总投资30亿美元,中环股份,晶盛机电携手投建大硅片项目

Release time：2017-10-14
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source：上海证券时报
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中环股份、晶盛机电12日晚间同时发布公告，两公司与无锡市政府签署《战略合作协议》，共同在宜兴市建设集成电路用大硅片生产与制造项目，以促进无锡市集成电路产业链的发展优化。

据介绍，无锡市政府表示，将全力支持两家上市公司来该市发展和投资。无锡市政府将把集成电路大硅片项目列入无锡市重大产业项目，为两家公司开设行政审批绿色通道，在选址用地、项目环评、税收优惠、投融资、科技研发、人才引进、项目推进机制等方面给予最便利的办事流程、最全面的服务保障、最优惠的政策支持，尽快创造满足项目开工的各项条件。

而中环股份、晶盛机电将协同无锡市政府下属的投资平台公司或产业基金确定项目投资主体，共同在宜兴市启动建设集成电路用大硅片生产与制造项目，以市场需求为导向，规划和分期建设，项目总投资约30亿美元，一期投资约15亿美元。

据悉，中环股份、晶盛机电的合作，是继国家科技重大专项（02专项）“极大规模集成电路制造装备及成套工艺”之《区熔硅单晶产业化技术与国产设备研制》合作之后的再一次在半导体领域的深度合作。双方均表示上述《协议》有利于实现合作方互利共赢，有利于促进公司综合竞争力提升，推动公司长期可持续发展。

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