| Pitch - Post | 0.100" (2.54mm) |
|---|---|
| Contact Finish Thickness - Post | 200µin (5.08µm) |
| Housing Material | Thermoplastic, Polyester |
| Contact Material - Mating | Beryllium Copper |
| Mounting Type | Through Hole |
| Termination | Wire Wrap |
| Contact Finish - Post | Tin |
| Packaging | Tube |
| Family | Sockets for ICs, Transistors |
| Operating Temperature | -40°C ~ 105°C |
| ECCN | EAR99 |
| Type | DIP, 0.3" (7.62mm) Row Spacing |
| Number of Positions or Pins (Grid) | 16 (2 x 8) |
| Contact Material - Post | Beryllium Copper |
| Pitch - Mating | 0.100" (2.54mm) |
| Material Flammability Rating | UL94 V-0 |
| Standard Package | 29 |
| Features | Open Frame |
| Contact Finish - Mating | Gold |
| Contact Resistance | 4 mOhm |
| Current Rating | 3A |
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