Samsung Reportedly Restarts 1.4nm Push, Targets 2029 Mass Production to Close Gap with TSMC, Intel

　　As Intel and TSMC both target 1.4nm mass production around 2028-29, Samsung—after reportedly delaying its own roadmap—is now re-entering the race. According to The Bell, the company has resumed efforts to commercialize its 1.4nm (SF1.4) foundry process, with mass production now slated for 2029, placing it slightly behind its leading rivals.

　　Samsung is also understood to have recently requested early development of process equipment from domestic and overseas partners. As noted by the report, it has recently shared its 1.4nm process roadmap with major semiconductor equipment makers, including Applied Materials and Lam Research.

　　Notably, the report, citing industry sources, points out that Samsung Electronics has already installed ASML’s next-generation High-NA extreme ultraviolet (EUV) lithography equipment at its NRD-K facility. The High-NA EUV tools are understood to be applied to select layers starting from the 1.4nm process, the report explains.

　　Why Samsung Delayed 1.4nm Plans

　　The Bell adds that the original 2027 target has been pushed back to 2029, as Samsung redirects focus toward strengthening its 2nm (SF2) and derivative SF2P processes, signaling a shift toward yield stabilization and process optimization over aggressive node advancement.

　　This strategic pivot is also reflected at the product level. A previous Global Economic News report suggested that Samsung has shifted the manufacturing process for its next-generation flagship smartphone processor, the Exynos 2800, from the originally planned 1.4nm node to an advanced version of its 2nm process.

　　A Closer Look at 1.4nm Plans for Intel, TSMC

　　Samsung Electronics’ renewed push into its 1.4nm process is drawing attention over whether it can narrow the technology gap with rivals such as TSMC and Intel. According to Economic Daily News, TSMC is targeting 1.4nm pilot production as early as 3Q27, with mass production planned for 2H28.

　　However, Tom’s Hardware notes that TSMC is expected to skip ASML’s High-NA EUV tools through 2029, meaning its 1.4nm node would proceed without the advanced system being adopted by Intel and Samsung.

　　For Intel, Reuters reports that its 18A-P process has already entered pilot production, with the company reportedly targeting 14A risk production in 2028, followed by high-volume manufacturing in 2029.