PIC32MX350F256L-I/PF specifications -Ameya360 electronic components purchase network

PCN Assembly/Origin	Additional Fabrication Site 21/Jun/2013 Qualification TQFP-100L Package 15/Jan/2014 Qualification TQFP-100L Package 15/Jan/2014 Qualification Assembly Site Revision 25/Jul/2014 Qualification TQFP-100L Package 18/Aug/2014 Report/Ship Date Revison 20/Oct/2
Core Size	32-Bit
Connectivity	I²C, IrDA, LIN, PMP, SPI, UART/USART
Program Memory Size	256KB (256K x 8)
Package / Case	TRAY
For Use With	DV164035-ND - MPLAB ICD3 DEBUGGER/PROGRAMMER DV164131-ND - KIT STARTER PICKIT 3 PROGRAMMER PG164130-ND - PROGRAMMER MCU PICKIT 3
Article Library	Creating Low-Cost Bluetooth Audio Applications with 32-bit MCUs
Peripherals	Brown-out Detect/Reset, DMA, POR, PWM, WDT
PCN Design/Specification	Datasheet Update 18/Oct/2013 Errata and Datasheet Update 21/Oct/2013 Errata/Datasheet Update 05/Jun/2014
Speed	80MHz
Series	PIC® 32MX
Operating Temperature	-40°C ~ 85°C
SDP	100-TQFP 14x14x1mm
Voltage - Supply (Vcc/Vdd)	2.3 V ~ 3.6 V
Number of I/O	85
Product Training Modules	Bluetooth Audio Development Platform
Oscillator Type	Internal
Core Processor	MIPS32® M4K™
Supplier Device Package	100-TQFP (14x14)
RAM Size	64K x 8
Standard Package	90
Packaging	Tray
Program Memory Type	FLASH
Family	Embedded - Microcontrollers
Data Converters	A/D 28x10b

Datasheet： PIC32MX350F256L-I/PF.pdf

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