| PIC24F04KA200-I/P | ||
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| 产品描述:
IC: PIC microcontroller; Memory: 4kB; SRAM: 512B; 1.8÷3.6VDC; THT
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| 标准包装:100 | ||
| 数据手册: |
| Datasheets | 16-bit Embedded Control Solutions PIC24F04KA201 Family PIC24F04KA20x Prog Spec |
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| Product Training Modules | XLP Deep Sleep Mode Getting the Lowest Current Consumption from a PIC24F MCU Bluetooth Audio Development Platform |
| Online Catalog | PIC® XLP™ 24F |
| PCN Design/Specification | PIC24F04KA201 Datasheet Update 27/Mar/2014 Copper Bond Wire 07/Apr/2015 |
| SDP | 14-PDIP .300in |
| EDA / CAD Models | Download from Accelerated Designs |
| Design Resources | Development Tool Selector |
| PCN Packaging | Label and Packing Changes 23/Sep/2015 |
| ECCN | 3A991.a.2 |
| Package / Case | TUBE |
| 数据手册: |
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