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BIWIN Built-in BGA SSD Plus Mini SSD Make Robots Smarter, Easier to Use, and Longer-Lasting

　　With the maturation of on-device AI computing, multimodal perception fusion, and reinforcement learning frameworks, robots are evolving from being merely reactive to becoming truly adaptive, with requirements of accumulating experience to achieve autonomous evolution, far beyond just executing commands.　　AI models are growing larger.What to do when data loading is too slow and affects decision-making?　　Devices are becoming increasingly compact, with every bit of internal space at a premium. How to balance tiny size with high-performance transmission?　　Training data keeps piling up, but memorycapacity isn’t enough and can’t be upgraded?　　Conventional embedded storage solutions (such as UFS, eMMC, M.2 SSD, MicroSD cards) are limited by trade-offs among performance, form factor, and scalability, making them insufficient for the evolving demands of humanoid robotics handling sustained high-load operation, long lifecycle, high system integration, and incremental learning.　　BIWIN BGA SSD, with its superior performance, compact form factor and excellent shock-resistance, has become one of the preferred solutions for robots; Mini SSD, positioned as an expandable storage choice with superb upgradability and flexibility, strikes a perfect balance between high performance and compact package. The combination of the built-in BGA SSD plus expandable Mini SSD constructs a new integrated storage architecture, working as a complete solution to provide stability, expandability, and systemic efficiency for intelligent robots.　　Built-in BGA SSD + External Mini SSD　　Supporting high-frequency data writes for advanced perception and decision-making　　The “brain” of a humanoid robot—the core computing motherboard—is the hardware hub for advanced perception, cognitive reasoning, and autonomous decision-making. Relying on high-performance AI computing chips, it runs multimodal large models and processes massive sensor data in real time to understand environments and plan tasks. This process demands fast and reliable storage for the operating system.　　BIWIN BGA SSD uses a PCIe 4.0 ×4 interface, delivering sequential read speeds up to 7350 MB/s and capacities up to 2TB, enabling “second-level” boot times for the OS and AI models.　　Robots operate under write-intensive workloads that far exceed typical consumer SSD applications. In some high-load systems, daily write volumes can reach 300 GB. Once the initial onboard storage (such as UFS or fixed SSD) becomes saturated, there’s no room left for ongoing data feeding and model iteration.　　Designed for effortless scalability, BIWIN Mini SSD features a SIM-card-style, slot-in design that enables a true “plug-and-play” experience. No disassembly or specialized tools are required to add up to 2 TB of high-speed storage (with higher capacities planned), ensuring long-term data accumulation, incremental learning, and intelligent evolution for robotic systems.　　While achieving extreme miniaturization and large capacity, BIWIN Mini SSD also delivers high-performance transfer rates. Equipped with a PCIe 4.0 ×2 interface, its read/write speeds reach up to 3700 MB/s and 3400 MB/s respectively, and future seamless upgrades to higher-performance versions (such as PCIe 5.0) are supported.　　SIM-card-sized, as light as 1g　　Saving device space and reducing weight　　As humanoid robots move toward practical deployment, lightweight design is not just about “shedding weight”; it’s more about simplifying mechanical structures, lowering manufacturing costs, improving mobility, and expanding application scenarios. As an essential hardware component, the size and weight of memory module directly impact overall device design.　　Both the BIWIN BGA SSD and Mini SSD feature a coin-sized footprint with an ultra-slim thickness of just 1.4 mm. The Mini SSD weighs as little as 1 g and can be directly inserted into a pre-designed socket, significantly reducing constraints on mechanical layout and overall system weight. For humanoid robots that demand high dynamic performance and extended battery life, BIWIN BGA SSD and Mini SSD deliver a “minimal physical presence” while enabling a “lightweight system design”—resulting in more compact architectures and greater motion agility.　　Dual Storage, Reshaping Industry Cooperation　　Safeguarding the Full Lifecycle Storage Needs of Robots　　Mini SSD, defined as an expandable memory solution, goes far beyond its storage function; its design concepts of modularization and standardization bring a brand-new product architecture mindset to intelligent terminal industries such as robots and notebooks.　　Manufacturer Enablement: Simplified Design, Faster Iteration　　BIWIN delivers a Mini SSD + socket solution based on a modular integration approach, enabling device manufacturers to optimize internal system layouts, reduce form-factor constraints, and develop thinner, lighter end products with clear differentiated competitiveness.　　The host-side socket offers strong compatibility across multiple capacity SKUs, requiring minimal hardware changes. This significantly lowers development effort, integration complexity, and overall system cost for device manufacturers.　　User Value: Plug-and-Play, Maximum Flexibility　　Storage expansion or replacement can be completed on-site without tools or specialized expertise. Designed for repeated, reliable insertion and removal, the solution allows end users to easily expand or swap TB-class storage, delivering a flexible and efficient storage experience.　　When paired with BIWIN’s in-house RD510 card reader (USB4.0 Type-C), users gain high-performance, portable storage for mobile productivity, content creation, and other data-intensive scenarios.　　Mini SSD has already entered mass production and is now integrated into multiple intelligent devices, including the OneXPlayer X1 Air, APEX, Super X, and GPD Win 5. It is also officially available for purchase in the consumer market.　　Since its debut, Mini SSD has been validated by several international honors, consisting of “Best Inventions of 2025” from TIME, “Best-in-Show” from Embedded World 2025, and “2026 CES Picks Awards” in the TWICE category. And BIWIN is also recognized as a winner of 2025 “China Chip” Outstanding Supporting Service Enterprise by right of this new innovation.　　Currently, BIWIN is collaborating with multiple SoC platforms and terminal brands to jointly promote Mini SSD interface specifications and ecosystem standards, accelerating its large-scale adoption in cutting-edge fields such as AI terminals and humanoid robots.

Key word：

BIWIN

Release time：2026-02-06 17:47 reading：208 Continue reading>>

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BIWIN Mini SSD Earns Dual Honors: TWICE Picks Award and AVRONA Most Innovative Award

　　Recently, BIWIN’s innovative product Mini SSD was honored with multiple international awards at CES 2026, earning the TWICE 2026 Picks Awards Winner as well as the AVRONA Most Innovative Award.　　With its breakthrough design philosophy and strong technical capabilities, this “small form factor, superior performance” storage solution not only continues BIWIN’s legacy of technological innovation, but also aligns seamlessly with the accelerating evolution of edge AI.　　Technological Breakthroughs Addressing Core Storage Challenges　　Conventional consumer storage solutions have long struggled to balance performance, portability, and expandability. BIWIN Mini SSD overcomes these limitations through three key innovations:　　AdvancedLGA packaging, compressing the form factor to just 15 × 17 × 1.4 mm (approximately the size of half a coin) and supporting capacities from 512GB to 2TB;　　PCIe 4.0 ×2interface with NVMe 1.4 protocol, delivering read speeds of up to 3700MB/s and write speeds of 3400MB/s, far surpassing traditional storage card solutions and rivaling mainstream consumer-grade M.2 SSDs;　　An industry-first standardized slot-in SSD design, enabling effortless TB-level expansion through a simple “open – insert – lock” three-step process, dramatically simplifying storage upgrades.　　Small in Size, Big in Capability: Empowering Two Key Tracks　　For consumers, BIWIN Mini SSD introduces a new level of convenience as no specialized tools are required for individuals to expand storage capacity, and its flagship-class performance is capable of supporting smooth operation of intelligent devices.　　For device manufacturers, its standardized interface, modular architecture, and scalability significantly streamline BOM management, reduce manufacturing, inventory, and after-sales costs, and support optimization across the entire product lifecycle.　　The product has already entered deep collaborations with well-known brands such as One-Netbook (ONEXPLAYER) and GPD, helping partners build differentiated competitive advantages in the market.　　Global Recognition Validating Technical Excellence　　Leveraging its ultra-compact design, high scalability, and reliable performance, BIWIN Mini SSD is redefining the integrated paradigm between AI terminals and storage technologies. Thanks to its disruptive innovation, the product was selected for TIME’s “Best Inventions of 2025”, becoming the only storage product worldwide to make the list.　　It subsequently won the “Best-in-Show” Award at Embedded World North America 2025, earning strong endorsement from industry authorities for both its technological advancement and commercialization potential. The dual awards at CES 2026 further reinforce the product’s real-world value and promising market outlook.　　Most notably, the latest achievement marks another milestone: BIWIN Mini SSD has been shortlisted as a finalist for the 2026 Edison Awards, often referred to as the “Oscars of Innovation.” This prestigious recognition, honoring the world’s most outstanding innovations, adds another heavyweight accolade to BIWIN Mini SSD’s growing global honors portfolio.

Key word：

BIWIN

Release time：2026-02-06 17:44 reading：207 Continue reading>>

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MQ771-GL: Fibocom’s Compact Cat.M Module Enters Sampling, Driving Asset Tracking Innovation

　　Fibocom (300638.SZ | 0638.HK), a global leader in wireless communicationmodules and AI solutions, announced that its Cat.Mmodule MQ771-GL has entered the engineering sample stage. Withits ultra-compact size, low power consumption,global frequency coverage, and stable network compatibility,the MQ771-GL offers a cost-effective IoT solution for asset tracking, enablinglong battery life, high reliability, and precise positioning for large-scaleLPWA deployments.　　Dual-Mode Support for FlexibleDeployment　　The MQ771-GL supports 3GPP Release 14Cat.M1 and NB-IoT standards and is compatible with mainstream frequencybands worldwide, making it ideal for LPWA network deployments across NorthAmerica, Europe, Asia, and beyond. This global compatibility ensuresreliable connectivity for asset tracking devices and enables flexible operationeven in complex or challenging environments.　　Compact Size with Ultra-Low Power Consumption　　Leveraging advanced power managementtechnologies, the MQ771-GL supports PSM (Power Saving Mode) and eDRX (extendedDiscontinuous Reception), dramatically extending device battery life. InPSM mode, standby current drops to the microampere (μA) level, cutting powerconsumption by 75% compared with the previous generation — ideal for smartwater meters. In eDRX mode, power usage is reduced by 90%, making itsuitable for gas meters, asset trackers, and other long-term outdoor devices,enabling multi-year operation.　　The module’s 17.7mm × 15.8mm LGA package is compatible with the pin layout of Fibocom’s Cat.1 modules, supportingflexible product iteration. Its compact form factor is well-suited forspace-constrained tracking devices, simplifying integration and deployment.　　Enhanced Performance with Rich InterfaceOptions　　The MQ771-GLsupports MQTT, CoAP, LwM2M and standard interfaces like UART, I2C,and I2S, making it adaptable for diverse asset tracking terminals. Itintegrates Soft GPS for precise real-time positioning and features a hardware-levelsecurity engine for encrypted, secure communications, protecting againstunauthorized access.　　Liu Sunzhi,General Manager of Fibocom’s MTC Business Unit, commented:　　"With the MQ771-GL now entering the engineering sample stage, itsultra-compact, ultra-low-power design is set to lower development barriers forasset tracking terminals and accelerate large-scale IoT connectivity. Movingforward, we will continue to strengthen collaborative innovation with verticalindustries, driving the rapid commercialization of low-power, wide-connectivitysolutions for asset tracking and other IoT applications."

Key word：

Fibocom

Release time：2026-02-06 17:41 reading：200 Continue reading>>

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Fibocom Launches AI Dongle to Transform Edge AI Experiences

　　Fibocom (300638.SZ | 0638.HK), a global leader in wireless communication modules and edge AI solutions, has unveiled its innovative AI Dongle. The device delivers mobile AI computing power to personal PCs, NAS devices, and other terminals, supporting real-time on-device LLM inference for applications like Q&A assistants, text-to-image search, and meeting summarization.　　Plug-and-Play AI Experience　　The AI Dongle addresses key challenges for edge devices, including real-time inference, data privacy, and energy efficiency. USB-powered, compact, and driver-free, it delivers a true plug-and-play experience on any USB-enabled device. By processing data locally, sensitive information remains on-device, making it ideal for privacy-focused scenarios such as smart meetings and personal assistants. Built on the Qualcomm® QCS6490 processor, the AI Dongle supports a wide range of tasks, from lightweight AI workloads to complex large-model inference.　　Fibocom’s proprietary AI Stack empowers developers to access popular models via OpenAI APIs, enabling seamless integration of on-device AI capabilities with minimal configuration.　　Empowering Devices from PCs to NAS　　Plugged into any standard PC USB port, the AI Dongle delivers powerful AI capabilities for applications like smart meeting systems, supporting offline multi-language translation and automatic meeting summaries.　　For developers, it lowers the barrier to entry—no expensive AI workstations are needed. Creative professionals can accelerate AI-powered plugins for image processing, video editing, and more.　　Paired with NAS devices, the AI Dongle adds dedicated AI computing to centralized storage. This combination is ideal for smart home and safety applications, enabling real-time analysis of local video for facial recognition and behavior detection while protecting data privacy. For small and medium-sized enterprises, it offers secure, efficient content management, supporting tasks like document analysis and intelligent categorization. In research and edge computing, it provides a local processing platform that reduces cloud dependency, latency, and costs.　　Flexible Expansion for Developers　　Fibocom currently offers two demo applications—knowledge Q&A and audio/video transcription—and plans to launch local knowledge-base solutions soon. The AI Dongle will also support open-source agent frameworks, including Tencent Youtu-Agent, streamlining AI application development and accelerating deployment.　　Willson Liu, General Manager of Fibocom AIS Business Unit, said:　　“The AI Dongle will accelerate AI adoption across intelligent devices, offering a portable, user-friendly, scalable AI+ solution. Fibocom is committed to collaborating across the edge AI ecosystem to explore diverse computing solutions and drive intelligent upgrades across industries.”

Key word：

Fibocom

Release time：2026-02-03 17:01 reading：230 Continue reading>>

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Texas Instruments begins production at its newest 300mm semiconductor manufacturing facility in Sherman, Texas

　　Texas Instruments (TI) announced the start of production at its newest semiconductor fab in Sherman, TX, just three and a half years after breaking ground. Leaders from TI were joined by local and state elected officials to celebrate the opening of this state-of-the-art 300mm semiconductor fab in North Texas.　　The new facility, called SM1, will ramp according to customer demand, ultimately producing tens of millions of chips daily that go into nearly every electronic device— from smartphones, automotive systems, and life-saving medical devices to industrial robots, smart home appliances, and data centers.　　Why it matters　　As the largest foundational semiconductor manufacturer in the U.S., TI produces analog and embedded processing chips critical for virtually all modern electronic devices. As electronics become increasingly more prevalent in everyday life, TI is building on its nearly 100-year legacy of innovation by expanding its 300mm semiconductor manufacturing footprint. By owning and controlling its manufacturing operations, process technology and packaging, TI has greater control of its supply to support customers for decades to come, in any environment.　　"The start of production at our newest wafer fab in Sherman, TX represents what TI does best: owning every part of the manufacturing process to deliver the foundational semiconductors that are vital for nearly every type of electronic system," said Haviv Ilan, president and CEO of Texas Instruments. “As the largest analog and embedded processing semiconductor manufacturer in the U.S., TI is uniquely positioned to provide dependable 300mm semiconductor manufacturing capacity at scale. We're proud to have called North Texas home for nearly a century, and excited about how TI technology will enable the technological breakthroughs of the future."Texas Instruments President and CEO Haviv Ilan (center), Texas Governor Greg Abbott, Sherman Mayor Shawn Teamann, and company leaders at TI's newest 300mm wafer fab in Sherman, Texas.TI in Sherman　　TI’s mega-site in Sherman includes future plans for up to four connected wafer fabs that will be constructed and equipped in alignment with market demand. Combined, this site will support as many as 3,000 direct jobs, along with thousands of additional jobs in support industries　　TI’s investment in Sherman is part of the company’s broader plans to invest more than $60 billion across seven semiconductor fabs in Texas and Utah, making this the largest investment in foundational semiconductor manufacturing in U.S. history. With 15 manufacturing sites around the world, TI’s internal operations build on decades of proven and reliable manufacturing expertise, providing greater control of its supply chain to get customers the products they need.

Key word：

TI

Release time：2026-02-02 16:15 reading：240 Continue reading>>

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Fibocom Launches Global LTE Cat.1 bis Module LE271-GL

　　January 14, 2026 – Fibocom (300638.SZ | 0638.HK), a global leader in wireless communication modules and edge AI solutions, today announced the launch of its global LTE Cat.1 bis module, LE271-GL, providing IoT devices with single-SKU global connectivity. With compact size, global frequency coverage, low power consumption, and high compatibility, the LE271-GL offers a cost-effective 4G solution for worldwide IoT applications such as asset tracking, IP cameras, new energy systems, and consumer electronics.　　Compact Design and Global Coverage　　Measuring 17.7mm × 15.8mm, the LE271-GL is pin-to-pin compatible with Fibocom’s MC661, LE270, and LE37X series, as well as other modules of similar packaging. Customers can migrate without changing PCB designs. Supporting both FDD-LTE and TDD-LTE bands, the module covers all major global frequencies under a single SKU, simplifying inventory management and reducing logistics costs for international deployment.　　High Performance and Fast Network Access　　The LE271-GL ensures quick and stable connections, achieving network registration in under 3.5 seconds. Optimized AT command response and USB enumeration improve device startup and connectivity efficiency. Its OpenCPU architecture provides flexibility for secondary development, lowering overall device costs.　　Ultra-Low Power and Extended Battery Life　　Optimized for battery-powered applications, the LE271-GL achieves microamp-level sleep current and supports DRX and other low-power modes. Interfaces including VDD_EXT and multiple GPIOs remain powered in standby, ensuring long battery life while maintaining critical functionality.　　Rich Functionality and Strong Compatibility　　LE271-GL supports LBS + Wi-Fi scan positioning (for indoor and international use), eSIM, and single/dual-SIM configurations. It integrates USB, UART, SPI, I2C, ADC, LCD, Camera, and GPIO interfaces, and supports TTS, MQTT, HTTP, and SSL protocols for versatile IoT applications.　　Now in the engineering sample stage, Fibocom’s LE271-GL sets a new benchmark for global Cat.1 bis connectivity, enabling customers and partners worldwide to explore new opportunities in the IoT market.

Key word：

Fibocom

Release time：2026-01-30 15:28 reading：330 Continue reading>>

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How Cat.1 bis Technology Solves the "Mobility and Endurance" Challenges of Smart Devices

　　The Internet of Things (IoT) is entering its second phase — a shift from "multi-point connectivity" to "intelligent scenarios."　　Traditional smart home devices are moving beyond indoor environments into outdoor spaces that lack stable power and network access. Asset tracking is expanding from localized monitoring to global roaming, while AI-powered wearables are pushing the limits of battery technology as computing demands rise.　　To address these challenges, the global Cat.1 bis standard is emerging as a key enabler. With its streamlined integrated design, ultra-low microamp-level power consumption, and global single-SKU compatibility, Cat.1 bis provides a breakthrough solution for mobility and endurance in next-generation smart devices.　　New Battlefield for IPCs: From "Fixed Sentries" to "Mobile Detectives"　　IPCs (Internet Protocol Cameras) are evolving rapidly from traditional indoor home security systems toward mobile, portable, and multi-scenario applications. Users now demand outdoor devices that can operate in "off-grid, weak-network" environments and portable cameras capable of capturing "brilliant moments" anytime, anywhere.　　However, once IPCs go outdoors, unstable networks and limited battery capacity become major constraints. How can video transmission remain stable during movement? How can a camera stay on standby 24/7 without missing key footage or draining the battery? These challenges set extremely high standards for module size, mobility, and power management.　　To cope with fluctuating networks in mobile scenarios, the new-generation Cat.1 bis technology introduces bandwidth adaptation, which dynamically adjusts bitrate based on real-time signal quality. This significantly improves bandwidth utilization and ensures smooth video streaming even in weak network conditions.　　Meanwhile, to tackle battery anxiety, smart detection and flexible recording technologies are being deployed. A Cat.1 module can stay connected while only triggering recording upon detecting anomalies or critical events. This "microamp standby, millisecond wake-up" mechanism captures every key moment while extending standby time exponentially.　　Asset Tracking: Building a Truly Global Network　　As global supply chains expand, goods increasingly travel across continents. Traditional tracking solutions require different hardware models for each country’s frequency bands — resulting in SKU fragmentation, higher R&D costs, and complex inventory management. Furthermore, to ensure covert installation and long operating time, devices must continuously shrink in size and reduce power consumption to near-physical limits.　　The global Cat.1 bis module solves this through multi-region compatibility, enabling a single device to achieve "one hardware, worldwide connectivity." Enterprises can maintain a single SKU that meets network certification requirements across major global operators. This not only reduces management complexity and cost but also enables seamless roaming for cross-border asset tracking.　　With its compact, integrated hardware design, the next-generation module minimizes PCB footprint to meet the "ultra-compact" demands of locators. Combined with software-level power optimization, standby consumption is reduced to the microamp level — allowing even coin cell–sized devices to deliver long-term asset protection.　　AI Companions and Wearables: The Art of Balancing Performance and Efficiency　　Driven by large AI models, new categories such as AI companion dolls and senior health trackers are booming. These devices embody the “have it all” dilemma — balancing the demanding requirements of AI voice interaction for speed and mobility access, cost efficiency for mass adoption, and large batteries within compact designs to support intensive AI operations. This transformation demands multi-functional connectivity.　　Cat.1 bis perfectly meets the speed requirements for both voice interaction and data transmission, avoiding the overkill and high costs of advanced LTE modules. For AI-driven devices that frequently wake from standby, Cat.1 bis optimizes power consumption and sleep mechanisms at the software level, achieving an efficient balance between connectivity and computational efficiency. Its compact hardware design also makes wearables lighter and more comfortable, enabling truly all-day intelligent companionship.　　Conclusion: The Core Enabler of the Next IoT Evolution　　From mobile IPCs to globally connected trackers and long-lasting AI wearables, every leap in IoT devices pushes the limits of connectivity technology. The new-generation global Cat.1 bis is rising to the challenge with three core capabilities — high compatibility, cost efficiency, and intelligent adaptability (including bandwidth self-adjustment, smart sleep, and single-SKU global support).　　Cat.1 bis not only achieves unprecedented compactness and power efficiency in hardware but also establishes a unified connectivity foundation for Chinese smart manufacturing to expand globally.

Key word：

Cat.1

Release time：2026-01-30 15:25 reading：285 Continue reading>>

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ROHM’s New LDO Regulators with 500mA Output Current Achieving Stable Operation Even with Ultra-small Capacitors to Expand Design Flexibility for High-current Applications

　　ROHM has developed the “BD9xxN5 Series” of LDO regulator ICs with 500mA output current, featuring its proprietary ultra-stable control technology “Nano Cap™”. This series comprises 18 products designed for 12V/24V primary power supply applications used in automotive equipment, industrial equipment, and communication infrastructure.　　In recent years, electronic devices have demanded higher density in smaller form factors at the same time. To meet this demand and achieve space savings and design flexibility, power supply ICs must be capable of stable operation even with small-capacity capacitors. However, achieving such performance with output capacitors of 1µF or less has been technically difficult.　　To address this challenge, ROHM developed the “BD9xxN1 Series” LDO regulator (150mA output current) in 2022, incorporating its proprietary ultra-stable control technology, “Nano Cap™”. This innovation enables stable operation with output capacitors as small as 100nF, earning widespread adoption across numerous applications.　　The newly developed BD9xxN5 Series builds on the success of the BD9xxN1 Series by increasing the output current to 500mA – more than three times higher than before – significantly broadening its suitability for applications requiring higher power. In addition, very low output voltage ripple of approximately 250mV (with load current variation of 1mA to 500mA within 1µs) is achieved with a small output capacitance of just 470nF (typical). Beyond standard small MLCCs (multi-layer ceramic capacitors) in the range of several µF and large-capacity electrolytic capacitors, it also supports ultra-small MLCCs, such as the 0603M size (0.6mm × 0.3mm), with capacities below 1µF – where stability was previously difficult to achieve. This contributes to space saving as well as greater flexibility in component selection.　　Furthermore, high-precision SPICE models, “ROHM Real Model” are provided for accurate simulation and can be downloaded from the ROHM official website.　　SPICE Models: BD900N5xxx-C BD933N5xxxx-C BD950N5xxxx-C　　ROHM will continue to contribute to the high performance, miniaturization, and high reliability of electronic devices by further expanding its Nano Cap™ technology-equipped LDO series.　　Application Examples　　Automotive Equipment　　● Powertrain system power supplies for fuel injection systems (FI) and tire pressure monitoring systems (TPMS)● Body system power supplies for body control modules (BCM)● Infotainment system power supplies for clusters ad head-up displays (HUD), etc.Industrial Equipment　　● Power supplies for controllers like Programmable Logic Controllers (PLC), Remote Terminal Units (RTU), and industrial gateways● High-precision LDOs for analog loads and sensors measuring temperature, pressure, flow rate, etc.● Power supplies for monitoring and control panels in disaster prevention systems, access control systems and building automation.● Standby power supplies for Human-Machine Interfaces (HMI) and panel equipment, etc.Consumer Electronics　　● Power supplies for control boards in refrigerators, dishwashers, air conditioners, etc.● Power supplies for home appliances like thermostats and doorbells● Power supplies for constant power applications in home security and network equipment, etc.　　What is Nano Cap™ Technology?　　Nano Cap™ refers to ultra-stable control technology achieved by combining advanced analog expertise covering circuit design, processes, and layout utilizing ROHM’s vertically integrated production system. Stable control eliminates the problem of unstable operation related to capacitors in analog circuits, contributing to a reduction in design resources for a wide range of applications in automotive, industrial equipment, consumer, and other fields.　　Terminology　　Primary　　In a power supply circuit, the side in charge of 1st stage conversion from a power source such as a battery is called the primary and the side responsible for 2nd stage conversion is referred to as the secondary.　　LDO Regulator (Low Drop Out Regulator / Low Saturation Regulator)　　A type of power supply IC that converts between two different DC voltage levels. Falls under the category of linear regulator (where the input/output voltages operate linearly) characterized by a small input-output voltage difference. Compared to DC-DC converter ICs (switching regulators), LDOs feature a simpler circuit configuration and lower noise.　　ROHM Real Model　　A high-accuracy simulation model that make it possible to also achieve a perfect match between the actual IC and simulation values utilizing ROHM’s proprietary model-based technology.

Key word：

ROHM

Release time：2026-01-27 13:47 reading：305 Continue reading>>

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SIMCom丨SIM8260 series Achieves Global Certifications, Delivering High-Performance 5G Connectivity

　　SIMCom, a global leader in IoT communication and solutions, proudly announces that its SIM8260 Series 5G modules have successfully obtained a wide range of international certifications, including CE, RCM, FCC, IC, JATE, TELEC, GCF, PTCRB, T-Mobile, Verizon, Deutsche Telekom, Orange, RoHS, REACH. These certifications demonstrate the SIM8230 series’ compliance with global standards and network requirements, ensuring smooth deployment across worldwide markets.　　Built on the Qualcomm® Snapdragon™ X62 chipset platform, the SIM8260 series are a multi-band 5G Release 16 module supporting NR, LTE-FDD, LTE-TDD, and HSPA+ in both NSA and SA modes. With its advanced capabilities, the SIM8260 series enable fast, stable, and secure mobile broadband connections for a wide range of industrial and commercial applications.　　The SIM8260 series achieve outstanding data rates across multiple network environments. On 5G Sub-6G SA, it supports download speeds of up to 2.4Gbps and upload speeds of up to 1Gbps, while in 5G Sub-6G NSA mode it can reach 3.4Gbps (DL) and 600Mbps (UL). For LTE networks, peak speeds of 1.6Gbps downlink and 200Mbps uplink are supported, and on HSPA+, the module achieves 42Mbps (DL) and 5.76Mbps (UL). These capabilities ensure stable, high-capacity communication to meet the demands of data-intensive IoT and enterprise applications.　　Beyond performance, the SIM8260 series offer robust expansion capabilities with a wide range of interfaces including PCIe, USB 3.1, and GPIO, enabling flexible integration into customer solutions, reduce development costs, and accelerate time-to-market.　　With its combination of high throughput, flexible integration, and proven security, the SIM8260 series are ideally suited for use cases such as smart manufacturing, connected vehicles, customer premises equipment (CPE), robotics, and other next-generation IoT solutions.　　The achievement of comprehensive global certifications underscores the SIM8260 series’ in large-scale international deployment. These approvals not only confirm compliance with stringent regulatory, safety, and environmental standards, but also guarantee broad operator interoperability across regions. For customers, this means accelerated product launches, reduced deployment risks, and greater confidence in global scalability.

Key word：

SIMCom

Release time：2026-01-23 16:51 reading：416 Continue reading>>

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Industry’s Highest* Rated Power! ROHM Unveils the UCR10C Series of Sintered Metal Shunt Resistors

　　ROHM has developed the “UCR10C Series”, which has the industry's highest rated power for 2012-size shunt resistors (10 mΩ to 100 mΩ).　　Shunt resistors are required to handle higher power for current sensing in both the automotive and industrial equipment markets. Additionally, specific requirements for high junction reliability in these markets has increased annually.　　ROHM’s new products form a copper-based resistive element on an alumina substrate via sintering. By optimizing the heat dissipation structure, it achieves rated powers of 1.0W and 1.25W-double that of equivalent-sized products including thick film types and metal plate types. This enables the replacement of products with wide terminal types or larger alternatives, facilitating miniaturization and reducing the number of components required.　　Furthermore, the use of a metal resistive element achieves a low TCR (0 to +60 ppm/°C). This minimizes errors due to temperature changes, enabling high-precision current sensing. Moreover, it achieves the same level of durability as the metal plate types in temperature cycle testing (-55°C / +155°C, 1000 cycles). This ensures high bonding reliability even in applications with extreme temperature fluctuations, such as automotive use, enabling stable, long-term operation.　　This series is fully lead-free. No lead materials are present, even in RoHS-exempted areas, thus reducing environmental impact.　　As part of its future expansion plans, ROHM has also commenced development of the 3216-size (2W) sintered metal shunt resistor, the “UCR18C Series”, further enhancing its product line-up that combines high power, high precision and high reliability.　　Application Examples　　Various current detection applications in automotive, industrial equipment, and consumer electronics.　　Terminology　　Thick Film Types　　A chip resistor using a material called metal glaze as the resistive element. In addition to cost advantages, the thick film resistive element provides superior resistance to pulses and surges.　　Metal Plate Types　　A chip resistor using a metal plate as the resistive element. It offers superior thermal dissipation and achieves high precision through low TCR, providing performance advantages.　　Wide Terminal Types　　A structure where the electrodes are positioned along the long side of the chip resistor body. Compared to the common structure with electrodes along the short side, it improves heat dissipation efficiency and enables high-power handling.　　TCR (Temperature Coefficient of Resistance)　　An indicator showing how much a resistor's resistance value changes with temperature. A lower value means less resistance variation due to temperature fluctuations, providing more stable performance.　　The TCR of the UCR10C varies depending on the resistance value. Furthermore, the listed TCR is the guaranteed value for the +25/+155°C range for the 10mΩ product.

Key word：

ROHM

Release time：2026-01-22 11:30 reading：1212 Continue reading>>

model	brand	Quote
MC33074DR2G	onsemi
TL431ACLPR	Texas Instruments
CDZVT2R20B	ROHM Semiconductor
BD71847AMWV-E2	ROHM Semiconductor
RB751G-40T2R	ROHM Semiconductor

model	brand	To snap up
BU33JA2MNVX-CTL	ROHM Semiconductor
TPS63050YFFR	Texas Instruments
IPZ40N04S5L4R8ATMA1	Infineon Technologies
ESR03EZPJ151	ROHM Semiconductor
BP3621	ROHM Semiconductor
STM32F429IGT6	STMicroelectronics

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