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<span style='color:red'>Cree</span> LED CV94A-FGC Standard LEDs

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Cree LED CV94A-FGC Standard LEDs

　　Cree LED CV94A-FGC Standard LEDs feature an IPx8 water-resistant rating in a PLCC6 package. This PLCC6 package offers an increased package height to ease the manufacturing process. These high-performance tricolor SMT LEDs are designed to work in various applications. The CV94A-FGC standard LEDs feature encapsulation resin that contains UV inhibitors to minimize the effects of long-term exposure to direct sunlight. This results in stable light output over the life of the LED. The CV94A-FGC standard LEDs feature a 5a moisture sensitivity level, lead-free, and are RoHS compliant. These standard LEDs operate at 2.7V forward voltage and -40°C to 85°C temperature range. The CV94A-FGC standard LEDs are ideally used in full-color video screens, digital billboards, and petrol signs.　　FEATURES　　9.4mm x 4.2mm x 4mm size　　Dominant wavelength:　　Red (619nm to 624nm)　　Green (520nm to 540nm)　　Blue (460nm to 480nm)　　Luminous intensity:　　Red (1120mcd to 2520mcd)　　Green (1800mcd to 4025mcd)　　Blue (403mcd to 900mcd)　　Water-Resistant (IPx8)*　　5a: Moisture sensitivity level　　Lead-free　　RoHS compliant　　SPECIFICATIONS　　2.7V forward voltage　　Power dissipation:　　140mW (red)　　126mW (green and blue)　　Forward current:　　50mA (red)　　35mA (green and blue)　　100mA peak forward current　　5V reverse voltage　　110°C junction temperature　　-40°C to 85°C operating temperature range　　40°C to 100°C storage temperature range　　APPLICATIONS　　Electronic Signs and Signals (ESS)　　Full-color video screen　　Digital billboards　　Motorway signs　　Variable Message Sign (VMS)　　Advertising signs　　Petrol signs

Key word：

Cree LED,CV94A-FGC

Release time：2023-03-27 11:46 reading：2831 Continue reading>>

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Hylinke launched the Internet of Things wireless serial port screen module HLK-US100

　　The first new product launched in 2023 is HLK-US100, an Internet of Things wireless serial port screen module designed based on Liansheng W800 and Lesrise Semiconductor LT7680A-R. HLK-US100 serial screen, support capacitive touch function, support WiFi, buy serial screen free custom APP.　　Serial screen product introduction　　Main function　　HLK-US100 serial port panel module produced by Hailingke Electronics is a wireless serial port panel for Internet of Things based on the design of Lianshengde W800 and Lesrise Semiconductor LT7680A-R.　　Serial screen HLK-US100 supports Wi-Fi/BLE wireless, 4.3 "display, capacitive touch function, rich interface and powerful processor.　　(Front view of HLK-US100 module)　　Serial screen HLK-US100 supports built-in geometry, picturesque points, lines, curves, ellipses, triangles, rectangles, rounded rectangles and so on.　　(HLK-US100 module application block diagram)　　In addition, serial screen HLK-US100 can also achieve RTC analog clock, digital clock, virtual controls, touch slider, ring touch slider, cyclic overlapping picture, digital keyboard interface, pop-up picture, cyclic rolling picture and other functions.　　Product data and application　　Hailingko serial screen can be applied to smart home, medical equipment, instruments and other industries, and can freely design the UI interface through the upper computer, through the TF card or remote OTA upgrade display firmware.　　The serial screen will be updated next week, including product manuals, tutorials and video tutorials.　　Product parameter　　Super data processing capability, MCU main frequency 240MHz, 288KB RAM　　Wireless standard: IEEE 802.11b /g/n, BLE4.2　　Supports STA, AP, AP+STA　　128Mb of built-in display memory　　Supports 16/18bits RGB interface display　　The display resolution ranges from 320*240 (QVGA) to 1280*1024 (SXGA)　　Support capacitive/resistive touch screen　　The FLASH storage space is 16MB　　Supports a maximum of 32 GB MicroTF/SD card　　Rich peripheral interface, SDIO,I2C,PWM,UART,GPIO　　Widely used in Internet of Things applications

Key word：

HLK-US100,Module,HLK-US100

Release time：2023-02-13 11:44 reading：1540 Continue reading>>

<span style='color:red'>Cree</span> Signs $250 Million Deal to Supply ST With SiC Wafers

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Cree Signs $250 Million Deal to Supply ST With SiC Wafers

Cree has signed a multi-year $250 million agreement to produce and supply its Wolfspeed 150-mm silicon-carbide (SiC) bare and epitaxial wafers to STMicroelectronics. The supply agreement is for ST’s silicon-carbide products in the broad automotive and industrial markets.Jean-Marc Chery, president and CEO of STMicroelectronics, said that ST is the only semiconductor company with automotive-grade silicon carbide in mass production today and that the company wants to press forward to grow its SiC business both in terms of volume and breadth of applications served. As ST had previously stated during an earnings announcement, its aim is to take the lead in a market estimated to be worth more than $3 billion in 2025.“This agreement with Cree will improve our flexibility, sustain our ambition and plans, and contribute to boosting the pervasion of SiC in automotive and industrial applications," Chery said.This is the third multi-year agreement that Cree has signed in the past year for its 150-mm silicon-carbide wafers. In February 2018, it announced a $100 million long-term supply agreement for its SiC wafers to Infineon Technologies for product lines including photovoltaic inverters, robotics, charging infrastructure, industrial power supplies, traction, and variable speed drives.In October 2018, it announced an $85M long-term agreement to produce and supply its SiC wafers to an unnamed “leading power device company.”

Key word：

Cree,ST

Release time：2019-01-10 00:00 reading：2669 Continue reading>>

<span style='color:red'>Cree</span> and STMicroelectronics Announce Multi-Year Silicon Carbide Wafer Supply Agreement

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Cree and STMicroelectronics Announce Multi-Year Silicon Carbide Wafer Supply Agreement

Cree announces that it signed a multi-year agreement to produce and supply its Wolfspeed silicon carbide (SiC) wafers to STMicroelectronics. The agreement governs the supply of a quarter billion dollars of Cree's advanced 150mm silicon carbide bare and epitaxial wafers to STMicroelectronics during this period of extraordinary growth and demand for silicon carbide power devices."ST is the only semiconductor company with automotive-grade silicon carbide in mass production today, and we want to press forward to grow our SiC business both in terms of volume and breadth of applications served, targeting leadership in a market estimated at more than $3B in 2025," said Jean-Marc Chery, president and CEO of STMicroelectronics. "This agreement with Cree will improve our flexibility, sustain our ambition and plans, and contribute to boosting the pervasion of SiC in automotive and industrial applications.""We remain focused on increasing the adoption of silicon carbide-based solutions, and this agreement is a testament to our mission," said Gregg Lowe, CEO of Cree. "This is the third multi-year agreement that we have signed this past year in support of the industry's transition from silicon to silicon carbide. As the world leader in silicon carbide, Cree continues to expand capacity to meet the growing market needs, particularly in industrial and automotive applications. We are extremely pleased to continue to support STMicroelectronics as we both invest to accelerate this market."

Key word：

Cree,STMicroelectronics

Release time：2019-01-09 00:00 reading：3022 Continue reading>>

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5G: Huawei India CEO says open to provide source code for screening to allay security concerns

Chinese telecom gear maker Huawei said that it is actively engaged with the Indian government and telecom operators, and is ready to put up its “source code” for screening and testing to allay security concerns.“In the UK, the government had set up a test center, and we had put original source code in that center for full screening and testing. In 2010, there were security concerns in India, and we had given committed to the Indian government to put our source code. We were the only one to do that. We are ready to do that now,” Jay Chen, Huawei chief executive officer in India said.Chen said that there hasn’t been any evidence that proves security-related allegations against the company’s products and solutions. “There has been no proof. All telcos have chief security officers that work with our security officer. We have a very mature working mechanism on security checks and everything,” he further said, adding that the Indian govt and telecom operators are very mature. The executive added that Huawei is 100% employee-owned company, and isn’t state-owned or a public company in China. Media reports said that Huawei will invest $2 billion in cybersecurity over the next five years as part of its global efforts to ease security concerns. ET on Friday reported that India was unlikely to ban Huawei from selling 5Gequipment in the country, in a reversal of its earlier stance, despite the US calling for a boycott over espionage concerns.The Cellular Operators Association of India (COAI) on Monday defended Huawei amid reports that said that the Telecom Equipment and Services Export Promotion Council (TEPC) was planning to seek restriction against the Chinese telecom gear maker over national security concerns. The industry body, in its letter to the telecom secretary, urged the government to not take any decision in haste on the basis of "alleged concerns" raised by the TEPCTelecom equipment providers such as Sweden’s Ericsson and Finland’s Nokia source parts from China but both say they have tight controls and security protocols in place.Chen said that the company is committed to making further investments in the country, and is currently working on a plan to resume local manufacturing of telecom gear and enterprise products.“We are thinking over the new plant for carrier business and enterprise. We are closely working with HQ for the new plant. We recently met people in Chennai. We understand Make in India project,” Chen said.Huawei earlier this year moved from its special economic zone (SEZ) manufacturing to FTW zone near Mumbai due to low demand for equipment and other challenges.On the handset part, the company recently extended its manufacturing capabilities by partnering with Foxconn. It already works with Flex to make handsets in India.Chen said that Huawei’s headquarters (HQ) considers India as a priority market and recently gave its support to the Indian unit to take part in the upcoming 5G field trials. “5G real trial is a real investment. we discussed with the HQ,” he said, adding that the company made recent investments in setting up a new enterprise lab in Gurugram.Huawei has earlier this week submitted joint applications with telcos for 5G trials. Chen said that the company is under discussions with all three private telcos in India. “We are waiting for the DoT’s final approval for these tests. We are also working with them for the trial spectrum.,” he added.

Key word：

5G,Huawei

Release time：2018-12-26 00:00 reading：1018 Continue reading>>

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High Screen-to-Body Ratio to Become Mainstream, Penetration Rate of Smartphones Based on COF Packaging Would Reach 35% in 2019

According to WitsView, a division of TrendForce, the market has witnessed stronger demand for full-screen smartphones while higher screen-to-body ratio has become a major trend of this year. In order to make bezels narrower, drive ICs for mid- and high-end phones have been switching from solutions based on Chip-on-Glass (COG) packaging to those on Chip-on-Film (COF) packaging. With major smartphone vendors actively adopting COF solutions, the percentage of models using COF packaging would account for 35% of the global smartphone market in 2019, a significant increase from 16.5% in 2018.“In the past, most driver ICs used in smartphones adopted COG packaging, which requires more room at the bottom of display panel for chip bonding, so the bottom bezel is normally larger than side bezels and top bezel”, says Boyce Fan, research director of WitsView. However, the recent bezel-less trend on smartphones has shaped the design of panels. High-end models have started to use COF package, in which driver IC is moved to the back of display panel, thus enabling a narrower bottom bezel. WitsView notes that COF package is only used in flexible AMOLED panels previously, but will see higher penetration this year after Apple adopted this packaging technology in its 2018 new models. Other brands are expected to follow suit for their high-end models.However, the stronger demand for COF package has resulted in a tight supply of tape, a necessary material for this packaging technology. The tapes have also seen rising quotes, which are rare in recent years. In the past, tapes are only used in large size COF panels, thus remaining in oversupply for a long time. Despite the rising number of high-end smartphones using COF packaging, WitsView does not discount the possibility that smartphone designers return to COG packaging because COF will increase the material costs for smartphones. For example, FHD+ 6MUX TDDI IC, which is currently in development, adopts COG packaging rather than COF. Considering the demand uncertainty, tape manufacturers may not be very active to expand production capacity.With little production expansion yet higher demand for COF package from smartphone vendors, WitsView expects the COF substrates to see a tight supply. As the result, large size panel makers and smartphone makers may need to compete to secure the supply of COF substrates.

Key word：

Market trend

Release time：2018-11-12 00:00 reading：1218 Continue reading>>

<span style='color:red'>Cree</span> Buys Infineon's RF Power Biz for $430 Million

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Cree Buys Infineon's RF Power Biz for $430 Million

　　LED and RF chip vendor Cree said it paid about $430 million to acquire Infineon Technologies' RF Power business in a move to bolster the offerings of Cree's Wolfspeed subsidiary in wireless, including faster 4G and 5G networks.　　In 2016, Cree struck a deal to sell Wolfspeed to Infineon for $850 million, but the companies called it off last year after the Committee for Foreign Investment in the United States (CFIUS) raised concerns about the deal’s implications for U.S. national security.　　Cree (Durham, N.C.) said the acquisition of the Infineon RF Power team and capabilities would complement Wolfspeed with additional technology, design, packaging, manufacturing and customer support. The Infineon RF Power business is a leader in offering transistors and monolithic microwave ICs (MMICs) for wireless infrastructure radio frequency power amplifiers based on both LDMOS and gallium nitride on silicon carbide (GaN-on-SiC) technologies, according to Cree.　　"This is a key element of Cree’s growth strategy and positions Wolfspeed to enable faster 4G networks and the revolutionary transition to 5G," said Cree CEO Gregg Lowe, in a press statement.　　Reinhard Ploss, CEO of Infineon, said sellign the business would enable Infineon to focus on strategic growth areas while retaining a strong technology portfolio for the wireless market.　　The deal includes about 260 employees in California, Arizona, Finland, Sweden, China and South Korea. The deal also includes the main Infineon Power facility in Morgan Hill, Calif., which includes packaging and test operations for LDMOS and GaN-on-SiC.　　Infineon said it would support the transaction with a long-term supply agreement for LDMOS wafers and related components out of its fab in Regensburg, Germany, and that it would also supply assembly and test services out of its facility in Melaka, Malaysia.　　“We are looking forward to combining our strengths with Cree,” said Gerhard Wolf, vice president and general manager of RF power products at Infineon.

Key word：

Cree,Infineon

Release time：2018-03-08 00:00 reading：2674 Continue reading>>

Trade news

Imagination Improves Virtualized GPU Core to Support Multiple Screens

　　Imagination Technologies announced a new GPU core that supports hardware virtualization specifically for the automotive environment. The new PowerVR Series8XT GT8540 GPU, which can simultaneously drive up to six 4K screens with complex UIs at 60fps, supports the multiple, ultra-high resolution displays for cluster, head-up display (HUD) and infotainment that automotive manufactures are fitting to car interiors from 2018 onwards.　　The company says it already has licensees for the core, though multiple 4k screens are probably between three and five years away.　　"This might be a long way away, but silicon is being designed for these today," said Kristof Beets, Imagination's senior director of product management.　　"A lot of GPUs are focused on the PC or mobile phone, and then they are re-badged for automotive," Beets said. "With this new core, we have developed it especially for the automotive environment, based on our proven solution for automotive.”　　Beets said Imagination has been developing its virtualized solution for automotive over a number of years, so it is a proven market solution.　　The new four-cluster PowerVR Series8XT features built-in hardware virtualization capability, enabling automotive OEMs to deliver secure, high-performance graphics capabilities for a vehicle’s many displays. PowerVR hardware virtualization can provide a complete separation of services and applications, ensuring they remain secure against system intrusion or data corruption. The platform can support up to eight applications or services running in separate containers at once and automotive OEMs can deploy and remove services at will without affecting others running at the same time.　　Beets said the focus on virtualization is a key differentiator for Imagination's new core, with dynamic advance scheduling, flexible budgeting of resource for each VM (virtual machine) on the core, prioritization flexibility (for example guaranteeing the dashboard display), with near zero-impact on performance.　　As more in-car infotainment systems move towards richer operating systems, such as Android which offer capabilities to run apps, the importance of a GPU capable of full hardware virtualization to contain rogue apps is of increasing importance. Allowing a rich graphical environment for the infotainment system, safe in the knowledge that the dashboard and other critical displays will be unaffected by malware with a single PowerVR GPU, enables higher levels of system integration, reducing costs, whilst maintaining the safety critical requirements of the design.　　With enhanced design flexibility over the previous generation, the PowerVR four-cluster Series8XT enables automotive OEMs to design their systems to prioritise either graphics or compute-based applications. The Series8XT GT8540 can support long-running compute workloads on a single Shader Processing Unit (SPU) for ADAS functions such as lane departure warning, blind-spot detection, and surround view, amongst others. Other tasks, such as infotainment and cluster, can run on the second SPU, using prioritising mechanisms to reach system performance targets.　　Dominique Bonte, a vice president and managing director at ABI Research, said the ability to run multiple workloads over each SPU is a game changer in the automotive industry.　　"As the automotive industry moves closer to introducing Level 4 and Level 5 autonomous vehicles, powerful GPUs will be vital to power multiple high-resolution display," Bonte said. "With distraction concerns removed in driverless cars, additional opportunities for advanced infotainment features including 5G-based 4K video streaming will emerge in the longer term.

Key word：

Imagination, Virtualized GPU

Release time：2018-01-31 00:00 reading：1960 Continue reading>>

Former Freescale CEO Takes Helm at <span style='color:red'>Cree</span>

Trade news

Former Freescale CEO Takes Helm at Cree

　　Gregg Lowe, the former leader of Freescale Semiconductor, has been appointed president and CEO of LED maker Cree Inc.　　Lowe will succeed Chuck Swoboda, Cree's top executive for the past 16 years. Cree announced in May that Swoboda would be stepping down.　　Lowe was also named to Cree's board of director. Robert Ingram, who had served as Cree's lead independent director, was named chairman, succeeding Swoboda, who will remain on the board until the company's annual shareholder meeting on Oct. 24, Cree said.　　Lowe served as Freescale's president and CEO from 2012 to 2015, when the company was acquired by NXP Semiconductors. Lowe previously worked for 28 years at Texas Instruments, rising to the rank of senior vice president and head of the firm's analog business.　　In a statement, Lowe called Cree's "innovation engine" unmatched in the industry. "I am honored to be a part of this team and look forward to working with the employees and the board to establish and execute a clear vision for the company moving forward," he said.　　Lowe currently serves on the board of directors of Silicon Labs, as well as Baylor Healthcare System and the Rock and Roll Hall of Hame.

Key word：

Freescale CEO, Helm,Cree

Release time：2017-09-28 00:00 reading：2773 Continue reading>>

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RB751G-40T2R	ROHM Semiconductor
MC33074DR2G	onsemi
BD71847AMWV-E2	ROHM Semiconductor
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IPZ40N04S5L4R8ATMA1	Infineon Technologies
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ESR03EZPJ151	ROHM Semiconductor
TPS63050YFFR	Texas Instruments
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STM32F429IGT6	STMicroelectronics

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