| MX60LF8G18AC-XKI | ||
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| 产品描述：
8Gb (x8) SLC NAND 3V 4-bit ECC 63-ball VFBGA (9mmx11mm)
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| 标准包装：1 | ||
| 数据手册： -- |
- 规格参数
- 产品特性
- 技术文档
- 产品评论
| ECCN | 3A991.b.1.a |
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| Rohs Code | Yes |
| Length | 11 Mm |
| Memory IC Type | Flash |
| Operating Mode | Asynchronous |
| Operating Temperature-Min | -40 °C |
| Package Style | Grid Array, Very Thin Profile, Fine Pitch |
| Programming Voltage | 3 V |
| Surface Mount | Yes |
| Temperature Grade | Industrial |
| Width | 9 Mm |
| packaging | Tray |
| Factory Lead Time | 10 Weeks |
| Memory Density | 8589934592 Bit |
| Memory Width | 8 |
| Operating Temperature-Max | 85 °C |
| Organization | 1gx8 |
| Peak Reflow Temperature (Cel) | 260 |
| Seated Height-Max | 1 Mm |
| Technology | Cmos |
| Time@Peak Reflow Temperature-Max (s) | 40 |
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