NXP-汽车仪表盘解决方案

Release time:2017-06-13
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source:ameya360
reading:196


仪表板似一扇窗户,随时反映出车子内部机器的运行状态,同时它又是部分设备的控制中心和被装饰的对象,是轿车车厢内最引人注目的部件。可以这样说,仪表板总成既有技术的功能又有艺术的功能,它反映出各国轿车制作工艺和风格上的差异,是整车的代表作之一。  

现代轿车的仪表板总成一般分成两部分,一部分是指方向盘前的仪表板和仪表罩及平台,另一部分是指司机旁通道上的副仪表板。其中仪表板是安装指示器的主体,集中了全车的监察仪表,通过它们揭示出发动机的转速、油压、水温和燃油的储量,灯光和发电机的工作状态,车辆的现时速度和里程积累。有些仪表还设有变速档位指示,计时钟,环境温度表,路面倾斜表和地面高度表等。按照现时流行的款式,现代轿车多数将空调,音响等设备的控制部件安装在副仪表板上,以方便驾驶者的操作,同时也显得整车布局紧凑合理。 

仪表板总成在车厢里处于中心的位置,非常引人注目,它的任何疵点都会令人感到浑身不舒服,因此汽车制造商是非常重视轿车仪表板总成的制作水平,从制作工艺上可以表现出制造公司的设计与工艺水平,从装饰风格上可以表现出这个国家或地区的文化传统。一种成功的轿车仪表板总成,既要融入轿车的整体,体现出它是轿车不可分割的一部分;又要体现出轿车的个性,使人看到仪表板就会想到车子的形象。正因如此,轿车仪表板总成的装饰材料是比较讲究的。

仪表板简称I/P(Instrument panel),是汽车内饰的重要组成部分。


Manufacturer Model Description
NXP MC9S08LG MCU
Atmel ATTINY10-TSHR MCU
Microchip PIC10F204T-I/OT MCU
ST STM8S003F3P6 MCU
Linear  LTC2974 电源管理
TI LM3880MF-1AA/NOPB 电源管理
Fairchild FAN7631SJX 电源管理
NXP MC33901WEF SBC
TI SN65HVD1050DR SBC
Microchip Technology MCP2561T-E/SN SBC
NXP MC33996EK LED Driver
Infineon Technologies TLE6214L LED Driver
NXP MC33972ATEW MSDI
TI TPD12S520DBTR MSDI
NXP PCA82C250T/YM,112 CAN Transceivers 
NXP UJA1078ATW/3V3WD,1 CAN/LIN
NXP 74AUP1G74DC 触发器
TI SN74AUP1G74DCUR 触发器
NXP MMA1618KWR2 加速度传感器
ROHM BD1020HFV 温度传感器
ROHM BM1422GMV 地磁加速度传感器
ROHM BU52742GUL 霍尔传感器
ROHM ML8511AFC 紫外线传感器
ROHM ML8540 红外线图像传感器
ROHM RPR-0521RS 光学接近传感器
ROHM RLD84PZJ2 红外运动传感器
NXP 2N7002BK,215 Mosfet
Toshiba T2N7002BK,LM Mosfet
NXP BZA408B,115 TVS
NXP MC33797BPEW Squib Drivers
Linear Technology LTC6820HMS#PBF Squib Drivers

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NXP will ship this year as many as five SoCs made in Samsung’s 28nm fully depleted silicon-on-insulator (FD-SOI) process, including one that has been sampling for six months. Samsung is expected to announce its FD-SOI roadmap in May and is already working on RF and in-house embedded MRAM for it. An NXP executive showed the first samples of the products at an event here, a key milestone in a long journey for FD-SOI. The next big step is finding an embedded non-volatile memory for the process, given embedded flash is expected to hit limits at 14nm. A Globalfoundries executive declined to say when it expects to ship the first commercial chip in its 22nm FD-SOI or how many tapeouts it has completed in the process. The company announced its first FD-SOI tapeout last year and said it now has 70 customer engagements. “Our FD-SOI business is small right now, but it will be mainstream,” said Ryan Lee, a vice president of foundry marketing for Samsung. One chip designer at the event said his company has been interested in FD-SOI for a long time. It made a test chip at STMicroelectronics but chose to work on commercial designs with Samsung because Globalfoundries was not ready until Sanjay Jha became the foundry’s CEO, after the fabless company made its decision. NXP's Geoff Lees shows samples of his FD-SOI i.MX chips. (Image: EE Times) NXP described four 64-bit ARMv8 and one 32-bit ARMv7 embedded SoCs under its i.MX brand, three now in production in Samsung’s FD-SOI process. Over the next two years, the family will cover a performance range that scales by a factor of 25, five times more than its planar-based i.MX chips, each design optimized for different performance and power characteristics. “I don’t think that would be possible without 28nm FD-SOI,” said Geoff Lees, general manager of NXP’s microcontroller group. A high-end automotive SoC will run up to eight 1080-progressive displays and run without a fan. “It’s operating in conditions that would kill a cellphone,” with three orders of magnitude better reliability, Lees said. An i.MX 7ULP announced in March includes independent application and real-time domains. It targets a wide range of markets from home automation to wearables. Long term, Lees said FD-SOI promises better ADCs and lower power radios. For example, he expects single-antenna 802.11n Wi-Fi on the power budget of Zigbee and other 802.15.4 protocols and an ability to take “Bluetooth Low Energy to new record power levels, opening up new apps at new cost points.”
2017-04-13 00:00 reading:877
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