| 2286B | ||
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| Product description : BOARD LEVEL HEAT SINK | ||
| SPQ：500 | ||
| Datasheet : -- |
- Specifications
- Product Attributes
- Documents
- Product reviews
| Package Cooled | BGA |
|---|---|
| Type | Board Level |
| Standard Package | 500 |
| Shape | Square |
| Material Finish | Black Anodized |
| Thermal Resistance @ Forced Air Flow | 20.0°C/W @ 200 LFM |
| Height Off Base (Height of Fin) | 0.155" (3.94mm) |
| Attachment Method | Thermal Tape, Adhesive (Not Included) |
| Material | Aluminum |
| Product Training Modules | How to Select a Heat Sink |
| Power Dissipation @ Temperature Rise | 1W @ 40°C |
| Length | 0.790" (20.07mm) |
| Family | Thermal - Heat Sinks |
| Width | 0.790" (20.07mm) |
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