selected for TIME’s “Best Inventions of 2025”, becoming the only storage product worldwide to make the list.　　It subsequently won the “Best-in-Show” Award at Embedded World North America 2025, earning strong endorsement from industry authorities for both its technological advancement and commercialization potential. The dual awards at CES 2026 further reinforce the product’s real-world value and promising market outlook.　　Most notably, the latest achievement marks another milestone: BIWIN Mini SSD has been shortlisted as a finalist for the 2026 Edison Awards, often referred to as the “Oscars of Innovation.” This prestigious recognition, honoring the world’s most outstanding innovations, adds another heavyweight accolade to BIWIN Mini SSD’s growing global honors portfolio.

Key word：

BIWIN

Release time：2026-02-06 17:44 reading：411 Continue reading>>

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MQ771-GL: Fibocom’s Compact Cat.M Module Enters Sampling, Driving Asset Tracking Innovation

　　Fibocom (300638.SZ | 0638.HK), a global leader in wireless communicationmodules and AI solutions, announced that its Cat.Mmodule MQ771-GL has entered the engineering sample stage. Withits ultra-compact size, low power consumption,global frequency coverage, and stable network compatibility,the MQ771-GL offers a cost-effective IoT solution for asset tracking, enablinglong battery life, high reliability, and precise positioning for large-scaleLPWA deployments.　　Dual-Mode Support for FlexibleDeployment　　The MQ771-GL supports 3GPP Release 14Cat.M1 and NB-IoT standards and is compatible with mainstream frequencybands worldwide, making it ideal for LPWA network deployments across NorthAmerica, Europe, Asia, and beyond. This global compatibility ensuresreliable connectivity for asset tracking devices and enables flexible operationeven in complex or challenging environments.　　Compact Size with Ultra-Low Power Consumption　　Leveraging advanced power managementtechnologies, the MQ771-GL supports PSM (Power Saving Mode) and eDRX (extendedDiscontinuous Reception), dramatically extending device battery life. InPSM mode, standby current drops to the microampere (μA) level, cutting powerconsumption by 75% compared with the previous generation — ideal for smartwater meters. In eDRX mode, power usage is reduced by 90%, making itsuitable for gas meters, asset trackers, and other long-term outdoor devices,enabling multi-year operation.　　The module’s 17.7mm × 15.8mm LGA package is compatible with the pin layout of Fibocom’s Cat.1 modules, supportingflexible product iteration. Its compact form factor is well-suited forspace-constrained tracking devices, simplifying integration and deployment.　　Enhanced Performance with Rich InterfaceOptions　　The MQ771-GLsupports MQTT, CoAP, LwM2M and standard interfaces like UART, I2C,and I2S, making it adaptable for diverse asset tracking terminals. Itintegrates Soft GPS for precise real-time positioning and features a hardware-levelsecurity engine for encrypted, secure communications, protecting againstunauthorized access.　　Liu Sunzhi,General Manager of Fibocom’s MTC Business Unit, commented:　　"With the MQ771-GL now entering the engineering sample stage, itsultra-compact, ultra-low-power design is set to lower development barriers forasset tracking terminals and accelerate large-scale IoT connectivity. Movingforward, we will continue to strengthen collaborative innovation with verticalindustries, driving the rapid commercialization of low-power, wide-connectivitysolutions for asset tracking and other IoT applications."

Key word：

Fibocom

Release time：2026-02-06 17:41 reading：401 Continue reading>>

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Fibocom Launches AI Dongle to Transform Edge AI Experiences

　　Fibocom (300638.SZ | 0638.HK), a global leader in wireless communication modules and edge AI solutions, has unveiled its innovative AI Dongle. The device delivers mobile AI computing power to personal PCs, NAS devices, and other terminals, supporting real-time on-device LLM inference for applications like Q&A assistants, text-to-image search, and meeting summarization.　　Plug-and-Play AI Experience　　The AI Dongle addresses key challenges for edge devices, including real-time inference, data privacy, and energy efficiency. USB-powered, compact, and driver-free, it delivers a true plug-and-play experience on any USB-enabled device. By processing data locally, sensitive information remains on-device, making it ideal for privacy-focused scenarios such as smart meetings and personal assistants. Built on the Qualcomm® QCS6490 processor, the AI Dongle supports a wide range of tasks, from lightweight AI workloads to complex large-model inference.　　Fibocom’s proprietary AI Stack empowers developers to access popular models via OpenAI APIs, enabling seamless integration of on-device AI capabilities with minimal configuration.　　Empowering Devices from PCs to NAS　　Plugged into any standard PC USB port, the AI Dongle delivers powerful AI capabilities for applications like smart meeting systems, supporting offline multi-language translation and automatic meeting summaries.　　For developers, it lowers the barrier to entry—no expensive AI workstations are needed. Creative professionals can accelerate AI-powered plugins for image processing, video editing, and more.　　Paired with NAS devices, the AI Dongle adds dedicated AI computing to centralized storage. This combination is ideal for smart home and safety applications, enabling real-time analysis of local video for facial recognition and behavior detection while protecting data privacy. For small and medium-sized enterprises, it offers secure, efficient content management, supporting tasks like document analysis and intelligent categorization. In research and edge computing, it provides a local processing platform that reduces cloud dependency, latency, and costs.　　Flexible Expansion for Developers　　Fibocom currently offers two demo applications—knowledge Q&A and audio/video transcription—and plans to launch local knowledge-base solutions soon. The AI Dongle will also support open-source agent frameworks, including Tencent Youtu-Agent, streamlining AI application development and accelerating deployment.　　Willson Liu, General Manager of Fibocom AIS Business Unit, said:　　“The AI Dongle will accelerate AI adoption across intelligent devices, offering a portable, user-friendly, scalable AI+ solution. Fibocom is committed to collaborating across the edge AI ecosystem to explore diverse computing solutions and drive intelligent upgrades across industries.”

Key word：

Fibocom

Release time：2026-02-03 17:01 reading：411 Continue reading>>

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Texas Instruments begins production at its newest 300mm semiconductor manufacturing facility in Sherman, Texas

　　Texas Instruments (TI) announced the start of production at its newest semiconductor fab in Sherman, TX, just three and a half years after breaking ground. Leaders from TI were joined by local and state elected officials to celebrate the opening of this state-of-the-art 300mm semiconductor fab in North Texas.　　The new facility, called SM1, will ramp according to customer demand, ultimately producing tens of millions of chips daily that go into nearly every electronic device— from smartphones, automotive systems, and life-saving medical devices to industrial robots, smart home appliances, and data centers.　　Why it matters　　As the largest foundational semiconductor manufacturer in the U.S., TI produces analog and embedded processing chips critical for virtually all modern electronic devices. As electronics become increasingly more prevalent in everyday life, TI is building on its nearly 100-year legacy of innovation by expanding its 300mm semiconductor manufacturing footprint. By owning and controlling its manufacturing operations, process technology and packaging, TI has greater control of its supply to support customers for decades to come, in any environment.　　"The start of production at our newest wafer fab in Sherman, TX represents what TI does best: owning every part of the manufacturing process to deliver the foundational semiconductors that are vital for nearly every type of electronic system," said Haviv Ilan, president and CEO of Texas Instruments. “As the largest analog and embedded processing semiconductor manufacturer in the U.S., TI is uniquely positioned to provide dependable 300mm semiconductor manufacturing capacity at scale. We're proud to have called North Texas home for nearly a century, and excited about how TI technology will enable the technological breakthroughs of the future."Texas Instruments President and CEO Haviv Ilan (center), Texas Governor Greg Abbott, Sherman Mayor Shawn Teamann, and company leaders at TI's newest 300mm wafer fab in Sherman, Texas.TI in Sherman　　TI’s mega-site in Sherman includes future plans for up to four connected wafer fabs that will be constructed and equipped in alignment with market demand. Combined, this site will support as many as 3,000 direct jobs, along with thousands of additional jobs in support industries　　TI’s investment in Sherman is part of the company’s broader plans to invest more than $60 billion across seven semiconductor fabs in Texas and Utah, making this the largest investment in foundational semiconductor manufacturing in U.S. history. With 15 manufacturing sites around the world, TI’s internal operations build on decades of proven and reliable manufacturing expertise, providing greater control of its supply chain to get customers the products they need.

Key word：

TI

Release time：2026-02-02 16:15 reading：380 Continue reading>>

Trade news

Fibocom Launches Global LTE Cat.1 bis Module LE271-GL

　　January 14, 2026 – Fibocom (300638.SZ | 0638.HK), a global leader in wireless communication modules and edge AI solutions, today announced the launch of its global LTE Cat.1 bis module, LE271-GL, providing IoT devices with single-SKU global connectivity. With compact size, global frequency coverage, low power consumption, and high compatibility, the LE271-GL offers a cost-effective 4G solution for worldwide IoT applications such as asset tracking, IP cameras, new energy systems, and consumer electronics.　　Compact Design and Global Coverage　　Measuring 17.7mm × 15.8mm, the LE271-GL is pin-to-pin compatible with Fibocom’s MC661, LE270, and LE37X series, as well as other modules of similar packaging. Customers can migrate without changing PCB designs. Supporting both FDD-LTE and TDD-LTE bands, the module covers all major global frequencies under a single SKU, simplifying inventory management and reducing logistics costs for international deployment.　　High Performance and Fast Network Access　　The LE271-GL ensures quick and stable connections, achieving network registration in under 3.5 seconds. Optimized AT command response and USB enumeration improve device startup and connectivity efficiency. Its OpenCPU architecture provides flexibility for secondary development, lowering overall device costs.　　Ultra-Low Power and Extended Battery Life　　Optimized for battery-powered applications, the LE271-GL achieves microamp-level sleep current and supports DRX and other low-power modes. Interfaces including VDD_EXT and multiple GPIOs remain powered in standby, ensuring long battery life while maintaining critical functionality.　　Rich Functionality and Strong Compatibility　　LE271-GL supports LBS + Wi-Fi scan positioning (for indoor and international use), eSIM, and single/dual-SIM configurations. It integrates USB, UART, SPI, I2C, ADC, LCD, Camera, and GPIO interfaces, and supports TTS, MQTT, HTTP, and SSL protocols for versatile IoT applications.　　Now in the engineering sample stage, Fibocom’s LE271-GL sets a new benchmark for global Cat.1 bis connectivity, enabling customers and partners worldwide to explore new opportunities in the IoT market.

Key word：

Fibocom

Release time：2026-01-30 15:28 reading：449 Continue reading>>

model	brand	Quote
CDZVT2R20B	ROHM Semiconductor
TL431ACLPR	Texas Instruments
RB751G-40T2R	ROHM Semiconductor
MC33074DR2G	onsemi
BD71847AMWV-E2	ROHM Semiconductor

model	brand	To snap up
STM32F429IGT6	STMicroelectronics
IPZ40N04S5L4R8ATMA1	Infineon Technologies
TPS63050YFFR	Texas Instruments
ESR03EZPJ151	ROHM Semiconductor
BU33JA2MNVX-CTL	ROHM Semiconductor
BP3621	ROHM Semiconductor

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