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| 产品描述：
275 No Clean Core 96.5% Tin 3% Silver 0.5% Copper Lead Free Solder Wire-Gauge 21
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| 标准包装：1 | ||
| 数据手册： |
- 规格参数
- 产品特性
- 技术文档
- 产品评论
| Melting Point | 422 ~ 428°F (217 ~ 220°C) |
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| Core Size | 0.022 |
| Part Status | Active |
| Manufacturer | Kester Solder |
| Process | Lead Free |
| Family | Solder |
| Flux Type | No-Clean |
| ECCN | EAR99 |
| Type | Wire Solder |
| Diameter | 0.031" (0.79mm) |
| Category | Soldering, Desoldering, Rework Products |
| Form | Spool, 454g (1 lb) |
| Series | 275 |
| Wire Gauge | 20 AWG, 21 AWG |
| Composition | Sn96.5Ag3.0Cu0.5 (96.5/3/0.5) |
| 数据手册： |
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