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| 产品描述：
2292BG - Leadless Chip Carriers & Flat Packs Bond On Heat Sink
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| 标准包装：500 | ||
| 数据手册： -- |
- 规格参数
- 产品特性
- 技术文档
- 产品评论
| Package Cooled | BGA |
|---|---|
| Type | Board Level |
| Standard Package | 500 |
| Diameter | 0.300" (7.62mm) ID, 1.125" (28.57mm) OD |
| Power Dissipation @ Temperature Rise | 1.5W @ 40°C |
| Thermal Resistance @ Forced Air Flow | 8.0°C/W @ 400 LFM |
| ECCN | EAR99 |
| Attachment Method | Thermal Tape, Adhesive (Not Included) |
| Material | Aluminum |
| Product Training Modules | How to Select a Heat Sink |
| Shape | Cylindrical |
| Material Finish | Black Anodized |
| Family | Thermal - Heat Sinks |
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