NXP芯片停止供货苹果lighting插头,MFi工厂没料下锅

Release time:2017-07-04
author:Ameya360
source:网络整理
reading:192

  城门失火,殃及池鱼。苹果与高通专利战白热化,NXP也加入战团,正陆续终止供应MFi数据线使用芯片,深圳相关配件厂面临无法出货、辅料积压的风险。

  不少中国深圳代工厂商透露,由于恩智浦陆续终止供应MFi使用芯片,预期到今年底之前将面临断货情况,或许因此影响下半年预计推出的iPhone新机,以及越来越多藉由MFi认证打造的凭过周边产品,其中包含对应HomeKit标准设计的连网设备。

  由于包含Ligihtning连接线内部均采用MFi设计,因此同样使用恩智浦所提供芯片,若恩智浦确定不再向苹果配件代工厂、周边配件厂商提供此关键组件,势必将从配件可能面临难产造成苹果面临压力。

  制作一根标准的MFi数据线有32道工序,需要45个工人的流水线来生产。每一款产品都需要支付数百美金送到苹果指定的UL Lab测试,通过后还需要寄送样品到苹果美国总部验证,待确认OK后才可以下单。而之后采购生产数据线所需的核心原材料——原装苹果头芯片——需要8-16周的漫长等待,这样的资金周转成本一般的工厂是难以承受的。此外,Lightning原装芯片单颗采购价格应该在2-3美金;进口还需要缴纳关税并选取最可靠的跨境物流公司运输;再考虑到MFi数据线对线材的超高标准,以及随之而来加工所需要的行业内顶级工艺;在不考虑研发、损耗和推广的前提下,产品成本至少在20-30人民币。

  根据充电头网报道,现在安富利回复交期是52周,所有的MFi工厂都撑不到年底;苹果如果不解决这个芯片(NXP20P3)的供应商问题估计很多MFi工厂要转型了;再加上现在iPhone8马上要上市,产能严重不足,MFi线估计要涨价了;现在都只维持老客户订单,新客户全部不接了。

  随着新一代iPhone的发布日期日益临近,苹果MFi认证lightning插头货源紧张,不少线材、背夹、优盘供应商看好iPhone8上市,开发了众多周边配件,面临无法出货、辅料积压的风险。

  对此,高通、恩智浦方面并未作任何响应。

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NXP will ship this year as many as five SoCs made in Samsung’s 28nm fully depleted silicon-on-insulator (FD-SOI) process, including one that has been sampling for six months. Samsung is expected to announce its FD-SOI roadmap in May and is already working on RF and in-house embedded MRAM for it. An NXP executive showed the first samples of the products at an event here, a key milestone in a long journey for FD-SOI. The next big step is finding an embedded non-volatile memory for the process, given embedded flash is expected to hit limits at 14nm. A Globalfoundries executive declined to say when it expects to ship the first commercial chip in its 22nm FD-SOI or how many tapeouts it has completed in the process. The company announced its first FD-SOI tapeout last year and said it now has 70 customer engagements. “Our FD-SOI business is small right now, but it will be mainstream,” said Ryan Lee, a vice president of foundry marketing for Samsung. One chip designer at the event said his company has been interested in FD-SOI for a long time. It made a test chip at STMicroelectronics but chose to work on commercial designs with Samsung because Globalfoundries was not ready until Sanjay Jha became the foundry’s CEO, after the fabless company made its decision. NXP's Geoff Lees shows samples of his FD-SOI i.MX chips. (Image: EE Times) NXP described four 64-bit ARMv8 and one 32-bit ARMv7 embedded SoCs under its i.MX brand, three now in production in Samsung’s FD-SOI process. Over the next two years, the family will cover a performance range that scales by a factor of 25, five times more than its planar-based i.MX chips, each design optimized for different performance and power characteristics. “I don’t think that would be possible without 28nm FD-SOI,” said Geoff Lees, general manager of NXP’s microcontroller group. A high-end automotive SoC will run up to eight 1080-progressive displays and run without a fan. “It’s operating in conditions that would kill a cellphone,” with three orders of magnitude better reliability, Lees said. An i.MX 7ULP announced in March includes independent application and real-time domains. It targets a wide range of markets from home automation to wearables. Long term, Lees said FD-SOI promises better ADCs and lower power radios. For example, he expects single-antenna 802.11n Wi-Fi on the power budget of Zigbee and other 802.15.4 protocols and an ability to take “Bluetooth Low Energy to new record power levels, opening up new apps at new cost points.”
2017-04-13 00:00 reading:914
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