Cutting-Edge Passive Components Revolutionizing Next-Generation Power Supply Designs for AI Servers and Automotive Applications

　　To address the rapid trend toward higher power and higher density in power supply circuits, TAIYO YUDEN’s advanced capacitor lineup delivers "Compact & Low-Profile Designs," "Component Count Reduction," and "High Reliability."

　　[AI Server Power Solutions]

　　Supporting Next-Generation Power Architectures

　　1. Compact, High-Capacitance MLCCs

　　・Enable high-density power supply designs for low-voltage rails (0.6 V to 1.2 V) located close to processors.

　　2. Embedded-Board Compatible MLCCs

　　・Wide, flat electrode structures support stable component placement and multiple via connections.

　　・Maximize PCB space savings and reduce parasitic inductance/resistance, supporting vertical power delivery architectures.

　　3. Fully Integrated Manufacturing from Material Development

　　In-house material technology ensures rigorous quality control and high reliability for mission-critical computing environments.

　　[Automotive Power Solutions]

　　High Reliability & Performance for ADAS and EV Applications (AEC-Q200 Qualified)

　　1. High-Capacitance 3225 mm size (220 µF / 4 V) MLCCs

　　・Industry-leading capacitance density in automotive-grade X7T (3225 size, 3.2 × 2.5 mm).

　　・Accelerate the replacement of polymer capacitors through low ESR and low ESL characteristics—suppressing ripple, spikes, and heat generation while reducing mounting area.

　　2. Soft-Termination MLCCs

　　・Guarantees resistance up to 5 mm of flexure.

　　・Low-Silver Filler Technology: Significantly suppresses ion migration in high-humidity environments while maintaining electrical performance and supply stability.