CG Power and Industrial Solutions Limited, Renesas and Stars Microelectronics, to Jointly Build Outsourced Semiconductor Assembly and Test Facility in India

发布时间：2024-03-05 13:10
作者：AMEYA360
来源：Renesas
阅读量：1435

　　CG Power and Industrial Solutions Limited (“CG”), a part of Tube Investments of India Limited and the Murugappa Group; Renesas Electronics Corporation, a premier supplier of advanced semiconductor solutions; and Stars Microelectronics (Thailand) Public Co. Ltd (“Stars Microelectronics”), a Thailand-based Outsourced Semiconductor Assembly and Test (OSAT) provider; had recently signed a Joint Venture Agreement (JVA) to establish a Joint Venture (JV) to build and operate an OSAT facility in India. The Union Cabinet, chaired by Prime Minister Shri Narendra Modi, approved the project of the JV under India’s Semiconductor scheme on February 29, 2024.

CG Power and Industrial Solutions Limited, Renesas and Stars Microelectronics, to Jointly Build Outsourced Semiconductor Assembly and Test Facility in India

　　The JV brings together unique capabilities of the partners with a vision to “Make in India for the World.” CG, with around 86 years of manufacturing expertise, is keen to build semiconductor capabilities and ecosystem in India. Renesas, a leading semiconductor company headquartered in Japan, will provide advanced semiconductor technology and expertise. Stars Microelectronics, a Thai based OSAT, will provide both technology for legacy packages and training and enablement.

　　The JV will be 92.3% owned by CG, with Renesas and Stars Microelectronics each holding equity capital of approximately 6.8% and 0.9%, respectively. The JV plans to invest INR 7,600 crores over a five-year period, which will be financed through a mix of subsidies, equity, and potential bank borrowings as required.

　　The JV will set up a state-of-the-art manufacturing facility in Sanand, Gujarat, with a capacity that will ramp up to 15 million units per day. The JV will manufacture a wide range of products – ranging from legacy packages such as QFN and QFP to advanced packages such as FC BGA, and FC CSP. The JV will cater to industries such as automotive, consumer, industrial, 5G, to name a few.

　　Commenting on this new venture, Mr. S. Vellayan, Chairman, CG Power and Industrial Solutions Limited, said, “CG’s entry into the semiconductor manufacturing marks a strategic diversification for us. Our partners, Renesas and Stars Microelectronics, will make our learning curves steeper and help us focus on innovation and excellence.

　　This is a very exciting phase for the entire nation, and we are very keen to build out India’s semiconductor capability and ecosystem.”

　　Mr. Natarajan Srinivasan, Managing Director, CG Power and Industrial Solutions Limited, added, “It is a matter of great pride for CG to implement this project of National importance.”

　　Commenting on the partnership, Mr. Hidetoshi Shibata, CEO of Renesas said, “India is a critical part of Renesas’ business. We value its innovative landscape and robust potential growth and are committed to accelerating our investment in India. By partnering with the Murugappa Group and Stars Microelectronics, we will bolster India’s semiconductor ecosystem and address the growing semiconductor demand for the customers worldwide.”

　　Mr. Prompong Chaikul, Chairman of Executive Committee of Stars Microelectronics (Thailand) Public Co., Ltd added, "We are deeply honored to join forces in this thrilling venture. Leveraging our expertise and experience in OSAT, we are committed to providing robust support to ensure the success of this project in India."

　　About CG Power and Industrial Solutions Limited

　　CG Power and Industrial Solutions Limited is an engineering conglomerate headquartered in Mumbai, India. The Company is a leader in the Electrical Engineering Industry and has two business lines—Industrial Systems and Power Systems. It manufactures Traction Motors, Propulsion systems, Signaling Relays etc., for the Indian Railways, and wide range of Induction Motors, Drives, Transformers, Switchgears, and other allied products for the Industrial and Power sectors. Recently, the Company also made a foray into the business of Consumer Appliances such as Fans, Pumps and Water Heaters.

　　The Company has world-class manufacturing plants across 9 locations in India and one in Sweden, and a Pan India network of 4 Regional and 15 Branch offices, with around 3000 employees. The Company’s consolidated revenue for FY23 was Rs 6,973 crores (USD 838 million).

　　The Company continues to excel and maintain its leadership position across its businesses, backed by its outstanding expertise, customer-centric approach, and enhanced focus on innovation and sustainability.

　　Since November 2020, the Company has become a part of the renowned Murugappa Group.

　　About Murugappa Group

　　A 123-year-old conglomerate with presence across India and the world, the INR 742 billion Murugappa Group has diverse businesses in agriculture, engineering, financial services and more.

　　The Group has 9 listed companies under its umbrella — Carborundum Universal Limited, CG Power & Industrial Solutions Limited, Cholamandalam Financial Holdings Limited, Cholamandalam Investment & Finance Company Limited, Cholamandalam MS General Insurance Company Limited, Coromandel International Limited, EID Parry (India) Limited, Shanthi Gears Limited, Tube Investments of India Limited and Wendt India Limited. Brands such as Ajax, Hercules, BSA, Montra, Montra Electric, Mach City, Gromor, Paramfos, Parry’s are part of the Group’s illustrious stable.

　　Abrasives, technical ceramics, electro minerals, electric vehicles, auto components, fans, transformers, signaling equipment for railways, bicycles, fertilizers, sugar, tea and several other products make up the Group’s business interests.

　　Guided by the five lights — integrity, passion, quality, respect and responsibility — and a culture of professionalism, the Group has a workforce of over 73,000 employees.

　　About Renesas Electronics Corporation

　　Renesas Electronics Corporation  empowers a safer, smarter and more sustainable future where technology helps make our lives easier. The leading global provider of microcontrollers, Renesas combines our expertise in embedded processing, analog, power and connectivity to deliver complete semiconductor solutions. These Winning Combinations accelerate time to market for automotive, industrial, infrastructure and IoT applications, enabling billions of connected, intelligent devices that enhance the way people work and live.

（备注：文章来源于网络，信息仅供参考，不代表本网站观点，如有侵权请联系删除！）

上一篇：GigaDevice Signs Distribution Agreement with EKOM, Extending business in Turkey

下一篇：3PEAK Launches Wide Input Voltage Buck TPP36308, Supporting Multiple Topologies!

在线留言询价

相关阅读
Renesas’ New FemtoClock™ 3 Timing Solution Delivers Industry’s Lowest Power and Leading Jitter Performance of 25fs-rms
Trade news

Renesas’ New FemtoClock™ 3 Timing Solution Delivers Industry’s Lowest Power and Leading Jitter Performance of 25fs-rms

　　Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today expanded its timing solutions portfolio with a new ultra-low 25fs-rms clock solution for wireline infrastructure, data center and industrial applications. The new FemtoClock™ 3 family includes ultra-low jitter clock generators and jitter attenuators with 8 and 12 outputs, enabling high-performance, easy-to-use, and cost-effective clock tree designs for next-generation, high-speed interconnect systems. Target applications for the new devices include telecom switches and routers, top-of-rack data center switches, medical imaging, broadcast audio & video and more.　　FemtoClock 3 devices provide industry leading phase noise and jitter required to meet the needs of 112Gbps SerDes rates, as well as next generation 224Gbps SerDes designs using commonly available 48MHz to 73MHz crystals. The highly integrated devices can generate up to four frequency domains and offer integrated LDOs (Low Drop Out regulators) with superior PSRR, reducing board complexity and cost.　　“Renesas leads the industry with best-in-class timing solutions built from decades of experience and patented technology,” said Zaher Baidas, Vice President of the Timing Division for Renesas. “FemtoClock 3 devices extend that leadership by providing multiple clock and synchronization functions in a single device with ultra-low jitter, simplifying printed circuit board design and reducing solution area and cost.”　　“FemtoClock 3 was the only timing solution that offered us the ultra-low jitter performance while maintaining low power dissipation and simplifying the PCB design and lowering solution area on our next-generation switches,” said Vincent Ho, CEO at UfiSpace. “We count on Renesas to deliver the timing solutions that enable us to deliver leading-edge products quickly and cost-effectively.”　　Key Features of the FemtoClock 3 Family　　Industry-leading 25fs-rms jitter exceeds next-generation 112Gbps and 224Gbps SerDes reference clock requirements　　Up to 4 frequency domains allow all system clocks to be generated from a single device　　Device variants with jitter attenuation, synchronization and clock generation capabilities and with 8 or 12 outputs　　Low power dissipation of 1.2W and operating a single 1.8V supply　　Integrated non-volatile memory allows for device customization in factory at no additional cost to customer　　Small 7 x 7mm 48-pin VFQFPN and 9 x 9mm 64-pin VFQFPN packages　　Compliant with ITU-T G.8262 and G.8262.1 for enhanced synchronous Ethernet　　Single chip with multiple operating modes simplifies overall clock tree　　FemtoClock 3 supports multiple operating modes, including synchronization, jitter attenuation, and clock generation. Customers can combine the new FemtoClock 3 solution with the broader ClockMatrix™, VersaClock, buffer and oscillator portfolio of timing solutions to address challenging timing needs for their high-performance wireline infrastructure and data center designs.　　FemtoClock 3 functions seamlessly in conjunction with the state-of-the-art Renesas IC Toolbox (RICBox) application, empowering users to configure and program devices on the evaluation board. Additionally, RICBox interfaces with the Renesas Lab on the Cloud platform, providing users with the capability to connect virtually to an actual laboratory setting.　　Winning Combinations　　Renesas has combined FemtoClock 3 with numerous compatible devices from its portfolio to offer Winning Combinations, including the 1600G Fixed Form Factor Switch. Winning Combinations are technically vetted system architectures from mutually compatible devices that work together seamlessly to bring an optimized, low-risk design for faster time to market. Renesas offers more than 400 Winning Combinations with a wide range of products from the Renesas portfolio to enable customers to speed up the design process and bring their products to market more quickly.
2024-04-19 11:28 阅读量：408
What’s aluminum PCB?Structure of aluminum PCB
Trade news

What’s aluminum PCB?Structure of aluminum PCB

　　PCB (printed circuit board) with copper layers on one side and aluminum on the other is commonly referred to as aluminum PCB (or the most widely used PCB). The dielectric between these two layers makes it different from the traditional copper foil-based PCBs and a good heat dissipator.　　If we zoom into its structure, the aluminum PCB is just a thin metal sheet with holes punched into them. These holes are where the components go—the contacts between the circuit board and whatever device it’s connected to.　　Structure of aluminum PCB　　Components that make aluminum PCBs are copper, aluminum, and an insulator.　　The copper is what makes up most of the board’s mass, and it conducts electricity efficiently.　　The aluminum is where current flows through the board, and it helps to create a solid connection between the copper and the insulator.　　Finally, the insulator prevents short circuits from forming between these pathways.　　This PCB flows heat away from the system by conducting it away from the area where you want to keep it.　　Here, aluminum conducts heat rapidly, so it’s great at conducting away heat. While copper conducts heat slowly but more efficiently than aluminum, so it can help transfer more heat at once. Insulation is used to prevent electrical shorts when a lot of current flows through a circuit.　　What are the types of aluminum PCBs?　　Through-hole aluminum PCBs　　They are made of a large number of through holes drilled into the board. The holes make it easy to connect different parts of the circuit together without having to rely on soldering connections between each piece of electronic equipment that you need to connect together.　　Flexible aluminum PCBs　　They are known for providing excellent electrical insulation, thermal conductivity, and exceptional flexibility. They are used in applications that require flexibility, such as circuit boards that need to bend easily.　　Multilayer aluminum PCBs　　Multilayer aluminum PCB is made of multiple layers of materials, such as epoxy resin, which allows for greater protection against corrosion and wear from vibration than conventional lead-free solder joints could achieve on their own.　　Hybrid aluminum PCBs　　Hybrid Aluminum PCB is made from two different types of materials: one layer is made out of copper foil, while the other layer is made out of aluminum foil. These boards are often used for circuit boards that require both conductors and insulators.　　Benefits and limitations of aluminum PCBs　　Benefits of aluminum PCBs　　Excellent thermal conductivity: makes it ideal for dissipating heat from high-power components, such as in LED lighting and power supplies.　　Durability and reliability: make them suitable for a wide range of applications, including in harsh environments.　　Cost-effective: generally less expensive to produce than traditional PCBs.　　Lightweight: ideal for applications where weight is a concern, such as in aerospace and automotive electronics.　　Limitations of aluminum PCBs　　Aluminum PCBs offer few design options than traditional PCBs.　　Has a higher electrical resistance which can cause issues with signal integrity and high-speed circuits.　　Limited availability of design software and manufacturing capabilities.　　Due to aluminum PCB heat dissipation ability, it is a useful part of different electronic applications. But the most common are:　　High-power LED lighting　　Automotive electronics　　Power supplies　　Telecommunications equipment　　Industrial control systems　　Medical devices　　Military and aerospace applications　　Electronic components are attached to aluminum PCBs in the above applications because the metal provides a stable and thermally conductive surface.　　How is an aluminum PCB manufactured?　　The process of manufacturing an aluminum PCB typically involves several steps.　　First, a layer of thermally conductive material, such as ceramic or metal, is bonded to the aluminum base using a high-temperature adhesive.　　Then, a layer of insulating material, such as epoxy or polyimide, is applied over the thermally conductive layer to provide electrical isolation.　　Next, the PCB is drilled with holes to accommodate the electronic components that will be mounted on it.　　Finally, the PCB is coated with a solder mask layer and printed with the desired circuit pattern using a photolithography process.　　Manufacturing of this type of board is referred to as metal-core printed circuit boards (MCPCB) in which metal is used as a base of the product.　　Challenges and solutions in aluminum PCB manufacturing　　One of the main challenges is ensuring that the thermally conductive layer is properly bonded to the aluminum base. To address this challenge, manufacturers must carefully control the temperature and pressure of the bonding process to ensure a strong and reliable bond.　　Another challenge in aluminum PCB manufacturing is drilling holes for electronic components. To overcome this challenge, manufacturers can use specialized drilling equipment and techniques, such as laser drilling or micro-drilling, to create precise and high-quality holes in the PCB.
2024-01-25 13:25 阅读量：1508
Renesas’ New Four-Channel Video Decoder for Automotive Cameras Enables Economical Surround View Applications
Trade news

Renesas’ New Four-Channel Video Decoder for Automotive Cameras Enables Economical Surround View Applications

　　Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today introduced the newest device in its Automotive HD Link (AHL) portfolio that enables automotive manufacturers to deliver high-definition video over low-cost cables and connectors. The new RAA279974 4-channel AHL video decoder processes four input sources simultaneously, making it an economical solution for surround-view and multi-camera applications.　　Renesas’ AHL technology uses a modulated analog signal to transmit video. The frequency is therefore 10 times lower than digital transmission solutions available in the market today (~37MHz vs. >3GHz), making it robust against noise and enabling longer transmission distances (20-30m) with unshielded twisted pair cables and standard connectors. Existing standard-definition analog video cables and connectors can also be employed. Using unshielded twisted pair cables not only reduces cost, but it is also easier to route through the vehicle and offers lighter weight for improved energy efficiency and performance. Digital links such as SerDes require heavily shielded cables and high-end connectors that cost significantly more than those for AHL and may require replacement after five to seven years.　　The RAA279974 completes the AHL family of products which consists of the RAA279971, single channel AHL video encoder and the RAA279972, a single channel AHL video decoder. The RAA279974 is an important addition to the AHL family as most OEMs want to support multiple cameras in vehicles for applications such as surround view parking assistance monitors. AHL can be paired with R-Car Automotive SoCs, RH850 MCUs, automotive PMICs, and analog components to cost-effectively implement numerous safety features in virtually any vehicle. Renesas provides multiple Winning Combinations that combine these components to enable manufacturers to quickly implement pre-tested video designs.　　“Multi-camera safety systems are quickly becoming a must-have feature for many consumers,” said Davin Lee, Vice President of the Analog & Connectivity Product Group. “The AHL system enables our automotive customers to now deliver these features in all new vehicles, including economy models.”　　AHL is robust against noise and offers excellent picture quality. There is no noticeable difference in picture quality when compared to a pure digital video image. Due to the fundamental nature of an analog signal, an AHL video transmission can withstand noise and interference. The picture may degrade slightly, but there will still be a live image to view. With a digital link, any noise/interference will result in a complete loss of picture.　　Key Features of AHL　　Supports resolutions from VGA up to 720p/60 or 1080p/30 for flexibility to implement non-standard vertical resolutions (not just the TV video standard 16:9 resolutions)　　MIPI-CSI2, BT656, & DVP inputs and outputs provide flexible interface to support a variety of image sensors　　AHL does not require compression like an Ethernet system does, so it has no latency in the video　　Requires only 27MHz crystal clock, with internal PLLs able to generate the necessary clock frequencies for higher resolutions, reducing cost　　AHL has passed BCI & CISPR25 EMC/EMI testing using UTP cables　　MIPI-CSI2 output with Virtual Channel allows 4 channels of video to be sent over a single data bus interface to the SoC (saves input ports on the SoC)　　Availability　　The four-channel RAA279974 AHL decoder samples and evaluation boards are available today. Renesas also offers the RTKA279974ZK0000BU Camera Kit Bundle evaluation system which includes four AHL cameras integrated with the RAA279971 AHL encoder. More information is available at www.renesas.com/RAA279974.　　About Renesas Electronics Corporation　　Renesas Electronics Corporation (TSE: 6723) empowers a safer, smarter and more sustainable future where technology helps make our lives easier. The leading global provider of microcontrollers, Renesas combines our expertise in embedded processing, analog, power and connectivity to deliver complete semiconductor solutions. These Winning Combinations accelerate time to market for automotive, industrial, infrastructure and IoT applications, enabling billions of connected, intelligent devices that enhance the way people work and live. Learn more at renesas.com. Follow us on LinkedIn, Facebook, X, YouTube, and Instagram.　　All names of products or services mentioned in this press release are trademarks or registered trademarks of their respective owners.　　The content in the press release, including, but not limited to, product prices and specifications, is based on the information as of the date indicated on the document, but may be subject to change without prior notice.
2024-01-25 13:21 阅读量：1054
Japan’s First Moon Lander Touches Down with Renesas’ Rad-Hard ICs on Board
Trade news

Japan’s First Moon Lander Touches Down with Renesas’ Rad-Hard ICs on Board

　　Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, announced today that its radiation-hardened (rad-hard) ICs were onboard the Smart Lander for Investigating Moon (SLIM) spacecraft that successfully touched down on the Moon’s low latitude area on January 20, Japan Standard Time.　　Operated by the Japan Aerospace Exploration Agency (JAXA), SLIM launched onboard a H-IIA rocket from the Tanegashima Space Center, Japan on September 7, 2023. The Moon landing represents a significant milestone for Japan, as it becomes only the fifth country to successfully touch down and operate a lunar lander, after Russia, the United States, China and India.　　The spacecraft landed near the Shioli Crater, in the vicinity of the Sea of Nectar region, aiming to achieve a more precise landing than previous lunar missions, which typically had precision levels of several kilometers to tens of kilometers. JAXA is currently investigating the specifics of its pinpoint landing and plans to release further information in the coming weeks. The spacecraft is engineered to achieve exceptional landing precision, due to a vision-based object detection system and its lightweight, compact design.　　This five-months long mission is intended to help the scientific community learn about the origin of the Moon. For this purpose, the spacecraft’s payload includes a multi-band spectral camera that can determine the composition of lunar rocks derived from the Moon’s mantle.　　Renesas provided a number of key components for the SLIM spacecraft’s integrated computer and electronic subsystems, which are designed to operate over a temperature range and tested to withstand total ionizing dose radiation rates as high as 300krad(Si). Among the ICs used for this mission are 3.3V and 5V RS-422 receivers, RS-422 drivers, a 16-channel analog multiplexer, a 40V rail-to-rail operational amplifier, and a 3A low-dropout voltage regulator.　　The Renesas Intersil brand has a long history in the space industry spanning more than six decades, beginning with the founding of Radiation Inc. in 1950. Since then, virtually every satellite, shuttle launch and deep-space exploration mission has included Intersil-branded products. Renesas leverages this experience to deliver efficient, thermally optimized and highly reliable SMD, MIL-STD-883 and MIL-PRF 38535 Class-V/Q Intersil-branded products for the defense, high-reliability (Hi-Rel), and rad-hard space markets. Renesas Intersil-brand rad-hard ICs support subsystems for mission critical applications in data communications transfer, power supplies and power conditioning, general protection circuitry, and telemetry, tracking and control (TT&C).　　Deep space is a challenging environment for spaceflight and asteroid exploration systems, particularly due to the intense radiation environment encountered in nearly all mission profiles. Design, layout, certain process technologies, and manufacturing steps like burn-in and total dose testing of ICs ensure predictable performance and prevent system failure while in flight and on long duration robotic and crewed missions to other planets. 
2024-01-24 13:48 阅读量：1521
热门分类
盒子，外壳，机架 电缆，电线 电路保护 连接器，互连器件 开发套件 机电产品 嵌入式解决方案 风扇，热管理 光电元件 其它 无源元件 电源 半导体 传感器，变送器 测试与测量
  • 一周热料
  • 紧缺物料秒杀
型号 品牌 询价
RB751G-40T2R ROHM Semiconductor
MC33074DR2G onsemi
CDZVT2R20B ROHM Semiconductor
TL431ACLPR Texas Instruments
BD71847AMWV-E2 ROHM Semiconductor
型号 品牌 抢购
TPS63050YFFR Texas Instruments
BP3621 ROHM Semiconductor
STM32F429IGT6 STMicroelectronics
ESR03EZPJ151 ROHM Semiconductor
IPZ40N04S5L4R8ATMA1 Infineon Technologies
BU33JA2MNVX-CTL ROHM Semiconductor
热门标签
ROHM
Aavid
Averlogic
开发板
SUSUMU
NXP
PCB
传感器
半导体
原厂授权品牌
更多授权品牌>>
资讯排行榜
  • 周排行榜
  • 月排行榜

相关百科
关于我们
AMEYA360微信服务号 AMEYA360微信服务号
AMEYA360商城(www.ameya360.com)上线于2011年，现 有超过3500家优质供应商，收录600万种产品型号数据，100 多万种元器件库存可供选购，产品覆盖MCU+存储器+电源芯 片+IGBT+MOS管+运放+射频蓝牙+传感器+电阻电容电感+ 连接器等多个领域,平台主营业务涵盖电子元器件现货销售、 BOM配单及提供产品配套资料等，为广大客户提供一站式购 销服务。