2016年全球晶圆制造设备商排名TOP 10,Gartner说出产生差距的原因

Release time:2017-04-25
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source:digitimes
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3D NAND与尖端逻辑芯片制程设备支出成长推动下,调研机构Gartner表示,2016全年全球半导体晶圆级制造设备市场规模年增11.3%,达374.07亿美元。一扫2015年规模年减1%阴霾。

Gartner研究副总裁Takashi Ogawa表示,由于市场对资料中心高端服务,以及对移动装置中的高效能处理器与存储器需求大增,使得各半导体业者纷纷对晶圆级制造设备进行投资,进而推动了半导体设备市场规模的成长。



Gartner进一步分析,3D半导体制造是造成前十大前段设备业者表现出现落差的主要原因。具有3D半导体蚀刻解决方案的设备业者,表现都相当亮眼,例如应材的蚀刻设备业务,便因为3DNAND Flash的投资需求而出现强劲成长。成长表现最亮眼的Screen Semiconductor Solutions,除了同样受惠于3D NAND Flash投资热潮外,还有日圆兑美元升值的汇率利多因素加持,因为本统计是以美元作为计价单位。

应用材料(AppliedMaterials)2016年营收大幅成长,尤其是蚀刻领域设备营收成长更是明显。主要归功于其3D刻蚀设备。

资料显示,2016年应用材料整体晶圆级制造设备营收年增20.5%,达77.37亿美元。营收续居各业者之冠。

日本业者ScreenSemiconductor Solutions则是在日圆兑美元汇率升值,以及市场对3D NAND产能需求增加等因素影响下,2016年整体晶圆级制造设备营收年增41.5%,达13.75亿美元。虽然该公司2016年营收在前十大业者中仅排名第六,但营收年增率居各业者之冠。

2016年营收年增率仅次于Screen Semiconductor的是日立先端科技(Hitachi High-Technologies)。该公司营收年增率为24.3%,营收为9.80亿美元。营收在前十大业者中排名第七。

美国科林研发(LamResearch)与荷兰ASML则是分别以营收52.13亿与50.91亿美元,名列二与三名。上述两业者2016年营收年增率为8.4%与7.6%。

综观2016年营收前十大业者,仅Hitachi Kokusai与ASM International营收下滑,分别年减16.6%与14.7%,达5.28亿与4.97亿美元。

前十大业者合计营收占所有业者总营收的78.6%,较2015年占比77.4%,扬升了1.2个百分点。

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Opinions are mixed on whether Intel’s 3D XPoint will open a door to disruptive server designs next year. Some believe the chips cannot hit the latency levels needed for main memory, some believe they will, and others are sitting on the fence. 3DXP is the first of a half-dozen storage-class memories (SCM) expected to emerge over the next three years. They will enable a range of new options in memory capacity and speed. Engineers are working on interfaces for the new chips, but they are largely unfinished and their future somewhat unclear. Flash-memory analyst Jim Handy is bullish on SCM in general and 3DXP in particular. At its 2015 launch, he predicted that Intel could reap $2 billion in the first two years of 3DXP revenues. It’s taken Intel and Micron longer to ramp the co-developed design, which uses novel and still-undisclosed materials. Nevertheless, Handy believes that Intel still has some chance to reach that high watermark. “3D NAND was three years late on conventional silicon processes; 3DXP is only a couple of quarters late, but it’s using materials never before in production,” he said, noting that 3DXP in DIMMs “could be a very large market.” While large in revenue, it is not expected to be profitable for the near-term. Handy estimates that the manufacturing cost of the 3DXP drives that started shipping earlier this year could be an order of magnitude more than their high prices. However, Intel can still come out ahead if the faster memories grease sales for faster, more expensive processors, he said. Of course, Intel’s bullish 3DXP will bring all the disruptive benefits of a new class of memories. “This is the largest change to computer architecture in the lives of any of us,” said Jim Pappas, a veteran Intel evangelist who helped establish PCI and USB. “This is real; it’s happening. Go back to your companies and make sure they do the right thing,” Pappas told engineers at a January gathering of the Storage Networking Industry Association devoted to getting software ready for persistent main memory.
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