MPC860ENCZQ50D4
  • 量产中
  • 357-BBGA
产品描述:
IC MPU MPC8XX 50MHZ 357BGA
标准包装:1
数据手册: --
  • 规格参数
  • 产品特性
  • 技术文档
  • 产品评论
封装/外壳 357-BBGA
供应商器件封装 357-PBGA(25x25)
电压 - I/O 3.3V
核心处理器 MPC8xx
工作温度 -40°C ~ 95°C
RAM 控制器 DRAM
Core Processor MPC8xx
Speed 50MHz
Operating Temperature -40°C ~ 95°C (TA)
Categories Integrated Circuits (ICs)
Supplier Device Package 357-PBGA (25x25)
Series MPC8xx
Additional Interfaces I²C, IrDA, PCMCIA, SPI, TDM, UART/USART
Number of Cores/Bus Width 1 Core, 32-Bit
Ethernet 10 Mbps (4)
Manufacturer NXP USA Inc.
Packaging Tray
Part Status Not For New Designs
RAM Controllers DRAM
Voltage - I/O 3.3V
Graphics Acceleration No
Co-Processors/DSP Communications; CPM
Base Part Number MPC860
以太网 10 Mbps(4)
图形加速
速度 50MHz
附加接口 I²C,IrDA,PCMCIA,SPI,TDM,UART/USART
协处理器/DSP 通信; CPM
核数/总线宽度 1 코어,32 位
Core Processor MPC8xx
Speed 50MHz
Operating Temperature -40°C ~ 95°C (TA)
Categories Integrated Circuits (ICs)
Supplier Device Package 357-PBGA (25x25)
Package / Case 357-BBGA
Package / Case 357-BBGA
Number of Cores/Bus Width 1 Core, 32-Bit
Manufacturer NXP USA Inc.
Packaging Tray
Part Status Not For New Designs
RAM Controllers DRAM
Voltage - I/O 3.3V
Graphics Acceleration No
Co-Processors/DSP Communications; CPM
Base Part Number MPC860
登录之后就可发表评论

请输入下方图片中的验证码:

验证码