| Voltage - Supply | 1.283 V ~ 1.45 V |
|---|---|
| Supplier Device Package | * |
| Memory Size | 4G (256M x16) |
| Part Status | Active |
| Category | Integrated Circuits (ICs) |
| Family | Memory |
| Format - Memory | RAM |
| Access Time-Max | 0.195 Ns |
| I/O Type | Common |
| Operating Temperature-Max | 95 °C |
| Output Characteristics | 3-State |
| Supply Voltage-Min (Vsup) | 1.283 V |
| Technology | DDR3 |
| Terminal Form | Ball |
| Terminal Position | Bottom |
| JESD-30 Code | R-PBGA-B96 |
| I/O Voltage | 1.35 VOLTS |
| Bus Width | x16 |
| Part Status Code | Production |
| Rohs Code | Yes |
| Length | 14 Mm |
| Refresh Cycles | 8192 |
| Self Refresh | Yes |
| Surface Mount | Yes |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Package / Case | * |
| Memory Type | DDR3L SDRAM |
| Interface | Parallel |
| Speed | 933MHz |
| Manufacturer | Micron Technology Inc. |
| Operating Temperature | 0°C ~ 95°C (TC) |
| Packaging | Tray |
| Clock Frequency-Max (fCLK) | 933 Mhz |
| Operating Mode | Synchronous |
| Organization | 256mx16 |
| Supply Voltage-Max (Vsup) | 1.45 V |
| Supply Voltage-Nom (Vsup) | 1.35 V |
| Terminal Finish | Tin Silver Copper |
| Terminal Pitch | 0.8 Mm |
| Pin Count | 96-ball |
| Component Density | 4Gb |
| Operating Temp | 0C to +95C |
| CAS Latency | CL = 13 |
| Package | TFBGA |
| Interleaved Burst Length | 8 |
| Memory Width | 16 |
| Seated Height-Max | 1.2 Mm |
| Sequential Burst Length | 8 |
| Temperature Grade | Other |
| Width | 8 Mm |
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