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ROHM Develops Compact Surface-Mount Near-Infrared LEDs Featuring Industry-Leading* Radiant Intensity

　　ROHM has expanded its portfolio of surface-mount near-infrared (NIR) LEDs with new compact top-view types. They are optimized for applications such as VR/AR devices, industrial optical sensors, and human detection sensors.　　The demand for advanced sensing technologies utilizing near-infrared (NIR) has grown in recent years, particularly in VR/AR equipment and biosensing devices. These technologies are used in applications such as eye tracking, iris recognition, and blood flow/oxygen saturation measurements that require high accuracy. At the same time, miniaturization, energy efficiency, and design flexibility are becoming increasingly important. In industrial equipment, near-infrared LEDs are playing a greater role with the rise of precise printer control and automation systems. In response, ROHM is expanding customer options by developing a lineup of compact packages and wavelengths that offer greater design flexibility, while contributing to higher precision and power savings by achieving high radiant intensity.　　The new lineup consists of six models in three package configurations, including two ultra-compact (1.0mm × 0.6mm), ultra-thin (t=0.2mm) products as part of the PICOLED™ series: SML-P14RW and SML-P14R3W. In addition, there are four variants in the industry-standard (1.6mm × 0.8mm) size, featuring a narrow beam circular lens package (CSL0902RT, CSL0902R3T) and flat lens design that emits light over a wide range (CSL1002RT, CSL1002R3T). Each package is available in two wavelengths, 850nm (860nm for the SML-P14RW) and 940nm, allowing customers various options for their specific application needs. The 850nm wavelength is ideal for phototransistors and camera sensors, making it suitable for high-sensitivity applications such as eye tracking and object detection in VR/AR. At the same time, the 940nm wavelength is less affected by sunlight and does not appear red when emitting light, making it suitable for motion sensors. It is also widely used in biosensing applications such as pulse oximeters to measure blood flow and oxygen saturation (SpO2).　　The light source incorporates an NIR element with an optimized emission layer structure utilizing proprietary technology developed through in-house manufacturing expertise. This has made it possible to achieve industry-leading* radiant intensity in a compact package, which was previously considered difficult. For example, compared to a standard 1006 size product, the SML-P14RW delivers approx. 1.4 times the radiant intensity at the same current. In other words, the SML-P14RW consumes 30% less power to achieve the same radiation intensity. This technology improves sensing accuracy and power savings for the entire system.　　Going forward, ROHM will continue to provide innovative light source solutions that support next-generation sensing technologies, creating new value in the VR/AR and industrial equipment markets, while contributing to the realization of a sustainable society.　　Compact NIR LED Lineup　　*1:Ta=25°C *2:IF=30mA *3:IF=20mA　　ROHM also offers NIR-sensitive phototransistors.　　Application Examples　　• VR/AR licenses (eye tracking, gesture recognition)　　• Pulse oximeters (blood flow/oxygen saturation measurement)　　• Industrial optical sensors (object passage detection, position detection), self-checkout systems (bill/card detection), mobile printers (paper detection)　　• Home appliance remote controls (IR data communication), robot vacuum cleaners (floor detection)　　Terminology　　VR/AR (Virtual Reality/Augmented Reality)　　Virtual reality immerses users in a completely digital environment through small high-resolution monitors or screens within an enclosed space. Augmented reality enhances the real world by overlaying digital content onto a headset or smart glasses, enabling users to interact with 3D images. Collectively, these technologies are sometimes referred to as XR (Cross Reality or Extended Reality).　　Near-Infrared (NIR)　　Refers to light in the wavelength range of 780nm to 1000nm. Primarily used in sensors, communication and measurement applications, it is suitable for high accuracy distance measurement and recognition.　　PICOLED™ Series　　ROHM's ultra-small, ultra-thin chip LEDs designed for compact mobile devices and wearables, developed using a proprietary element manufacturing process.　　Radiant Intensity　　An index representing the strength of energy emitted by a light-emitting device in a specific direction (unit: W/sr). This is an important factor that affects the LED’s output intensity and detection performance on the receiving side.　　Note: DigiKey™, Mouser™ and Farnell™ are trademarks or registered trademarks of their respective companies.　　*PICOLED™ is a trademark or registered trademark of ROHM Co., Ltd.

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ROHM

Release time：2025-05-26 14:54 reading：220 Continue reading>>

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Renesas Extends RZ/A MPU Line-up with RZ/A3M for Cost-Sensitive, Advanced HMI Solutions

　　Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today introduced a new high-performance microprocessor (MPU) in the RTOS-based RZ/A series that meets the growing demands of advanced human-machine interface (HMI) systems. The new RZ/A3M MPU comes with large SDRAM, SRAM and RTOS support to facilitate the seamless execution of complex tasks and real-time graphical displays. The RZ/A3M drives video and camera output on large LCD panels with resolutions up to 1280x800, addressing the display requirements in next-generation home appliances, industrial and office automation, healthcare devices and building control systems.　　Similar to its existing RZ/A3UL, the RZ/A3M features a 64-bit Arm® Cortex®-A55 core with a maximum operating frequency of 1 GHz and 128 KB (kilobytes) of on-chip SRAM. By integrating high-speed 128MB DDR3L-SDRAM in a single System-in-Package (SiP), the device eliminates the complex task of designing a high-speed signal interface for connecting external memory.　　Reducing System Cost with Built-in Memory and Simplified PCB Design　　The RZ/A3M is designed to reduce system costs and accelerate development. It supports both external NAND and NOR flash via QSPI for data and code storage. Paired with a driver, high-capacity NAND flash offers a cost-effective option for memory expansion. Additionally, the RZ/A3M's BGA package has a unique pin layout with two main rows positioned on the outside edge. This layout simplifies PCB routing and enables a low-cost, dual-layer printed wiring board design, providing significant cost and time savings. This memory integration simplifies PCB design by reducing the routing complexity and minimizing layout constraints.　　“I’m pleased to launch the RZ/A3M, the first RZ product with large built-in memory targeting high-function video/animation HMI performance while keeping overall system costs low,” said Daryl Khoo, Vice President of the Embedded Processing Marketing Division at Renesas. “In addition, we aim to deliver a highly responsive user experience with high-quality, real-time graphics, and provide the ease of design and cost efficiency to help our customers build advanced HMI solutions quickly.”　　Comprehensive Development Environment　　Renesas offers a comprehensive HMI development environment that includes the Flexible Software Package (FSP), evaluation kits, development tools, and sample software. Graphical user interface (GUI) solutions from partner companies such as LVGL, Crank, SquareLine Studio, and Envox will be available for the RZ/A3M to facilitate rapid HMI graphics development.　　Key Features of RZ/A3M　　Arm Cortex-A55 CPU with a maximum operating frequency of 1GHz　　128KB SRAM with error correction, Built-in 128MB DDR3L SDRAM　　Graphics capabilities: LCD controller supporting resolutions up to 1280x800 (WXGA), parallel RGB and MIPI-DSI (4-lane) interfaces, 2D graphics drawing engine　　Peripheral functions: QSPI interface for serial NOR/NAND flash memory, SPI, I2C, SDHI, USB2.0, I2S, temperature sensor, timer　　Package: 244-pin LFBGA, 17mm x 17mm, 0.8mm pitch　　Renesas’ Comprehensive HMI Solutions　　Renesas offers a wide variety of HMI solutions ranging from the 32-bit RX and RA MCU families to the 64-bit RZ family supporting 4K displays. The RZ/A series, built on RTOS-based MPUs with fast startup, includes the new RZ/A3M, which delivers high-performance HMI capabilities with the same ease of use offered by MCUs using large memory capacity.　　Multi-HMI Winning Combination　　Renesas offers Multi-HMI Solution which combines the new RZ/A3M MPU with numerous compatible devices from its portfolio to offer HMI functions for appliances. These Winning Combinations are technically vetted system architectures from mutually compatible devices that work together seamlessly to bring an optimized, low-risk design for faster time to market. Renesas offers more than 400 Winning Combinations with a wide range of products from the Renesas portfolio to enable customers to speed up the design process and bring their products to market more quickly. They can be found at renesas.com/win.

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Renesas

Release time：2025-05-26 14:49 reading：217 Continue reading>>

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GigaDevice Launches New EtherCAT® SubDevice Controller Chip An Excellent Choice for Industrial Automation

　　GigaDevice (Stock Code: 603986), a leading semiconductor supplier, announced today the official launch of its EtherCAT® SubDevice Controller chip.　　GigaDevice has received official authorization from Beckhoff and launched its first EtherCAT® SubDevice Controller, GDSCN832, along with the ultra-high performance industrial automation MCU series GD32H75E, which incorporates the EtherCAT® SubDevice Controller. These new products are tailored to meet the demands of the industrial automation market, providing optimal solutions for applications such as servo control, variable frequency drives, industrial PLCs, and communication modules, thanks to their exceptional processing power and extensive interface resources. Samples and development boards are now available, with mass production scheduled for 2nd quarter of 2025.　　GigaDevice EtherCAT® SubDevice Controller Chip　　EtherCAT® SubDevice Controller: Achieving Ultra-Fast Response Time　　The GDSCN832 series is a 2/3-port EtherCAT® SubDevice Controller integrating two internal PHYs and one MII extension interface. It has a dual-channel integrated Ethernet physical layer device, with each channel offering a full-duplex 100BASE-TX transceiver supporting 100 Mbps operation. This series supports eight Fieldbus Memory Management Units (FMMU), enhancing data processing performance and security while effectively reducing memory access latency to improve system response time and real-time performance, providing users with high flexibility in data mapping. Additionally, it supports eight Sync Manager entities for efficient memory management.　　The GDSCN832 series includes up to 8 KB of Dual-Port RAM (DPRAM), facilitating large data processing capabilities for complex control systems. It incorporates a 64-bit distributed clock with a host bus interface that achieves equivalent functionality through high-speed synchronous/asynchronous device interfaces, with a precision below 1 µs. This product series supports 8/16-bit serial/parallel port communication, SPI/QSPI/OSPI device interfaces with communication speeds up to 100 MHz, and EXMC synchronous mode. Its diverse interface options provide users with greater flexibility in interface configuration. An integrated 1.1V core regulator supports operation with a single 3.3V power supply and allows for variable voltage I/O from 1.8V to 3.3V. The GDSCN832 supports HP Auto-MDIX, enabling direct or crossover LAN cable connections. Four low-power modes are available to balance energy efficiency and power consumption.　　With its high integration, flexibility, and stability, the GDSCN832 is ideal for applications such as motor motion control, data acquisition, industrial automation, communication modules, and sensors. The series comes in a compact QFN64 package, along with a development and evaluation board, providing a cost-effective EtherCAT® SubDevice Controller device solution for developers.　　GD32H75E Series EtherCAT® Industrial Automation MCUs: Combining Superior Control and Efficient Communication Capabilities　　GigaDevice has launched the GD32H75E series, its first high-performance MCU product authorized by Beckhoff to integrate the EtherCAT® SubDevice Controller. Combining the GDSCN832 series chip with a high-performance MCU, this product offers a seamless solution for diverse industrial automation applications, including servo motor control, variable frequency drives, industrial PLCs, and communication modules.　　Building on the exceptional features of the GD32H7 series, the GD32H75E series uses an Arm® Cortex®-M7 high-performance core with a frequency of up to 600 MHz. It includes an advanced DSP hardware accelerator, a double-precision floating-point unit (FPU), a hardware trigonometric accelerator (TMU), and a filter algorithm accelerator (FAC). The series offers on-chip Flash memory ranging from 1024 KB to 3840 KB and 1024 KB of SRAM, with 512 KB configurable tightly coupled memory (ITCM, DTCM) for zero-wait execution of critical instructions and data. All Flash and SRAM regions support ECC verification, enhancing system reliability. Additionally, it features a 64 KB L1-Cache (I-Cache, D-Cache) to further improve CPU efficiency and real-time performance.　　The GD32H75E provides a wealth of peripheral resources, including 8 USARTs, 4 I2Cs, 6 SPIs, 4 I2S, and an 8-line OSPI (backward compatible with 4-line QSPI). It supports 2 USB 2.0 OTG interfaces with Full Speed and High Speed modes and includes 3 CAN-FD controllers. The series also features four 32-bit general-purpose timers, twelve 16-bit general-purpose timers, four 64-bit/32-bit basic timers, and two advanced PWM timers. Two 14-bit ADCs provide sampling rates up to 4 MSPS, with one 12-bit ADC reaching 5.3 MSPS, along with a fast comparator (COMP) and DAC for high-precision analog functions. A high-performance digital filter module (HPDF) for external Σ-Δ modulators and an encoder divide output controller (EDOUT) are also integrated, making it ideal for high-precision motion control systems.

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GigaDevice

Release time：2025-05-21 16:53 reading：274 Continue reading>>

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GigaDevice launches the GD32G5 series high-performance MCUs with Cortex®-M33 core, unleashing innovation potential in industrial applications

　　GigaDevice (Stock Code: 603986), a leading semiconductor supplier, today officially announced the launch of the GD32G5 series high-performance microcontrollers, based on the Arm® Cortex®-M33 core.　　The GD32G5 series MCUs, featuring exceptional processing performance, a wide range of digital and analog interface resources, and enhanced security capabilities, can be widely applied across diverse scenarios such as digital power systems, charging stations, energy storage inverters, frequency converters, servo motors, and optical communication. This new product lineup offers 14 models across 7 package types, including LQFP, QFN, and WLCSP. 　　Powerful Performance Empowering the Industrial Market　　The GD32G5 series MCUs are powered by the high-performance Arm® Cortex®-M33 core, with a clock frequency of up to 216 MHz. These MCUs feature an advanced DSP hardware accelerator and a single-precision floating-point unit (FPU). They also integrate a hardware trigonometric function accelerator (TMU), supporting 10 types of function calculations, along with various other hardware acceleration units, including filter algorithms (FAC) and Fast Fourier Transform (FFT), which significantly enhance processing efficiency. At maximum frequency, the GD32G5 series MCUs deliver performance of up to 316 DMIPS, achieving an impressive CoreMark® score of 694.　　The GD32G5 series MCUs are equipped with 256KB to 512KB of embedded Flash memory, supporting the dual-bank Flash feature, and 128KB of SRAM, which includes 32KB Tightly Coupled Memory RAM (TCMRAM) for zero-wait execution of critical instructions and data. Additionally, they feature high-speed cache memory, with up to 2KB I-Cache and 512B D-Cache, further boosting core processing performance.　　Extensive Peripherals Enable Development Innovation　　The GD32G5 series MCUs integrate a comprehensive range of peripheral resources. They support four 12-bit ADCs with a sampling rate of up to 5.3 MSPS and up to 42 channels, as well as four 12-bit DACs, two of which offer sampling rates as high as 15 MSPS. Additionally, the series includes eight high-speed comparators (COMPs) and a suite of high-precision analog peripherals designed to meet the demands of motor and power control applications. The GD32G5 series also features a 16-channel high-precision timer (HRTimer) with accuracy reaching 145 ps, along with three advanced 8-channel timers, two 32-bit general-purpose timers, five 16-bit general-purpose timers, two 16-bit basic timers, and one low-power timer.　　In terms of communication interfaces, the GD32G5 series offers five U(S)ARTs, four I2Cs, three SPIs, and one QSPI supporting up to 200 MHz DDR/SDR interfaces. The MCUs are equipped with three CAN-FD modules, ideal for high-speed communication applications. Additionally, they integrate one HPDF (high-performance digital filter) supporting 8 channels and 4 filters, with external Σ-Δ modulator support. The series also includes four configurable logic modules (CLAs) and the Trigsel module, which allows flexible configuration of trigger sources. Designed to operate in a wide temperature range from -40°C to 105°C, the GD32G5 series is well-suited for demanding applications such as optical modules, industrial power supplies, and high-speed motor control, where stringent temperature requirements must be met.

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GigaDevice

Release time：2025-05-21 16:47 reading：260 Continue reading>>

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EMC components: TDK offers multilayer chip beads with the industry's highest rated current of 8 A for power supply lines

　　TDK Corporation (TSE: 6762) has expanded its MPZ1608-PH series of large-current multilayer chip beads for automotive and commercial power supply lines (1.6 x 0.8 x 0.6 mm – L x W x H). Mass production of the product series began in May 2025.　　These 1608-size chip beads for power supply lines achieve a rated current of 8 A, the industry’s highest value*. Chip beads are used as noise suppression components in power and signal circuits. In a circuit with a current of 8 A or more, usually two or more chip beads must be used in parallel. This has the disadvantage that the current is not evenly distributed between the ferrite beads. TDK’s new product simplifies the circuit structure because fewer components are required compared to conventional methods, and it improves the quality of power circuits.　　The MPZ1608-PH series of products halves the component footprint in comparison with circuits using two conventional 1608-sized chip beads. Moreover, the highly reliable components with a specified operating temperature of up to +125 °C are designed to be used in high-temperature environments like automotive and industrial equipment applications.　　With TDK’s proprietary materials and structural designs adapted to market needs, the company is committed to expanding its lineup of high rated current products in the automotive, industrial equipment, and consumer equipment areas. These chip beads will serve as EMC components contributing to the enhancement of the quality of power circuits.　　Glossary　　EMC: electromagnetic compatibility　　Main applications　　Power circuit for different pieces of equipment: in-vehicle ECUs, power train, vehicle body control, automotive multimedia (telematics), base stations, PCs, servers, set-top box, smart grids, robots, smartphones, tablet devices, etc.　　Main features and benefits　　Compatible with large currents as high as 8 A　　Reduces components and footprint　　Highly reliable; can be used in high-temperature environments like automotive applications　　Key data

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TDK

Release time：2025-05-16 13:45 reading：263 Continue reading>>

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BIWIN Domestically-Produced eMMC for the Power Industry is Officially Launched

　　In response to the high-standard requirements of data storage for the sake of intelligence development in the electric power industry, BIWIN Spec has officially launched 100% domestically-produced power-specific eMMC, which achieves self-sufficiency from IC design and controller R&D to wafer fabrication, capable of providing secure, reliable and strong storage foundation for the power industry.　　True Industrial-Grade Design, Enhanced Stability and Reliability　　BIWIN’s power-specific eMMC supports wide-temperature operations from -40℃ to 105℃ (Max), excelling in various extreme conditions. In line with the industrial-grade hardware design standards and equipped with reinforced electromagnetic interference (EMI) resistance, the product has been validated by over 1,000 industrial specialized tests, able to offer beyond 10 years of stable operations.　　Self-Developed Controller and Firmware Algorithm, Exceptional Workload Capability　　　BIWIN power-specific eMMC, featured with a self-developed controller, is characterized by efficiently optimized design particularly in power consumption, performance and reliability, offering reduced data transfer latency and also more efficient and stable storage experience. The built-in specialized software algorithms tailored to power industry secure operational continuity, including technical properties such as FFU OTA with zero downtime, power loss protection, S.M.A.R.T., and operational log access. The product also supports pSLC mode, granting extended lifespan with over 30,000 P/E cycles; meanwhile, the inbuilt advanced resource scheduling algorithms—including garbage collection (GC), Trim, and wear leveling for both dynamic and static writes—further maximize product lifespan and performance stability.　　Superior Integrated Performance, Compatible with Diversified Power Equipment　　　Engineered in full compliance with power industry standards, BIWIN's eMMC covers the complete development cycle—from product definition and software/hardware algorithm to testing and manufacturing. With capacities ranging from 16GB-128GB and read/write speeds up to 330MB/s and 220MB/s respectively, this eMMC is qualified for the demand of “high frequency in small data streams”in power industry, ideal for data collectors, protection devices, concentrators, and integrated terminals.　　Beyond the newly-launched power-specific eMMC, BIWIN has leveraged its technical edges in “Integrated Solution and Manufacturing”(ISM) to establish the all-scenario solutions for the power industry, consisting of industrial-grade SODIMM/UDIMM, SATA/PCIe SSD, storage cards, LPDDR4X, and Nor Flash in multiple form factors and dimensions, supporting the full spectrum of digital-intelligent operations in modern power systems.

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BIWIN

Release time：2025-05-14 14:26 reading：289 Continue reading>>

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Renesas Partners with Indian Government to Drive Innovation Through Startups and Industry-Academia Collaboration, Strengthening India’s Semiconductor Ecosystem

　　Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today announced its partnership with the Ministry of Electronics & Information Technology (MeitY), Government of India, to support local startups and academic institutions in the field of VLSI and embedded semiconductor systems. Renesas also celebrated the expansion of its offices in Bengaluru and Noida to accommodateits growing R&D teams, with the inauguration ceremonies held today. This strategic move underscores Renesas’ commitment to innovation and excellence in India and aims to drive continued growth in the region.　　Renesas and the Centre for Development of Advanced Computing (C-DAC), an autonomous scientific society of MeitY, today signed and exchanged two Memoranda of Understanding (MOUs) under the MeitY Chips to Startup (C2S) programme (Note). These MOUs focus on 1) Supporting local startups by enabling them to drive technological advancement andpromote local manufacturing in alignment with the Make in India initiative; and 2) Enhancing industry-academia collaboration by fostering an innovative, product-focused mindset among students.　　Shri Ashwini Vaishnaw, Minister for Railways, Information & Broadcasting, and Electronics & Information Technology, Government of India; along with Malini Narayanamoorthi, India Country Manager and VP, MID Engineering, Analog & Connectivity Group at Renesas; and Rea Callendar, Head of Platform Adoption and Ecosystem Enablement at Altium, which joined forces with Renesas in August 2024, attended the celebration at the Noida office. Hidetoshi Shibata, CEO of Renesas, also joined virtually, underscoring the global significance of this milestone.　　India is a key market for Renesas, offering significant growth potential and access to a highly skilled talent pool. Renesas is committed to deepening its partnerships with local companies, startups, and universities, with the target to generate over 10 percent of itsglobal revenue from the Indian market by 2030. Recent collaborations include the OSAT factory project with CG Power and Stars Microelectronics in Gujarat and the MOU with IIT Hyderabad. Renesas is also expanding its operations in India, with plans to increase its headcount to 1,000 by the end of 2025. This growth initiative reinforces Renesas' long-term commitment to India and supports its ambition to become an employer of choice in this dynamic and fast-evolving market.　　"The inauguration of our expanded offices marks a significant milestone for Renesas in India. It reflects our unwavering commitment to innovation, excellence, and the nurturing of local talent. By building products in India, for India and the world, we continue to drive growth and deliver meaningful impact across the Indian market,” said Malini Narayanamoorthi, India Country Manager and VP, MID Engineering, Analog & Connectivity Group at Renesas. "We are proud to sign two MOUs under the MeitY C2S programme, focused on advancing research, fostering innovation, and nurturing product-focused engineers. These strategic collaborations align with the Make in India initiative, aiming to strengthen local design and manufacturing capabilities and empower homegrown talent to drive the future of industry."　　MOUs under MeitY C2S programme　　Renesas and C-DAC signed two MOUs to collaborate in the field of VLSI and embedded semiconductor systems, with the aim of supporting local startups and academic institutions to accelerate innovation and foster self-reliance in India’s semiconductor and product ecosystem. The C2S programme encompasses collaboration with over 250 academic institutions and R&D organizations across the country, including IITs, NITs, IIITs, government and private colleges, along with approximately 15 startups, creating a strong ecosystem for indigenous innovation.　　MOU for Startups: Renesas will help strengthen the product engineering capabilities of local startups by providing Renesas development boards and Altium Designer, the leading PCB design software.　　MOU for Academic Institutions: Renesas will support experiential learning by offering development boards, PCB education and training, Altium Designer software, and access to the Altium 365 cloud platform, aiming to empower the next generation of electronics engineers and nurture a community of innovators.　　Opening of new offices in Bengaluru and Noida　　In May, Renesas consolidated and relocated its existing offices in Bengaluru and Noida into new, state-of-the-art office spaces, marking a significant milestone in the company’s growth and expansion in India.　　The new Bengaluru office is Renesas’ largest site in India, encompassing world-class design teams, test labs, and comprehensive facilities to support employees. It brings together approximately 500 team members, including R&D engineers, business teams, and employees from the recently acquired Altium and Part Analytics, creating a unified and collaborative workspace. The facility is designed to leverage India’s rich talent ecosystem to drive the development of innovative products.　　The new Noida office brings the engineering and business teams together to accelerate the delivery of world-class high-performance compute solutions, driving automotive market growth through innovation, collaboration, and consistent execution. This strategic expansion reinforces Renesas’ commitment to investing in top-tier local talent and strengthening its capabilities in R-Car system-on-chip (SoC) solutions. Designed to integrate cutting-edge tools and workflows, the new Noida site will further enhance synergy across the global engineering team and support Renesas’ long-term strategy in this critical domain.　　(Note) Chips to Startup (C2S) programme: An initiative launched by the Indian government in December 2021 to boost semiconductor and display manufacturing in the country. C2S not only aims at developing specialized manpower in VLSI/Embedded System Design domain but also addresses each entity of the electronics value chain via specialized manpower training, creation of reusable IP repository, design of application-oriented Systems/ASICs/FPGAs, and deployment by academia/ R&D organization by way of leveraging the expertise available at Startups/MSMEs. For more details, please visit the C2S programme website.　　About Renesas Electronics Corporation　　Renesas Electronics Corporation (TSE: 6723) empowers a safer, smarter and more sustainable future where technology helps make our lives easier. A leading global provider of microcontrollers, Renesas combines our expertise in embedded processing, analog, power and connectivity to deliver complete semiconductor solutions. These Winning Combinations accelerate time to market for automotive, industrial, infrastructure and IoT applications, enabling billions of connected, intelligent devices that enhance the way people work and live. Learn more at renesas.com. Follow us on LinkedIn, Facebook, X, YouTube and Instagram　　(Remarks). All names of products or services mentioned in this press release are trademarks or registered trademarks of their respective owners.

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Renesas

Release time：2025-05-14 14:21 reading：294 Continue reading>>

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DENSO and ROHM Reach Basic Agreement to Establish a Strategic Partnership in the Semiconductor Field

　　DENSO CORPORATION and ROHM Co., Ltd. are pleased to announce that the two companies have reached a basic agreement to establish a strategic partnership in the semiconductor field. This agreement follows discussions and considerations that began in September 2024.　　Recently, the importance of semiconductors that support the electrification and intelligence of vehicles has been increasing significantly. This is driven by the development and spread of electric vehicles aimed at achieving carbon neutrality, as well as the realization of automated driving, which is expected to contribute to zero fatalities in traffic accidents.　　DENSO and ROHM have a long-standing collaboration in the trade and development of automotive semiconductors. Going forward, both companies will integrate DENSO's advanced system construction capabilities in the automotive sector with ROHM's cutting-edge semiconductor technology, cultivated in the consumer market. This partnership will focus on enhancing the lineup of high-quality devices, particularly analog ICs, that support vehicle electrification and intelligence, and deepening collaboration in development. Additionally, in highly compatible fields within their semiconductor businesses, both companies will discuss broad collaboration. By globally supplying products created through this co-creation, both companies aim to contribute to technological innovation in the automotive field and realize a sustainable mobility society.　　To further solidify this partnership, DENSO and ROHM will continue to consider strengthening their capital relationship.　　DENSO CORPORATION President & CEO, Shinnosuke Hayashi　　DENSO positions semiconductors as key devices to realize next-generation vehicle systems and has been deepening its cooperative relationships with semiconductor manufacturers that possess rich experience and knowledge. ROHM has a wide range of semiconductor lineups that are crucial for automotive electronics products, essential for vehicle intelligence and electrification. We are very pleased that the partnership with ROHM is progressing smoothly. By further deepening the collaboration between both companies and integrating DENSO's accumulated automotive technology and expertise, we believe we can contribute to the development of the mobility society through stable supply and enhanced product value.　　ROHM Co., Ltd. President (Representative Director), Katsumi Azuma　　We are very pleased to deepen our collaborative relationship with DENSO, a leader in technological innovation for the mobility society. This partnership not only strengthens our relationship as suppliers but also envisions broad collaboration in the semiconductor business of both companies. Initially, we will focus on the development of analog ICs related to next-generation systems such as electrification, automated driving, and connected vehicles. Furthermore, without narrowing the scope, we will integrate our respective technologies, knowledge, and assets across a wide range of fields to contribute to technological innovation and stable supply in the automotive industry.

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ROHM

Release time：2025-05-13 15:12 reading：279 Continue reading>>

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Renesas Unveils Complete Lithium-Ion Battery Management Platform with Pre-Validated Firmware

　　Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today introduced all-in-one solutions for managing lithium-ion battery packs in a wide range of battery-powered consumer products, such as e-bikes, vacuum cleaners, robotics and drones. With pre-validated firmware provided, the R-BMS F (Ready Battery Management System with Fixed Firmware) will significantly reduce the learning curve for developers, enabling rapid designs of safe, power-efficient battery management systems.　　Designed for lithium-ion batteries in both 2-4 and 3-10 cell series (S), R-BMS F solutions include Renesas’ industry-leading fuel gauge ICs (FGICs), an integrated microcontroller (MCU) and an analog battery front end, pre-programmed firmware, software, development tools and full documentation – all available in complete evaluation kits that are now ready to ship.　　Pre-programmed Firmware to Simplify Development　　Firmware is essential in battery management systems as it is used to monitor batteries’ state of charge (SoC), state of health (SoH), current, and temperature, as well as actively balancing the voltages of the individual cells, and detect faults. In some cases, however, consumer electronics developers may lack the highly specialized expertise needed to develop control algorithms that keep the batteries operating in a safe temperature region and ensure adequate battery life over many charge/discharge cycles.　　Renesas’ R-BMS F solutions include built-in, pre-tested firmware designed to work with the FGIC’s on-board MCU. The firmware includes critical pre-programmed functions to maximize battery life and ensure safe operation. These include cell balancing, current control, and voltage and temperature monitoring. For added flexibility, the battery management system lets developers set many parameters to meet specific requirements and adjust the solution for different cell chemistries via a graphical user interface (GUI), without the need for a full integrated development environment (IDE).　　“One of the biggest bottlenecks for designing advanced power management solutions is the complex task of firmware development and validation,” said Chris Allexandre, Senior Vice President and General Manager of Power at Renesas. “Not everyone has the expertise or in-house resources to write their own algorithms. Our all-in-one R-BMS F battery management system eliminates this process and provides market-ready power solutions that work without requiring specialized technical knowledge of MCU programming or advanced battery management design.”　　All-Inclusive Evaluation Kits Ready to Ship　　Both R-BMS F solutions contain a full evaluation kit, which has all the hardware, software, tools and documentation required to start developing. The underlying hardware powering the R-BMS F is Renesas’ FGIC solution, which combines an analog battery front end and an ultra-low-power RL78 MCU into a single, small package. The analog portion provides accurate measurements of cell voltage, current and temperature, as well as controlling the external MOSFETs and converting analog data to digital signals. The digital section is where synchronous functions reside, including the main CPU, clocks, timers and serial interfaces. Also included in the evaluation kits are: pre-programmed firmware stored in embedded flash memory with the flexibility to set the battery pack and cell chemistry parameters; the USB System Management Bus (SMBus) interface; GUI-based software; cables to communicate with the host system; dedicated development tools for parameter setting; and full documentation, including schematics and an engineering bill of materials (eBOM). With these resources, developers can confidently innovate intelligent power management systems that safely monitor battery usage and provide longevity, while reducing their impact on the environment. Renesas plans to include turn-key R-BMS F solutions in all future FGICs.　　2-4 Cell Series Solution (RTK0EF0163DK0002BU)　　The R-BMS F for 2 to 4S cell (~8V to 16V) solutions targets small vacuum cleaners, robotic vacuums, consumer and medical devices and runs on Renesas’ RAJ240055 Li-ion battery FGIC. Renesas offers Smart Robot Vacuum Cleaner | Renesas by combining this FGIC with other devices from its portfolio.　　3-10 Cell Series Solution (RTK0EF0136DK0002BU)　　The R-BMS F for 3 to 10S cell (~12V to 40V) solutions runs on Renesas RAJ240100 and RAJ240090 Li-ion battery FGICs, with target applications including e-bikes, e-mobility, vacuum cleaners, robotics, drones and industrial, consumer and medical systems.　　Renesas has combined these FGICs with other devices from its portfolio to offer Wall to Battery Low Power Energy Storage System and USB-PD All in One Battery and Charging Solution. These Winning Combinations are technically vetted system architectures from mutually compatible devices that work together seamlessly to bring an optimized, low-risk design for faster time to market. Renesas offers more than 400 Winning Combinations with a wide range of products from the Renesas portfolio to enable customers to speed up the design process and bring their products to market more quickly.　　Availability　　Both R-BMS F solutions are available today in production volumes.

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Renesas

Release time：2025-05-08 13:23 reading：341 Continue reading>>

Trade news

Murata Unveils High-Efficiency 1W DC-DC Converter with Reinforced Isolation and Ultra- low Capacitance

　　Murata Manufacturing has launched the NXJ1T series, a high-performance 1W DC-DC converter designed to provide reinforced isolation for communication interfaces and analog front-end (AFE) measurement circuits. With 4.2kVDC isolation (Hi Pot Test) and compliance with UL62368 safety standards, the NXJ1T series delivers exceptional electrical isolation, noise immunity, and thermal reliability for industrial, energy, and medical applications.　　As industries transition to higher voltage systems, particularly in 800V electric vehicles (EV) and supporting chargers, battery energy storage (BESS), and renewable energy infrastructure, the need for robust isolation in communication and sensing systems has become increasingly critical. Furthermore, in medical applications, where low leakage current and safety isolation are essential, reliable power solutions must also meet stringent regulatory requirements like ANSI/AAMI ES60601-1.　　Murata’s NXJ1T series addresses these challenges, offering a compact (10.55mm x 13.70mm x 4.04mm), high-performance DC-DC converter engineered for safety and durability in the most demanding environments. It features an unregulated 1W 5V input to 5V/200mA output design, ideal for embedded systems. Murata's proprietary molding technology provides the NXJ1T series with high ingress protection against dust and particulates in harsh industrial environments and extreme temperatures. During development, the DC-DC converter has successfully undergone 1,000 temperature cycles between -40°C and 125°C, demonstrating its ability to withstand the highest levels of thermal stress.　　Manufactured in the UK, the NXJ1T incorporates Murata’s proprietary block-coil transformer technology, providing high isolation, low leakage current, and exceptional performance. In contrast to many alternative solutions on the market, which utilize wireless power coils that exhibit low coupling factors, high switching frequencies (approximately 10 MHz), and low efficiencies of typically around 40-60%, Murata's block-coil transformer technology facilitates lower switching frequencies (500 kHz–2 MHz) and higher efficiencies of approximately 80%. The result is exceptional common mode transient immunity (CMTI) and significantly lower isolation capacitance, making the NXJ1T series an ideal choice for engineers requiring high-performance power isolation in electrically noisy environments.　　Each device features UL62368 recognition including reinforced insulation to 200Vrms and basic insulation to 250Vrms, providing an added layer of protection in high-voltage environments, while the under-voltage lockout (UVLO) functionality enhances operational stability, preventing erratic behavior under fluctuating power conditions. Furthermore, in medical equipment, where low leakage current is critical for patient-connected applications, the NXJ1T’s ultra-low isolation capacitance helps minimize unwanted leakage, supporting compliance with stringent safety standards like IEC 60601-1 when used within a certified system.　　With a standard industry pin out and compact surface mount device (SMD) package, the NXJ1T provides seamless system integration into applications such as CAN Bus systems in EV chargers, heavy industrial automation systems, and medical instrumentation including X-ray, laser, ultrasound, and surgical instrumentation. In these high-voltage deployments, the DC-DC converters can deliver long-term stability and safety in high-voltage applications.　　“As power system voltages continue to rise across industrial, and medical sectors, engineers require robust isolation solutions that can withstand demanding environments while maintaining efficiency,” said Ann-Marie Bayliss, Product Manager at Murata. She continued, “With its advanced transformer technology, the NXJ1T series delivers class-leading isolation, ultra-low leakage current, and high reliability, helping designers create safer and more efficient systems across a wide range of applications.”

Key word：

Murata

Release time：2025-05-07 14:48 reading：286 Continue reading>>

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