| 封装/外壳 | 357-BBGA |
|---|---|
| 供应商器件封装 | 357-PBGA(25x25) |
| 电压 - I/O | 3.3V |
| 核心处理器 | MPC8xx |
| 工作温度 | -40°C ~ 95°C |
| RAM 控制器 | DRAM |
| Core Processor | MPC8xx |
| Speed | 50MHz |
| Operating Temperature | -40°C ~ 95°C (TA) |
| Categories | Integrated Circuits (ICs) |
| Supplier Device Package | 357-PBGA (25x25) |
| Series | MPC8xx |
| Additional Interfaces | I²C, IrDA, PCMCIA, SPI, TDM, UART/USART |
| Number of Cores/Bus Width | 1 Core, 32-Bit |
| Ethernet | 10 Mbps (4) |
| Manufacturer | NXP USA Inc. |
| Packaging | Tray |
| Part Status | Not For New Designs |
| RAM Controllers | DRAM |
| Voltage - I/O | 3.3V |
| Graphics Acceleration | No |
| Co-Processors/DSP | Communications; CPM |
| Base Part Number | MPC860 |
| 以太网 | 10 Mbps(4) |
| 图形加速 | 无 |
| 速度 | 50MHz |
| 附加接口 | I²C,IrDA,PCMCIA,SPI,TDM,UART/USART |
| 协处理器/DSP | 通信; CPM |
| 核数/总线宽度 | 1 코어,32 位 |
| Core Processor | MPC8xx |
| Speed | 50MHz |
| Operating Temperature | -40°C ~ 95°C (TA) |
| Categories | Integrated Circuits (ICs) |
| Supplier Device Package | 357-PBGA (25x25) |
| Package / Case | 357-BBGA |
| Package / Case | 357-BBGA |
| Number of Cores/Bus Width | 1 Core, 32-Bit |
| Manufacturer | NXP USA Inc. |
| Packaging | Tray |
| Part Status | Not For New Designs |
| RAM Controllers | DRAM |
| Voltage - I/O | 3.3V |
| Graphics Acceleration | No |
| Co-Processors/DSP | Communications; CPM |
| Base Part Number | MPC860 |
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