| 573300D00010G | ||
|---|---|---|
|
|
||
|
||
| 产品描述：
TO-226 Surface Mount 18.00 C/W Thermal Resistance D2 Semiconductor Heat Sink
|
||
| 标准包装：250 | ||
| 数据手册： -- |
- 规格参数
- 产品特性
- 技术文档
- 产品评论
| Package Cooled | TO-263 (D²Pak) |
|---|---|
| Type | Top Mount |
| Part Status | Active |
| Category | Fans, Thermal Management |
| Power Dissipation @ Temperature Rise | 1.25W @ 30°C |
| Length | 0.500" (12.70mm) |
| Family | Thermal - Heat Sinks |
| Width | 1.030" (26.16mm) |
| ECCN | EAR99 |
| Attachment Method | SMD Pad |
| Material | Copper |
| Shape | Rectangular |
| Manufacturer | Aavid Thermalloy |
| Material Finish | Tin |
| Thermal Resistance @ Forced Air Flow | 10.0°C/W @ 200 LFM |
| Height Off Base (Height of Fin) | 0.400" (10.16mm) |
| Thermal Resistance @ Natural | 18°C/W |
登录之后就可发表评论
请输入下方图片中的验证码：