NXP汽车后视摄像头解决方案

Release time:2017-06-13
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source:ameya360
reading:188


倒车后视摄像头定义:倒车后视摄像头就是一种将摄像头安装在车尾使用的汽车摄像头。与车内安装的显示屏共同组合成一套完整的倒车影像系统,倒车时可以看到车后实时视频的图像。

今天给大家介绍的后视摄像头系统可以帮助驾驶员发现车后的物体或人员,以便在确保安全的情况下倒车并顺利停车入位。高级系统中部署1万像素的高动态范围(HDR)摄像头,并通过非屏蔽双绞线实现高性价比的高速以太网连接和视频压缩。其他系统要求包括适当的物理层接口和电源。

多款恩智浦MCU可帮助你建立后视摄像头系统设计。


目标应用

· 带有紧急刹车的倒车保护

· 盲点侦测

· 十字路口管理

· 行人侦测

· 环视泊车辅助系统

Manufacturer Model Description
Renesas Electronics America R7S721000VCFP#AA0 MCU
ST STM32F030R8T6 MCU
NXP LPC11U37FBD64/501, MCU
Cypress Semiconductor CY8C4127AZI-M485 MCU
4D Systems Pty Ltd  UCAM-II CMOS Image
ON Semiconductor NOIL1SM0300A-QDC CMOS Image
OmniVision Technologies OV07740-A32A CMOS Image
TI TPS659122YFFT PMIC
NXP MC32PF3000A0EP PMIC
Maxim Integrated MAX17480GTL+ PMIC
Active-Semi ACT8865QI305-T PMIC
Micrel KSZ8852HLEYA Ethernet Interface
Micrel KSZ8852HLEWA Ethernet Interface


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NXP will ship this year as many as five SoCs made in Samsung’s 28nm fully depleted silicon-on-insulator (FD-SOI) process, including one that has been sampling for six months. Samsung is expected to announce its FD-SOI roadmap in May and is already working on RF and in-house embedded MRAM for it. An NXP executive showed the first samples of the products at an event here, a key milestone in a long journey for FD-SOI. The next big step is finding an embedded non-volatile memory for the process, given embedded flash is expected to hit limits at 14nm. A Globalfoundries executive declined to say when it expects to ship the first commercial chip in its 22nm FD-SOI or how many tapeouts it has completed in the process. The company announced its first FD-SOI tapeout last year and said it now has 70 customer engagements. “Our FD-SOI business is small right now, but it will be mainstream,” said Ryan Lee, a vice president of foundry marketing for Samsung. One chip designer at the event said his company has been interested in FD-SOI for a long time. It made a test chip at STMicroelectronics but chose to work on commercial designs with Samsung because Globalfoundries was not ready until Sanjay Jha became the foundry’s CEO, after the fabless company made its decision. NXP's Geoff Lees shows samples of his FD-SOI i.MX chips. (Image: EE Times) NXP described four 64-bit ARMv8 and one 32-bit ARMv7 embedded SoCs under its i.MX brand, three now in production in Samsung’s FD-SOI process. Over the next two years, the family will cover a performance range that scales by a factor of 25, five times more than its planar-based i.MX chips, each design optimized for different performance and power characteristics. “I don’t think that would be possible without 28nm FD-SOI,” said Geoff Lees, general manager of NXP’s microcontroller group. A high-end automotive SoC will run up to eight 1080-progressive displays and run without a fan. “It’s operating in conditions that would kill a cellphone,” with three orders of magnitude better reliability, Lees said. An i.MX 7ULP announced in March includes independent application and real-time domains. It targets a wide range of markets from home automation to wearables. Long term, Lees said FD-SOI promises better ADCs and lower power radios. For example, he expects single-antenna 802.11n Wi-Fi on the power budget of Zigbee and other 802.15.4 protocols and an ability to take “Bluetooth Low Energy to new record power levels, opening up new apps at new cost points.”
2017-04-13 00:00 reading:913
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