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Applications

Renesas Electronics IA Functional Safety Reference Board

　　Renesas Electronics IA Functional Safety Reference Board is a solution for ensuring the safety of systems while keeping a tab on development costs. The Renesas Electronics board is based on IEC61508 and meets the HFT=1 and SIL3 requirements. The device is ideal for applications with cost and knowledge limitations for FSoE system development. The board is optimized for BOM cost by integrating EtherCAT and FSoE in one system.　　FEATURES　　Hardware functionality　　HFT=1, SIL3 architecture　　No external network communication IC is needed　　Coexist w/EtherCAT slave communication by RX72M built-in EtherCAT slave controller (2 ports) and FSoE slave functions　　Safety input five channel　　Safety output eight channel　　Non-safety I/O four channel　　Dual MCU(RX72M+RX23T) configuration board for FSoE Slave function　　Software and documents　　Full set of Renesas’s FuSa SWs　　User manual, schematics, BOM list　　APPLICATIONS　　Safety remote I/O　　Functional safety application for HFT=1 and SIL3 criteria under IEC61508 standards　　AC drive / GP inverter　　Safety system broadly for safety PLC, safety sensors　　Target market segment　　Industrial automation (factory automation, process automation)　　Building automation

Key word：

Renesas

Release time：2023-03-28 14:57 reading：4628 Continue reading>>

Applications

Hangshun chip: the world's highest technology 40nm NOR Flash mass production HK25Q20

　　The HK25Q20 (2M-Bit) serial flash supports the standard Serial Peripheral Interface (SPI)，and supports the Dual SPI: Serial Clock, Chip Select, Serial Data I/O0 (SI), I/O1 (SO)，I/O2 。The Dual I/O & Dual output data is transferred with Maximum speed of 208Mbits/s。　　FEATURES　　SPI Flash Meories　　– Densities: 2Mbit　　– Standard SPI: SCLK, /CS, SI, SO　　– Dual SPI: SCLK, /CS, IO0, IO1　　Highest Performance Serial Flash　　– 104MHz for fast read　　– Dual I/O Data transfer up to 208Mbits/s　　– Minimum 100,000 Program/Erase Cycles　　– More than 20-year data retention　　Low Power Consumption　　– Single 2.3V to 3.6V supply　　– 0.4μA standby current　　– 0.2μA deep power down current　　– 1.5mA active read current at 33MHz　　– 3.0mA active program or erase current　　Flexible Architecture　　– Uniform 256-byte Page Erase　　– Uniform 4K-byte Sector Erase　　– Uniform 32/64K-byte Block Erase　　– Program 1 to 256 byte per programmable page　　Fast Program and Erase Speed　　– 2ms page program time　　– 15ms page erase time　　– 15ms 4K-byte sector erase time　　– 15ms 32K/64K-byte block erase time　　Advanced Security Features　　– 128-Bit Unique ID for each device　　– 1*256-Byte Security Registers with OTP Locks　　Package Information　　– SOP8　　– USON8 (3x2 mm)　　– USON8(1.5x1.5mm)　　– USON6(1.2x1.2mm)　　– TSSOP8　　– KGD

Key word：

HK25Q20,Hangshun chip

Release time：2023-02-24 10:30 reading：4746 Continue reading>>

Applications

Tiny solar panels embedded in clothes can charge a mobile phone

　　Clothing embedded with tiny solar cells the size of a flea can allow wearers to generate electricity on the move and charge items like mobile phones and smartwatches.　　Nottingham Trent University has developed a way to embed miniaturised solar cells into yarn that can then be knitted and woven into textiles.　　The technology has been tested and proven to charge a mobile phone and a Fitbit.　　The cells are encapsulated in a resin which allows the textile fabric to be washed and worn like any other form of clothing.　　Measuring only three millimetres in length and 1.5 millimetres in width, the cells are almost invisible to the naked eye and cannot be felt by the wearer.　　For all intents and purposes, garments appear exactly the same as any other form of clothing despite having the capability to generate electricity.　　Project lead Professor Tilak Dias, of the School of Art & Design, said: “By embedding miniaturised solar cells into yarn we can create clothing and fabric that generate power in a sustainable way.　　“The clothing would look and behave like any other textile, but within the fibres would be a network of miniaturised cells which are creating electricity.　　“This could do away with the need to plug items into wall sockets and reduce the demand on the grid while cutting carbon emissions.　　“The electrical power demand for smart e-textiles has always been its Achilles heel and this technology will allow people to use smart textiles while on the move.”　　Up to 200 miniaturised cells can generate 2.5-10 volts and up to 80 miliwatts in power. The university’s Advanced Textiles Research Group made a proof of concept textile of 5cm by 5cm size with 200 cells.　　This proved powerful enough to charge a mobile phone and a Fitbit (please see video). Researchers say if 2,000 solar cells were incorporated into a textile it would generate enough power to charge a smart phone.　　Researcher Achala Satharasinghe, who developed the prototype as part of his PhD at the university, said: “This is an exciting technology which could revolutionise the way we think about solar power, clothing and wearable technology.　　“With the availability of miniaturised solar cells we can generate power in a range of new ways, by utilising things like clothing, fashion accessories, textiles and more.　　“It will allow mobile devices to be charged in environmentally-friendly ways which are more convenient for consumers than ever before.”

Key word：

Power battery

Release time：2019-01-03 00:00 reading：6548 Continue reading>>

Applications

New standards provide public assurance on safety, security and etiquette for use of drones

　　The first ever worldwide standards for the drone industry are being released by the International Standards Organisation (ISO).　　After several years of global collaboration between standards institutions from across the world, the long-awaited drone standards have been developed.　　These regulations are expected to trigger rapid acceleration of growth within the drone industry as organisations throughout the world are galvanised to adopt drone technology against a new background of reassurance on safety and security. The new standards will play an essential role in guiding how drones are used safely and effectively in a framework of regulatory compliance.　　The ISO Draft International Standards for Drone Operations have been formally released today (21 November 2018) for public consultation, with drone professionals, academics, businesses and the general public being invited to submit comments by 21 Jan 2019. Final adoption of these Standards can be expected in the US, UK and worldwide next year.　　The announcement is the first important step in the standardisation of the global drone industry, encompassing applications for all environments - surface, underwater, air and space. Today’s standards are particularly significant for the general public and Government, in that they address Operational Requirements of the more recognised and prevalent aerial drones, including protocols on safety, security and overall etiquette for the use of drones, which will shape regulation and legislation going forward. They are the first in a four part series for aerial drones, with the next three addressing General Specifications, Manufacturing Quality and Unmanned Traffic Management (UTM).　　Air safety　　A prime characteristic of the ISO Standards announced today, is their focus on air safety, which is at the forefront of public attention in connection with airports and other sensitive locations. The new standards act as a new etiquette for drones which promote and reinforce compliance regarding no-fly zones, local regulation, flight log protocols, maintenance, training and flight planning documentation. Social responsibility is also at the heart of the standards, strengthening the responsible use of a technology that aims to improve and not obstruct everyday life. The effectiveness of the standards in improving air safety will be further strengthened by the rapid development of geo-fencing and of counter-drone technology, providing frontline protection against ‘rogue’ drone use.　　Privacy and data protection　　The standards are also set to address public concerns surrounding privacy and data protection, demanding that operators must have appropriate systems to handle data alongside communications and control planning when flying. The hardware and software of all related operating equipment must also be kept up to date. Significantly, the fail-safe of human intervention is required for all drone flights, including autonomous operations, ensuring that drone operators are accountable.

Key word：

Robot drone

Release time：2018-12-03 00:00 reading：3655 Continue reading>>

Applications

NUS researchers offer solution in fight against fake graphene

　　A lack of quality control in the graphene market has led to inferior products being touted as high-grade. In response, a National University of Singapore (NUS) research team has developed what it says is a reliable way to test graphene quality.　　Ever since the isolation of graphene was first achieved in 2004, there has been an explosion in graphene-related research and development, with hundreds of business opportunists producing graphene to capitalise on this rapidly expanding industry. However, a new study by researchers from the NUS has uncovered a major problem – a lack of production standards has led to many cases of poor quality graphene from suppliers. Such practices can impede the progress of research that depend fundamentally on the use of high-quality graphene.　　“It is alarming to uncover that producers are labelling black powders as graphene and selling them for top dollar, while in reality, they contain mostly cheap graphite," said Professor Antonio Castro Neto, Director of the NUS Centre for Advanced 2D Materials, who led the study.　　"There is a strong need to set up stringent standards for graphene characterisation and production to create a healthy and reliable graphene market worldwide."　　Graphene is typically produced by exfoliating graphite into a powder, submerging this into a liquid, and then separating the tiniest graphene flakes by using sound energy to vibrate the mixture. The aim of this synthesis is to produce the thinnest graphene possible. Pure graphene would be just one atomic layer thick, however the International Organization for Standardisation (ISO) states that stacks of graphene flakes up to ten layers thick can still behave like graphene.　　With this in mind, Prof Castro Neto and his team set out to develop a systematic and reliable method for establishing the quality of graphene samples from around the world. They were able to achieve this by using a wide range of analytical techniques and tested samples from many suppliers.　　Upon analysing samples from over 60 different providers from the Americas, Asia and Europe, the NUS team discovered that the majority contained less than 10 per cent of what can be considered graphene flakes. The bulk of the samples was graphite powder that was not exfoliated properly.　　“Whether producers of the counterfeit graphene are aware of the poor quality is unclear. Regardless, the lack of standards for graphene production gives rise to bad quality of the material sold in the open market. This has been stalling the development of the future applications,” elaborated Prof Castro Neto.　　Graphite powder and graphene have wildly different properties, so any research conducted under the pretext that the sample was pure graphene would give inaccurate results. In addition, just one of the samples tested in the study contained more than 40 per cent of high-quality graphene. Some samples were even contaminated with other chemicals used in the production process. These findings mean that researchers could be wasting valuable time and money performing experiments on a product that is falsely advertised, says NUS.　　“This is the first ever study to analyse statistically the world production of graphene flakes. Considering the important challenges related to health, climate, and sustainability that graphene may be able to solve, it is crucial that research is not hindered in this way,” explained Prof Castro Neto.　　With this discovery, and the development of a reliable testing procedure, graphene samples may now be held to a higher standard.　　“We hope that our results will speed up the process of standardisation of graphene within ISO as there is a huge market need for that. This will urge graphene producers worldwide to improve their methods to produce a better, properly characterised product that could help to develop real-world applications,” said Prof Castro Neto.　　In addition, NUS believes that testing graphene using a universal and standardised way has the potential to ensure easy quantitative comparisons between data produced from different laboratories and users around the world.

Key word：

graphene

Release time：2018-12-03 00:00 reading：6808 Continue reading>>

Applications

UltraSoC launches “any processor” lockstep solution for safety-critical systems

　　UltraSoC has launched the Lockstep Monitor, a hardware-based, scalable solution, that helps functional safety by checking that the cores at the heart of a critical system are operating reliably, safely and securely.　　UltraSoC’s flexible IP supports all common lockstep/redundancy architectures, including full dual-redundant lockstep, split/lock, master/checker, and voting with any number of cores or subsystems.　　The Lockstep Monitor can support any processor architecture or other subsystem, including custom logic or accelerators. Lockstep operation is needed for safety standards such as ISO26262 for automotive, IEC 61508, EN50126/8/9 and CE 402/2013.　　The Monitor consists of a set of configurable semiconductor IP (SIP) blocks that are protocol aware and can be used to cross-check outputs, bus transactions, code execution and even register states, between two or more redundant systems. It can be used with any processor architecture, including those – such as the emerging RISC-V architecture – which lack native support for lockstep configurations. In addition to traditional processor cores, it can also check other subsystems or accelerators. Because it is implemented in hardware, it responds at wire speed and imposes no execution overhead on the host system.　　Unlike more traditional approaches, the Lockstep Monitor includes flexible, run-time configurable embedded intelligence, allowing the SoC designer to tailor the monitoring and response system precisely to the application.　　Monitoring can be implemented at a variety of levels of granularity: at the subsystem level (comparing the outputs of the two processors); at the transaction level (for example comparing bus traffic); at the instruction level, using UltraSoC’s advanced instruction trace capability; and at the most fundamental hardware-level, checking processor internal states or register contents.　　By embedding intelligence in the system, UltraSoC also allows more sophisticated comparisons between the operation of the lockstep processors than can be achieved with traditional solutions.　　RISC-V is gaining increasing traction in safety-critical applications, particularly in the automotive industry. However, the RISC-V ecosystem lacks support for the functional safety and security principles – such as lockstep operation – mandated by global standards such as ISO26262 for functional safety, J3061 for cybersecurity, IEC 61508, EN50126/8/9 and CE 402/2013.　　UltraSoC’s Lockstep Monitor allows any RISC-V system, whether using open source or commercial cores, to incorporate sophisticated safety capabilities.　　Lockstep systems employ two or more processor subsystems running the same code in a redundant backup configuration. The cores may be clock-cycle synchronised, or offset by a small number of cycles, an arrangement that protects against transient errors in the surrounding system.The outputs, code execution or bus traffic from the subsystems are compared and if the results differ, an error can be signalled. Lockstep systems with two processors are typically configured in a ‘master/checker’ arrangement; those with more than two processors may use ‘voting’ or other redundancy schemes.　　More sophisticated “split/lock” processor arrangements may allow the lockstep function to be dynamically engaged and disengaged, allowing the cores to run in redundant mode or to run different code for higher performance.

Key word：

safety-critical

Release time：2018-12-03 00:00 reading：6322 Continue reading>>

Applications

STMicroelectronics launches ultra-low-power Sigfox Monarch-ready solution

　　STMicroelectronics says it is the first chip maker to develop and market a certified solution for seamless global, ultra-low-power, and long-range wireless IoT connectivity enabling the Monarch worldwide tracking and positioning service from Sigfox, a lead IoT service provider.　　ST’s solution lets users create region-independent smart objects that connect automatically to the local Sigfox network anywhere in the world, empowering inter-regional mobility, geolocation, and asset tracking without relying on more expensive GPS or GNSS positioning devices. These could include smart-baggage products that aid tracking in airports or transport hubs, or innovations for supply-chain management and air or rail transportation in the industrial asset-management market, such as smart pallets. Regional independence also allows makers of connected smart objects such as consumer or commercial IoT devices to standardise products for multiple export markets, simplifying manufacturing and logistics.　　ST is providing a complete Software Development Kit (SDK) that runs on STM32, for Sigfox Monarch networking, supported by development kits, reference designs, and tools that accelerate project completion.　　The fully certified Sigfox Monarch solution is based on ST’s S2-LP ultra-low-power, long-range, sub-1GHz radio, which is automatically tuned on the local regional Sigfox frequency band, across all relevant worldwide zones (RC1 to RC6), enabling seamless connectivity to the Global Sigfox network and geolocation services.　　For processing demanding applications, the ARM Cortex-M4 based devices are said to enable efficient data pre-processing and localised AI, reducing network traffic requirements.　　To jump-start new product development, ST’s S2-LP radio is also available for the STM32 Open Development Environment (ODE) with X-NUCLEO-S2868A1/-S2915A1 (upcoming in late Q4’18) expansion boards and X-CUBE-SFXS2LP1 Sigfox Ready software expansion pack.　　The SDK also supports a dual-radio reference solution powered by the S2-LP and BlueNRG-2 Bluetooth low energy SoC, design to offer easy in-field provisioning, maintenance and configuration of the device through a convenient smartphone app.　　The design can be enhanced with the STSAFE secure element for robust cyber-protection and with ST’s comprehensive industrial portfolio of motion and environmental MEMS sensors.

Key word：

Intelligent hardware

Release time：2018-10-31 00:00 reading：2219 Continue reading>>

Applications

Next-generation quantum communications technology under development

　　Part of the European Quantum Flagship initiative, the Fraunhofer HHI is developing a range of optical integration solutions.　　Part of the UNIQORN project, the Institute is looking to develop quantum technologies suitable for the mass market and, to that end, has developed a hybrid photonic integration platform. The PolyBoard enables the flexible and efficient combination of various optical functionalities on a single chip.　　This toolbox will be further developed in the coming years as part of the "Quantum Flagship" of the European Union to meet the specific requirements of quantum technologies.　　The project UNIQORN (Affordable Quantum Communication for Everyone: Revolutionizing the Quantum Ecosystem from Fabrication to Application) has set itself the goal of miniaturising quantum technologies using photonic integration and making them available to users as system-on-chip solutions.　　The project will develop the key components for the quantum communications systems of the future and an important focus of the research is on integrated system-on-chip solutions. They are the basis for highly miniaturised optical systems that can fully exploit quantum mechanical properties such as entanglement and squeezed light.　　The core of this integration is the micro-optical bench technology of the PolyBoard platform, which makes it possible to combine large, millimeter size, optical components such as crystals for generating entangled photons with typically sub-millimeter sized integrated optical components and functionalities on a PolyBoard chip.　　It is based on the generation of free-space optical areas inside photonic integrated chips with the help of specially adapted lenses.　　As a result, known material systems for quantum technology can be combined directly with photonic integrated circuits, without having to compromise on the performance of the micro-optical components.　　So far, this technology facilitated the development of miniaturized optical components for telecom and datacom applications as well as micro-optical chips for analytics and sensor technology.　　In the UNIQORN consortium, which is coordinated by the AIT (Austrian Institute of Technology), 17 partners from all over Europe are working on a multidisciplinary research agenda. Research institutes (AIT, Fraunhofer HHI, Interuniversity Microelectronics Center) with many years of experience in the transfer of academic basic research into industrial applications will work with quantum researchers with theoretical and experimental know how (University of Vienna, University of Paderborn, University of Innsbruck, Technical University of Denmark).　　The project can also draw on photonics and electronics as well as integration and packaging expertise (Eindhoven University of Technology, Micro-Photon Devices, Politecnico Milano, Smart Photonics, Institute of Computer and Communication Systems of Athens, VPI Photonics, Cordon Electronics).　　The perspective of the industrial end users is being introduced by the system provider Mellanox and the operator Cosmote. Field evaluation will be conducted in a Smart City test environment operated by the University of Bristol.

Key word：

Communications technology

Release time：2018-09-18 00:00 reading：2151 Continue reading>>

Applications

'Smart' material enables novel applications in autonomous driving and robotics

　　Liquid crystal shells have several properties that could be utilised within the autonomous and robotics markets, claim scientists from the University of Luxembourg.　　The team discovered that as these shells reflect light highly selectively, they can be arranged into patterns that are readable for machines, akin to a QR code, adding coded information to objects.　　"These patterns could be used to guide autonomous vehicles or to instruct robots when handling workpieces in a factory. This could become important especially in indoors applications where GPS devices don't work," Professor Jan Lagerwall of the University of Luxembourg explains.　　According to the scientists, the shells can be manufactured to reflect only certain wavelengths of light, such as infrared, that would be invisible to the human eye. As the liquid crystal shells reflect light "omnidirectionally" meaning that beholders see the same pattern regardless of their position and viewing angle, the patterns can even be read by moving objects.　　Additionally, the team say th shells can be manufactured in a way that they change their structure when they are exposed to certain external impacts, such as pressure, heat or specific chemicals.　　The belief is that, together with computers to interpret these changes, the shells could be used as sensors. For example, implemented as pressure sensors in the fingertips of robots, enabling tactile feeling – a current challenge in robotics engineering.　　Another application could be fire exit signage on walls inside buildings that only becomes visible when the temperature exceeds a certain threshold. The big advantage of these sensors, according to the team, is that they passively react to external impacts and don't need electricity and batteries.　　The team also believe that liquid crystal shells could be used to prevent counterfeiting. The micropatterns that emerge when the shells are brought together are said to be “unique and impossible to copy.” These unclonable patterns could be used to create uncopiable identifiers that can be attached to valuable objects. In combination with cryptographic tools they could be used to create a system that ensures that a buyer or user has the original and not a counterfeited product.　　Prof. Lagerwall makes clear that the ideas require further research, but the hope is that the article can "stimulate future research”.

Key word：

autonomous driving,robotics

Release time：2018-06-22 00:00 reading：1722 Continue reading>>

Applications

Cadence unveils first analogue IC design-for-reliability solution

　　Cadence Design Systems has introduced the Legato Reliability Solution, the industry’s first software product that looks to address the challenges associated with designing high-reliability analogue and mixed-signal integrated circuits (ICs).　　Whether for automotive, medical, industrial, and aerospace and defence applications, the Legato Reliability Solution is able to provide analogue designers with a range of new tools to better manage their design’s reliability throughout the entire lifecycle, from initial test through active life through aging.　　Based on Cadence’s Spectre Accelerated Parallel Simulator and the Virtuoso custom IC design platform, Legato integrates capabilities into an intuitive cockpit to address the reliability concerns of the three phases of the product lifecycle, these include:　　Analogue defect analysis accelerates analogue defect simulation by up to 100X, reducing test cost and eliminating test escapes, the main source of early failure in IC designs.　　Cadence has introduced a simulation engine to enable a new test methodology for analogue ICs. Called defect-oriented testing, it expands the capabilities of test far beyond what is traditionally achieved by just performing functional and parametric tests.　　Defect-oriented testing allows designers to evaluate the ability to eliminate die with manufacturing defects and resulting test escapes that cause field failures. It can also be used to optimise wafer test, reducing the number of tests required to achieve the target defect coverage by eliminating over-testing and potentially reducing the number of tests up to 30 percent.　　Customer experience with the tool indicates that it accelerates defect simulation by more than 100X.　　Electro-thermal analysis avoids premature failures due to thermal overstress during the product’s useful life.　　Cadence has introduced a dynamic electro-thermal simulation engine. For automotive designers, for example, actual usage results in significant temperature rise during normal operation due to on-chip losses and power dissipated in the switches. In addition, these components need to operate in hostile environments under the hood of an automobile.　　The combination of high-power dissipation in a high-temperature environment can result in thermal overstress that can result in failure during normal operation. Dynamic electro-thermal simulation will allow designers to simulate the on-chip temperature rise and validate the operation of over temperature protection circuits.　　Advanced aging analysis enables accurate prediction of product wear-out by analyzing aging acceleration due to temperature and process variation.　　With existing technologies, like RelXpert and AgeMOS, to analyse the device degradation due to electrical stress, Cadence has sought to enhance aging analysis and Legato will now include the effects that accelerate device wear-out including temperature and process variation.　　Legato will also provide a new aging model for device degradation in advanced nodes with FinFET transistors.　　“Designing the chips to meet requirements across the entire product lifecycle has become a huge challenge,” said Tom Beckley, Cadence senior vice president and general manager, custom IC and PCB Group. “Designers are faced with the challenge of designing across the entire lifecycle, including eliminating the test escapes that become field failures early in the life cycle, preventing thermal overstress from operating in extreme conditions like under the hood of a car, and designing for 15 years or more of operating lifetime. Our new Legato Reliability solution enables designers to answer these critical questions much earlier in the design process.”

Key word：

IC design

Release time：2018-05-11 00:00 reading：1352 Continue reading>>

model	brand	Quote
RB751G-40T2R	ROHM Semiconductor
CDZVT2R20B	ROHM Semiconductor
TL431ACLPR	Texas Instruments
MC33074DR2G	onsemi
BD71847AMWV-E2	ROHM Semiconductor

model	brand	To snap up
STM32F429IGT6	STMicroelectronics
BU33JA2MNVX-CTL	ROHM Semiconductor
IPZ40N04S5L4R8ATMA1	Infineon Technologies
TPS63050YFFR	Texas Instruments
BP3621	ROHM Semiconductor
ESR03EZPJ151	ROHM Semiconductor

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