| DILB20P-223TLF | ||
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| Product description : 20 Position (2 x 10 ) 2.54 mm Pitch Open Frame Through Hole DIP Socket | ||
| SPQ：1 | ||
| Datasheet : -- |
- Specifications
- Product Attributes
- Documents
- Product reviews
| Termination Post Length | 0.124" (3.15mm) |
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| Termination | Solder |
| Contact Finish - Post | Tin |
| Part Status | Active |
| Number of Positions or Pins (Grid) | 20 (2 x 10) |
| Category | Connectors, Interconnects |
| Housing Material | Polyamide (PA), Nylon |
| Contact Finish Thickness - Mating | 100µin (2.54µm) |
| Pitch - Mating | 0.100" (2.54mm) |
| Mounting Type | Through Hole |
| Operating Temperature | -55°C ~ 105°C |
| Packaging | Tube |
| ECCN | EAR99 |
| Pitch - Post | 0.100" (2.54mm) |
| Type | DIP, 0.3" (7.62mm) Row Spacing |
| Features | Open Frame |
| Contact Finish Thickness - Post | 100µin (2.54µm) |
| Manufacturer | Amphenol FCI |
| Contact Finish - Mating | Tin |
| Contact Material - Post | Copper Alloy |
| Contact Material - Mating | Copper Alloy |
| Family | Sockets for ICs, Transistors |
| Contact Resistance | 30 mOhm |
| Material Flammability Rating | UL94 V-0 |
| Current Rating | 1A |
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