| 573300D00010 | ||
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| Product description : HEATSINK D-PAK .4" HIGH SMD | ||
| SPQ：1 | ||
| Datasheet : -- |
- Specifications
- Product Attributes
- Documents
- Product reviews
| Package Cooled | TO-263 (D虏Pak) |
|---|---|
| Type | Top Mount |
| Standard Package | 1 |
| Shape | Rectangular |
| Material Finish | Tin |
| Thermal Resistance @ Forced Air Flow | 10.0掳C/W @ 200 LFM |
| Height Off Base (Height of Fin) | 0.400" (10.16mm) |
| Thermal Resistance @ Natural | 18掳C/W |
| Attachment Method | SMD Pad |
| Material | Copper |
| Product Training Modules | How to Select a Heat Sink |
| Power Dissipation @ Temperature Rise | 1.25W @ 30掳C |
| Length | 0.500" (12.70mm) |
| Family | Thermal - Heat Sinks |
| Width | 1.030" (26.16mm) |
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