A11芯片交货在即,台积电还不忙翻?

Release time:2017-05-12
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source:环球网
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据英国《每日邮报》5月11日援引台湾《中时电子报》搜集的“内部消息”称,苹果的A11芯片6月将开始量产。

有消息称,苹果供应商,包括台湾集成电路制造公司(TSMC)、类载板制造商臻鼎科技、景硕科技以及电池供应商新普科技,都准备在6月初增量生产iPhone配件,这与之前的报道也相吻合。

其中,TSMC将在6月10日生产A11芯片所需要的初制晶圆,并在7月下旬完成芯片运输。



同时,iPhone装配公司富士康、纬创、和硕正在加速招聘新员工,为之后iPhone的大规模生产做准备。

尽管iPhone8或许能够准时发布,但凯基证券的郭明池10日表示iPhone8很有可能面临成产和运输的最糟情况。9to5Mac网站的调查也表明了苹果公司的生产问题,原因在于其大规模的硬件升级或许会导致上市时的设备短缺。

郭明池还预计,iPhone极有可能面临最糟的出货情况,从1亿到1.1亿部降至0.8亿到0.9亿部。

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