1554116-3
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产品描述:
CONN SOCKET LGA 1356POS GOLD
标准包装:1
数据手册: --
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Termination Solder
PCN Assembly/Origin Multiple Devices Location 17/Aug/2014
Standard Package   200
Features Open Frame
Contact Finish Thickness - Post 30µin (0.76µm)
Housing Material Thermoplastic
Contact Material - Post Copper Alloy
Contact Material - Mating Copper Alloy
Family Sockets for ICs, Transistors
Operating Temperature -25°C ~ 100°C
Material Flammability Rating UL94 V-0
Pitch - Post 0.040" (1.01mm)
Type LGA
Contact Finish - Post Gold
Packaging   Tray  
Number of Positions or Pins (Grid) 1356 (32 x 41)
Contact Finish - Mating Gold
Contact Finish Thickness - Mating 30µin (0.76µm)
Pitch - Mating 0.040" (1.01mm)
Mounting Type Surface Mount
3D Model 1554116-3.pdf
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