Termination | Solder |
---|---|
PCN Assembly/Origin | Multiple Devices Location 17/Aug/2014 |
Standard Package | 200 |
Features | Open Frame |
Contact Finish Thickness - Post | 30µin (0.76µm) |
Housing Material | Thermoplastic |
Contact Material - Post | Copper Alloy |
Contact Material - Mating | Copper Alloy |
Family | Sockets for ICs, Transistors |
Operating Temperature | -25°C ~ 100°C |
Material Flammability Rating | UL94 V-0 |
Pitch - Post | 0.040" (1.01mm) |
Type | LGA |
Contact Finish - Post | Gold |
Packaging | Tray |
Number of Positions or Pins (Grid) | 1356 (32 x 41) |
Contact Finish - Mating | Gold |
Contact Finish Thickness - Mating | 30µin (0.76µm) |
Pitch - Mating | 0.040" (1.01mm) |
Mounting Type | Surface Mount |
3D Model | 1554116-3.pdf |
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